KR200211271Y1 - Loadlock-chamber of semiconductor fabricating device - Google Patents

Abstract

The present invention relates to a load lock chamber of a semiconductor manufacturing equipment, the load lock chamber body is installed so as to communicate with each other on one side of the process chamber and to form a predetermined transfer space for transferring the wafer; A pumping line connected to one end of the load lock chamber body so as to communicate with each other; A pumping line opening and closing valve installed to open and close the pumping line; A pumping bypass pipe installed at both ends thereof so as to communicate with each of the upstream side and the downstream side of the pumping line opening and closing valve; A pumping bypass pipe opening and closing valve for opening and closing the pumping bypass pipe; A pumping bypass pipe needle valve configured to adjust an amount of fluid flowing through the pumping bypass pipe; A venting line connected to one side of the load lock chamber body so as to communicate with each other; A venting line opening and closing valve installed to open and close the venting line; A venting bypass tube whose both ends are installed in communication with an upstream side and a downstream side of the venting line opening and closing valve with respect to a flow direction of the fluid; A venting bypass pipe opening and closing valve installed at the venting bypass pipe; And a venting bypass pipe needle valve configured to adjust an amount of fluid flowing through the venting bypass pipe. Thereby, the load lock chamber of the semiconductor manufacturing equipment which can suppress generation | occurrence | production of a vortex when the fluid enters and prevents an impurity from adhering to a wafer is provided.

Description

LOADLOCK-CHAMBER OF SEMICONDUCTOR FABRICATING DEVICE}

The present invention relates to a load lock chamber of semiconductor manufacturing equipment, and in particular, to suppress the formation of vortices when the fluid flows in and out of the load lock chamber, thereby preventing impurities from adhering to the wafer by the vortex. It relates to a load lock chamber of a semiconductor manufacturing equipment.

As shown in FIG. 1, the conventional load lock chamber 10 is connected to the process chamber 20 with the slit valve V2 interposed therebetween, and one end of the load lock chamber 10 has a cassette ( An elevator 11 for elevating the wafer W transferred from C) is provided, and on one side of the load lock chamber 10, an air discharge valve 13a is provided so that the process chamber 20 can maintain a vacuum during the process. ) Is provided with a pumping line 13 having a diameter of about 40 to 100 mm. In addition, a venting line (VENTIVG LUNE) 12 having a diameter of 1/4 inch provided with an air inlet valve 12a to convert the load lock chamber 10 from the vacuum state to the atmospheric pressure state is the pumping line ( 13) is provided at a predetermined distance.

A pump 14 is installed at the end of the pumping line 13, and a vacuum gauge 15 measures a pressure of the load lock chamber 10 at one end of the pumping line 13. Is installed. Reference numeral V1 denotes a valve for wafer in / out.

By such a configuration, when the wafer conveying means (not shown) transfers the wafers W in units of six pieces from the cassette C in which the plurality of wafers W are stored to the elevator 11 of the load lock chamber 10, The elevator 11 rises a predetermined height and a wafer transfer means (not shown) transfers the wafer W to the slit valve V2 provided at one side of the process chamber 20.

At this time, the air discharge valve 13a is opened and the pump 14 is driven to open the air discharge valve 13a so that the atmosphere inside the load lock chamber 10 may be similar to the process chamber 20 in a vacuum state. The interior of the fluid discharges through the pumping line (13).

When the atmosphere inside the load lock chamber 10 is formed similarly to the process chamber 20, the slit valve V2 is opened to introduce the wafer W into the process chamber 20, and then the slit valve ( V2) is closed and a predetermined process is performed.

As such, during the process, the air inlet valve 12a is opened to the venting line 12 to supply nitrogen gas to adjust the atmosphere of the load lock chamber 10 to atmospheric pressure, and also to proceed with the process. The reaction by-products generated in the process chamber 20 in the prevention of the leakage into the load lock chamber (10).

Thereafter, the slit valve V2 is opened in the reverse order as described above, and the wafer W taken out is stored in the cassette C again, thereby completing the process.

However, in the load lock chamber of the conventional semiconductor manufacturing equipment, when the fluid inside the load lock chamber 10 is discharged through the pumping line 13, when the air discharge valve 13a is opened, the fluid is pumped momentarily. Due to the discharge into the line 13, a vortex is formed inside the load lock chamber 10. When the vortex is formed in this way, there is a problem that particles are attached to the wafer W transferred to the process chamber 20 to cause a process defect.

In addition, when the air inlet valve 12a is opened even when nitrogen gas is supplied to the venting line 12 in order to convert the vacuum state inside the load lock chamber 10 to the atmospheric pressure state, the nitrogen gas is momentarily loaded in the load lock chamber. There is a problem that foreign matter is attached to the wafer (W) by entering the (10) to form a vortex inside the load lock chamber (10).

Accordingly, an object of the present invention is to provide a load lock chamber of a semiconductor manufacturing apparatus capable of preventing wafer defects by suppressing the formation of vortices therein when the inner rotor fluid is discharged and introduced into the load lock chamber.

1 is a schematic view showing a conventional semiconductor wafer drying equipment.

Figure 2 is a schematic view showing a semiconductor wafer drying apparatus according to an embodiment of the present invention.

** Explanation of symbols for main parts of drawings **

100; Load lock chamber 110; elevator

120; Venting line 120a; Air Inlet Valve

121; Venting bypass pipe 122; Air valve

123; Flowmeter 124; Needle valve

130; Pumping line 130a; Air exhaust valve

131; Pumping bypass pipes 132; Air valve

133; Needle valve

The above object is, in accordance with the present invention, the load lock chamber body is installed to be in communication with each other on one side of the process chamber to perform a predetermined process and to form a predetermined transfer space for transferring the wafer; A pumping line connected to one end of the load lock chamber body to form an atmosphere of the load lock chamber body in a vacuum state at atmospheric pressure; A pumping line opening and closing valve installed to open and close the pumping line; A pumping bypass tube having a diameter smaller than that of the pumping line and installed at both ends of the pumping line opening and closing valve so as to communicate with the upstream side and the downstream side of the pumping line opening and closing valve; A pumping bypass pipe opening / closing valve installed at the pumping bypass pipe to open and close the pumping bypass pipe; A pumping bypass pipe needle valve configured to adjust an amount of fluid flowing through the pumping bypass pipe; A venting line connected to one side of the load lock chamber body to convert the atmosphere of the load lock chamber body from a vacuum state to an atmospheric pressure state; A venting line opening and closing valve installed to open and close the venting line; A venting bypass pipe having a diameter smaller than that of the venting line and installed at both ends in upstream and downstream sides of the venting line opening and closing valve with respect to a flow direction of the fluid; A venting bypass pipe opening and closing valve installed at the venting bypass pipe to open and close the venting bypass pipe; It is achieved by the load lock chamber of the semiconductor manufacturing equipment, characterized in that it comprises a venting bypass needle valve for controlling the amount of fluid flowing through the venting bypass pipe.

Here, it is preferable to further include a flow meter installed in the venting bypass pipe so as to measure the flow rate of the fluid flowing into the load lock chamber body.

In addition, the diameter of the pumping bypass pipe and the venting bypass pipe may be configured to be 1/8 inch or less.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

As shown in FIG. 2, the load lock chamber of the present invention has a rod having a predetermined shape and length to form a transfer path of the wafer W on one side of the process chamber 20 for actually performing the process. The lock chamber body 100 is provided.

One end of the load lock chamber body 100 is provided with an elevator 110 for elevating the wafer W transferred from the cassette C. At one side of the load lock chamber body 100, an atmosphere of the venting line 120 and the load lock chamber body 100 for supplying a fluid such as nitrogen gas to form the atmosphere of the load lock chamber body 100 at atmospheric pressure, respectively. Pumping line 130 for discharging the fluid of the load lock chamber body 100 to form a vacuum state is installed so as to communicate with the load lock chamber body 100.

Venting line 120 is provided with a venting line opening and closing valve (120a) for opening or blocking the nitrogen gas flows into the load lock chamber body 100, venting line opening and closing valve 120a for the flow direction of the fluid Both ends of the venting bypass pipe 121 having a diameter of about 1/8 inch or less are provided on the upstream and downstream sides of each other so as to communicate with each other.

The venting bypass pipe 121 has a venting bypass pipe opening / closing valve 122 for opening and closing the venting bypass pipe 121 so that the fluid can flow through the venting bypass pipe 121, and finely controlling the amount of the fluid. A venting bypass pipe needle valve 124 is provided, and a flow meter 123 for detecting a flow rate of the venting bypass pipe 122 is interposed therebetween.

On the other hand, the pumping line 130 is provided with a pumping line opening and closing valve 130a for opening and closing the pumping line 130 so that the fluid from the load lock chamber body 100 can be discharged and shut off, the pumping line opening and closing valve ( Both ends of the pumping bypass pipe 131 are provided in the front-rear region of 130a) so that mutual communication is possible. The pumping bypass pipe 131 has a pumping bypass pipe opening / closing valve 132 to open and close the pumping bypass pipe 131, and a pumping bypass pipe needle valve for finely controlling the flow rate of the pumping bypass pipe 131. 133 are provided respectively.

Reference numeral 15 is a vacuum gauge for measuring the pressure of the load lock chamber body 100, (P) is a pump.

By such a configuration, when the wafer conveying means (not shown) transfers the wafers W to the elevator 110 of the load lock chamber body 100 from the cassette C in which the plurality of wafers W are stored, the elevator W 110 rises a predetermined height and the wafer transfer means (not shown) transfers the wafer W to the slit valve V2 provided on one side of the process chamber 20.

At this time, in order to make the atmosphere of the load lock chamber body 100 similar to the process chamber 20 in a vacuum state, it is installed in the bypass pipe 131 to allow fluid to flow into the load lock chamber body 100. The venting bypass pipe opening / closing valve 132 and the venting bypass pipe needle valve 133 are opened and the pump P is driven. Then, the fluid inside the load lock chamber body 100 is gradually discharged through the pumping bypass pipe 131 without forming a vortex inside, and the pressure inside the load lock chamber body 100 reaches about 25 Torr. When opening, the pumping line opening and closing valve 130a installed in the pumping line 130 is opened to completely discharge the fluid existing in the load lock chamber body 100.

When the atmosphere inside the load lock chamber body 100 is formed similarly to the process chamber 20, the slit valve V2 is opened and the wafer W is introduced into the process chamber 20. When the introduction of the wafer W is completed, the slit valve V2 is closed to allow a predetermined process to proceed.

Meanwhile, nitrogen gas is supplied to the venting line 120 during the process in the process chamber 20 to adjust the atmosphere of the load lock chamber body 100 to an atmospheric pressure state. As a result, reaction by-products generated in the process chamber 20 in the process of the process is prevented from leaking to the load lock chamber body 100.

Referring to the injection process of nitrogen gas into the load lock chamber body 100, first, the venting bypass pipe opening and closing valve 132 and the venting bypass pipe needle valve (1) so that the venting bypass pipe 121 can be opened. 133) is opened. Then, the fluid is introduced into the load lock chamber body 100 through the venting bypass pipe 121 without forming a vortex in the load lock chamber body 100. The flow rate of the fluid through the flow meter 123 is measured, and when a predetermined value or more, the venting line opening and closing valve 120a is opened to allow the fluid to flow.

As described above, according to the present invention, a separate bypass pipe is installed in the venting line and the pumping line, respectively, and an opening / closing valve for opening and closing each bypass pipe, and a needle valve are installed, thereby providing the inside of the load lock chamber body. By allowing vortex formation to be suppressed when the furnace fluid flows in or out of the fluid inside, there is provided a load lock chamber of a semiconductor manufacturing equipment capable of preventing impurities from adhering to the wafer by vortex flow.

Claims (3)

A load lock chamber body installed on one side of a process chamber for performing a predetermined process and forming a predetermined transfer space for transferring a wafer; A pumping line connected to one end of the load lock chamber body to form an atmosphere of the load lock chamber body in a vacuum state at atmospheric pressure; A pumping line opening and closing valve installed to open and close the pumping line; A pumping bypass tube having a diameter smaller than that of the pumping line and installed at both ends of the pumping line opening and closing valve so as to communicate with the upstream side and the downstream side of the pumping line opening and closing valve; A pumping bypass pipe opening / closing valve installed at the pumping bypass pipe to open and close the pumping bypass pipe; A pumping bypass pipe needle valve configured to adjust an amount of fluid flowing through the pumping bypass pipe; A venting line connected to one side of the load lock chamber body to convert the atmosphere of the load lock chamber body from a vacuum state to an atmospheric pressure state; A venting line opening and closing valve installed to open and close the venting line; A venting bypass pipe having a diameter smaller than that of the venting line and installed at both ends in upstream and downstream sides of the venting line opening and closing valve with respect to a flow direction of the fluid; A venting bypass pipe opening and closing valve installed at the venting bypass pipe to open and close the venting bypass pipe; And a venting bypass pipe needle valve configured to adjust an amount of fluid flowing through the venting bypass pipe. The load lock chamber of claim 1, further comprising a flow meter installed in the venting bypass pipe to measure a flow rate of the fluid flowing into the load lock chamber body. The load lock chamber of claim 1 or 3, wherein a diameter of the pumping bypass tube and the venting bypass tube is 1/8 inch or less.