KR102625511B1 - Loadlock chamber and method for discharging particle of loadlock chamber - Google Patents

Abstract

The present invention includes a chamber in which a substrate entrance is formed; A vacuum pump that depressurizes the interior of the chamber; a first discharge module connected to the vacuum pump and installed on one side of the chamber; and a second discharge module in communication with the vacuum pump and installed on one side of the chamber, wherein the first discharge module includes a first exhaust port formed on a side of the chamber where the substrate entrance or exit is not formed, The second discharge module includes a second exhaust port formed on one side of the chamber where the substrate entrance is not formed, and the diameter of the second exhaust port is 3.5 to 4.5 times the diameter of the first exhaust port. It's about the chamber.

Description

Load lock chamber and method of discharging foreign substances from the load lock chamber {LOADLOCK CHAMBER AND METHOD FOR DISCHARGING PARTICLE OF LOADLOCK CHAMBER}

The present invention relates to a load lock chamber and a method for discharging foreign substances from the load lock chamber.

To manufacture semiconductor devices, flat panel displays, or thin-film solar cells, a deposition process involves depositing a specific material on the surface of a substrate to form a thin film, and exposing or hiding selected areas of the thin film formed using a photosensitive material. Unit processes such as photo processes and etching processes that remove selected thin films to form patterns are performed.

Each unit process is performed in each process chamber that is optimally designed to suit each unit process.

A cluster-type substrate processing system that improves productivity by installing each process chamber that performs each unit process spatially adjacent to each other and minimizing the time to transport the substrate to each process chamber has been developed and used. .

The cluster-type substrate processing system includes a transfer chamber equipped with a robot for transferring substrates, a plurality of process chambers installed outside the transfer chamber, and a load lock chamber installed outside the transfer chamber.

The load lock chamber receives unprocessed substrates from the storage area where the substrates are stored and temporarily stores them, or receives processed substrates from the process chamber via the transfer chamber and temporarily stores them. The substrate stored in the load lock chamber is brought into the process chamber through the transfer chamber or taken out to the storage unit.

A conventional load lock chamber will be described with reference to FIG. 1. Figure 1 is a schematic plan cross-sectional view of a conventional load lock chamber.

As shown, the conventional load lock chamber has a chamber 11 that provides a space where the substrate S is temporarily stored, and a vacuum pump 15 for depressurizing the inside of the chamber 11 to a vacuum state.

Substrate entrances 11a and 11b through which the substrate S enters and exits are formed on one side and the other side of the chamber 11, respectively, and the substrate entrances 11a and 11b are formed on one side and the other side of the chamber 11, respectively. Each is opened and closed by an installed opening and closing plate (not shown).

At this time, the substrate entrance 11a is selectively communicated with the storage unit in an atmospheric state where the substrate S is stored by the opening and closing plate, and the substrate entrance 11b is connected to the transfer chamber in a vacuum state and the opening and closing plate. It communicates selectively. And, an exhaust port 11c communicating with the vacuum pump 15 is formed in the chamber 11.

Therefore, when the substrate S from the storage unit is to be brought into the process chamber, the substrate entrance 11a is opened, the substrate S is introduced into the chamber 11, and then the substrate entrance 11a is closed. Afterwards, the vacuum pump 15 is driven to depressurize the inside of the chamber 11 and discharge foreign substances from the chamber 11 to the outside. Afterwards, the substrate entrance 11b is opened, and the substrate S in the chamber 11 is transferred to the process chamber via the transfer chamber.

On the other hand, when it is desired to transport the substrate (S) from the process chamber to the storage unit, the substrate entrance (11b) is opened, the substrate (S) from the process chamber is introduced into the chamber 11 via the transfer chamber, and then the substrate entrance (11b) is opened. Close 11b). Afterwards, the vacuum pump 15 is driven to depressurize the inside of the chamber 11 to discharge foreign substances in the chamber 11 to the outside, and then the substrate entrance 11a is opened to transport the substrate S to the storage unit. .

The conventional load lock chamber as described above has a disadvantage in that it is difficult to completely discharge foreign substances present inside the chamber 11 due to the structure and method of depressurizing the chamber 11 to discharge foreign substances.

And, since the exhaust port 11c is formed in one location, many foreign substances are concentrated on the exhaust port 11c side. Because of this, a relatively large amount of foreign substances may remain on the exhaust port 11c side, so there is a risk that the substrate S may be contaminated.

Additionally, since one vacuum pump 15 is installed to depressurize the chamber 11, if the vacuum pump 15 malfunctions, the entire substrate processing system, including the load lock chamber, must be stopped. This has the disadvantage of lowering productivity.

The purpose of the present invention may be to provide a load lock chamber and a method of discharging foreign substances from the load lock chamber that can solve all the problems of the prior art as described above.

Another object of the present invention may be to provide a load lock chamber and a method of discharging foreign substances from the load lock chamber that can completely discharge foreign substances from the chamber.

Another object of the present invention may be to provide a load lock chamber and a method of discharging foreign substances from the load lock chamber that can prevent contamination of the substrate and improve productivity at the same time.

The load lock chamber according to this embodiment for achieving the above object includes a chamber in which a substrate entrance and exit is formed; A vacuum pump that depressurizes the interior of the chamber; a first discharge module connected to the vacuum pump and installed on one side of the chamber; And it may include a second discharge module that communicates with the vacuum pump and is installed on one side of the chamber. The first exhaust module may include a first exhaust port formed on one side of the chamber where the substrate entrance or exit is not formed. The second exhaust module may include a second exhaust port formed on one side of the chamber where the substrate entrance or exit is not formed. The diameter of the second exhaust port may be 3.5 to 4.5 times the diameter of the first exhaust port.
The load lock chamber according to this embodiment includes a chamber in which a substrate entrance is formed; A vacuum pump that depressurizes the interior of the chamber; It may include a first discharge module and a second discharge module formed on a side of the chamber where the substrate entrance is not formed, communicating with the vacuum pump, and discharging foreign substances from the chamber at different rates.

In addition, the substrate processing system according to this embodiment includes a transfer chamber installed with a robot for transferring the substrate; A plurality of process chambers are installed outside the transfer chamber and into which substrates are brought in and processed; A chamber in which a substrate entrance is formed, a vacuum pump that depressurizes the interior of the chamber, and a first discharge formed on a side of the chamber in which the substrate entrance is not formed, communicates with the vacuum pump and discharges foreign substances from the chamber at different rates. It may include a load lock chamber having a module and a second discharge module.

In addition, the foreign matter discharge method of the load lock chamber according to the present embodiment is a method of discharging foreign matter inside the chamber where the substrate entrance is formed using a vacuum pump, in which the foreign matter in the chamber is suspended (floating). discharging through a first discharge module formed in the chamber while discharging; And after closing the first discharge module, discharging foreign substances in the chamber through a second discharge module formed in the chamber with a suction force greater than the suction force of the vacuum pump when discharging foreign substances through the first discharge module. May include steps.

The load lock chamber and the method of discharging foreign substances from the load lock chamber according to an embodiment of the present invention gradually suspend foreign substances in the chamber and discharge them to the outside through the first discharge module with a relatively weak suction force, and then discharge them to the outside with a relatively strong suction force. 2 Since foreign substances in the chamber are quickly discharged through the discharge module, it can be effective in completely removing foreign substances in the chamber.

Additionally, since a plurality of exhaust ports are formed at the corners of the chamber, foreign substances in the chamber are dispersed and discharged. Then, the concentration of foreign substances in any one exhaust port is prevented, so foreign substances do not remain on the exhaust port side. This may have the effect of preventing contamination of the substrate by foreign substances remaining on the exhaust side.

In addition, since the exhaust port formed on one side of the chamber and the exhaust port formed on the other side communicate with separate vacuum pumps, even if a problem occurs in one vacuum pump, the chamber can be depressurized using the other vacuum pump. You can. Because of this, even if a problem occurs in any one vacuum pump, the substrate processing system including the load lock chamber can continue to operate, which may have the effect of improving productivity.

Figure 1 is a schematic plan cross-sectional view of a conventional load lock chamber.
Figure 2 is a plan view of a substrate processing system according to a first embodiment of the present invention.
Figure 3 is a schematic perspective view of the load lock chamber shown in Figure 2.
Figure 4a is a schematic plan cross-sectional view of Figure 3;
Figure 4b is an enlarged view of portion “A” of Figure 4a.
Figure 5 is a schematic perspective view of a load lock chamber according to a second embodiment of the present invention.
Figure 6 is a schematic perspective view of a load lock chamber according to a third embodiment of the present invention.

In this specification, it should be noted that when adding reference numbers to components in each drawing, the same components are given the same number as much as possible even if they are shown in different drawings.

Meanwhile, the meaning of the terms described in this specification should be understood as follows.

Singular expressions should be understood to include plural expressions unless the context clearly defines otherwise, and terms such as “first” and “second” are used to distinguish one element from another element. The scope of rights should not be limited by these terms.

Terms such as “include” or “have” should be understood as not precluding the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

The term “at least one” should be understood to include all possible combinations from one or more related items. For example, “at least one of item 1, item 2, and item 3” means each of item 1, item 2, or item 3, as well as item 2 of item 1, item 2, and item 3. It means a combination of all items that can be presented from more than one.

The term “and/or” should be understood to include all possible combinations from one or more related items. For example, “item 1, item 2, and/or item 3” means item 1, item 2, or item 3, as well as any two of item 1, item 2, or item 3. It means a combination of all the items that can be presented from the above.

When a component is referred to as being “connected or installed” to another component, it should be understood that it may be directly connected or installed to the other component, but that other components may also exist in between. On the other hand, when a component is referred to as being “directly connected or installed” to another component, it should be understood that there are no other components in between. Meanwhile, other expressions that describe the relationship between components, such as “between” and “immediately between” or “neighboring” and “directly adjacent to” should be interpreted similarly.

The identification code (e.g., S100, S110, S120, etc.) for each step is used for convenience of explanation. The identification code does not determine the order of each step, and each step is clearly specified in the context. Unless the order is specified, it may occur differently from the specified order. That is, each step may occur in the same order as specified, may be performed substantially simultaneously, or may be performed in the opposite order.

Hereinafter, the load lock chamber, the substrate processing system equipped therewith, and the method of discharging foreign substances from the load lock chamber according to embodiments of the present invention will be described in detail with reference to the attached drawings.

First embodiment

Figure 2 is a plan view of a substrate processing system according to a first embodiment of the present invention.

As shown, the substrate processing system according to the first embodiment of the present invention is equipped with a robot 61 for transferring the substrate S, and includes a transfer chamber 110 that maintains a vacuum state, and the transfer chamber 110 It is installed on the outside of the transfer chamber 110 in a form that surrounds the outer surface and is installed between the process chambers 150 and a plurality of process chambers 150 that provide space for processing the substrate S. It may include a load lock chamber 200 that contacts the external surface and temporarily stores the substrate S.

That is, the substrate processing system according to the first embodiment of the present invention is a cluster-type substrate processing in which each process chamber 150 that performs unit processes such as deposition process, photo process, or etching process is installed spatially adjacent to each other. It could be a system.

On one side of the load lock chamber 200, a storage unit 50 in an atmospheric state where the substrate S is stored may be installed, and the substrate S in the storage unit 50 may be stored in a cassette, etc. there is. Another robot 65 may be installed in the storage unit 50 to transport the substrate S.

The load lock chamber 200 receives the unprocessed substrates (S) from the storage unit 50 and temporarily stores them, or receives the processed substrates (S) from the process chamber 150 via the transfer chamber 110. It can be stored temporarily.

The processed substrate S of the process chamber 150 that is inputted into the load lock chamber 200 via the transfer chamber 110 and the processed substrate S of the transfer chamber 110 have the same meaning.

The load lock chamber 200 will be described with reference to FIGS. 2 to 4B. FIG. 3 is a schematic perspective view of the load lock chamber shown in FIG. 2, FIG. 4A is a schematic plan cross-sectional view of FIG. 3, and FIG. 4B is an enlarged view of portion “A” of FIG. 4A.

As shown, the load lock chamber 200 according to the first embodiment of the present invention provides a space in which the substrate S is stored, and the chamber 210 is formed in a hexahedral shape and the interior of the chamber 210 is depressurized. It may include a discharge unit for discharging foreign substances to the outside of the chamber 210.

The substrate S stored in the chamber 210 may be brought into the process chamber 150 via the transfer chamber 110 or taken out to the storage unit 50 .

In order to transfer the substrate (S) between the storage unit 50 and the chamber 210 or between the chamber 210 and the transfer chamber 110, the substrate (S) is provided on one and the other opposing surfaces of the chamber 210. The substrate entrances 211 and 213 may be formed to face each other. Additionally, an opening and closing plate that selectively opens and closes the substrate entrances 211 and 213 may be installed in the chamber 210, respectively. Therefore, the substrate entrance 211 can be selectively communicated with the storage unit 50 by the opening and closing plate, and the substrate entrance 213 can be selectively communicated with the transfer chamber 110.

Therefore, when it is desired to bring the substrate S from the storage unit 50 into the process chamber 150, the substrate entrance 211 is opened and the substrate S is introduced into the chamber 210 using the robot 65. , the substrate entrance 211 is closed. Afterwards, the discharge unit is driven to clean the inside of the chamber 210, and then the substrate entrance 213 is opened. Afterwards, the substrate S of the chamber 210 is loaded into the process chamber 150 by the robot 61 .

In addition, when the substrate (S) of the process chamber 150 is to be taken out to the storage unit 50, the substrate entrance 213 is opened, and then the substrate (S) of the process chamber 150 is removed using the robot 61. Injected into chamber 210. After that, the substrate entrance 213 is closed, the discharge unit is driven to clean the inside of the chamber 210, and the substrate entrance 211 is opened to remove the substrate from the chamber 210 using the robot 65. It is taken out to the storage unit (50).

The discharge unit may include a vacuum pump 230 and a discharge module 250, and discharges foreign substances in the chamber 210 to the outside of the chamber 210 in a suspended state, thereby Foreign substances can be completely discharged.

The discharge module 250 may be formed on one side of the chamber 210 where the substrate entrances 211 and 213 are not formed. At this time, the first discharge module 251 and the second discharge module 255 may be communicated with each other.

The first discharge module 251 includes a first exhaust port 252 formed on one side of the chamber 210, one side of which communicates with the vacuum pump 230, and the other side of which communicates with the first exhaust port 252. ) and a first valve 254 installed in the first pipe 253 to open and close the first pipe 253. At this time, a plurality of the first exhaust port 252, the first pipe 253, and the first valve 254 may be provided as a set.

The second discharge module 255 is a second exhaust port 256 formed on one side of the chamber 210 in which the first discharge module 251 is formed. One side is in communication with the vacuum pump 230 and the other side is a second exhaust port 256. ) may include a second pipe 257 in communication with the second pipe 257 and a second valve 258 installed in the second pipe 257 to open and close the second pipe 257.

The first discharge module 251 can discharge foreign substances in the chamber 210 while slowly floating them, and the second discharge module 255 can discharge foreign substances in the floating chamber 210 and foreign substances in the non-suspended chamber 210. It can be quickly discharged to the outside of the chamber 210.

To this end, the first exhaust port 252 and the first pipe 253 of the first discharge module 251 may be formed with the same diameter, and the second exhaust port 256 and the second pipe 253 of the second discharge module 255 may be formed. The conduits 257 may be formed with the same diameter. Also, the diameter of the second exhaust port 256 of the second exhaust module 255 may be larger than the diameter of the first exhaust port 252 of the first exhaust module 251. More preferably, the diameter of the second exhaust port 256 may be 3.5 to 4.5 times larger than the diameter of the first exhaust port 252. More specifically, the diameter of the second exhaust port 256 may be 95 to 105 mm, and the diameter of the first exhaust port 252 may be 21 to 30 mm.

Therefore, when the first discharge module 251 is intended to slowly suspend foreign substances in the chamber 210 and discharge the foreign substances in the chamber 210 to the outside, the suction power of the vacuum pump 230 can be relatively weakened, When attempting to discharge foreign substances in the chamber 210 to the outside through the second discharge module 255, it is natural that the suction power of the vacuum pump 230 can be relatively strong.

That is, with the second pipe 257 closed using the second valve 258, foreign substances in the chamber 210 are slowly suspended and discharged through the first discharge module 251, and then the first valve ( With the first pipe 253 closed using 254), foreign substances in the chamber 210 can be quickly discharged to the outside through the second discharge module 255. It is preferable that the suspension and discharge of foreign substances through the first discharge module 251 and the discharge of foreign substances through the second discharge module 255 alternate sequentially.

A baffle plate 270 may be installed inside the chamber 210 in a shape that approximately covers the second exhaust port 256. The baffle plate 270 can prevent foreign substances in the chamber 210 from concentrating on the central part of the second exhaust port 256 when discharging foreign substances in the chamber 210 to the outside through the second discharge module 255. there is.

In detail, the baffle plate 270 may be provided with a size slightly larger than the diameter of the second exhaust port 256, and a plurality of through holes 272 may be formed. The baffle plate 270 may have a gap with the inner surface of the chamber 210 and be spaced apart from the second exhaust port 256. Then, when discharging foreign substances in the chamber 210 through the second discharge module 255, the foreign substances in the chamber 210 pass through the through hole 272 and the outer peripheral surface of the baffle plate 270 through the second exhaust port 256. ), foreign substances in the chamber 210 may flow in through the entire second exhaust port 256.

The load lock chamber 200 and the substrate processing system equipped with the same according to the first embodiment of the present invention gradually float foreign substances in the chamber 210 through the first discharge module 251 using a relatively weak suction force. After discharging to the outside, the foreign substances in the chamber 210 are quickly discharged to the outside through the second discharge module 255 using a relatively strong suction force, so that the foreign substances in the chamber 210 can be completely removed.

And, since the first exhaust port 252 and the second exhaust port 256 are formed at the corners of the chamber 210, foreign substances in the chamber 210 are dispersed toward the first exhaust port 252 and the second exhaust port 256. and is discharged. Then, compared to the case where only one exhaust port is formed, the concentration of foreign substances on the exhaust port side is prevented, so foreign substances do not remain on the first exhaust port 252 and the second exhaust port 256 side. As a result, the substrate S is prevented from being contaminated by foreign substances remaining in the first exhaust port 252 and the second exhaust port 256.

A method for discharging foreign substances from a load lock chamber according to the first embodiment of the present invention configured as described above will be described.

First, the chamber 210 is depressurized through the first discharge module 251. At this time, the suction power of the vacuum pump 230 is adjusted so that foreign substances in the chamber 210 can float and be slowly discharged through the first exhaust port 252. Thereafter, after closing the first discharge module 251, the foreign matter in the chamber 210 is removed to the second discharge using a suction force greater than the suction power of the vacuum pump 230 when discharging the foreign matter through the first discharge module 251. It is discharged through the discharge module (255).

At this time, the diameter of the second exhaust port 256 is preferably larger than the diameter of the first exhaust port 252, and more preferably 3.5 to 4.5 times.

Second embodiment

Figure 5 is a schematic perspective view of a load lock chamber according to a second embodiment of the present invention, and only the differences from the first embodiment are explained.

As shown, the load lock chamber 300 according to the second embodiment of the present invention has a first discharge module 351 and a second discharge module 355 facing each other without substrate entrances 311 and 313. may be formed on one side and the other side of the chamber 310, respectively.

At this time, the first discharge module 351 and the second discharge module 355 installed on one side of the chamber 310 may be in communication with one vacuum pump 330, and installed on the other side of the chamber 310. The first discharge module 351 and the second discharge module 355 may be in communication with another vacuum pump 330. That is, the first discharge module 351 and the second discharge module 355 installed on one side of the chamber 310 communicate with the vacuum pump 330 and the first discharge module 351 installed on the other side of the chamber 310. ) and the second discharge module 355 may be provided separately from the vacuum pump 330.

Then, even if a problem occurs in one of the vacuum pumps 330, the chamber 310 can be depressurized using the other vacuum pump 330, so even if a problem occurs in one of the vacuum pumps 330, The substrate processing system including the load lock chamber 300 can continue to operate.

Third embodiment

Figure 6 is a schematic perspective view of a load lock chamber according to a third embodiment of the present invention, and only the differences from the second embodiment are explained.

As shown, the load lock chamber 400 according to the third embodiment of the present invention includes a first discharge module 451 and a second discharge module 455 installed on one side of the chamber 410 and communicating with each other. The first discharge module 451 and the second discharge module 455, which are installed on the other side of the chamber 210 and communicate with each other, may be communicated with each other through a communication pipe 460. Additionally, a vacuum pump 430 may be installed in communication with the communication pipe 460.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and it is known in the technical field to which the present invention pertains that various substitutions, modifications, and changes are possible without departing from the technical spirit of the present invention. It will be clear to those who have the knowledge of. Therefore, the scope of the present invention is indicated by the claims described later, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

200: Road lock chamber
210: chamber
211, 213: Board entrance
230: Vacuum pump
251: First discharge module
255: Second discharge module

Claims (10)

A chamber in which a substrate entrance is formed;
A vacuum pump that depressurizes the interior of the chamber;
A first discharge module installed on one side of the chamber; and
It includes a second discharge module installed on one side of the chamber,
One side of the first discharge module and one side of the second discharge module are connected to the vacuum pump,
The other side of the first exhaust module is connected to a first exhaust port formed on one side of the chamber where the substrate entrance is not formed,
The other side of the second discharge module is connected to a second exhaust port formed on one side of the chamber where the substrate entrance is not formed,
The diameter of the second exhaust port is 3.5 to 4.5 times the diameter of the first exhaust port,
A baffle plate disposed inside the chamber to cover the second exhaust port,
A load lock chamber, characterized in that foreign matter in the chamber flows into the second exhaust port through the outer peripheral surface of the baffle plate. According to paragraph 1,
A load lock chamber further comprising a first discharge module and a second discharge module installed on the other side of the chamber. According to paragraph 2,
The vacuum pump is in communication with the first discharge module and the second discharge module installed on one side of the chamber, and the vacuum pump is in communication with the first discharge module and the second discharge module installed on the other side of the chamber. A load lock chamber characterized by being separate. delete In the method of discharging foreign substances from the load lock chamber, which uses a vacuum pump to discharge foreign substances inside the chamber where the substrate entrance is formed,
Discharging foreign substances in the chamber through a first discharge module formed in the chamber while floating them; and
After closing the first discharge module, discharging foreign substances in the chamber through a second discharge module formed in the chamber with a suction force greater than the suction force of the vacuum pump when discharging foreign substances through the first discharge module. Including,
One side of the first discharge module and one side of the second discharge module are connected to the vacuum pump,
The other side of the first exhaust module is connected to a first exhaust port formed on one side of the chamber where the substrate entrance is not formed,
The other side of the second discharge module is connected to a second exhaust port formed on one side of the chamber where the substrate entrance is not formed,
The second exhaust module includes a second exhaust port formed on a side of the chamber,
The step of discharging through the second discharge module is a load lock characterized in that foreign matter in the chamber flows into the second exhaust port through the outer peripheral surface of the baffle plate disposed inside the chamber to cover the second exhaust port. Method of discharging foreign substances from the chamber. According to clause 5,
A method of discharging foreign substances from a load lock chamber, wherein the diameter of the second exhaust port is 3.5 to 4.5 times larger than the diameter of the first exhaust port. delete delete delete delete

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