KR200205143Y1 - Apparatus for chucking wafer - Google Patents

Apparatus for chucking wafer Download PDF

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Publication number
KR200205143Y1
KR200205143Y1 KR2019970026111U KR19970026111U KR200205143Y1 KR 200205143 Y1 KR200205143 Y1 KR 200205143Y1 KR 2019970026111 U KR2019970026111 U KR 2019970026111U KR 19970026111 U KR19970026111 U KR 19970026111U KR 200205143 Y1 KR200205143 Y1 KR 200205143Y1
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South Korea
Prior art keywords
wafer
dicing
mounting table
semiconductor wafer
frame
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KR2019970026111U
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Korean (ko)
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KR19990012936U (en
Inventor
황정걸
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김영환
현대반도체주식회사
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Priority to KR2019970026111U priority Critical patent/KR200205143Y1/en
Publication of KR19990012936U publication Critical patent/KR19990012936U/en
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Publication of KR200205143Y1 publication Critical patent/KR200205143Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Abstract

본 고안은 반도체 웨이퍼 척킹장치에 관한 것으로, 종래에는 테이프 마운팅 공정과 다이싱 공정이 각각 다른 장비에서 수행되므로 웨이퍼를 옮기는 등의 공정으로 공정시간이 길고, 각각의 장비에 따른 설치면적이 큰 문제점이 있었던바, 본 고안의 반도체 웨이퍼 척킹장치는 웨이퍼의 테이프 마운팅과 다이싱을 한 개의 장비에서 수행할 수 있도록 하여 공정시간을 줄이고 장비의 설치면적도 줄이도록 한 것이다.The present invention relates to a semiconductor wafer chucking apparatus. In the related art, since the tape mounting process and the dicing process are performed in different equipment, the process time is long, such as a wafer transfer process, and the installation area of each equipment is large. As such, the semiconductor wafer chucking device of the present invention allows tape mounting and dicing of wafers to be performed in a single device, thereby reducing the process time and reducing the installation area of the device.

Description

반도체 웨이퍼 척킹장치{APPARATUS FOR CHUCKING WAFER}Semiconductor Wafer Chucking Device {APPARATUS FOR CHUCKING WAFER}

본 고안은 반도체 제조장비에 관한 것으로, 특히 반도체 제조공정 중 테이프 마운팅(tape mounting)과 다이싱(dicing)을 동시에 할 수 있는 반도체 웨이퍼 척킹(chucking)장치에 관한 것이다.The present invention relates to a semiconductor manufacturing equipment, and more particularly, to a semiconductor wafer chucking apparatus capable of simultaneously performing tape mounting and dicing during a semiconductor manufacturing process.

종래의 반도체 제조장비는 웨이퍼를 개개의 칩으로 절단하기 위해서 웨이퍼의 일면을 고정시키도록 웨이퍼에 테이프를 마운팅하는 척 테이블과 이 웨이퍼를 개개의 칩으로 절단하는 다이싱공정을 위한 척 테이블이 각각 존재하여 각 장비별로 공정을 수행할 수 있도록 되어 있었다.Conventional semiconductor manufacturing equipment has a chuck table for mounting a tape on a wafer to fix one side of the wafer to cut the wafer into individual chips, and a chuck table for a dicing process for cutting the wafer into individual chips. To perform the process for each piece of equipment.

상기와 같은 종래의 반도체 제조장비를 이용하여 웨이퍼를 다이싱하는 공정을 설명하면 다음과 같다.Referring to the process of dicing the wafer using the conventional semiconductor manufacturing equipment as described above are as follows.

먼저, 테이프 마운팅 장비에서 테이프 마운팅을 위한 척 테이블에 웨이퍼를 올려 놓은 후 테이프를 접착시킨다.First, the wafer is placed on the chuck table for tape mounting in the tape mounting apparatus, and then the tape is adhered.

이후 테이프 마운팅이 완료되면 테이프가 접착된 상태의 웨이퍼를 다이싱 장비의 척 테이블에 놓고 다이싱 작업을 수행한다.After the tape mounting is completed, the tape-bonded wafer is placed on the chuck table of the dicing equipment and dicing is performed.

그러나, 상기와 같은 종래의 반도체 제조장비는 테이프 마운팅 공정과 다이싱 공정이 각각 다른 장비에서 수행되므로 웨이퍼를 옮기는 등의 공정으로 공정시간이 길고, 각각의 장비에 따른 설치면적이 큰 문제점이 있었던바, 이에 대한 보완이 요구되어 왔다.However, in the conventional semiconductor manufacturing equipment as described above, since the tape mounting process and the dicing process are performed in different equipment, the process time is long due to the process of moving the wafer, and the installation area according to each equipment has a large problem. However, a supplement has been required.

따라서, 본 고안은 상기와 같은 문제점을 감안하여 안출한 것으로서, 웨이퍼의 테이프 마운팅과 다이싱을 한 개의 장비에서 수행할 수 있는 반도체 웨이퍼 척킹장치를 제공하는데 그 목적이 있다.Accordingly, an object of the present invention is to provide a semiconductor wafer chucking apparatus capable of performing tape mounting and dicing of wafers in one device in view of the above problems.

도 1은 본 고안에 따른 반도체 웨이퍼 척킹장치의 구성을 도시한 종단면도.1 is a longitudinal sectional view showing a configuration of a semiconductor wafer chucking apparatus according to the present invention;

도 2는 본 고안의 척킹장치를 이용하여 테이프 마운팅을 하는 것을 도시한 종단면도.Figure 2 is a longitudinal sectional view showing the tape mounting using the chucking device of the present invention.

도 3은 본 고안의 척킹장치를 이용하여 다이싱을 하는 것을 도시한 종단면도.Figure 3 is a longitudinal sectional view showing the dicing using the chucking device of the present invention.

(도면의 주요부분에 대한 부호의 설명)(Explanation of symbols for main parts of drawing)

1 ; 마운팅 테이블 2 ; 다이싱 테이블One ; Mounting table 2; Dicing table

3 ; 회전축 4 ; 프레임 고정부3; Axis of rotation 4; Frame fixing

5 ; 웨이퍼 6 ; 프레임5; Wafer 6; frame

7 ; 프레임 진공라인 8 ; 마운팅 테이블 진공라인7; Frame vacuum line 8; Mounting Table Vacuum Line

9 ; 공기라인 10 ; 다이싱 테이블 진공라인9; Air line 10; Dicing Table Vacuum Line

11 ; 테이프11; tape

상기와 같은 목적을 달성하기 위하여 본 고안은 웨이퍼에 테이프를 접착시키기 위한 마운팅 테이블이 상면에 설치되고, 웨이퍼를 다이싱하기 위한 다이싱 테이블이 하면에 설치된 척 테이블과; 이 척 테이블의 양측에 회전가능하게 설치되어 상기 마운팅 테이블과 다이싱 테이블의 위치를 교체시키는 회전축과; 이 회전축의 일단에 설치되어 다이싱 작업시 상기 테이프를 고정시키기 위한 고정부를 포함하여 구성된 것을 특징으로 하는 반도체 웨이퍼 척킹장치가 제공된다.In order to achieve the above object, the present invention is a mounting table for adhering a tape to a wafer is provided on the upper surface, the dicing table for dicing the wafer is installed on the lower surface of the chuck table; Rotating shafts rotatably installed at both sides of the chuck table to replace positions of the mounting table and the dicing table; Provided is a semiconductor wafer chucking device which is provided at one end of the rotary shaft and comprises a fixing part for fixing the tape during a dicing operation.

이하, 본 고안의 반도체 웨이퍼 척킹장치의 일실시예를 첨부한 도면을 참조로 하여 상세히 설명한다.Hereinafter, an embodiment of a semiconductor wafer chucking apparatus of the present invention will be described in detail with reference to the accompanying drawings.

첨부한 도 1은 본 고안에 따른 반도체 웨이퍼 척킹장치의 구성을 도시한 부분종단면도로서, 이에 도시한 바와 같이, 본 고안의 척킹장치는 테이프 마운팅과 다이싱을 하기 위한 척 테이블(100)과, 이 척 테이블(100)을 회전시킬 수 있도록 척 테이블(100)의 양측에 회전가능하게 설치되는 회전축(3)과, 이 회전축(3)의 일단에 설치되는 프레임 고정부(4)를 포함하여 구성된다.1 is a partial longitudinal cross-sectional view showing the configuration of a semiconductor wafer chucking device according to the present invention, as shown in the drawing, the chucking device of the present invention includes a chuck table 100 for tape mounting and dicing; It comprises a rotating shaft (3) rotatably installed on both sides of the chuck table (100) so as to rotate the chuck table (100), and a frame fixing part (4) provided at one end of the rotating shaft (3). do.

또한 상기 프레임 고정부(4)의 상면에는 다이싱 작업시 웨이퍼에 마운팅된 테이프를 고정시키기 위한 프레임(6)이 놓이게 된다.In addition, the frame 6 for fixing the tape mounted on the wafer during the dicing operation is placed on the upper surface of the frame fixing part (4).

상기 척 테이블은 웨이퍼(5)에 테이프(11)를 접착시키기 위한 마운팅 테이블(1)이 일면에 설치되어 있고, 그 반대면에는 웨이퍼(5)를 다이싱하기 위한 다이싱 테이블(2)이 설치되어 있다.The chuck table is provided with a mounting table 1 for attaching the tape 11 to the wafer 5 on one side thereof, and a dicing table 2 for dicing the wafer 5 on the opposite side thereof. It is.

첨부한 도 2는 본 고안에 따른 척 테이블을 이용하여 테이프 마운팅을 수행하는 것을 도시한 것으로, 이에 도시한 바와 같이, 상기 마운팅 테이블(1)은 웨이퍼(5)가 올려지면 웨이퍼(5)의 가장자리만을 지지할 수 있도록 웨이퍼(5)의 가장자리를 제외한 부분은 웨이퍼(5)와 접하지 않도록 홈이 형성된 구조이다.Attached FIG. 2 illustrates tape mounting using a chuck table according to the present invention. As shown in FIG. 2, the mounting table 1 has an edge of the wafer 5 when the wafer 5 is lifted up. The portion except the edge of the wafer 5 to support only the groove is formed so that the grooves are not in contact with the wafer 5.

또한 웨이퍼(5)와 접하는 상기 마운팅 테이블(1)의 가장자리에는 웨이퍼(5)가 마운팅 테이블(1)에 올려진 후 진공압을 가하여 웨이퍼(5)를 마운팅 테이블(1)에 고정시킬 수 있도록 마운팅 테이블 진공라인(vacumm line)(8)이 설치되어 있고, 마운팅 테이블(1)의 중앙에는 웨이퍼(5)에 테이프(11)를 접착시킬 때 웨이퍼(5)의 중앙부가 처지는 것을 방지하도록 공기압을 가하는 공기라인(air line)(9)이 설치되어 있다.In addition, the wafer 5 is mounted on the mounting table 1 at the edge of the mounting table 1, which is in contact with the wafer 5, and then mounted so that the wafer 5 can be fixed to the mounting table 1 by applying a vacuum pressure. A table vacuum line 8 is provided, and at the center of the mounting table 1, air pressure is applied to prevent the center portion of the wafer 5 from sagging when the tape 11 is adhered to the wafer 5. An air line 9 is provided.

상기 프레임 고정부(4)의 내부에도 다이싱 작업시 웨이퍼(5)에 마운팅된 테이프를 고정시키기 위해 프레임 고정부(4)의 상면에 놓이는 프레임(6)을 고정시킬 수 있도록 진공압을 가하는 프레임 진공라인(7)이 설치되어 있다.The frame to which vacuum pressure is applied to fix the frame 6 placed on the upper surface of the frame fixing part 4 to fix the tape mounted on the wafer 5 in the dicing operation also inside the frame fixing part 4. The vacuum line 7 is provided.

또한, 상기 다이싱 테이블(2)의 내부에도, 도 3에서 보는 바와 같이, 웨이퍼(5)를 고정시킬 수 있는 다이싱 테이블 진공라인(10)이 설치되어 있다.Moreover, as shown in FIG. 3, the dicing table vacuum line 10 which can fix the wafer 5 is provided also inside the said dicing table 2.

상기와 같은 구성의 반도체 웨이퍼 척킹장치의 동작을 설명하면 다음과 같다.Referring to the operation of the semiconductor wafer chucking device of the above configuration is as follows.

먼저, 도 2에 도시한 바와 같이, 테이프(11)를 접착시키기 위한 마운팅 테이블(1) 위에 웨이퍼(5)를 올려 놓고 마운팅 테이블 진공라인(8)을 온(on)시킨다.First, as shown in FIG. 2, the wafer 5 is placed on the mounting table 1 for attaching the tape 11, and the mounting table vacuum line 8 is turned on.

프레임 고정부(4)에 프레임(6)을 올려놓고 프레임 진공라인(7)을 온(on)시킨다.The frame 6 is placed on the frame fixing part 4 and the frame vacuum line 7 is turned on.

이때 웨이퍼(5)가 밑으로 처지는 것을 방지하도록 마운팅 테이블(1)의 중앙부에 설치되어 있는 공기라인(9)을 온(on)시킨 후 웨이퍼(5)와 프레임(6)에 테이프(11)를 접착시키면 테이프 마운팅 작업이 완료된다.At this time, the air line 9 installed at the center of the mounting table 1 is turned on to prevent the wafer 5 from falling down, and then the tape 11 is attached to the wafer 5 and the frame 6. Gluing completes the tape mounting operation.

이후, 다이싱 작업을 수행하기 위해서 테이프(11)와 프레임(6)이 부착된 상태의 웨이퍼(5)를 들어올려 180°회전시키고, 상기 회전축(3)을 180°회전시켜 다이싱을 위한 다이싱 테이블(2)이 위를 향하게 한다.Subsequently, in order to perform a dicing operation, the wafer 5 having the tape 11 and the frame 6 attached thereto is lifted and rotated 180 °, and the rotating shaft 3 is rotated 180 ° to die for dicing. The Singh table 2 is facing up.

테이프 마운팅이 완료되고 180°회전한 웨이퍼(5)를 다이싱 테이블(2) 위에 올려 놓고, 프레임 진공라인(7)과 다이싱 테이블 진공라인(10)을 온(on)시켜 테이프(11)가 접착된 웨이퍼(5)를 다이싱 테이블(2)에 고정시킨다.The tape mounting is completed and the wafer 5 rotated 180 ° is placed on the dicing table 2, and the frame vacuum line 7 and the dicing table vacuum line 10 are turned on to turn the tape 11 on. The bonded wafer 5 is fixed to the dicing table 2.

이후 다이싱 작업을 실시한다.After that, dicing is performed.

본 고안의 반도체 웨이퍼 척킹장치에 의하면 테이프 마운팅 작업과 다이싱 작업을 한 개의 척 테이블에서 수행할 수 있으므로 웨이퍼를 옮기는 등의 공정시간을 단축시킬 수 있고 장비의 설치면적을 감소시킬 수 있는 효과가 있다.According to the semiconductor wafer chucking device of the present invention, tape mounting and dicing can be performed in one chuck table, so that the processing time such as wafer transfer can be shortened and the installation area of the equipment can be reduced. .

Claims (7)

웨이퍼에 테이프를 접착시키기 위한 마운팅 테이블이 상면에 설치되고, 웨이퍼를 다이싱하기 위한 다이싱 테이블이 하면에 설치된 척 테이블과; 이 척 테이블의 양측에 회전가능하게 설치되어 상기 마운팅 테이블과 다이싱 테이블의 위치를 교체시키는 회전축과; 이 회전축의 일단에 설치되어 다이싱 작업시 상기 테이프를 고정시키기 위한 고정부를 포함하여 구성된 것을 특징으로 하는 반도체 웨이퍼 척킹장치.A chuck table having a mounting table for adhering a tape to a wafer on an upper surface thereof, and a dicing table for dicing a wafer provided on a lower surface thereof; Rotating shafts rotatably installed at both sides of the chuck table to replace positions of the mounting table and the dicing table; A semiconductor wafer chucking device, comprising: a fixing part provided at one end of the rotary shaft to fix the tape during a dicing operation. 제1항에 있어서, 상기 고정부는 상기 회전축의 일단에 설치되는 프레임 고정부와, 이 프레임 고정부의 상면에 놓여 다이싱 작업시 웨이퍼에 마운팅된 테이프를 고정시키기 위한 프레임으로 구성되는 것을 특징으로 하는 반도체 웨이퍼 척킹장치.The method of claim 1, wherein the fixing portion is composed of a frame fixing portion installed on one end of the rotating shaft, and a frame for fixing the tape mounted on the wafer during the dicing operation is placed on the upper surface of the frame fixing portion Semiconductor wafer chucking device. 제1항에 있어서, 상기 마운팅 테이블은 웨이퍼의 가장자리만을 지지할 수 있도록 웨이퍼의 가장자리와 접하는 부분을 제외한 부분에 홈이 형성된 것을 특징으로 하는 반도체 웨이퍼 척킹장치.The semiconductor wafer chucking apparatus of claim 1, wherein the mounting table has grooves formed at portions other than the portion in contact with the edge of the wafer so as to support only the edge of the wafer. 제3항에 있어서, 상기 마운팅 테이블의 가장자리 내부에는 상기 마운팅 테이블과 접한 웨이퍼에 진공압을 가하여 웨이퍼를 상기 마운팅 테이블에 고정시키도록 마운팅 테이블 진공라인이 설치되는 것을 특징으로 하는 반도체 웨이퍼 척킹장치.The semiconductor wafer chucking apparatus of claim 3, wherein a mounting table vacuum line is installed inside the edge of the mounting table to apply a vacuum pressure to the wafer in contact with the mounting table to fix the wafer to the mounting table. 제5항에 있어서, 상기 마운팅 테이블의 중앙에는 웨이퍼의 중앙부가 밑으로 처지는 것을 방지하도록 공기압을 가하는 공기라인이 설치되는 것을 특징으로 하는 반도체 웨이퍼 척킹장치.6. The semiconductor wafer chucking device according to claim 5, wherein an air line for applying air pressure is installed at the center of the mounting table to prevent the center portion of the wafer from sagging. 제2항에 있어서, 상기 프레임 고정부의 내부에는 상기 프레임 고정부의 상면에 놓이는 프레임을 고정시키도록 진공압을 가하는 프레임 진공라인이 설치되는 것을 특징으로 하는 반도체 웨이퍼 척킹장치.The semiconductor wafer chucking apparatus of claim 2, wherein a frame vacuum line is applied to the frame fixing part to apply a vacuum pressure to fix the frame placed on the upper surface of the frame fixing part. 제1항에 있어서, 상기 다이싱 테이블의 내부에는 상기 다이싱 테이블에 올려진 웨이퍼를 고정시키기 위한 다이싱 테이블 진공라인이 설치되는 것을 특징으로 하는 반도체 웨이퍼 척킹장치.The semiconductor wafer chucking apparatus of claim 1, wherein a dicing table vacuum line is installed in the dicing table to fix the wafer on the dicing table.
KR2019970026111U 1997-09-19 1997-09-19 Apparatus for chucking wafer KR200205143Y1 (en)

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