KR200204702Y1 - Spacing table with individual ceramic guide per passing groove for steel wire in continuous multi-wire electroplating - Google Patents

Abstract

The present invention relates to a wiring rod used in a continuous multiple electroplating line of steel wire.

The continuous multi-electroplating wiring board to which the individual wire guide of the present invention is mounted includes a wiring board body, two guide cases attached to the front and rear surfaces in the width direction of the wiring board body, and a plurality of guide assembly grooves formed in the guide case. In the wire guide to be mounted, a plurality of bolt assembly holes for coupling with the guide case is formed on the front and rear surfaces in the width direction of the wiring board body, the guide case is equal to the number of wire passing grooves formed in the wiring board body. The wire through groove is formed, the wire guide assembly groove is formed integrally with the through groove of the guide case has a technical feature in that the wire guide is mounted.

That is, the front and rear two wire guides are mounted on each of the inlet and outlet of each passage groove of the wiring board body, which is a passage of the plated wire, which proceeds continuously. It minimizes the wear or damage of wire guide by wire.

The wiring board of the present invention is equipped with two guides in each passage groove of the wiring board body to effectively distribute the downward pressure applied to the wire to minimize the wear and damage of the guide to reduce the consumption of the guide, accordingly As the contact of the wire is stabilized, there is an effect of reducing the occurrence of poor plating, and because only the damaged guide is replaced, the maintenance of the wire guide is easy, and in case of poor plating due to the damage of the wire guide, only the wire guide can be replaced. Bar can minimize the downtime of the plating equipment according to the wire guide replacement, there is an effect to increase the wire plating productivity.

Description

Spacing table with individual ceramic guide per passing groove for steel wire in continuous multi-wire electroplating}

The present invention has a number of individual wire guides that support the wires that are in contact with the electrode in the continuous multiple electroplating lines of steel wires (hereinafter referred to as "wires") and the bottom of the wire passage groove of the wiring board body to prevent contact. More particularly, the mounting of the wiring board, and more specifically, the wire passing through the wiring board body that can support the wire, in the width direction front and rear surface of the wiring board body that serves to maintain the gap between the wires in the electrolytic cell By distributing the downward contact pressure by the electrode by installing the 'U' shaped individual wire guide as many as the number of grooves, stabilizing the contact state between the wire and the electrode while minimizing the damage of the wire guide, Quality of electroplated layer by replacing only broken guides Sikkim and improve at the same time related to maintenance for the wiring for a number of consecutive multi-equipped electric private wire guide so to reduce repair costs of plating the wire guide.

Continuous multi-wire electroplating is a plating method in which an electroplating layer is formed on the surface of a plurality of wires which progress at a high speed in one electrolytic cell. In order to prevent a short circuit between adjacent wires during a plurality of wires, At least one wiring board is installed along the length of the plating bath to maintain a constant gap between the plurality of wires that proceed simultaneously.

The planar shape of the wiring rod is usually a rectangular shape, and the longitudinal direction thereof coincides with the width direction of the electrolytic cell, and the width direction coincides with the traveling direction of the plated wire, which is the longitudinal direction of the electrolytic cell. Therefore, in order to prevent electrical short between the wires and maintain a constant gap, a plurality of grooves are formed so that the wires can pass while maintaining a proper gap in the wiring width direction.

Electroplating of the wire proceeds by depositing the wire in an electrolyte in which the plating metal to be plated is in a cation state, and then applying a direct current power so that the plated material becomes a '-' electrode. As pyrophosphoric acid or zinc sulfate is used, the wiring board is made of polypropylene or plastics which are not corroded by acid or alkali.

As described above, the wiring board made of synthetic resin is a place where an electrode rod for supplying electricity to the wire in contact with the wire is located in the recess, in addition to maintaining a constant gap between the wires. In order to keep the traveling height constant so that the wire which proceeds at high speed by pressure is in contact with the bottom surface of the wire passing groove formed in the wiring board and is not damaged by frictional contact, Ceramic rods are installed.

The top view, sectional drawing, and front view of the said conventional wiring board are shown in FIG.

As shown, the wiring board 1 has a plurality of passage grooves 1A, which are referred to as recesses in the above, from the wiring board front surface 1B to the rear surface 1C and the upper surface 1D when the plurality of passage grooves 1A. It is formed to have a certain depth in the (1E) direction.

The electrode insertion grooves 1F into which the electrode rods are inserted are alternately formed in each of the passage grooves 1A near the front and rear surfaces 1B and 1C of the wiring rod, and the wiring rod is disposed on the bottom surface of the electrode insertion groove 1F. An electrolyte adjusting groove 1G penetrates to the lower surface 1E is formed.

The adjusting groove 1G is inserted perpendicularly to the bottom surface of the electrode insertion groove 1F in the electrode insertion groove 1F so that the electrolyte filled between the electrode and the bottom prevents the vertical movement of the electrode contacting the wire 13. In order to prevent this, the electrolyte can move more smoothly through the adjusting groove 1G.

In the widthwise center of the wiring board 1, a ceramic rod 12 for supporting the in-process plated wire 13 upward to prevent contact between the bottom of the passage groove 1A and the wire of the wiring board has a length of the wiring board. Direction is installed.

As shown in the enlarged partial view of the front view of the wiring diagram shown in FIG. 2 showing the state in which the electrode is mounted, the electrode rod (eg, to supply electricity to the wire 13 passing through the passage groove 1A of the wiring board 1). 2) is in downward contact with the wire 13, it is installed so as to protrude slightly from the bottom (1H) in order to maintain contact between the electrode and the wire and to prevent contact damage of the bottom surface (1H) of the wiring passage through grooves by the wire. The ceramic rod 12 is inevitably damaged by contact friction with the continuous wire 13, which is a change in the contact pressure between the electrode and the electrode that is in contact with the damaged ceramic rod, which is the electrode and the wire. Inducing a poor contact between them will result in a plating failure.

However, the ceramic rod is mounted in such a manner that the upper end of the outer circumferential surface of the ceramic rod is inserted into the central portion of the wiring rod in the longitudinal direction of the wiring rod as described above, so that the ceramic rod may not be damaged. The entire ceramic rod should be replaced even if it is damaged, or the wire should not be passed through the damaged part. There is a problem that the raw unit of the ceramic rod is increased and the productivity decreases, and the replacement time of the ceramic rod is also high. .

The present invention is devised to solve the above problems, it is attached to the front and rear surface of the wiring rod to support the wire to distribute the downward pressure of the wire to extend the service life, it is easy to determine whether damage It is an object of the present invention to provide a wiring board equipped with a wire guide that is individually attached to each wire passing groove rather than an integrated unit that can easily replace only a damaged part.

1 shows a conventional wiring board,

(A) is a plan view,

(B) is front view.

2 is a partially enlarged view of a conventional wiring board equipped with an electrode.

3 shows the present invention wiring board,

(A) is a plan view,

(B) is front view.

4 shows the present invention wire guide,

(A) is a front view,

(B) is a side view.

5 is a view showing the subject innovation guide case,

(A) is a perspective view,

(B) is a top view.

Figure 6 is an enlarged view showing the assembly state of the present invention guide case and the wire guide.

((Explanation of symbols for main part of drawing))

1. Wiring board 2. Electrode

12. Ceramic rods 13. Wire

32. Wire guide 33. Guide case

The above object of the present invention is an integral type for attaching a wire guide to the width direction front and rear surfaces of a wire wiring board body (conventional wiring board) provided on the inlet side and the outlet side wire movement path of a conventional continuous multi-wire electroplating bath. It is achieved by a wire guide formed with a 'U' shaped groove is inserted into the guide case and the guide assembly groove formed in the guide case.

The continuous multi-electroplating wiring board to which the individual wire guide of the present invention is mounted is mounted on the wiring board body, two guide cases attached to the front and rear surfaces of the wiring board, and a plurality of guide assembly grooves formed on the guide case. Consists of a wire guide.

A plurality of bolt assembly holes for coupling with the guide case are formed on the front and rear surfaces of the wiring board body constituting the inventive wiring board, and the guide case has the same number of wires as the number of wire passing grooves formed in the wiring board body. The through groove is formed, the wire guide assembly groove is formed integrally with the through groove of the guide case has a technical feature in that the wire guide is mounted.

In other words, the front and rear two wire guides are mounted on each of the inlet and outlet of each passage groove of the wiring board body, which is the passage of the plated wire, to advance the contact pressure for the electrode to press the wire to two places. Dispersion minimizes wear and damage to wire guides by wires.

The wire guide mounted on the wiring board body of the present invention is not directly attached to the wiring board body, and the integrated guide case is coupled to the wiring board, and then a guide assembly groove is formed between the back of the guide case and the front and rear of the wiring board body. Only the damaged guide can be easily replaced because it is mounted by inserting the wire guide into the socket.

The purpose and detailed technical characteristics and effects of the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

3A and 3B illustrate a plan view and a front view of a continuous multi-electroplating wiring board equipped with the individual ceramic guide of the present invention.

As shown, the wiring board 3 of the present invention has a plurality of wire passing grooves 31A formed in the width direction of the wiring board body 31, and the front and rear surfaces 31B and 31C in the width direction of the wiring board body. The guide case 33 is attached to each other, and one wire guide 32 is mounted in each of the guide assembly grooves (33C in FIG. 5) formed by the guide case on each entry and exit side of the wiring board body. That is, two wire guides are mounted in one wire passage groove 31A of the wiring board body, one at the entry and exit side.

4A and 4B show front and side views of the wire guide mounted on the inventive wiring board body, and a perspective view and a plan view of the guide case are shown in FIGS. 5A and 5B.

As shown, the wire guide 32 has an overall rectangular parallelepiped shape, and the 'U'-shaped through groove 32C, which is a passage through which the wire passes from the front surface 32A to the rear surface 32B, is formed from the center of the guide upper surface 32D. Since the guide main body 32 is formed to the center part in the longitudinal direction, it is a structure which not only supports the downward pressure of the electrode rod applied to a wire, but also suppresses the left-right movement of a wire.

In addition, the guide case 33 attached to the front and rear surfaces in the width direction of the inventive wiring board body 31 has through holes 33A corresponding to the number of wire passing grooves formed in the wiring board body at the rear of the guide case front surface 33D. It is penetrated by 33E.

The through groove 33A is formed in the width direction center from the guide case upper surface 33B by a predetermined length, and is formed in the same width only from the guide case front surface 33D to the rear surface 33E direction to the same thickness, and from the predetermined thickness to the rear surface. The width and depth are extended to 33E to form a guide assembly groove 33C space into which the wire guide 32 can be inserted.

In addition, the width of the through groove 33A of the guide case is wider than the width of the 'U'-shaped through groove 32C formed in the guide, and the through groove 33A and the guide assembly groove 33C of the guide case are integrated. It is formed as, the front 33D of the guide case is formed with a plurality of bolt assembly hole (33F) used for coupling with the wiring board.

6 illustrates a partial assembly view of the guide and the guide case.

As shown in the drawing, after attaching the integrated guide case 33 as a bolt 6 to the front and rear surfaces of the wiring board body in the width direction, guide assembly grooves respectively formed between the guide case 33 and the front and rear surfaces of the wiring board ( The structure of this invention wiring stand is completed by inserting the wire guide 32 into 33C).

As described above, the wiring board of the present invention is wired by the electrode rod, each one is mounted on the entry and exit side of the through groove formed in the wiring board body that the wire guide is a passage through which the wire proceeds By effectively dispersing the downward pressure applied to the bar to minimize the wear and damage of the guide, the consumption of the guide is reduced, thereby stabilizing the contact between the electrode and the wire has the effect of reducing the occurrence of plating failure.

In addition, each wire guide is a structure that is simply inserted into the guide assembly groove formed in the guide case, and is simply installed. Since only the damaged guide needs to be replaced, maintenance of the wire guide is easy and plating is poor due to damage of the wire guide. In this case, by replacing only the wire guide, it is possible to minimize downtime of the plating facility due to wire guide replacement, thereby increasing productivity.

Claims (3)

As a wiring stand in which the distance of the wire is kept constant and the electrode bar is positioned in continuous multiple electroplating of the wire, the wiring stand body 31, two guide cases 33 attached to the front and rear surfaces in the width direction of the wiring stand, Wiring rack for continuous multi-electroplating is equipped with a separate wire guide, characterized in that consisting of a wire guide 32 mounted to a plurality of guide assembly groove (33C) formed in the guide case. The wire guide 32 has a rectangular parallelepiped shape as a whole, and the U-shaped through groove 32C, which is a passage through which the wire passes from the front surface 32A to the rear surface 32B, is the upper surface of the guide 32D. A wiring board for continuous multi-electroplating with individual wire guides, characterized in that it is formed from a central portion to a central portion in the longitudinal direction of the guide body 32. According to claim 1, The wire guide case 33 is a through groove 33A of the number of the wire through grooves formed in the wiring board body 31 is penetrated from the guide case front surface 33D to the rear surface 33E, The through groove 33A is formed in the width direction center from the guide case upper surface 33B by a predetermined length, and is formed in the same width only from the guide case front surface 33D to the rear surface 33E direction to the same thickness, and from the predetermined thickness to the rear surface. Up to 33E, its width and depth extend to form a guide assembly groove 33C space into which the wire guide 32 can be inserted. .