KR200204639Y1 - Packing material for electronic elements - Google Patents
Packing material for electronic elements Download PDFInfo
- Publication number
- KR200204639Y1 KR200204639Y1 KR2020000013439U KR20000013439U KR200204639Y1 KR 200204639 Y1 KR200204639 Y1 KR 200204639Y1 KR 2020000013439 U KR2020000013439 U KR 2020000013439U KR 20000013439 U KR20000013439 U KR 20000013439U KR 200204639 Y1 KR200204639 Y1 KR 200204639Y1
- Authority
- KR
- South Korea
- Prior art keywords
- filler
- present
- packing material
- electronic
- electronic elements
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
- B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
- B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
- B65D81/127—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using rigid or semi-rigid sheets of shock-absorbing material
- B65D81/133—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using rigid or semi-rigid sheets of shock-absorbing material of a shape specially adapted to accommodate contents, e.g. trays
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
이 고안은 전자 부품 운송용 충전재에 관한 것임. 충전재는 펄프로 형성되었으며, 상하로 융출된 융출부(2,3)와 중앙의 융출부(4,5,6)를 갖고 있음. 본 고안에 의하면 전자부품들을 안전하게 운송할 수 있음.This invention relates to a filler for transporting electronic components. The filler is formed of pulp and has melted portions (2, 3) melted up and down and melted portions (4, 5, 6) at the center. According to the present invention, electronic components can be transported safely.
Description
본 고안은 전자 부품 포장용 충전재에 관계되는 것으로서, 특히 반도체 칩과 같은 전자제품을 운송하기 위하여 반도체 칩등을 저장 케이스에 넣고 상자에 수납하여 운송할 때 반도체 칩이 손상되지 않도록 보호하기 위하여 저장 케이스를 고정시키는 전자 부품 포장용 충전재에 관한 것이다.The present invention relates to a packing material for packing electronic components, and in particular, in order to transport electronic products such as semiconductor chips, the semiconductor chip is placed in a storage case, and the storage case is fixed in order to protect the semiconductor chip from damage during transportation. It relates to a filler for packaging an electronic component.
일반적으로 반도체 칩과 같이 소형 전자 부품들은 운송할 때 칩을 보호하기 위하여 다수의 칩들을 저장 케이스에 넣은 다음 상자에 넣어 운송하고 있는바, 이때 칩을 보호하기 위하여 저장 케이스 주위에 충전재를 넣어 저장 케이스가 이동하지 못하도록 고정시키고 운송하고 있다. 이와 같은 충전재로는 종이, 발포 플라스틱등이 사용되고 있는바, 이러한 충전재를 사용하면 칩이 오염될 우려가 있을 뿐만 아니라 칩을 와전히 보호하지 못하는 문제점이 나타난다. 따라서 반도체 칩과 같은 소형 전자부품을 안전하게 운송하기 위하여는 보다 개선된 충전재가 요구되고 있다.In general, small electronic components, such as semiconductor chips, are transported in a case where a plurality of chips are put in a storage case to protect the chip during transportation. In this case, a packing material is placed around the storage case to protect the chip. Is transported and fixed to prevent movement. Paper, foamed plastics, etc. are used as such fillers. If such fillers are used, chips may not only be contaminated, but may not be fully protected. Therefore, in order to safely transport small electronic components such as semiconductor chips, an improved filler is required.
본 고안의 목적은 전술한 바와 같은 소형 전자부품을 전자 부품이 수용된 케이스를 상자에 넣고 운송할 때 전자부품 케이스가 외부의 힘에 의하여 쉽게 파손되지 않고 오염되지 않도록 전자부품 케이스를 상자에 고정시키는 충전재를 제공하는 것이다.An object of the present invention is to provide a packing material for fixing an electronic component case to a box so that the electronic component case is not easily damaged and contaminated by external forces when transporting the case containing the electronic component in the box. To provide.
전술한 본 고안의 목적은 저면에 다수의 충격방지용 요철면을 형성하고 중앙에 길이 방향의 요철부를 갖는 본 고안의 전자제품 운송용 충전재에 의하여 달성된다.The object of the present invention described above is achieved by the electronic product transport filler of the present invention to form a plurality of anti-concave convex and concave surface on the bottom and a longitudinal concave-convex portion in the center.
도1은 본고안에 의한 전자 부품 운송용 포장재의 사시도,1 is a perspective view of a packaging material for transporting electronic components according to the present invention;
도2는 도1에 도시된 포장재의 평면도,2 is a plan view of the packaging material shown in FIG.
도3은 도2의 A-A선 단면도,3 is a cross-sectional view taken along the line A-A of FIG.
도4는 도2의 B-B선 단면도이다.4 is a cross-sectional view taken along the line B-B in FIG.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
1...대판 2... 상향 융출부 3...하향 융출부 4,5,6...중앙 융출부1 ... Large 2 ... Upward Melt 3 ... Downward 4,5,6 ... Center Melt
본 고안은 두 개의 전자 부품 운송용 케이스를 상자 내에 고정시키게된 충전재에 있어서, 충전재가 저면에 다수의 요철부를 갖고 있고 중앙에 두 케이스의 저면을 고정시키고 측면에서의 충격을 완충시키는 길이방향의 요철부를 갖는 전자제품 운송용 충전재로 구성된다.The present invention is a filler for fixing two electronic parts transport case in a box, the filler has a plurality of uneven parts on the bottom surface, the longitudinal uneven portion to secure the bottom of the two cases in the center and cushion the impact on the side It consists of a filler for transporting electronics.
본 고안의 충전재는 상하 두 개를 일조로하여 사용하는바, 포장할 때는 운송용 상자의 저면에 하나의 충전재를 깔고 중앙의 길이 방향 요철부 양측에 두 개의 전자제품 케이스를 올려 놓은 후 케이스 상면에 제2의 충전재를 덮어서 포장한다. 본 고안의 포장재는 동일한 두께로 형성되었으며, 요철부는 상부로 돌출된 부분은 하부에서 보면 내부로 요입되었다.The packing material of the present invention uses two upper and lower parts as a pair. When packing, one filling material is placed on the bottom of the shipping box, and two electronics cases are placed on both sides of the central longitudinal concave-convex part. Cover the filling in 2 and pack. The packaging material of the present invention was formed with the same thickness, and the uneven portion protruded to the upper part was indented into the inner view.
본 고안에 따르면, 충전재는 펄프로 제작되는바, 펄프는 폐지를 물에 풀어서 사용하는 것이 바람직하다. 저면의 요철부는 바둑판 형태로 상하로 교대로 돌출되게 형성하여야 한다. 그리고 중앙에는 길이방향의 요철부가 형성되는바, 이 길이방향의 요철부는 이 요철부는 측방향의 외압이 가하여 졌을 때 수축되면서 외압을 완충시키는 역할을 한다.According to the present invention, the filler is made of pulp, the pulp is preferably used to loosen the waste paper in water. The irregularities on the bottom should be formed to alternately protrude up and down in the form of a checkerboard. And the center is formed in the longitudinal concave-convex portion, the longitudinal concave-convex portion serves to buffer the external pressure while the concave-convex portion contracts when the lateral external pressure is applied.
이하 본 고안을 도면에 의하여 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the drawings.
도1은 본 고안에 의한 전자제품 운송용 충전재의 사시도로서, 충전재는 펄프를 물에 풀어서 반죽상태로 만들고 형틀에 넣어서 성형하도록 되었다. 충전재는 플렌지형 대판(1)을 갖고 있으며, 내측에는 하부로 돌출된 융출부(2)를 갖고 있다. 이 융출부(2)는 일정한 간격으로 형성되었으며, 융출부(2)들 사이에는 하부로 돌출된 융출부(3)가 형성되었다. 그리고 대판(1)의 중앙에는 길이방향의 융출부(4), (5),(6)가 형성되었다.1 is a perspective view of a filler for transporting electronic products according to the present invention, wherein the filler is formed by dissolving pulp in water to make a dough and putting it in a mold. The filler has a flange-like base plate 1 and has a fusing portion 2 protruding downward from the inside. The fusing part 2 was formed at regular intervals, and the fusing part 3 protruding downward was formed between the fusing parts 2. And in the center of the base plate 1, the fusing part 4, 5, 6 of the longitudinal direction was formed.
본 고안의 충전재는 운송용 상자의 저면에 깔고 중앙 융출부(4,5,6)의 좌우에 각각 하나씩의 운송용 상자를 올려 놓은 다음 위에 동일한 형태의 충전재를 씌워서 상자를 포장하게 된 것으로서, 전술한 융출부(2),(3)들은 상부와 하부에서의 충격을 완화시키고, 중앙의 융출부(4,5,6)들은 두 운송용 상자의 접촉을 방지함과 동시에 좌우에서의 충격을 완화시키는 역할을 한다.The filling material of the present invention was laid on the bottom of the shipping box, and each one of the shipping boxes was placed on the left and right sides of the central melter (4, 5, 6), and then the same packing material was put on to wrap the box. The outlets (2) and (3) alleviate the impact at the top and the bottom, and the central melters (4, 5, 6) act to mitigate the impact at the left and right while preventing contact between the two transport boxes. do.
본 고안에 의하면, 충격에 약한 전자부품들을 안전하게 이송할 수 있음은 물론이고, 충전재에 의한 전자 부품들의 오염을 방지할 수 있는 효과를 얻을 수 있다.According to the present invention, it is possible to safely transport the electronic parts that are susceptible to impact, and to obtain an effect of preventing contamination of the electronic parts by the filler.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020000013439U KR200204639Y1 (en) | 2000-05-12 | 2000-05-12 | Packing material for electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020000013439U KR200204639Y1 (en) | 2000-05-12 | 2000-05-12 | Packing material for electronic elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR200204639Y1 true KR200204639Y1 (en) | 2000-12-01 |
Family
ID=19655928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2020000013439U KR200204639Y1 (en) | 2000-05-12 | 2000-05-12 | Packing material for electronic elements |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR200204639Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100901450B1 (en) * | 2006-06-05 | 2009-06-19 | (주)대원산업 | Packing buffer for stacked body in which semiconductor package trays are receivable |
-
2000
- 2000-05-12 KR KR2020000013439U patent/KR200204639Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100901450B1 (en) * | 2006-06-05 | 2009-06-19 | (주)대원산업 | Packing buffer for stacked body in which semiconductor package trays are receivable |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3711778B2 (en) | Packing method and package | |
| EP0916584B1 (en) | Packaging tray | |
| US3771712A (en) | Boxes or packs for packaging eggs; fruit or other articles | |
| US5738219A (en) | Protective plastic package for printed circuit boards | |
| JP4335921B2 (en) | Improvement of low-cost wafer box | |
| JP6888399B2 (en) | Paper container and its manufacturing method | |
| KR200204639Y1 (en) | Packing material for electronic elements | |
| KR102080436B1 (en) | Shocking absorber for packing | |
| US1977160A (en) | Side pad for shipping cases | |
| US6082546A (en) | Shock-resistant container | |
| CN212922580U (en) | Fragile container packing box | |
| CN101284589A (en) | Device and method for reducing foam material in package | |
| US20040252513A1 (en) | Packaging for a lamp and method for packaging a lamp | |
| GB2328934A (en) | Packaging for transporting bottles | |
| JP2010285208A (en) | Pulp mold-made cushioning material | |
| KR100901450B1 (en) | Packing buffer for stacked body in which semiconductor package trays are receivable | |
| CN1168854A (en) | Protective multi-unit packaging arrangement | |
| US755640A (en) | Egg-tray. | |
| CN202625009U (en) | Lens blister packaging box and lens packaging structure | |
| JP4952270B2 (en) | Corner cushioning material | |
| CN219807100U (en) | Rubber cushion pad and packing box | |
| JP7032086B2 (en) | Plate-shaped material transport container | |
| JP3010964B2 (en) | Packing equipment | |
| JP2003276767A (en) | Cushioning material for cushion-packaging | |
| KR200271045Y1 (en) | packing member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20080902 Year of fee payment: 9 |
|
| LAPS | Lapse due to unpaid annual fee |