KR20020088960A - organic deposition device for OELD panel fabrication - Google Patents
organic deposition device for OELD panel fabrication Download PDFInfo
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- KR20020088960A KR20020088960A KR1020010028056A KR20010028056A KR20020088960A KR 20020088960 A KR20020088960 A KR 20020088960A KR 1020010028056 A KR1020010028056 A KR 1020010028056A KR 20010028056 A KR20010028056 A KR 20010028056A KR 20020088960 A KR20020088960 A KR 20020088960A
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- 230000008021 deposition Effects 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000011368 organic material Substances 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000007670 refining Methods 0.000 claims abstract description 9
- 238000000859 sublimation Methods 0.000 claims abstract description 5
- 230000008022 sublimation Effects 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 8
- 238000000746 purification Methods 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 239000005416 organic matter Substances 0.000 description 11
- 238000011109 contamination Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910002065 alloy metal Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
본 발명은 유기 ELD(organic electro luminescence display)패널의 소자를 제작시 고온 진공분위기를 유지하는 챔버(chamber) 내에서 기판에 대해 유기물질의 증착 두께를 조절하도록 사용되는 셔터(shutter)를 이용하여 유기물을 고순도로 정제시켜 재활용할 수 있도록 한 OELD패널 제작용 유기막 증착장치에 관한 것이다.The present invention relates to an organic material using a shutter used to control the deposition thickness of the organic material on a substrate in a chamber that maintains a high temperature vacuum atmosphere when fabricating an organic electroluminescent display (ELD) panel. It relates to an organic film deposition apparatus for manufacturing OELD panel to be purified to high purity.
더욱 상세하게는, 기판에 대해 유기물의 증착되는 두께를 조절하도록 사용되는 메인 셔터 하방으로 추가 설치되는 정제용 셔터에 의해 유기물을 고순도로 정제후 재활용하여 유기물로 인해 챔버내에 오염되는 부위를 줄일 수 있도록 한 OELD패널 제작용 유기막 증착장치에 관한 것이다.More specifically, the refining shutter is further installed under the main shutter used to control the thickness of the deposition of organic matter on the substrate, so that the organic matter is purified and recycled in high purity so as to reduce the contamination of the organic matter in the chamber. An organic film deposition apparatus for manufacturing an OELD panel.
일반적으로, 평판 디스플레이(FPD)는 사용물질의 종류에 따라 유기물 사용소자와 무기물 사용소자로 구분되고, 무기물 사용소자는 플라즈마 디스플레이 패널(PDP;plasma display panel)과 전계 방출 디스플레이(FED;field emission display) 등이 있으며, 유기물 사용소자는 액정 디스플레이(LCD;liquid crystal display)와 유기 전계 발광 디스플레이(OELD;organic electro luminescence display) 등이 있다.In general, a flat panel display (FPD) is classified into an organic using device and an inorganic using device according to the type of material used, and the inorganic using device is a plasma display panel (PDP) and a field emission display (FED). Organic materials include liquid crystal displays (LCDs) and organic electro luminescence displays (OELDs).
도 1은 개략적으로 도시된 바와 같이, 종래 기술에 의한 OELD패널 제작용 유기막 증착장치는, 고온 진공분위기를 유지하는 챔버 내에서 유기물의 시료가 증착되는 투명한 유리를 사용하는 기판(1)과, 기판(1)에 유기물을 증착하고자 하는 경우 개방되며 기판(1)에 대해 유기물의 증착되는 두께를 조절할 수 있도록 개폐가능하게 설치되는 메인 셔터(2)와, 유기물이 용융온도 이상으로 가열되는 경우 열에너지를 가지고 승화되어 기판(1)에 증착되도록 유기물을 수용하는 질화붕소(boron nitride)재 등의 절연체로 형성되는 도가니(boat)(3)와, 유기물이 더이상 챔버내로 성막되는 것을 방지할 수 있도록 도가니(3) 상방으로 설치되는 소오스 셔터(4)를 구비한다.1 schematically shows an organic film deposition apparatus for manufacturing an OELD panel according to the prior art, comprising: a substrate 1 using transparent glass on which a sample of organic material is deposited in a chamber holding a high temperature vacuum atmosphere; When the organic material is to be deposited on the substrate 1, the main shutter 2 is opened to be opened and opened so as to adjust the thickness of the organic material with respect to the substrate 1, and when the organic material is heated above the melting temperature, thermal energy. And a crucible 3 formed of an insulator such as a boron nitride material that contains organic material so as to be sublimated and deposited on the substrate 1, and a crucible to prevent organic material from being deposited into the chamber any more. (3) A source shutter 4 provided upward is provided.
미 설명부호 5는 메인 셔터(2)를 차단시킬 때 유기물이 메인 셔터(2) 저면에 성막된 것을 나타내는 것이다.Reference numeral 5 denotes that an organic material is formed on the bottom surface of the main shutter 2 when the main shutter 2 is blocked.
전술한 바와 같은 유기막 증착장치는, OELD패널을 제작하는 작업공정중 전술한 기판(1)에 대해 유기물이 더이상 증착되지 않도록 하기 위하여 전술한 메인 셔터(2) 및 소오스 셔터(4)를 차단시키며, 이때 전술한 메인 셔터(2) 저면에 유기물이 성막되는 것이다.The organic film deposition apparatus as described above blocks the main shutter 2 and the source shutter 4 described above in order to prevent organic matters from being deposited on the substrate 1 during the process of manufacturing the OELD panel. In this case, the organic material is deposited on the bottom surface of the main shutter 2 described above.
그러나, 전술한 메인 셔터(2)를 차단하는 경우, 메인 셔터(2) 저면에 성막되는 유기물의 양이 기판(1)에 증착되어 사용되는 유기물보다 상대적으로 많게되어 유기물이 필요이상으로 소모되므로 비효율적으로 사용되고 있는 것이다. 즉 메인 셔터(2) 저면에 성막된 유기물은 작업공정후 챔버 내부를 세정시 모두 폐기처분 하게되므로 EL소자의 원가비용을 상승시키는 요인이 되는 것이다.However, when the above-described main shutter 2 is blocked, the amount of organic matter deposited on the bottom surface of the main shutter 2 is relatively higher than the amount of organic matter deposited and used on the substrate 1, and the organic material is consumed more than necessary. It is used as. In other words, the organic material deposited on the bottom surface of the main shutter 2 is disposed of when the inside of the chamber is cleaned after the work process, thereby increasing the cost of the EL element.
또한, 스테인레스계 합금재질을 사용하여 제작되는 전술한 메인 셔터(2) 및 소오스 셔터(4)들이 OELD패널을 제작하는 작업공정중 챔버 내부의 고온의 열로 의해 팽창 또는 수축과정을 반복하는 경우, 전술한 셔터(2,4)에 함유된 합금성분의 금속들이 셔터(2,4) 저면에 성막되는 유기물에 대해 불순물로서 작용하게 되므로 오염되는 유기물을 재활용할 수 없게되며, 이로 인해 유기물의 소모량을 증대시킴에 따른 EL소자를 제조하는 원가비용을 상승시키는 문제점을 갖게 된다.In addition, when the above-described main shutter (2) and the source shutters (4) made of a stainless-based alloy material repeats the expansion or contraction process by the high temperature heat inside the chamber during the manufacturing process of the OELD panel, Since the alloy metals contained in the shutters 2 and 4 act as impurities to the organic materials deposited on the bottom of the shutters 2 and 4, the contaminated organic materials cannot be recycled, thereby increasing the consumption of organic materials. There is a problem in that the cost of manufacturing the EL element is increased.
또한, 오염되는 유기물로 인해 챔버 내부의 오염되는 부위가 확산되어 양산 라인을 구축시킬 때 장비의 예비가동(pre-maintenance)시간이 증가되어 장비의 가동율이 떨어지며, 이로 인해 수율이 감소되며 장비의 수명을 단축시키는 문제점을갖게 된다.In addition, when the contaminated area inside the chamber is diffused due to the contaminated organic matter, the pre-maintenance time of the equipment is increased when the mass production line is built up, which reduces the operation rate of the equipment, thereby reducing the yield and the life of the equipment. It has a problem of shortening.
따라서, 본 발명의 목적은, 고온 진공분위기를 유지하는 챔버 내에서 기판에 대해 증착되는 유기물을 정제하는 셔터에 의해 유기물을 고순도로 정제시켜 재활용함에 따라 유기물 소모량을 대폭적으로 줄여 EL소자를 제조하는 원가비용을 낮출 수 있도록 한 OELD패널 제작용 유기막 증착장치를 제공하는 것이다.Therefore, an object of the present invention is to reduce the consumption of organic materials significantly and to reduce the consumption of organic materials by producing a high purity purified by recycling the organic matter deposited on the substrate in the chamber holding a high temperature vacuum atmosphere, the cost of manufacturing an EL device It is to provide an organic film deposition apparatus for manufacturing OELD panel to lower the cost.
본 발명의 다른 목적은, 유기물의 오염되는 것을 방지하여 챔버 내부의 오염되는 부위를 줄임에 따라 장비의 예비가동시간이 단축되어 장비의 가동율이 증가되어 수율이 향상되며, 장비의 수명을 연장할 수 있도록 한 OELD패널 제작용 유기막 증착장치를 제공하는 것이다.Another object of the present invention, by reducing the contamination of the organic matter to reduce the preliminary operating time of the equipment by reducing the contamination of the inside of the chamber to increase the operation rate of the equipment to improve the yield, can extend the life of the equipment It is to provide an organic film deposition apparatus for manufacturing an OELD panel.
본 발명의 또 다른 목적은, 정제 셔터의 구조 간단화로 인해 설치비용이 저렴하고 기존의 작업라인에 추가설치가 용이하며, 이의 사후유지관리 및 보수 비용을 줄일 수 있도록 한 OELD패널 제작용 유기막 증착장치를 제공하는 것이다.Another object of the present invention, due to the simplified structure of the tablet shutter is low installation cost and easy to install additional to the existing work line, the organic film deposition for manufacturing OELD panel to reduce the post-maintenance and maintenance costs To provide a device.
도 1은 종래 기술에 의한 OELD패널 제작용 유기막 증착장치의 개략도,1 is a schematic view of an organic film deposition apparatus for manufacturing an OELD panel according to the prior art,
도 2는 본 발명에 따른 OELD패널 제작용 유기막 증착장치의 개략도 이다.Figure 2 is a schematic diagram of an organic film deposition apparatus for producing an OELD panel according to the present invention.
*도면중 주요 부분에 사용된 부호의 설명* Explanation of symbols used in the main part of the drawing
10; 기판10; Board
11; 메인 셔터11; Main shutter
12; 도가니12; Crucible
13; 소오스 셔터13; Source shutter
14; 정제용 셔터14; Tablet Shutters
P1,P2; 포스트P1, P2; Post
전술한 본 발명의 목적은, 고온 진공분위기를 유지하는 챔버와, 챔버 내에서 기판에 대해 유기물질의 증착 두께를 조절하도록 설치되는 메인 셔터와, 승화에 의해 기판에 증착될 유기물을 수용하는 도가니와, 유기물이 챔버내로 더이상 성막되는 것을 방지할 수 있도록 도가니 상방에 설치되는 소오스 셔터를 구비하는 OELD패널 제작용 유기막 증착장치에 있어서, 전술한 메인 셔터와 소오스 셔터 사이에 설치되며 기판에 유기물이 더이상 증착되지 않도록 유기물을 차단시 저면에 성막되는 유기물을 재활용할 수 있도록 정제하는 정제용 셔터를 구비하는 것을 특징으로 하는 OELD패널 제작용 유기막 증착장치를 제공함에 의해 달성된다.The above object of the present invention is to provide a chamber for maintaining a high temperature vacuum atmosphere, a main shutter installed to control the deposition thickness of the organic material with respect to the substrate in the chamber, a crucible for receiving the organic material to be deposited on the substrate by sublimation; In the organic film deposition apparatus for manufacturing an OELD panel having a source shutter installed above the crucible so as to prevent the organic material from being deposited into the chamber any more, the organic material is installed between the main shutter and the source shutter and the organic material is no longer present on the substrate. It is achieved by providing an organic film deposition apparatus for producing an OELD panel, characterized in that it comprises a refining shutter for refining the organic material deposited on the bottom when the organic material is blocked to prevent deposition.
바람직한 실시예에 의하면, 전술한 정제용 셔터 및 소오스 셔터는 유기물의 용융점 이하의 불순물을 차단할 수 있도록 석영 등과 같은 단결정 또는 다결정형의 재질로 형성된다.According to a preferred embodiment, the above-described purification shutter and source shutter are formed of a single crystal or polycrystalline material such as quartz to block impurities below the melting point of the organic material.
바람직한 실시예에 의하면, 전술한 정제용 셔터 및 소오스 셔터를 교체할 수 있도록 챔버에 설치되는 포스트에 대해 정제용 셔터 및 소오스 셔터를 착탈가능하게 고정하며, 전술한 정제용 셔터 및 소오스 셔터를 개폐시킬 수 있도록 포스트를 챔버에 대해 회전가능하게 고정한 것이다.According to a preferred embodiment, the tablet shutter and the source shutter are detachably fixed to a post installed in the chamber so that the aforementioned tablet shutter and the source shutter can be replaced, and the above-described tablet shutter and the source shutter can be opened and closed. The post is rotatably fixed relative to the chamber.
이하, 본 발명의 바람직한 일실시예를 첨부도면에 따라 상세하게 설명하되, 이는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있을 정도로 상세하게 설명하기 위한 것이지, 이로 인해 본 발명의 기술적인 사상 및 범주가 한정되는 것을 의미하지는 않는 것이다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, which are intended to be described in detail to be easily carried out by those skilled in the art to which the present invention pertains. It is not intended that the technical spirit and scope of the invention be limited.
도 2에 도시된 바와 같이, 본 발명의 일실시예에 의한 OELD패널 제작용 유기막 증착장치는, 고온 진공상태의 작업분위기를 유지하는 챔버(미도시됨)와, 투명한 유리 기판(10)에 증착되는 유기물의 증착 두께를 조절하도록 챔버내에 설치되는 메인 셔터(11)와, 승화에 의해 기판(10)에 증착될 유기물을 수용하는 도가니(12)와, 유기물이 챔버내로 더이상 성막되는 것을 방지할 수 있도록 도가니(12) 상방에 설치되는 소오스 셔터(13)를 구비하는 OELD패널 제작용 유기막 증착장치에 적용되며, 이들은 당해분야에서 사용하고 있는 기술내용에 속한다 할 것이므로 이하에서 이들에 대한 구성 및 작동의 상세한 설명은 생략함을 밝혀둔다.As shown in FIG. 2, the organic film deposition apparatus for manufacturing an OELD panel according to an embodiment of the present invention includes a chamber (not shown) that maintains a working atmosphere in a high temperature vacuum state, and a transparent glass substrate 10. The main shutter 11 installed in the chamber to adjust the deposition thickness of the organic matter to be deposited, the crucible 12 containing the organic material to be deposited on the substrate 10 by sublimation, and the organic material to be prevented from being deposited further into the chamber. It is applied to the organic film deposition apparatus for manufacturing an OELD panel having a source shutter 13 installed above the crucible 12 so that they belong to the technical content used in the art, so that the configuration and Note that detailed description of operation is omitted.
따라서, 본 발명의 바람직한 실시예에 의하면, 전술한 기판(10)에 유기물이 더이상 증착되지 않도록 유기물을 차단시키는 경우 저면에 성막되는 유기물을 재활용할 수 있도록 정제하는 정제용 셔터(14)를 메인 셔터(11)와 소오스 셔터(13) 사이에 설치하되, 전술한 정제용 셔터(14) 및 소오스 셔터(13)는 유기물의 용융점 이하의 불순물을 차단할 수 있도록 석영 등과 같은 단결정 또는 다결정형태의 재질로 형성된다.Therefore, according to the preferred embodiment of the present invention, when the organic material is blocked so that the organic material is no longer deposited on the substrate 10 described above, the main shutter has a purification shutter 14 for refining the organic material deposited on the bottom surface to be recycled. It is provided between the 11 and the source shutter 13, the above-described purification shutter 14 and the source shutter 13 is formed of a single crystal or polycrystalline material such as quartz to block impurities below the melting point of the organic material. do.
이때, 전술한 정제용 셔터(14) 및 소오스 셔터(13)를 교체할 수 있도록 챔버에 설치되는 포스트(P1,P2)에 대해 정제용 셔터(14) 및 소오스 셔터(13)를 체결부재(15,16)에 의해 각각 착탈가능하게 고정하며, 또한 전술한 정제용 셔터(14) 및 소오스 셔터(13)를 개폐시킬 수 있도록 포스트(P1,P2)를 챔버에 대해 회전가능하게 고정한 것이다.At this time, the fastening member 15 is fastened to the tablet shutter 14 and the source shutter 13 with respect to the posts P1 and P2 installed in the chamber so that the above-described tablet shutter 14 and the source shutter 13 can be replaced. And 16 are detachably fixed to each other, and the posts P1 and P2 are rotatably fixed to the chamber to open and close the above-described tablet shutter 14 and the source shutter 13.
이하에서, 본 발명의 일실시예에 의한 OELD패널 제작용 유기막 증착장치의 작동을 첨부도면을 참조하여 상세하게 설명하면 아래와 같다.Hereinafter, the operation of the organic film deposition apparatus for manufacturing an OELD panel according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
도 2에 도시된 바와 같이, 고온 진공상태의 작업분위기를 유지하는 미도시된 챔버 내에 설치된 전술한 도가니(12)가 내부에 수용되는 유기물의 용융온도 이상으로 가열되는 경우, 유기물이 열에너지에 의해 도가니(12)로 부터 승화되어 기판(10)에 대해 증착되는 것이다.As shown in FIG. 2, when the above-mentioned crucible 12 installed in a chamber not shown, which maintains a working atmosphere in a high temperature vacuum state, is heated above a melting temperature of an organic material contained therein, the organic material is crucible by thermal energy. Sublimation from 12 is deposited on the substrate 10.
이때, 전술한 기판(10)에 증착되는 유기물이 정해진 두께로 증착되는 경우, 전술한 메인 셔터(11)와 소오스 셔터(13) 사이에 설치되는 정제용 셔터(14)와 소오스 셔터(13)를 각각 포스트(P1,P2)를 중심축으로 하여 회전시키는 경우, 유기물이 더이상 기판(10)에 증착되는 것을 차단할 수 있게 된다.In this case, when the organic material deposited on the substrate 10 is deposited to a predetermined thickness, the purification shutter 14 and the source shutter 13 installed between the main shutter 11 and the source shutter 13 described above are removed. When each of the posts P1 and P2 is rotated about the central axis, the organic material can be prevented from being deposited on the substrate 10 anymore.
이때, 전술한 정제용 셔터(14)와 소오스 셔터(13)가 석영 등의 단결정 또는 다결정 형태로 형성됨에 따라, 전술한 소오스 셔터(13)에 의해 유기물의 용융점 이하의 불순물을 차단할 수 있게되며, 또한 전술한 정제용 셔터(14) 저면에 성막되는 유기물을 고순도로서 정제하여 재활용함에 따라 유기물의 소모되는 양을 줄여 EL소자를 제조하는 원가비용을 대폭적으로 낮출 수 있게되며, 유기물의 오염되는 것을 방지하여 챔버 내부의 오염되는 부위를 줄여 양산 라인 구축시 장비의 예비가동시간(PM)을 단축시킬 수 있게 된다.In this case, as the above-described purification shutter 14 and the source shutter 13 are formed in a single crystal or polycrystalline form such as quartz, impurities described below the melting point of the organic material may be blocked by the source shutter 13 described above. In addition, by refining and recycling the organic material deposited on the bottom surface of the above-described cleaning shutter 14 with high purity, the cost of manufacturing an EL device can be significantly reduced by reducing the amount of organic material consumed, and preventing contamination of organic materials. By reducing the contaminated parts inside the chamber it is possible to shorten the preliminary operating time (PM) of the equipment when building the mass production line.
전술한 정제용 셔터(14) 및 소오스 셔터(3)는 미도시된 챔버 내부에 설치되는 포스트(P1,P2)에 대해 체결부재(15,16)에 의해 각각 착탈가능하게 고정됨에 따라 교체가 용이하여 편리성을 제공한다.The above-described tablet shutter 14 and the source shutter 3 are easily detached and fixed by the fastening members 15 and 16 with respect to the posts P1 and P2 installed inside the chamber, not shown. To provide convenience.
또한, 전술한 정제용 셔터(14) 및 소오스 셔터(3)재로서 석영판 자체를 사용함에 따라 스테인레스 합금계 재질보다 상대적으로 제작비용을 줄일 수 있고, 석영판이 투명하여 육안으로도 불순물의 함유부위를 식별할 수 있게됨에 따라 유기물을 정제한후 재활용시 오염된 불순물의 사용을 예방할 수 있는 것이다.In addition, by using the quartz plate itself as the above-described purification shutter 14 and the source shutter (3) material, it is possible to reduce the manufacturing cost relative to the stainless alloy-based material, and the quartz plate is transparent, so that the part containing impurities even with the naked eye As it can be identified, the use of contaminated impurities in the recycling of organic matter after purification can be prevented.
이상에서와 같이, 바람직한 실시예에 의하면 아래와 같은 이점을 갖게 된다.As mentioned above, according to a preferable embodiment, it has the following advantages.
고온 진공상태의 작업분위기를 유지하는 챔버 내에서 기판에 대해 증착되는 유기물을 정제하는 셔터에 의해 유기물을 고순도로 정제후 재활용함에 따라 유기물 소모량을 대폭적으로 줄여 EL소자를 제조하는 원가비용을 낮출 수 있다.As the organic material is purified and recycled by the shutter to purify the organic material deposited on the substrate in the chamber maintaining the working environment in a high temperature vacuum state, the organic material consumption can be drastically reduced, thereby reducing the cost of manufacturing the EL device. .
유기물의 오염되는 것을 방지하여 챔버 내부의 오염되는 부위를 줄임에 따라 장비의 예비가동시간이 단축되어 장비의 가동율이 증가되어 수율이 향상되며, 장비의 수명을 연장할 수 있다.By preventing the contamination of organic matter and reducing the contaminated area inside the chamber, the preliminary operating time of the equipment is shortened, the operation rate of the equipment is increased, the yield is improved, and the life of the equipment can be extended.
정제용 셔터의 구조 간단화로 인해 설치비용이 저렴하고 기존의 작업라인에 추가 설치가 용이하며, 이의 사후유지관리 및 보수 비용을 줄일 수 있다.Due to the simplified structure of the shutter for tablets, the installation cost is inexpensive, and it is easy to install additionally on an existing work line, thereby reducing the post maintenance and maintenance costs.
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| KR20040037661A (en) * | 2002-10-29 | 2004-05-07 | 주식회사 엘리아테크 | Apparatus for depositing organic material |
| KR100477747B1 (en) * | 2002-07-11 | 2005-03-18 | 삼성에스디아이 주식회사 | A vacuum evaporation apparatus and design method of shield member for vacuum evaporation apparatus |
| KR100806840B1 (en) * | 2006-06-30 | 2008-02-22 | 세메스 주식회사 | Apparatus for evaporation of Organic Light-Emitting DeviceOLED and method for controlling motion module of the apparatus |
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| KR101009558B1 (en) * | 2003-12-02 | 2011-01-18 | 삼성모바일디스플레이주식회사 | Equipments for forming layers in vacuum condition |
| KR20070044891A (en) * | 2005-10-26 | 2007-05-02 | 엘지전자 주식회사 | Deposition apparatus |
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| JPH0834126B2 (en) * | 1988-08-22 | 1996-03-29 | 松下電器産業株式会社 | Phosphor thin film manufacturing method and thin film EL device |
| JPH02135697A (en) * | 1988-11-16 | 1990-05-24 | Sharp Corp | Manufacture of thin film el device |
| JPH06151612A (en) * | 1992-11-04 | 1994-05-31 | Fujitsu Ltd | Manufacture of semiconductor device |
| KR970030947A (en) * | 1995-11-27 | 1997-06-26 | 이우복 | Manufacturing apparatus and method for manufacturing the polymer light emitting device |
| JP2000294372A (en) * | 1999-04-09 | 2000-10-20 | Pioneer Electronic Corp | Formation of organic material film, manufacture of organic el element and device therefor |
| KR100362333B1 (en) * | 2000-05-26 | 2002-11-23 | 주식회사 켐트로닉 | Thin film deposition apparatus for fabricating organic light-emitting devices |
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| KR100477747B1 (en) * | 2002-07-11 | 2005-03-18 | 삼성에스디아이 주식회사 | A vacuum evaporation apparatus and design method of shield member for vacuum evaporation apparatus |
| KR20040037661A (en) * | 2002-10-29 | 2004-05-07 | 주식회사 엘리아테크 | Apparatus for depositing organic material |
| KR100806840B1 (en) * | 2006-06-30 | 2008-02-22 | 세메스 주식회사 | Apparatus for evaporation of Organic Light-Emitting DeviceOLED and method for controlling motion module of the apparatus |
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