KR20020078097A - A manufacturing method for multilayer high density substrate - Google Patents

Abstract

PURPOSE: A method is provided to reduce manufacturing costs by using a new composition and simplifying the process of compression. CONSTITUTION: A method comprises the first step of forming the first layer polyimide substrate of a multi-layer board(1) by using a polyimide(111), forming a circuit layout(112) having a narrow pitch on the first layer polyimide substrate, and forming a solder pad(113) at the bottom surface of the first layer polyimide substrate by permitting the circuit layout to be directed toward the bottom surface of the first layer polyimide substrate; the second step of forming the second layer of a non-high density organic substrate using an organic material, forming a circuit(1231) by mounting a conductive layer(123) at both sides of a core substrate(122), soldering the polyimide substrate disposed on the top of the layout of the circuit with a solder bump(125), permitting the circuit to have a path(1221) which passes through the core substrate and reaches the conductive layer arranged at the bottom of the non-high density organic substrate, and distributing the circuit and lowering circuit density; and the third step of soldering and electrically connecting the first layer polyimide substrate, second layer, non-high density organic substrate, solder bump and the bottom surface of the first layer polyimide substrate.

Description

A manufacturing method for multilayer high density substrate

Electronic products have been developed at a high speed for high speed, high performance, high frequency, high density, digital and light weight, and have environmentally friendly features. In FIG. 1, the fan-out of the connecting pin 11 'by the circuit 12' in the substrate 1 'or the multilayer board is intended to make fine wiring on the substrate or the circuit board. Is one stumbling block to the goal.

In Fig. 2, in the conventional high density multilayer board, a plurality of conductive layers and insulating layers are formed on both sides of the core substrate, so that the high density connecting pins are sufficiently fan-out by the conductive layers of the various boards. In the manufacturing method of the high density multilayer board, the substrate is generally made using the polyimide layer. The organic substrate of the high density multilayer board 2 'is made of an organic material, in which the core substrate 211' is formed of a conductive layer 212 'and a plurality of conductive patterns obtained during a build-up process. It is configured in the form of an epoxy resin insulating layer 213 'containing. By continuous accumulation, a multilayer conductive circuit is formed, and solder pads or solder balls 215 'are formed on the top surface and the bottom surface of the bottom layer to form another chip 3' or substrate (not shown). Not connected). However, since the circuit density of the organic substrate is limited by the properties of the material used, it cannot have the same high density as the polyimide substrate. However, when the polyimide layer is used as the substrate material of other layers, a high density wiring board with a fine pitch is obtained. If all the layers are made of polyimide substrate, the entire polyimide multilayer board becomes very expensive since the polyimide material is very expensive (shown in FIG. 2).

Accordingly, it is an object of the present invention to provide a method for producing a multilayer high density substrate, which uses a new composition and simplifies the compression process so that the manufacturing cost is low.

It is still another object of the present invention to provide a method for producing a multilayer high density substrate, wherein the first board of the multilayer board is made of a polyimide substrate and the non-high density organic substrate is composed of a second and subsequent substrate board. Is in.

1 is a top perspective view of a conventional high density multilayer board.

2 is a view showing the structure of a conventional high density multilayer board.

3A-3B illustrate a method of manufacturing a multilayer high density substrate of the present invention.

4A-4B illustrate another embodiment of the present invention.

As shown in Figures 3A and 3B, a method of making a multilayer high density substrate using a polyimide substrate to make a first layer and combining it with a non-high density organic substrate, which is a second layer board made of organic material;

(a) using a polyimide (or other high density polymer film) 111 to make a first layer polyimide substrate 11 (or a high density polymer thin film substrate) of the multilayer board 1, wherein the polyimide substrate 11 A circuit manufacturing method (such as an electroplating method) on a high density polymer film substrate (or electroplating method) to create a narrow pitch circuit layout 112 and direct the prefabricated circuit 112 to the bottom of the polyimide substrate 11. Thereby suitably expanding / diluting the circuit density and providing the solder pads 113 at appropriate locations on the bottom surface;

(b) The second layer is made of a non-high density organic substrate using the organic material 12, and the conductive layer 123 is mounted on both sides of the core substrate 122 to implement the circuit 1231 and the insulating layer 124. The top and top layer polyimide substrates 11 (or high-density polymer thin film substrates) of the circuit 1231 layout are soldered with solder bumps 125 at positions corresponding to the pad solder 113 on the bottom surface, The circuit 123 has a path 1221 through the core substrate 122 to the conductive layer 123 of the bottom surface of the non-high density organic substrate 12 and distributes the circuit 1231 and distributes the circuit density. Lowering; And

(c) the first layer polyimide substrate 11 (or the high density polymer thin film substrate) and the second layer, an alignment-free non-high density organic substrate 12, the second layer non-high density organic substrate Soldering (12) the bottom surface of the first polyimide substrate 11 (or high density polymer thin film substrate) and soldering together to electrically connect.

In FIGS. 4A-4B, the core substrate, conductive layer, and insulating layer are subsequently joined together to form a multilayer and lower the circuit density of the first layer.

According to the present invention, the first layer of the multilayer, a polyimide substrate (or a high density polymer thin film substrate), provides a very fine pitch circuit layout, and other subsequent layer boards that do not require the same circuit density as the first layer are non-high density. Organic material is used as a component. According to the method of the present invention, a circuit pitch layout that satisfies the requirements can be obtained to lower manufacturing costs. Moreover, compression and bonding of the first layer board and the second layer board does not require any soldering and is compressed directly with the heating process. When the boards are compressed and joined, a low cost, high density substrate with fine pitch and circuitry inside the substrate is obtained.

Claims (2)

A multi-layer high density substrate manufacturing method for making a first layer using a polyimide substrate and combining it with a non-high density organic substrate, which is a second layer board made of an organic material; (a) using polyimide (or other high density polymer thin film) to make a first layer polyimide substrate (or high density polymer thin film substrate) of a multi-layer board, and to fabricate a circuit on the polyimide substrate (or high density polymer thin film substrate) Forming a narrow pitch circuit layout (such as an electroplating method) and directing the prefabricated circuit to the bottom surface of the polyimide substrate results in an appropriate expansion and dilution of the circuit density, with the solder pads in place at the bottom. Forming; (b) The second layer is made of a non-dense organic substrate using an organic material as a material, and a conductive layer is mounted on both sides of the core substrate to form a circuit, and the insulating layer, the top and top layers of the circuit layout polyimide substrate ( Or solder bumps are soldered to the bottom surface of the high density polymer thin film substrate corresponding to pad solder, and the circuit uses a pass through the core substrate to the conductive layer on the bottom surface of the non-high density organic substrate. Distributing the circuit and lowering the circuit density; And (c) the first layer polyimide substrate (or high density polymer thin film substrate) and the second layer, an alignment-free non-high density organic substrate, solder bumps of the second layer non-high density organic substrate and the first layer The bottom surface of the polyimide substrate (or high density polymer thin film substrate) is soldered together and electrically connected; manufacturing method of a multi-layer high-density substrate comprising a. The multi-layer high density of claim 1, wherein the second layer non-dense organic substrate has a multilayer structure in which the core substrate, the conductive layer, and the insulating layer are successively bonded to lower the circuit density of the first layer. Method of manufacturing a substrate.