KR20020066524A - A heating test apparatus for semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE: A heating test apparatus is provided to quickly heat to a defined temperature by restraining a surface temperature decrease of a heater due to a transferred air. CONSTITUTION: A heating test apparatus comprises a chamber(100), a heating room(140) having a heater(141) installed at the lower portion of the chamber(100), a tray transferring room(150) installed at the upper portion of the chamber(100) on the heating part(140) for transferring a tray(110) through openings, a transferring part installed in the tray transferring room(150) and an air circulation part for circulating an inner air of the tray transferring room(150). At this point, the separation of the heating room(140) and the tray transferring room(150) prevents a temperature decrease of a heater surface.

Description

A heating test apparatus for semiconductor manufacturing apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat test apparatus for a semiconductor manufacturing apparatus, and more particularly, to a heat test apparatus for a semiconductor manufacturing apparatus for heating and testing a semiconductor device in order to inspect product performance of a final manufactured semiconductor device.

In general, semiconductor devices are manufactured through a number of complex manufacturing processes. The manufacturing process is briefly described. First, a process of fabricating a semiconductor chip by forming a semiconductor thin film on a wafer to form an integrated circuit on a pure silicon substrate, a packaging process of packaging the manufactured semiconductor chip, and It is roughly divided into a test process that tests normal operation.

In particular, the test process includes creating an artificial high temperature environment to test whether a semiconductor device can maintain its own performance characteristics even in a harsh environment.

The conventional heating test apparatus for such a high temperature test process blows high temperature air heated at about 120 ° C to 130 ° C through a heating heater, a fan, and a duct in a predetermined chamber to a semiconductor device seated in the chamber to provide a semiconductor device. It is intended to be heated.

Referring to FIG. 1, a heat test apparatus for a semiconductor manufacturing apparatus for a conventional high temperature test process will be described in more detail. The chamber 10 and the inside of the chamber 10 having a shape of an upper surface and an opening of a part thereof are opened. It is provided with a multi-stage stacking tray 20 is provided with a plurality of semiconductor devices on the surface, and the lifting device 30 for raising and lowering the tray 20 in the lower portion of the tray 20 is provided.

And the inner surface of the chamber 10 is provided with a duct 40 which is formed to be bent to the periphery of the tray 20 and the elevating device 30, the blowing fan 50 and the air blowing inside the duct 40 The heating heater 60 for heating the air blown by the fan 50 is provided.

On the other hand, the duct 40 is formed with a plurality of preheating holes 41 for preheating the inside of the chamber 10 by discharging a portion of the heated air while passing through the heating heater 60. And the discharge port 42 of the duct 40 is formed smaller and thinner than the size of the duct 40 so that the heated air can be concentrated and discharged to the tray 20 side.

However, such a conventional heating test apparatus to install the duct 40 around the elevating device 30 and the elevating device 30 for elevating the tray 20 up and down inside the chamber 10 as described above. As such, the exterior size should always be kept above a certain size. In other words, it is difficult to deform and reduce the appearance size depending on the equipment applied.

In addition, since the installation state of the duct 40 installed in the conventional heating test apparatus is formed to be bent along the inner wall of the chamber 10, the curved portion of the duct 40 with respect to the fluid by the blowing fan 50 Significant fluid resistance and vortex or turbulence can cause airflow efficiency to decrease.

In addition, since the resistance of the fluid and the leakage of the fluid are generated through the heating heater 60 and the preheater 41, the flow efficiency of the fluid is relatively decreased, and thus, the heating time to the target temperature for the tray 20 is long. You lose.

On the other hand, in order to overcome the above-mentioned problems, it is necessary to install a blower fan 50 and a heating heater 60 having a relatively large capacity. In this case, the air flow noise is increased and the power consumption is increased. Even if it can be reduced, there is a problem that the operating efficiency of the device is lowered.

The present invention is to solve the above-mentioned problems, an object of the present invention is to prevent the surface temperature decrease of the heating heater caused by the blowing air to be heated to the target predetermined temperature in a faster time, the device To provide a heating test apparatus of a semiconductor manufacturing apparatus that can be applied by reducing the size of the.

Another object of the present invention associated with the above object is to provide a heating test apparatus of a semiconductor manufacturing apparatus which can minimize the pressure loss and the heat loss of the heat source by the fluid resistance by preventing the circulated air is not in direct contact with the heat source. will be.

1 is a cross-sectional view showing a test handler for a conventional semiconductor manufacturing apparatus.

2 is an external perspective view illustrating a test handler for a semiconductor manufacturing apparatus according to the present invention.

3 is a perspective view illustrating an internal cutaway of a test handler for a semiconductor manufacturing apparatus according to the present invention.

4 is a cross-sectional view taken along line A-A of the test handler for a semiconductor manufacturing apparatus according to the present invention.

** Description of the symbols for the main parts of the drawings **

100 ... chamber

110 ... tray

130 ... middle partition wall

140.Heating room

150 ... Transfer Room

160.Circulation duct

A heating test apparatus for a semiconductor manufacturing apparatus according to the present invention for achieving the above objects is a heating test apparatus for a semiconductor manufacturing apparatus for testing an operating state of a heated semiconductor device by heating a tray provided with a semiconductor device, the chamber ; A heating chamber provided below the chamber and having a heating heater installed therein; A tray transfer chamber provided in an upper portion of the chamber and partitioned with the heating chamber, and formed with an entrance opening through which the tray enters one side and heated by the heat provided from the heating chamber, and an exit opening through which the tray heated to the other side enters. ; Transfer means mounted inside the tray transfer chamber to transfer the tray from the entry port to the exit port; It is provided with an air circulation means for circulating the air in the tray transfer chamber.

And preferably, the heating heater according to the present invention is provided such that the number of windings increases from the entrance side to the exit side so that the heating temperature increases from the entrance side toward the exit side.

The air circulation means described above preferably extends in a state spaced apart from the sidewall of the tray transfer chamber extending in the conveying direction side of the tray by a predetermined interval and communicates with the inside of the tray transfer chamber at a portion adjacent to the exit port. And a circulation fan mounted on a flow path of the circulation duct.

And, preferably, the transfer means according to the invention is characterized in that the conveyor is provided to extend from the entry port side to the exit port side to rotate by an external power source.

Hereinafter, one preferred embodiment of a heating test apparatus of a semiconductor manufacturing apparatus according to the present invention will be described in detail with reference to the drawings.

The heating test apparatus of the semiconductor manufacturing apparatus according to the present invention as shown in Figure 2 as a whole has a rectangular parallelepiped shape, and has a chamber 100 implemented as a heat insulating wall in which a heat insulating material such as quartz.

In addition, the front side of the chamber 100 allows the tray 110 provided with a plurality of semiconductor devices 111 and temperature sensors 112 to enter the chamber 100 in a horizontal direction by a handler (not shown). Entry port 101 is formed, the entrance to the upper surface of the chamber 100 to enter the chamber 100 to allow the heated tray 110 to be forced out by a handler such as a vacuum adsorber 120 to the outside Sphere 102 is formed.

In addition, an air circulation means for air circulation in the chamber 100 is provided above the portion where the inlet 101 of the chamber 100 is formed.

2 and 3, the interior of the chamber 100 has an intermediate partition wall made of aluminum, stainless steel, copper, or other metal alloys whose upper and lower parts are excellent in thermal conductivity. It is partitioned from each other with 130 in between.

In addition, a heating chamber 140 provided with a heating heater 141 repeatedly wound to be bent several times in a long direction of the chamber 100 is disposed below the chamber 100 with the intermediate partition wall 130 interposed therebetween. Prepared.

The heating heater 141 is to increase the number of times the smell more from the entrance 101 side of the chamber 100 toward the exit 102, the reason is that the tray 110 entering the entry port 101 side After heating gradually, the semiconductor device 111 can be sufficiently heated to a predetermined test temperature, that is, 120 ° C. to 130 ° C. at the exit port 102.

In addition, a tray transfer chamber 150 is implemented at the upper portion of the chamber 100 at the boundary of the intermediate partition wall 130 so that the tray 110 entering the entry port 101 side is heated and transferred to the exit port 102 side. In the tray transfer chamber 150, a transfer means for smoothly horizontally transferring the tray 110 from the entrance 101 of the chamber 100 to the exit 102 is provided.

The conveying means applied to the embodiment of the present invention is provided with a conveyor 151 extending from one side to the other side inside the tray transfer chamber 150 to be driven by a motor (not shown) mounted inside or outside the chamber 100. do.

Meanwhile, both side walls of the tray transfer chamber 150, that is, sidewalls extending from the entrance 101 to the exit 102, extend along each sidewall and are spaced apart from the inner wall of the chamber 100 by a predetermined distance. 160 is formed.

The circulation duct 160 is in communication with the inside of the transfer chamber 150 at a portion adjacent to the exit port 102 side of the tray transfer chamber 150, and the outside of the portion where the entry port 101 of the chamber 100 is formed. An auxiliary circulation duct 170 is formed in the upper portion so that both sides of the circulation duct 160 communicate with the circulation duct 160 for air circulation in the circulation duct 160. ) And a circulation fan 180 that performs smooth air circulation in the transfer chamber 150 is installed.

Hereinafter, an operation state of the heating test apparatus for a semiconductor manufacturing apparatus according to the present invention configured as described above will be described.

The operating state of the heating test apparatus according to the present invention operates the first heating heater 141 to heat the inside of the heating chamber 140 to a predetermined temperature, and then the semiconductor device 111 toward the entrance port 101 inside the tray transfer chamber 150. ) And the tray 110 on which the temperature sensor 112 is mounted are continuously entered at predetermined intervals.

In addition, the tray 110 entered is gradually heated to a higher temperature while being conveyed toward the exit port 102 by the conveyor 151, and finally heated to a predetermined temperature or higher when a target is located on the exit port 102 side. do.

Thereafter, the tray 110 heated to a predetermined temperature is transferred to the outside through the outlet 102 by the adsorber 120, and then the test of the semiconductor device 111 is performed.

Herein, the temperature inside the heating chamber 140 is relatively higher at the exit 102 than at the entrance 101. The reason for this is because the winding water of the heating heater 141 wound up at the exit 102 is more densely realized than the entrance 101.

Therefore, the entry port 101 side performs a sufficient preheating function for the tray 110, the temperature rise to the required test temperature on the exit port 102 side is made.

And for the same reason as above tray 110 is entered from the first entry port 101 side is heated more and more toward the exit port 102 side is heated to the required temperature state, the heating temperature efficiency at this time is the circulation duct 160 (170) And by the convection of air circulated by the circulation fan 180 is made more quickly in an appropriate state.

Here, the circulation ducts 160 and 170 and the circulation fan 180 applied in the present invention may be sufficient to maintain the convection of the fluid for smooth flow of heat rather than for forced supply of heat.

Therefore, since the rated capacity may be smaller than that of the blowing fan installed in the conventional heating test apparatus, the amount of current consumption and the generation of noise are improved as compared with the conventional heating test apparatus.

In addition, the heating test apparatus according to the present invention does not generate the fluid resistance and heat loss according to the air circulated by the circulation fan 180 does not go through the heating heater as in the prior art. Therefore, the time to the target attainment temperature of the heating test apparatus is shortened significantly in comparison with the prior art, so that the use efficiency of the apparatus is improved accordingly.

As described above, the heating test apparatus for a semiconductor manufacturing apparatus according to the present invention prevents the heat source and the blowing air from directly contacting each other, thereby preventing the occurrence of fluid resistance, heat loss, and blowing noise, and furthermore, It is an improvement to simplify the transfer structure of the tray by transfer.

Therefore, if another modified embodiment basically has a dual structure in which the inside of the chamber is divided into a heating chamber and a transfer chamber, and the circulating air is not in direct contact with the heat source, the arrangement of the heating heater or the material of the other parts may be modified. Even if added or added, they should all be considered to be included in the technical scope of the present invention.

Since the heating test apparatus for a semiconductor manufacturing apparatus according to the present invention as described above does not directly blow air into a heat source, it is possible to prevent heat loss and noise caused by fluid resistance, and at the same time, faster than before. There is an effect to enable the heating to the target temperature in the inside, and also because the tray is transferred to the conveyor transfer structure has the effect of simplifying the configuration of the transfer structure and thus the test apparatus.

Claims (4)

A heating test apparatus of a semiconductor manufacturing apparatus for testing an operating state of a heated semiconductor device by heating a tray provided with a semiconductor device, chamber; A heating chamber provided below the chamber and having a heating heater installed therein; A tray transfer chamber provided in an upper portion of the chamber and partitioned with the heating chamber, and having an entrance opening through which the tray enters one side, and an exit opening through which the tray heated to the other side enters; Transfer means mounted in the tray transfer chamber to transfer the tray from the entry port to the exit port; And a heat circulation means for circulating air in the tray transfer chamber. The heating test of the semiconductor manufacturing apparatus according to claim 1, wherein the heating heater is wound up more frequently from the inlet side to the outlet side so that a heating temperature increases from the inlet side toward the outlet side. Device. According to claim 1, The air circulation means extends in a state spaced apart from the side of the side of the tray extending in the conveying direction of the tray at a predetermined interval, the communication portion is in communication with the inside of the tray transfer chamber in a portion adjacent to the exit port And a circulation fan mounted on the circulation duct and a flow path of the circulation duct. The heating test apparatus according to any one of claims 1 to 3, wherein the transfer means is provided as a conveyor extending from the entry port side to the exit port side and rotating by an external power source.