JPH03188383A - Heating tester for semiconductor element - Google Patents

Abstract

PURPOSE:To enable simple and efficient execution of a test by providing a main body of a box formed of a heat insulating material, a connector in which a board is fitted, a cable led outside the main body of the box from the connector, an external power source heating a semiconductor element on the board by electrification through the cable and the connector, and a door closing up the main body of the box. CONSTITUTION:A board 12 is inserted into a main body 16 of a box from a doorway 14 and the inserted fore end thereof is fitted in a connector 18. Then, a door 24 is shut to close up the main body 16 of the box. Moreover, electrification by an external power supply 22 is started and each semiconductor element 10 on the board 12 is self-heated by this electrification. The main body 16 of the box is formed of a heat insulating material and, accordingly, the semiconductor element 10 itself is heated by the self-heating of the semiconductor element 10.

Description

Detailed Description of the Invention Industrial Field of Application Conventional Technology Problems to be Solved by the Invention Means for Solving the Problems Effects of the Invention [Summary] Concerning an apparatus for conducting a heating test of a semiconductor element. With the aim of providing a small and inexpensive device that can be easily and efficiently carried out, the device is equipped with an entrance and exit for the substrate on which the semiconductor device to be tested is mounted, a box body made of heat insulating material, and a box body that is inserted into the box body. A connector into which the printed circuit board is inserted, a cable drawn out from the connector to the outside of the box body, an external power source that heats the semiconductor elements on the circuit board through the cable and connector, and a connector installed at the entrance and exit of the circuit board and closed. The box body is characterized by having a door that hermetically seals the box body.

[Industrial Field of Application] The present invention relates to an apparatus for performing a heating test on a semiconductor element.

A heating test (burn-in) is performed using this type of apparatus in order to detect initial defects in semiconductor elements and guarantee reliability.

[Prior Art] FIG. 6 shows the configuration of a conventional test device.

The semiconductor device 10 to be tested is mounted on a substrate 12, and the substrate I2 is housed in a constant temperature oven 50.

Inside the thermostatic oven 50, a plurality of connectors 18 are provided on the back panel 56, and the substrate 12 is fitted into each connector 18, respectively.

Furthermore, inside the constant temperature bath 50, a semiconductor element l on the substrate 12 is placed.
A heating element 52 that heats O. A power source 54 is provided to energize the air conditioning fan 349 for stirring internal air, the heating element 52, and the air conditioning fan 34.

During the test, the door 58 is opened, the boards 12 are inserted, and their insertion tips are fitted into the connector 18.

Then, by closing the door 58, the thermostatic chamber 50 is sealed, the air conditioning fan 34 and the heating element 52 are energized, and a heating test of the semiconductor element 10 is performed.

[Problem M to be Solved by the Invention] However, since the thermostatic chamber 50 is large in size in order to test a large number of substrates 12 at the same time, even a single device occupies a large installation space.

When the types of semiconductor devices 10 to be tested are different or when the number of substrates 12 is small, each of the constant temperature chambers 50 is used for each test, and a large dedicated test chamber is required.

Furthermore, large-scale air conditioning equipment is also required to remove the heat generated by each thermostatic chamber 50.

Therefore, the initial investment amount is enormous, and moreover, a large amount of electricity is consumed during testing.

Also, since a considerable amount of noise is generated during the test, it is necessary to consider countermeasures against this.

The present invention has been made in view of the above-mentioned conventional circumstances, and
The purpose is to provide a small and inexpensive device that allows testing to be performed easily and efficiently.

Means for Solving the Problem] In order to achieve the above object, an apparatus of the present invention is configured as shown in FIG.

A semiconductor element 10 to be tested is mounted on a substrate 12 in the figure.

Further, the box body 10 is provided with a board entrance/exit 14 into which the board 2 is inserted, and the box main body 10 is made of a heat insulating material.

Furthermore, a connector 18 is attached inside the box body 16, and the insertion tip of the board 12 is fitted into this connector 18.

A cable 20 is drawn out from the connector 18 to the outside of the box body 16, and the tip of this cable 20 is connected to an external power source 22.

The external power supply 22 heats the semiconductor element 10 on the substrate 12 through the cable 20 and the connector 18 .

Furthermore, a door 7124 is provided at the entrance/exit 14 of the box body 16, and by closing this door 24, the box body 16 is sealed.

[Operation] In the present invention, the board 12 is inserted into the box body 16 through the entrance/exit 14, and its insertion tip is fitted into the connector 18.

The shield 24 is then closed, thereby sealing the box body 16.

Further, energization by the external mold R22 is started, and the energization causes each semiconductor element 10 on the substrate 12 to self-heat.

This box body 16 is made of a heat insulating material, so that the semiconductor element 10 itself is heated by the self-heating of the semiconductor element 10.

[Embodiments] Hereinafter, preferred embodiments of the apparatus according to the present invention will be described based on the drawings.

A first embodiment is shown in FIG. 1, in which a semiconductor device 10 to be tested is mounted on a substrate 12.

In addition, the box body 16 is provided with an entrance/exit 14, and guide grooves 26, 26 are provided on the inner wall surfaces on both sides of the entrance/exit 14.
The board 12 is inserted into the box body 16 from the entrance/exit 14 along.

Further, a connector 18 is provided on the inner wall surface facing the entrance/exit 14, and the insertion tip of the board 12 is fitted into the connector 18.

A cable 20 is drawn out from the connector 18 to the outside of the box body 16, as shown in FIG. 2, and its tip is connected to an external power source 22 (see FIGS. 1 and 3).

This external power supply 22 connects the cable 20 and the connector 1.
Electricity is applied to the substrate 12 through the semiconductor element 8, and as a result, the semiconductor element 10 self-heats.

Further, a door 24 is provided at the substrate entrance/exit 14, and a handle 32 is provided on the outer surface of the door 24 as shown in FIG.

The handle 32 is opened and closed when inserting and removing the board 12, and the handle 32 is opened and closed when the board 12 is inserted and removed.
4 is closed, the box body 16 is sealed.

The box body 16 has a double structure, and is made up of a heat insulating material 28 and a cover 30 covering it.

Note that the heat insulating material 28 is made of styrene foam or the like, and the cover 30 is made of heat-resistant synthetic resin or the like.

The present embodiment has the above configuration, and its operation will be explained below.

First, the door 24 is opened and a board is inserted into the box body 16.

Sometimes, both sides of the board 12 are guided by guide grooves 26, and the insertion tip of the board 12 is inserted into the connector 18.

The door 24 is then closed, thereby sealing the box body 16.

Furthermore, energization by the external mold R22 is started, and each semiconductor element 10 on the substrate 12 self-heats due to the energization.

The box body 16 has a heat insulating structure, and since the door 24 is closed and the inside is hermetically sealed, thermal energy generated by self-heating of the semiconductor element 10 does not escape from the box body 16, and the heat is used to heat the semiconductor element 16. A heating test is performed.

As described above, according to this embodiment, only one board 12 is housed in the box body 16, so the size of the box body 16 can be suppressed to be slightly larger than the board 12.

For this reason, the device can be made smaller and testing can be performed in places with limited installation space, such as on a desk.

In addition, since the device is small, the semiconductor device 1 to be tested
Even when the types of 0s are different or the number of substrates 12 is small, the necessary number of devices can be prepared without considering the operating rate, etc., and the test can be performed easily and efficiently.

Furthermore, the device has a small number of parts and is easy to manufacture, and since the box body 16 can be made of styrene foam or the like, the manufacturing cost is also low.

Further, since the test is performed by the self-heating of the semiconductor element 10 and there is no need to provide a heating element for heating the semiconductor element 10, power consumption is extremely low.

Even if tests are conducted using a large number of devices,
The device itself generates only a small amount of heat and does not require large-scale air conditioning equipment, so it does not consume large amounts of electricity.

Additionally, since there is no air conditioning fan installed inside the device, testing can be carried out quietly.

41st! 1 shows the configuration of a second embodiment, and in this embodiment, the box body 16 can accommodate three substrates 12 on which semiconductor elements 10 are mounted.

For this reason, three connectors 18 into which the insertion tips of the boards 12 are fitted are provided on the inner wall on the far side of the box body 16.

Furthermore, an air conditioning fan 34 for stirring the air and a motor 3 for driving the air conditioning fan 34 are provided at the bottom and ceiling inside the box body 16.
6 and a temperature sensor 38 for measuring internal temperature.

According to this embodiment, since the air inside the box body 16 is stirred by the rotation of the air conditioning fan 34, the temperature inside the box body 16 can be made uniform.

Further, the heating temperature can be controlled by detecting the temperature inside the box body 16 using the temperature sensor 38.

Therefore, even if a plurality of substrates 12 are housed inside the box body 6, it is possible to conduct the test in good condition.

In addition, the box body 16 is small, and the air conditioning fan 34 and motor 3
6 uses a small device, so it consumes little power and is quiet.

Note that when conducting a test at a high heating temperature, if the self-heating of the semiconductor element 100 alone is insufficient, it is desirable to provide a heating element inside the box body 16.

FIG. 5 shows the configuration of the third embodiment.

In this embodiment, a predetermined number of slits 40 are formed at the bottom of the box body 16, and excess heat inside the box body 16 is discharged to the outside through the slits 40.

Therefore, the internal temperature of the box body 16 is kept constant.

Note that the number of slits 40 varies depending on the heating temperature during the test.

[Effects of the Invention] As explained above, according to the present invention, the size of the box body can be formed to be slightly larger than the board, so the device can be downsized and tests can be performed in places with little installation space, such as on a desk. becomes.

Moreover, since the apparatus is small, the test can be performed easily and efficiently even when the types of semiconductor devices to be tested are different or when the number of substrates is small.

Furthermore, since the structure can be simplified, the production cost can also be reduced.

Further, in the apparatus of the present invention, the test is performed by self-heating of the semiconductor element, and no heating element is required for heating, so power consumption is extremely low.

Even if tests are conducted using a large number of devices,
The device itself generates only a small amount of heat and does not require large-scale air conditioning equipment, so it does not consume large amounts of electricity.

Additionally, since there is no air conditioning fan or the like installed inside the device, testing can be carried out quietly.

[Brief explanation of drawings]

Fig. 1 is a perspective view illustrating the overall configuration of the first embodiment, Fig. 2 is a rear perspective view of the first embodiment, Fig. 3 is a sectional view of the first embodiment, and Fig. 4 is a second embodiment. FIG. 5 is a sectional view illustrating the configuration of the third embodiment, and FIG. 6 is a sectional view illustrating the configuration of a conventional example. 10... Semiconductor element 12... Board 14... Board entrance/exit 16... Box body 18... Connector 20... External power supply 22... Cable 24... Door 26... Guide structure 2nd...Insulating material 30...Cover 32...Handle 34...Air conditioning fan 36...Motor 38...Temperature sensor 40...Slit Fig. 2

Claims (1)

[Claims] A substrate (on which a semiconductor element (10) to be tested is mounted)
a box body (16) formed of a heat insulating material, a connector (18) into which a board (12) inserted into the box body (16) is fitted; ) pulled out to the outside of the box body (16), and an external power source (22) that heats the semiconductor element (10) on the board (12) via the cable (20) and connector (18). ); and a door (24) that is provided at the entrance/exit (14) of the substrate (12) and seals the box body (16) when closed.