KR20020059062A - Anti-fingerprint treatment for the copper metal - Google Patents

Anti-fingerprint treatment for the copper metal Download PDF

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KR20020059062A
KR20020059062A KR1020000087444A KR20000087444A KR20020059062A KR 20020059062 A KR20020059062 A KR 20020059062A KR 1020000087444 A KR1020000087444 A KR 1020000087444A KR 20000087444 A KR20000087444 A KR 20000087444A KR 20020059062 A KR20020059062 A KR 20020059062A
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weight
agent
parts
copper
fingerprint
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KR100393820B1 (en
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김동윤
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한영재
주식회사 디피아이
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16Antifouling paints; Underwater paints
    • C09D5/1656Antifouling paints; Underwater paints characterised by the film-forming substance
    • C09D5/1662Synthetic film-forming substance
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/08Anti-corrosive paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/47Levelling agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14Nitrogen-containing compounds
    • C23F11/149Heterocyclic compounds containing nitrogen as hetero atom

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Paints Or Removers (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

PURPOSE: An anti-fingerprint agent with excellent anti-corrosion and soldering property for copper metal is provided. CONSTITUTION: The anti-fingerprint agent for the copper metal comprises anionic urethane acrylic resin 20 wt.%, anti-corrosion agent 0.1 to 5 wt.%, alcohol 0.1 to 50 wt.% and a balance of water as solvent. Further, anti-fingerprint agent comprises 0.05 to 1 parts by weight of wetting agent, 0.1 to 5 parts by weight of leveling agent, 0.01 to 2 parts by weight of defoaming agent, based on the weight of 100 parts by weight of the anti-fingerprint agent. The anti-corrosion agent is selected from the group consisting of triazole, tetrazole, benzotriazole, benzimidazole and imidazole. In the anti-fingerprint agent, the ratio of the anti-corrosion agent and alcohol is 1:1 to 1:10. The anionic urethane acrylic resin has mean molecular weight of 8000 to 30000, pH 6 to 8 and viscosity(cps) range of 200 to 1000.

Description

구리금속용 내지문 처리제{Anti-fingerprint treatment for the copper metal}Anti-fingerprint treatment for the copper metal

본 발명은 구리의 내지문 처리제에 관한 것으로서, 보다 상세하게는 건축용 자재 또는 전자 부품의 소재등으로 사용되는 구리등에 사용할 수 있고, 우수한 내지문성과 내식성, 납땜성을 가지며, 부착 성능을 크게 향상시킨 구리용 내지문 처리제에 관한 것이다.TECHNICAL FIELD The present invention relates to a copper anti-fingerprint agent, and more particularly, can be used for copper used as a building material or an electronic component material, and has excellent anti-fingerprint, corrosion resistance, and solderability, and greatly improves adhesion performance. It relates to an anti-fingerprint agent for copper.

건축용 자재 및 전자부품의 소재 등에는 구리의 사용 부문이 많다. 하지만, 이러한 사용에 있어서 구리는 별도의 내지문 처리 없이 사용하는 것이 일반적이다. 따라서, 작업중 작업자에 의해 발생하는 지문의 발생 및 땀에 의한 구리 표면의 부식과 구리를 가공하는 후처리 제조 공정 중에 발생하는 기계적, 물리적 환경이 구리의 부식과 변색을 유발시켜 상품으로서의 가치가 떨어지게 하고 요구되어지는 여러 물성을 저하시키게 된다.There are many uses of copper in building materials and electronic parts. However, in this use, copper is generally used without separate rubbing treatment. Therefore, the corrosion and discoloration of the copper surface caused by fingerprints and sweat caused by workers during work and the post-treatment manufacturing process of processing copper cause corrosion and discoloration of copper, thereby degrading its value as a commodity. This lowers the required physical properties.

이들의 내지문성 및 내식성을 해결하기 위한 방법으로 기존에 사용하는 방법은 에틸렌 아크릭산 수지를 사출에 의해 접착시키는 방법이 제안되었다. 이들 에틸렌 아크릭산 수지를 접착 처리 방법은 처리가 안되었을 때보다 월등한 내지문 및내식 효과를 가지는 것으로 제안되었다.As a method for solving the anti-fingerprint and corrosion resistance of the conventional method has been proposed a method of adhering ethylene acrylic acid resin by injection. It has been proposed that the method of adhering these ethylene acrylic acid resins has a superior anti-fingerprint and corrosion resistance effect than when not treated.

그러나, 에틸렌 아크릭산 수지를 접착시키는 방법은 사출 방법으로 하기 때문에 도막이 두껍고 이로 인하여 납땜이 안되는 문제와 사출전 에틸렌 아크릭산 수지를 녹이기 위하여 많은 양의 열소비로 에너지 비용이 많이 드는 단점이 있다.However, since the method of adhering the ethylene acrylic acid resin is an injection method, there are disadvantages in that the coating film is thick, and therefore, the soldering problem and the energy cost are high due to a large amount of heat consumption in order to melt the ethylene acrylic acid resin before injection.

최근에는 이러한 문제들을 해결하는 방법으로는 수용화된 에틸렌 아크릭산 수지 용액을 사용하는 방법이 제안되었다. 이들의 수용화된 수지 용액은 내지문, 내식 및 내수성이 기존 에틸렌 아크릭산 수지를 이용한 사출 접착 처리보다 여러 물성 면에서 약간 떨어지나 도막을 얇게 할 수 있기 때문에 상황에 따라 도막량 조절에 의해 납땜성 및 내식성의 조절도 가능하게 되었다.Recently, as a method of solving these problems, a method of using an ethylene acetic acid resin solution which has been accepted has been proposed. These water-soluble resin solutions may be thinner in terms of physical properties than the injection adhesive treatment using conventional ethylene acrylic acid resin, but may be thinner. Corrosion resistance can also be adjusted.

이들 수용화된 수지 용액은 구리 및 구리를 이용한 합금등에 적용되고 있으며 이들의 도장 방법으로서는 롤에 감겨있는 구리에 리버스롤을 사용하여 1㎛ 정도로 도장하여 소재온도(MT)를 100-150℃ 조건에서 연속도장 건조시키는 피시엠(PCM) 도장방법과 용액조에 코팅제를 넣고 직접적으로 구리판등을 침적하는 침적 도장을 한후 100-150℃ 조건에서 건조시키는 침적도장 방법등이 사용되고 있다.These water-soluble resin solutions are applied to copper and alloys using copper, and as a coating method thereof, the copper wound around the roll is coated with a roll of about 1 μm, so that the material temperature (MT) is controlled at 100-150 ° C. PCM coating method for continuous drying and dip coating method for depositing copper plate directly by putting coating agent in solution bath and drying at 100-150 ℃ is used.

그러나, 수용화된 에틸렌 아크릭산 수지 용액에서는 수용화 하기 위하여 수지(바인더)의 산함유량이 15 내지 20% 정도로 높기 때문에 이후 건조 도막으로 코팅되었을 경우 내수성 부족으로 인하여 내식성 등에 있어서의 부분적 결함을 지니고 있다. 특히 수용화된 수지 용액의 높은 점도는 여전히 도막의 두께를 두껍게 하여 납땜의 과정에서 잦은 불량이 발생하는 것으로 나타났다.However, since the acid content of the resin (binder) is high in the range of 15 to 20% in order to solubilize the ethylene acrylic acid resin solution, there is a partial defect in corrosion resistance and the like due to lack of water resistance when coated with a dry coating film. . In particular, the high viscosity of the resin solution accommodated still thickens the thickness of the coating film, so that frequent defects occur during the soldering process.

따라서 본 발명자들은 지금까지 열거했던 사출 접착 또는 수용화된 에틸렌아크릭산 수지용액들을 이용한 처리의 방법으로 얻어지는 물성의 결함을 개선하기 위하여 다른 수지를 사용하는 방향으로 접근하고, 현장 적용을 통한 연구와 노력을 계속한 결과, 내지문성과 내식성이 우수하며 내수성, 납땜성 및 부착성 등이 우수하고, 기타 금속에 적용이 가능한 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지를 주원료로 사용하는 에너지·환경 친화성의 구리용 내지문 처리제를 개발하였다.Therefore, the present inventors have approached the direction of using other resins to improve the defects of physical properties obtained by the method of treatment using injection-adhesive or hydrated ethylene acrylic acid resin solutions, which have been enumerated so far, and research and efforts through field application As a result, the energy-environment-friendly copper using the anionic water-based urethane acryl resin of thermoplastic type which is excellent in rubbing and corrosion resistance, excellent in water resistance, solderability and adhesion, and applicable to other metals Solvent-treatment agents have been developed.

따라서, 본 발명의 목적은 건축용 자재 및 전자부품 소재등의 제조에 사용되는 구리의 내지문성과 내식성, 납땜성등을 비롯한 제반 특성이 우수하고, 환경이나 에너지 문제를 고려한 구리용 내지문 처리제를 제공하는 것이다.Accordingly, an object of the present invention is to provide an anti-fingerprint agent for copper, which is excellent in various properties including copper's anti-fingerprint, corrosion resistance, solderability, etc. used in the manufacture of building materials and electronic component materials. It is.

상기 목적을 달성하기 위하여 본 발명은, 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 및 부식방지제와 알코올을 포함하고 소정의 첨가제들로 이루어진 구리용 내지문 처리제를 제공한다.In order to achieve the above object, the present invention provides an anionic water-based urethane acryl resin of a thermoplastic type and an anti-fingerprinting agent for copper containing an anticorrosive agent and an alcohol and made of predetermined additives.

상기 구리용 내지문 처리제의 조성은, 상기 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 20중량%, 상기 부식방지제 0.1 내지 5중량%, 상기 알코올 0.1 내지 50중량%를 포함하고, 상기 첨가제를 적량 포함하는 것으로, 용매로 물을 사용하여 구리용 내지문 처리제를 구성한다.The composition of the anti-fingerprint agent for copper includes 20% by weight of the anionic aqueous urethane acryl resin of the thermoplastic type, 0.1 to 5% by weight of the corrosion inhibitor, and 0.1 to 50% by weight of the alcohol, and includes the appropriate amount of the additive. By using water as a solvent, the anti-fingerprint agent for copper is comprised.

상기 첨가제는 습윤제, 평활제, 소포제 등으로, 이들은 공지된 물질을 사용할 수 있는데, 그 사용량은 상기 습윤제는 전체 처리제 조성물 100 중량부에 대해서 0.05 내지 1 중량부, 상기 평활제는 0.1 내지 5 중량부, 상기 소포제는 0.01 내지 2 중량부 포함하는 것이 바람직하다.The additive is a wetting agent, a leveling agent, an antifoaming agent, and the like, and these may use a known material. The amount of the wetting agent is 0.05 to 1 part by weight based on 100 parts by weight of the total treatment agent composition, and the leveling agent is 0.1 to 5 parts by weight. , The antifoaming agent preferably contains 0.01 to 2 parts by weight.

그리고, 상기 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지로는 중량평균분자량이 8000∼30000 이고 피에취(pH)는 6∼8이며, 점도(cps)는 200∼1000 이하인 것이 바람직하다.In addition, the thermoplastic type anionic aqueous urethane acrylic resin preferably has a weight average molecular weight of 8000 to 30000, a odor (pH) of 6 to 8, and a viscosity (cps) of 200 to 1000 or less.

상기 부식방지제로는 트리아졸, 테트라졸, 벤조트리아졸, 벤조이미다졸 및 이미다졸로 이루어진 군에서 선택된 적어도 하나를 사용할 수 있다. 이 부식방지제는 상기 알코올로 녹인 다음 상기 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지에 첨가하고, 상기 부식방지제와 상기 알코올은 1:1 내지 1:10의 비율로 혼합하여 내지문 처리제를 제조한다.As the corrosion inhibitor, at least one selected from the group consisting of triazole, tetrazole, benzotriazole, benzoimidazole and imidazole may be used. This preservative is dissolved with the alcohol and then added to the thermoplastic type anionic aqueous urethane acryl resin, and the preservative is prepared by mixing the preservative and the alcohol in a ratio of 1: 1 to 1:10.

이하 본 발명에 대하여 상세히 설명한다.Hereinafter, the present invention will be described in detail.

앞서 설명한 대로 본 발명의 구리용 내지문 처리제는 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 및 부식방지제와 알코올을 포함하고 소정 첨가제들로 이루어진 것으로, 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지를 포함한다. 본 발명에서 사용할 수 있는 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지는 공지된 물질로서, 본 발명에 사용될 수 있는 음이온계 수성 우레탄 아크릭 수지는 중량평균분자량이 8000∼30000 이고 피에취(pH)는 6∼8이며, 점도(cps)는 200∼1000 이하인 것이 바람직하다.As described above, the anti-fingerprint agent for copper of the present invention comprises a thermoplastic type anionic aqueous urethane acrylic resin and a corrosion inhibitor and an alcohol, and includes certain additives, and includes a thermoplastic type anionic aqueous urethane acrylic resin. The anionic aqueous urethane acrylic resin of the thermoplastic type that can be used in the present invention is a known material, and the anionic aqueous urethane acrylic resin that can be used in the present invention has a weight average molecular weight of 8000 to 30000 and a pieche (pH) of 6 to It is preferable that it is 8 and viscosity (cps) is 200-1000 or less.

무게 평균 분자량이 800보다 작은 경우는 도막의 형성이 어려워지고 부착성이 나빠지며 30000 이상이면 작업성과 도막의 외관이 불량해진다. 피에취는 6 미만일 경우 내알카리성이 떨어지며 8 이상이면 내산성이 떨어지게 된다. 점도는 200 이하일 경우 롤코팅 작업중 처리제의 튐 현상이나 침적 도장시 일정량 이상의 도막 형상이 어렵게 되고 1000 이상이면 오히려 코팅 작업중에 줄무늬 발생 및 평활성 불량을 나타낸다. 따라서 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지의 중량평균분자량이 8000∼30000 이고 폐하(pH)는 6∼8이며, 점도(cps)는 200∼1000 이하인 것이 바람직하다.If the weight average molecular weight is less than 800, the coating film becomes difficult to form, the adhesion is poor, and if it is 30000 or more, the workability and the appearance of the coating film are poor. If the odor is less than 6 alkali resistance is lowered, if more than 8 it is less acid resistance. If the viscosity is less than 200, the coating film shape of a certain amount or more during the coating or deposition of the treatment agent during the roll coating operation becomes difficult, and if it is more than 1000, the viscosity occurs and the smoothness is poor during the coating operation. Therefore, it is preferable that the weight-average molecular weight of the thermoplastic anionic aqueous urethane acryl resin is 8000 to 30000, the macular pH (pH) is 6 to 8, and the viscosity (cps) is 200 to 1000 or less.

본 발명에서 사용할 수 있는 부식방지제로는 트리아졸, 테트라졸, 벤조트리아졸, 벤조이미다졸 및 이미다졸중 어느 하나를 단독 또는 혼합 사용이 가능하다. 대표적인 부식방지제로 벤조트리아졸을 사용 할 수가 있다. 이의 사용량은 전체 조성물 100중량부에 대해서 0.1내지 5중량부를 사용하는 것이 좋다. 만약 이의 사용량이 0.1중량부 미만이면 구리의 내식성이 저하되고 5량부 이상이면 수성 수지와의 상용성이 나쁘게 되어 도막의 형성을 저해한다.As the corrosion inhibitor that can be used in the present invention, any one of triazole, tetrazole, benzotriazole, benzoimidazole and imidazole may be used alone or in combination. As a typical corrosion inhibitor, benzotriazole can be used. Its amount is preferably used 0.1 to 5 parts by weight based on 100 parts by weight of the total composition. If the amount thereof is less than 0.1 part by weight, the corrosion resistance of copper is lowered. If the amount is more than 5 parts by weight, compatibility with the aqueous resin becomes poor, which hinders the formation of the coating film.

상기 부식방지제를 사용함에 있어 알코올류의 사용이 불가피하다. 수성 수지와 부식방지제의 상용성을 위해서는 알코올류로 부식방지제를 녹인 다음 수지에 첨가하는 방법으로 사용한다. 사용할 수 있는 알코올류는 메틸알코올, 에틸알코올, 프로판올, 이소프로판올, 메톡시 프로판올 및 부톡시 에탄올중 어느 하나를 단독 또는 혼합 사용이 가능하다. 대표적인 알코올로 에틸알코올을 사용 할 수가 있다. 그 사용량에 있어 알코올과 부식방지제와의 비율은 1:1 내지 10:1 의 비율로 사용하는 것이 좋다. 만약 이의 사용량이 1:1 이하이면 부식방지제가 알코올류에 완전히 녹지 않고 수용성 수지와의 상용성이 떨어지게 되며 10:1 이상이면 알코올의 함유량이 높아져 휘발성 유기화합물 발생이 증가되어 인체 및 환경에 유해하게 된다.In using the corrosion inhibitors, the use of alcohols is inevitable. For compatibility between aqueous resins and corrosion inhibitors, dissolve the corrosion inhibitors with alcohols and add them to the resin. Alcohols that can be used may be used alone or in combination of methyl alcohol, ethyl alcohol, propanol, isopropanol, methoxy propanol and butoxy ethanol. Ethyl alcohol can be used as a representative alcohol. In the amount used, the ratio of the alcohol and the corrosion inhibitor is preferably used in a ratio of 1: 1 to 10: 1. If the amount is less than 1: 1, the corrosion inhibitor is not completely dissolved in alcohols, and the compatibility with water-soluble resins is inferior. If it is more than 10: 1, the content of alcohol is increased, which increases the generation of volatile organic compounds, which is harmful to human body and environment. do.

본 발명에 사용되는 기타 첨가제 즉, 습윤제, 평활제, 소포제 등은 공지된 물질을 사용할 수 있으며, 그 사용량은 각각 전체 조성물 100 중량부에 대하여 적정량 사용한다.Other additives used in the present invention, that is, wetting agents, leveling agents, antifoaming agents and the like can be used a known material, the amount of each is used in an appropriate amount based on 100 parts by weight of the total composition.

각각에 대하여 설명하면, 본 발명에서 사용할 수 있는 습윤제로서 어느 하나를 단독 또는 혼합 사용이 가능하다. 비와이케이(BYK)사의 151, 180, 183, 184, 190, 191, 192 테고(TEGO)사의 Wet KL 245, wet 450, wet 260, wet265, wet 500, Dispers 715w, Dispers 735w, Dispers 745w와 에어프러덕트사(Air Product)의 Surfynol GA등을 사용 가능하다. 이의 사용량이 전체 조성물 100 중량부에 대해서 0.05 내지 1 중량부 사용하는 것이 좋다. 만약 이의 사용량이 0.05 중량부 미만이면 처리제가 구리표면에 도포되지 못하여 도막 형성이 어렵고 1 중량부 이상이면 내식성과 내수성등이 저하된다.If each is explained, it can be used individually or in mixture as a humectant which can be used by this invention. BYK's 151, 180, 183, 184, 190, 191, 192 Tego's Wet KL 245, wet 450, wet 260, wet265, wet 500, Dispers 715w, Dispers 735w, Dispers 745w and air purifier Duct (Air Product) Surfynol GA etc. can be used. It is preferable to use 0.05 to 1 parts by weight based on 100 parts by weight of the total composition thereof. If the amount thereof is less than 0.05 parts by weight, the treatment agent is not applied to the copper surface, so that the coating film is difficult to form, and if it is 1 part by weight or more, the corrosion resistance and water resistance are lowered.

본 발명에서 사용할 수 있는 소포제로서 어느 하나를 단독 또는 혼합 사용이 가능하다. 비와이케이(BYK)사의 011, 019, 020, 022, 025, 028와 테고(TEGO)사의 Foamex 800, Foamex 810, Foamex 815, Foamex 825와 에어프러덕트사(Air Product)의 DF 75등을 사용 가능하다. 이의 사용량이 전체 조성물 100 중량부에 대해서 0.01 내지 2 중량부 사용하는 것이 좋다. 만약 이의 사용량이 0.01 중량부 미만이면 충분한 소포성을 나타내지 못하여 도막에 기포가 남게 되거나 작업중의 기포 발생이 심하게 되고 1 중량부 이상이면 크레이터링이 발생되거나 습윤 되지 않게 된다.As the antifoaming agent that can be used in the present invention, any one can be used alone or in combination. BYK's 011, 019, 020, 022, 025, 028 and TEGO's Foamex 800, Foamex 810, Foamex 815, Foamex 825 and Air Product DF 75 are available. Do. It is preferable to use the amount thereof in an amount of 0.01 to 2 parts by weight based on 100 parts by weight of the total composition. If the amount thereof is less than 0.01 parts by weight, it will not show sufficient anti-foaming properties, and bubbles will remain in the coating film or bubbles will be generated during the operation. If it is more than 1 part by weight, no cratering will occur or wetting.

본 발명에서 사용할 수 있는 평활제로서 어느 하나를 단독 또는 혼합 사용이 가능하다. 비와이케이(BYK)사의 375, 380, 385와 테고(TEGO)사의 Flow 425, Glide 435등을 사용 가능하다. 이의 사용량이 전체 조성물 100 중량부에 대해서 0.1 내지 5 중량부 사용하는 것이 좋다. 만약 이의 사용량이 0.1 중량부 미만이면 처리제가 표면에 코팅후 열풍 또는 건조 과정중에서 평활성이 떨어져 외관이 불량하게 되고 5 중량부 이상이면 도막이 불투명해지게 된다.As the leveling agent that can be used in the present invention, any one can be used alone or in combination. BYK's 375, 380, 385, and Tego's Flow 425 and Glide 435 are available. It is preferable to use the amount thereof in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the total composition. If the amount thereof is less than 0.1 part by weight, the surface of the treatment agent may be uneven during hot air or drying after coating on the surface, resulting in poor appearance.

이하 본 발명을 실시예에 의하여 더욱 상세히 설명되나, 본 발명이 하기의 실시예에 한하는 것은 아니며, 본 발명의 상세한 설명 및 특허 청구 범위를 기초로 하여 본 발명의 정신 및 범위내에서 다양한 변형 및 응용이 가능하다는 것과 이 변형 및 응용이 본 발명의 범위에 포함된다는 것을 알 수 있을 것이다.Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the following examples, and various modifications and changes within the spirit and scope of the present invention are made based on the detailed description and the claims of the present invention. It will be appreciated that applications are possible and that variations and applications are within the scope of the present invention.

실시예 1Example 1

열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 R-CM 20 중량부를 비이커에 투입하고 교반하면서 에탄올 2 중량부와 벤조트리아졸 0.3 중량부의 용액을 서서히 투입한다. 물을 76.9 중량부와 투입하여 희석한다음 첨가제로 습윤제 BYK-192와 평활제로 BYK-380을 각각 0.4 와 0.2 중량부 첨가하고 소포제로 BYK-020 0.2 중량부를 혼합하여 고형분 7.5%, pH 7, 점도 12초(훠드컵 4번 20℃)에 반투명 우유빛 용액을 얻었다.20 parts by weight of the thermoplastic anionic aqueous urethane acryl resin R-CM was added to a beaker, and a solution of 2 parts by weight of ethanol and 0.3 parts by weight of benzotriazole was gradually added while stirring. After diluting with 76.9 parts by weight of water, 0.4 and 0.2 parts by weight of BYK-380 as a wetting agent BYK-192 and a leveling agent as additives, and 0.2 parts by weight of BYK-020 as antifoaming agent were mixed, and the solid content was 7.5%, pH 7, viscosity. A translucent milky solution was obtained in 12 seconds (Cand Cup No. 4 20 ° C).

실시예 2Example 2

열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 R-912B 20 중량부를 비이커에 투입하고 교반하면서 부톡시 에탄올 2중량부와 벤조트리아졸 0.5 중량부의용액을 서서히 투입한다. 물을 75 중량부와 투입하여 희석한다음 첨가제로 습윤제 TEGO Dispers 715w와 평활제로 TEGO Flow 425을 각각 0.3 와 0.5 중량부 첨가하고 소포제로 Surfynol DF 75 0.05 중량부를 혼합하여 고형분 7.5%, pH 7, 점도 11초(훠드컵 4번 20℃)에 반투명 우유빛 용액을 얻었다.20 parts by weight of a thermoplastic anionic aqueous urethane acryl resin R-912B was added to a beaker, and then 2 parts by weight of butoxy ethanol and 0.5 parts by weight of benzotriazole were gradually added while stirring. After diluting with 75 parts by weight of water, 0.3 and 0.5 parts by weight of TEGO Dispers 715w as a wetting agent and TEGO Flow 425 as a leveling agent were added, respectively, and 0.05 parts by weight of Surfynol DF 75 as an antifoaming agent. A translucent milky solution was obtained in 11 seconds (Cand Cup No. 4 20 ° C).

비교예 1Comparative Example 1

수용성 우레탄 폴리에스터 수지 R-974 17.5 중량부를 비이커에 투입하고 교반하면서 에탄올 2 중량부와 벤조트리아졸 0.3 중량부의 용액을 서서히 투입한다. 물을 79.4 중량부와 투입하여 희석한다음 첨가제로 습윤제 BYK-192와 평활제로 BYK-380을 각각 0.4 와 0.2 중량부 첨가하고 소포제로 BYK-020 0.2 중량부를 혼합하여 고형분 7.5%, pH 7, 점도 12초(훠드컵 4번 20℃)에 반투명 우유빛 용액을 얻었다.17.5 parts by weight of a water-soluble urethane polyester resin R-974 was added to a beaker, and a solution of 2 parts by weight of ethanol and 0.3 parts by weight of benzotriazole was gradually added while stirring. 79.4 parts by weight of water and dilution were added, and 0.4 and 0.2 parts by weight of BYK-380 as an additive and a wetting agent BYK-192 as a smoothing agent were added, and 0.2 parts by weight of BYK-020 as an antifoaming agent. A translucent milky solution was obtained in 12 seconds (Cand Cup No. 4 20 ° C).

비교예 2Comparative Example 2

에틸렌 아크릭산 수지 5980의 7 중량부를 암모니아수 0.3 중량부 및 물 89.5 중량부에 수용화 한 다음 비이커에 투입하고 교반하면서 에탄올 2중량부와 벤조트리아졸 0.3 중량부의 용액을 서서히 투입한다. 첨가제로 습윤제 Surfynol GA 와 평활제로 BYK-381을 각각 0.5 와 0.2 중량부 첨가하고 소포제로 BYK-011 0.2 중량부를 혼합하여 고형분 7.5%, pH 8.5, 점도 14초(훠드컵 4번 20℃)에 반투명 우유빛 용액을 얻었다.7 parts by weight of ethylene acrylic acid resin 5980 was solubilized in 0.3 parts by weight of ammonia water and 89.5 parts by weight of water, and then charged into a beaker and slowly added a solution of 2 parts by weight of ethanol and 0.3 parts by weight of benzotriazole. 0.5 and 0.2 parts by weight of BYK-381 as a wetting agent Surfynol GA and a smoothing agent as additives and 0.2 parts by weight of BYK-011 as antifoaming agent were mixed and then semi-transparent in 7.5% of solid content, pH 8.5 and viscosity 14 seconds (4 cups 20 ℃). A milky solution was obtained.

비교예 3Comparative Example 3

에틸렌 아크릭산 수지 용액인 4983-40R 17.5 중량부를 비이커에 투입하고 교반하면서 부톡시에탄올 2중량부와 벤조트리아졸 0.5 중량부의 용액을 서서히 투입한다. 물을 18 중량부와 투입하여 희석한다음 첨가제로 습윤제 Dispers 815W와 평활제로 BYK-381을 각각 0.3 와 0.4 중량부 첨가하고 소포제로 BYK-020을 0.2 중량부를 혼합하여 고형분 7.5%, pH 8, 점도 15초(훠드컵 4번 20℃)에 반투명 우유빛 용액을 얻었다.17.5 parts by weight of 4983-40R, an ethylene acrylic acid resin solution, was added to a beaker and a solution of 2 parts by weight of butoxyethanol and 0.5 parts by weight of benzotriazole was gradually added while stirring. 18 parts by weight of water and dilution were added, followed by adding 0.3 and 0.4 parts by weight of BYK-381 as a wetting agent, Dispers 815W as an additive, and 0.2 parts by weight of BYK-020 as an antifoaming agent, and a solid content of 7.5%, pH 8, and viscosity. A translucent milky solution was obtained in 15 seconds (cup 4 times 20 ° C.).

실험예\원료Experimental Example 실시예 1Example 1 실시예 2Example 2 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 R-CM(주1)R-912B(주2)R-974(주3)5980수지용액(주4)4983-40R(주5)에탄올부톡시에탄올벤조트리아졸물BYK-192(주6)TEGO Dispers 715\(주7)Surfynol GA(주8)BYK-380(주6)TEGO FLOW 425(주7)BYK-381(주6)BYK-020(주6)Surfynol DF75(주8)BYK-011(주6) R-CM (Note 1) R-912B (Note 2) R-974 (Note 3) 5980 resin solution (Note 4) 4983-40R (Note 5) Ethanol butoxyethanol benzotriazole water BYK-192 (Note 6) TEGO Dispers 715 \ (Note 7) Surfynol GA (Note 8) BYK-380 (Note 6) TEGO FLOW 425 (Note 7) BYK-381 (Note 6) BYK-020 (Note 6) Surfynol DF75 (Note 8) BYK-011 Note 6 20----2-0.3750.4--0.2--0.2--20 ---- 2-0.3750.4--0.2--0.2-- -20----20.576.6-0.3--0.5--0.1--20 ---- 20.576.6-0.3--0.5--0.1- --17.5--2-0.379.40.4--0.2--0.2----17.5--2-0.379.40.4--0.2--0.2-- ---96.8-2-0.3---0.5--0.2--0.2--- 96.8-2-0.3 --- 0.5--0.2--0.2 ----17.5-20.579.1-0.3---0.40.2------ 17.5-20.579.1-0.3 --- 0.40.2-- 합 계Sum 100.0100.0 100.0100.0 100.0100.0 100.0100.0 100.0100.0

주1) 국내 보광화학의 열가소성 음이온계 수성 우레탄 아크릭수지(고형분 35%)Note 1) Thermoplastic anionic aqueous urethane acryl resin of Korea Bokwang Chemical (solid content 35%)

주2) 국내 보광화학의 열가소성 음이온계 수성 우레탄 아크릭수지(고형분35%)Note 2) Thermoplastic anionic water-based urethane acrylic resin of Korea Gwanggwang Chemical (solid content 35%)

주3) 스위스국 제네카사의 열가소성 비이온계 수용성 우레탄 폴리에스터수지(고형분 35%)Note 3) Thermoplastic nonionic water-soluble urethane polyester resin manufactured by Genca, Switzerland (35% solids)

주4) 미국 다우코닝사의 프리마코르 5980수지 7 중량부와와 암모니아수 0.3 중량부, 물 89.5 중량부의 혼합 용액4) 7 parts by weight of Primacor 5980 resin, 0.3 parts by weight of ammonia water and 89.5 parts by weight of water

주 5) 미국 마이켐사의 프라임 수지(고형분 40%)Note 5) Prime resin (40% solids) of Mychem, USA

주 6) 독일국 비와이케이사 제품Note 6) product made by Germany

주7) 독일국 테고사 제품Note 7) Tegosa Products, Germany

주8) 미국 에어프러덕트사 제품Note 8) US Air Products Company

시편의 제작Psalm Fabrication

탈지 처리된 70×150×0.05㎜ 크기의 구리판을 침적 도장 방식으로 코팅조내에 침적하여 30초정도 침적한다음 빼어내어 상온에서 1분간 건조후 소지 표면온도가 100℃ 되도록 강제 열풍 순환 오븐에서 건조시켰다.Degreased 70 × 150 × 0.05 mm sized copper plate was deposited in a coating bath by immersion coating method, and then immersed for 30 seconds, then extracted and dried at room temperature for 1 minute, and then dried in a forced hot air circulation oven to have a surface temperature of 100 ° C. .

상기 표 1에 나타난 각 처리제의 특성을 알아보기 위하여 상기에 언급된 시편의 제작방법으로 도장후 도막의 특성을 다음과 같은 시편의 시험 방법으로 시험하였다.In order to find out the characteristics of each of the treatment agents shown in Table 1, the characteristics of the coating film after coating were tested by the test method of the following specimens by the method of manufacturing the specimens mentioned above.

도막 물성 시험Coating film property test

외관 시험Appearance test

도장된 시편의 외관이 이물질 및 미도장 부위가 없이 양호한지 평가한다.Evaluate the appearance of the painted specimens, with no foreign matter and no unpainted area.

(◎ : 이상없음, ○ : 티 약간, △ : 크레이터링, × : 미도장)(◎: No abnormality, ○: Tee slightly, △: Cratering, ×: Unpainted)

내지문성 시험Anti-fingerprint test

코팅된 부분에 바세린 도포후 5분 경과 뒤 닦아내어 도막 상태 관찰.Wipe off after 5 minutes after applying petroleum jelly to the coated area to observe the coating state.

(◎ : 이상없음, ○ : 10% 이내 바세린 자국 남음, △ : 50% 이내의 바세린 자국 남음손실크레이터링, × : 전체 바세린 자국이 남음)(◎: No abnormality, ○: Less than 10% of petrolatum remains, △: Less than 50% of petrolatum remains Loss cratering, ×: All of petrolatum remains)

부착성 시험Adhesion test

도장된 시편을 가로세로의 크기가 1㎜가 되도록 총 100개를 만들고 쓰리엠 스카치테잎을 붙인다음 떼어내어 도막의 밀착성을 평가한다.A total of 100 coated specimens are to be 1 mm in width, 3M Scotch tape is attached, and then peeled off to evaluate the adhesion of the coating film.

(◎ : 이상없음, ○ : 10개 이내 탈락, △ : 50개 이내 탈락, × : 완전 탈락)(◎: No abnormality, ○: 10 or more dropouts, △: 50 or more dropouts, ×: complete dropouts)

내용제성 시험Solvent resistance test

거즈에 메틸에틸케톤을 뭍혀 일정한 힘을 가해 왕복으로 문지른후 도막 상태 관찰.Methyl ethyl ketone was applied to the gauze and rubbed in a reciprocating direction with a constant force.

(◎ : 이상없음(20회이상), ○ : 20회 미만, △ : 5회이하, × : 1회 이하)(◎: no abnormality (more than 20 times), ○: less than 20 times, △: 5 times or less, ×: 1 time or less)

내식성 시험Corrosion resistance test

도장된 시편을 35℃, 95%의 습도에서 5%의 식염수를 연속 분무하여 초기발청 정도를 평가한다.The painted specimens were sprayed continuously with 5% saline solution at 35 ° C and 95% humidity to evaluate the initial degree of rust.

(◎ : 72시간 이상없음, ○ : 48시간이후 초기 발청 △ : 24시간이후 초기발청, × : 24시간 이전 초기발청)(◎: No more than 72 hours, ○: Initial call after 48 hours △: Initial call after 24 hours, ×: Initial call before 24 hours)

납땜성 시험Solderability test

도장된 시편위에 0.1mm 지름의 구리선을 납땜하여 부착성을 평가Adhesion was evaluated by soldering a 0.1 mm diameter copper wire onto the painted specimen

(◎ : 0.4kg/㎠ 이상, ○ : 0.4kg/㎠ 미만, △ : 0.1kg/㎠ 이하, × : 미부착)(◎: 0.4 kg / cm 2 or more, ○: less than 0.4 kg / cm 2, △: 0.1 kg / cm 2 or less, ×: not attached)

수득한 도막의 물성 시험 결과를 하기 표 2에 나타낸다.The physical property test results of the obtained coating film are shown in Table 2 below.

실험예\항목Experimental Example 실시예 1Example 1 실시예 2Example 2 비교예 1Comparative Example 1 비교예 2Comparative Example 2 비교예 3Comparative Example 3 외 관Exterior 내지문성Anti-fingerprint 부착성Adhesion 내용제성Solvent resistance 내식성Corrosion resistance XX XX 납땜성Solderability

상기 표 2로부터, 실시예 1 내지 2에 의하여 수득한 조성물을 사용하는 경우에는 외관 및 내지문성, 내식성, 부착성, 내용제성, 납땜성등의 면에서 비교예의 조성물에 비하여 우수한 효과를 나타냄을 알 수 있었다.Table 2 shows that the compositions obtained in Examples 1 and 2 exhibited superior effects compared to the compositions of Comparative Examples in terms of appearance and fingerprint resistance, corrosion resistance, adhesion, solvent resistance, solderability, and the like. Could.

상술한 바와 같이, 구리 또는 구리합금등에 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 및 부식방지제와 알코올, 습윤제, 평활제, 소포제등을 이용하여 제조된 처리제를 사용하면 내지문성, 내식성 및 제반 물성이 우수한 도막을 얻을 수 있다. 또한, 수성 우레탄 아크릭 수지를 주원료로 사용하기 때문에 에너지 절약문제, 환경 공해 문제, 작업 위생 안정성 문제 및 화재 위험성도 감소하는 장점이 있다.As described above, when a thermoplastic type anionic aqueous urethane acryl resin and a corrosion inhibitor, and a treatment agent prepared using an alcohol, a humectant, a leveling agent, an antifoaming agent, etc. are used in copper or a copper alloy, excellent anti-fingerprint, corrosion resistance, and physical properties A coating film can be obtained. In addition, the use of water-based urethane acrylic resin as a main raw material has the advantage of reducing energy saving problems, environmental pollution problems, work hygiene stability problems and fire risk.

Claims (6)

열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 및 부식방지제와 알코올을 포함하고 소정 첨가제들로 이루어진 구리용 내지문 처리제.An anionic aqueous urethane acryl resin of a thermoplastic type, and an anti-fingerprint agent for copper comprising a corrosion inhibitor and an alcohol, and comprising certain additives. 제1항에 있어서, 상기 구리용 내지문 처리제는, 상기 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지 20중량%, 상기 부식방지제 0.1 내지 5중량%, 상기 알코올 0.1 내지 50중량%를 포함하고, 상기 첨가제를 적량 포함하며, 용매로 물을 사용하는 것을 특징으로 하는 구리용 내지문 처리제.According to claim 1, wherein the anti-fingerprint agent for copper, 20% by weight of the anionic aqueous urethane acrylic resin of the thermoplastic type, 0.1 to 5% by weight of the corrosion inhibitor, 0.1 to 50% by weight of the alcohol, the additive An anti-fingerprint agent for copper, comprising a suitable amount, and using water as a solvent. 제2항에 있어서, 상기 첨가제는 습윤제, 평활제, 소포제 등으로, 상기 습윤제는 전체 처리제 조성물 100 중량부에 대해서 0.05 내지 1 중량부, 상기 평활제는 0.1 내지 5 중량부, 상기 소포제는 0.01 내지 2 중량부 포함하는 것을 특징으로 하는 구리용 내지문 처리제.The method of claim 2, wherein the additive is a wetting agent, a smoothing agent, an antifoaming agent, the wetting agent is 0.05 to 1 part by weight, the leveling agent is 0.1 to 5 parts by weight, the defoaming agent is 0.01 to about 100 parts by weight of the total treatment agent composition An anti-fingerprint agent for copper, comprising 2 parts by weight. 제1항에 있어서, 상기 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지로는 중량평균분자량이 8000∼30000 이고 피에취(pH)는 6∼8이며, 점도(cps)는 200∼1000 이하인 것을 특징으로 하는 구리용 내지문 처리제.The method of claim 1, wherein the thermoplastic type anionic aqueous urethane acryl resin has a weight average molecular weight of 8000 to 30000, a odor (pH) of 6 to 8, and a viscosity (cps) of 200 to 1000 or less. Anti-fingerprint agent for copper. 제1항에 있어서, 상기 부식방지제로는 트리아졸, 테트라졸, 벤조트리아졸,벤조이미다졸 및 이미다졸로 이루어진 군에서 선택된 적어도 하나를 사용하는 것을 특징으로 하는 구리용 내지문 처리제.The anti-fingerprint agent for copper according to claim 1, wherein at least one selected from the group consisting of triazole, tetrazole, benzotriazole, benzoimidazole and imidazole is used as the corrosion inhibitor. 제5항에 있어서, 상기 부식방지제는 상기 알코올로 녹인 다음 상기 열가소성 타입의 음이온계 수성 우레탄 아크릭 수지에 첨가하고, 상기 부식방지제와 상기 알코올은 1:1 내지 1:10의 비율로 혼합하는 것을 특징으로 하는 구리용 내지문 처리제.The method of claim 5, wherein the corrosion inhibitor is dissolved in the alcohol and added to the anionic aqueous urethane acrylic resin of the thermoplastic type, the corrosion inhibitor and the alcohol is mixed in a ratio of 1: 1 to 1:10. Anti-fingerprint agent for copper to be used.
KR10-2000-0087444A 2000-12-30 2000-12-30 Anti-fingerprint treatment for the copper metal KR100393820B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100891808B1 (en) * 2002-12-02 2009-04-07 주식회사 포스코 Resin composition to prevent blowhole mark on surface of anti-finger printing steel sheet
CN103225084A (en) * 2013-03-28 2013-07-31 中国科学院海洋研究所 Application of acethydrazide type compound containing furan nitrogen heterocycle and being used as corrosion inhibitor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170066697A (en) * 2013-03-16 2017-06-14 피알시-데소토 인터내쇼날, 인코포레이티드 Azole compounds as corrosion inhibitors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100891808B1 (en) * 2002-12-02 2009-04-07 주식회사 포스코 Resin composition to prevent blowhole mark on surface of anti-finger printing steel sheet
CN103225084A (en) * 2013-03-28 2013-07-31 中国科学院海洋研究所 Application of acethydrazide type compound containing furan nitrogen heterocycle and being used as corrosion inhibitor

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