KR20020049376A - In-Line system for operating ball-mounting and marking in manufacturing process of semiconductor - Google Patents

Abstract

PURPOSE: An inline system for performing marking and ball-mounting operations in a process for fabricating a semiconductor is provided to reduce a space for installing apparatuses and to enable a consecutive process, by performing an assembly operation. CONSTITUTION: A plurality of integrated circuit(IC) chips are of a strip state before the plurality of IC chips are sawed to each IC chip. The strip is supplied one by one from a magazine(3) for receiving the strip. A company mark, a standard, etc. are marked on the surface of the strip by using a laser. A process for fabricating the semiconductor IC chip is performed to form a contact point of the IC chip so that an inline state is formed by an assembly process.

Description

In-line system for operating ball-mounting and marking in manufacturing process of semiconductor

In the process of manufacturing a semiconductor device such as an IC chip, the present invention receives a strip, which is a state before a plurality of IC chips are connected and cut into respective IC chips, from a magazine containing strips. This is a process of marking a company mark, a standard, etc. on the surface of a strip with a laser, and then forming a contact point of an IC chip. Currently, the semiconductor assembly process attaches a die to a lead frame or a printed circuit board (P, C, B; printed circuit board), and then connects the connection between the die and the frame. Wire Bonding In order to protect the wire and die after molding, molding or insulation is performed in order to protect the wires and dies. The molding / in-cap process is called a molding process, which is called an in or front line. After the molding process, a marking process is performed to mark a trademark or specification. It is a process of forming a contact point on an IC chip so that it can be mounted on a board. The process including a marking is generally called a back-end or end line process. The over-molding or in-encapsulation process is intended to be a separate process.

As described above, the marking process and the molding process, which are one of the conventional IC chip semiconductor production processes, are separate from each other, and a strip, which is a semiconductor chip, in which the molding process is completed, is again accommodated in a magazine, which is a strip housing, for marking. When moving to the process, the strips are flipped over and placed back into the magazine for marking on the back of the molded strip (the strip cannot be reversed due to the characteristics of the previous process), then loading marking on the marking machine, inspection for marking defects, and After the marking process is completed, the marking process is completed, and after the marking process is completed, the strip is turned upside down and accommodated in a magazine for ball mounting, which is the next process, and then supplied to a ball mounter machine. This is because the product moves to the next process after a process such as fluxing and ball mounting defect inspection. Due to the various processes, there is a risk of damage to the strip, waste of manpower to turn the strip over, or other equipment (equipment to turn the strip into the magazine). In addition to the increase, the cost of production will increase due to the expansion of installation space, which will lead to a reduction in corporate profit or loss of price competitiveness.

1 is a block diagram schematically illustrating an in-line system for sequentially performing marking and ball mounting operations according to the present invention.

FIG. 2 is a full line perspective view of an in-line system for sequentially performing marking and ball mounting operations performed in FIG. 1; FIG.

3 is a perspective view of a transfer apparatus in which a marking operation is completed on a strip of an IC chip having a plurality of lengths connected to a plurality of IC chips before each IC chip is moved to the next process;

<Code Description of Main Parts of Drawing>

1. Square Expectation 2. Strip

3. Magazine 4. Information

5. Conveyer 6. Laser marking M / C

7. Bad marking machine 8. Glue application device

9. Ball Mounting Machine

11. Picker 12. Defective Treatment Plant

30. Vacuum suction mover 31. Pneumatic actuator

32. Between operations 32a. Sucker

32b. Hinge 33. Top Plate

33a. Lower plate 34. Screw shaft

35. Guide Post

The present invention eliminates the problems caused by the separate molding and marking work as described above, and the line to work consistently with the in-line system (In-Line System) in order to produce better quality products more quickly and accurately. As the invention formed, it will be described in detail with reference to Figure 1 attached as follows.

A rectangular base 1 having a constant width is provided at a constant height and a magazine 3 having a plurality of strips 2 stacked on the left bottom thereof is moved along the guide path 4 so that the rectangular base 1 has a length. Raise from the left end of the conveying device (5), such as belt conveyor formed in the direction, spaced apart from the left end by a certain distance so that the laser marking machine (6) is fixed to the upper position of the conveying device (5) At the lower end of the laser marking machine 6, the strip 2 mounted on the conveying apparatus 5 is hinged by a pneumatic actuator 31 to be rotated 180 °, and a plurality of suckers 32a are rotated 180 °. Is equipped with a vacuum suction moving device (30) provided on the upper surface of the separate upper plate (33) is installed, the moving device (30) is a midway of the plate (33a) located separately in the lower portion By screw shaft 34 arranged perpendicularly to the The sub-plate 33 is moved up and down, but can be moved up and down while being horizontally supported by the guide post 35 during the vertical movement of the upper plate 33, and the distance spaced to the right from the laser marking machine (6) at a certain distance The upper surface of the device (5) is provided by fixing the marking failure recognizer (7) downwardly, the adhesive application device (Flux Dotting) on the upper surface of the conveying device (5) spaced at a certain distance to the right from the marking failure recognition machine (7) (8) is positioned and the ball mounting machine (9) is located on the right side of the adhesive applying device (8), and the right side of the ball mounting machine (9) is equipped with a sensitizer (10) to recognize whether the ball mounting state is bad or not. The picker 11 clamps the strip 2 according to the identification of the condenser 10 so that the good strip can be moved to the next process or stacked in a separate magazine 3a and the defective product is moved to the defective treatment plant 12. Mounting Come on, the laser marking and ball mounting operations that are performed by the present invention allows the assembly lines in the system.

That is, when the work is started for the first time, when the strip 2 is placed on the strip moving device 5 and moved to the lower portion of the laser marking machine 6, the transfer device 5 stops and the vacuum suction moving device 30 is stopped. The operating rod 32 provided on the left side of the upper plate 33 of the upper plate 33 is waiting directly on the strip 2 beforehand, and the suction plate 32a at the tip of the operating rod sucks the strip 2 and simultaneously the operating rod 32. When the hinge 32b is rotated 180 ° about the shaft by the pneumatic actuator 31 to stop, the upper plate 33 on which the vacuum suction device 30 is mounted rises to mark the label on the upper surface of the strip 2 with a laser. Then, the vacuum suction moving device 30 is moved to the right in the state shown in FIG. 2, and the operating space 32 is rotated again by 180 ° so that the suction plate 32a of the operating interval 32 is adsorbed. On the upper surface of the moving device (5) so that the adhesive application sheet along the strip (2) feeder (5) line The in-line system implemented according to the present invention operates through various processes such as the tooth 8, the ball mounting machine 9, the condenser 10, the picker 11, etc. Identification and separation work takes place.

As the above-described in-line system is a consistent work is performed, the machine installation space of the factory is reduced and the continuous work is possible, so that the product production yield is increased and the probability of defects due to the process movement of the product is significantly reduced.

Claims (1)

In constructing an in-line system for manufacturing a semiconductor IC chip, a magazine 3 having a plurality of strips 2 stacked on a bottom surface thereof is provided with a rectangular base 1 having a constant width at a constant height. The laser marking machine 6 is moved along the guide path 4 so as to ascend from the left end of the conveying device 5 such as a belt conveyor formed in the longitudinal direction of the square base 1, and spaced apart from the left end by a predetermined distance. ) Is fixed to the upper position of the transfer device 5, the lower end of the laser marking machine (6) is coupled to the hinge (32b) by the pneumatic actuator 31 to the strip (2) placed on the transfer device (5) The vacuum suction moving device 30 is provided on the upper surface of the separate upper plate 33, and the operating device 32 on which the sucker 32a is mounted on the rear surface thereof is rotated 180 °. Of the plate 33a which is located separately in the lower part The upper plate 33 is vertically moved by the screw shaft 34 vertically arranged on the part, and the upper plate 33 can be moved up and down while being horizontally supported by the guide post 35 when the upper plate 33 is vertically moved. On the upper surface of the conveying device 5 spaced to the right from the machine 6 by a fixed distance to the monitoring chimera (7) is provided fixed downward and the conveying device spaced at a certain distance to the right from the marking defective recognizer (7) 5) Flux Dotting (8) is located on the upper surface, the ball mounting machine (9) is located on the right side of the adhesive applying device (8), and whether the ball mounting state is bad on the right side of the ball mounting machine (9) An in-line system for marking and ball mounting in a semiconductor manufacturing process, which is provided with a condenser (10) for identifying the condensation and clamping the strip (2) according to the condensation of the condenser (10).