KR20020036152A - Wafer Stage Holder Examination Device of Semiconductor Lithography Apparatus - Google Patents
Wafer Stage Holder Examination Device of Semiconductor Lithography Apparatus Download PDFInfo
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- KR20020036152A KR20020036152A KR1020000066175A KR20000066175A KR20020036152A KR 20020036152 A KR20020036152 A KR 20020036152A KR 1020000066175 A KR1020000066175 A KR 1020000066175A KR 20000066175 A KR20000066175 A KR 20000066175A KR 20020036152 A KR20020036152 A KR 20020036152A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
본 발명은 반도체장치 제조용 노광설비에 관한 것으로서, 특히, 웨이퍼 스테이지 홀더에 먼지가 안착됨을 노광공정 진행 전에 체크를 할 수 있도록 하여, 반도체 공정불량을 감소시키는 반도체 노광설비의 스테이지 홀더 검사장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an exposure apparatus for manufacturing a semiconductor device, and more particularly, to a stage holder inspection apparatus for a semiconductor exposure apparatus for reducing a semiconductor process defect by enabling a check before a process of an exposure process to deposit dust on a wafer stage holder. .
일반적으로, 반도체장치 제조공정의 리소그래피(Lithography) 공정에서는 특정막이 형성된 반도체 기판 상에 포토레지스트(Photoresist)를 도포 한 후, 상기 반도체 기판 상에 미리 설계된 패턴이 형성된 레티클(Reticle)을 위치시켜 상기 반도체 기판을 노광시키고, 상기 노광 된 반도체 기판을 현상함으로서 레티클의 패턴이 전사된 포토레지스트 패턴을 형성하고 있다.In general, in a lithography process of a semiconductor device manufacturing process, a photoresist is applied onto a semiconductor substrate on which a specific film is formed, and then a reticle on which a predesigned pattern is formed is placed on the semiconductor substrate. The photoresist pattern to which the pattern of the reticle was transferred is formed by exposing the substrate and developing the exposed semiconductor substrate.
도 1은 일반적인 반도체 노광설비의 웨이퍼 스테이지의 구성을 도시한 사시도로서, 상기 도면에 도시한 바와 같이 일측은 X모터(10)와 연결되고, 다른 일측은 Y모터(14)와 연결되며, 중앙에 포토레지스트가 도포 된 웨이퍼가 위치하는 웨이퍼홀더(12)가 형성된 스테이지 상층부(15)가 형성되어 있다.1 is a perspective view showing the configuration of a wafer stage of a general semiconductor exposure equipment, one side is connected to the X motor 10, the other side is connected to the Y motor 14, as shown in the figure The upper stage 15 of the stage on which the wafer holder 12 on which the photoresist coated wafer is located is formed is formed.
상기 스테이지 상층부(15) 하부에는 표면에 복수개의 니들베어링이 삽입된 가이드레일이 형성되어 있는 X스테이지(16)가 설치되어 있으며, 상기 X스테이지(16)의 하부에는 표면에 복수개의 니들베어링이 삽입된 가이드레일이 형성되어 있는 Y스테이지(18)가 설치되어 있다.An X stage 16 having a guide rail having a plurality of needle bearings inserted therein is provided below the upper stage 15 of the stage, and a plurality of needle bearings inserted into the bottom of the X stage 16. The Y stage 18 in which the guide rail was formed is provided.
따라서, 웨이퍼 홀더(12)에 포토레지스트가 도포 된 웨이퍼가 위치하게 되면, X모터(10)의 구동에 의해서 X스테이지(16)는 이동하게 되고, Y모터(14)의 구동에 의해서 Y스테이지(18)도 이동하게 된다.Therefore, when the wafer to which the photoresist is applied is placed on the wafer holder 12, the X stage 16 is moved by the driving of the X motor 10, and the Y stage (the driving of the Y motor 14) is carried out. 18) will also move.
이에 따라서 웨이퍼는 웨이퍼 스테이지 상부에 위치한 렌즈와 수직으로 정렬된다.The wafer is thus aligned perpendicular to the lens located above the wafer stage.
이어서, 광원에서 투사되는 광에너지가 마스크 또는 레티클을 통과하며 웨이퍼 상에 도포 된 포토레지스트를 감광시키게 된다.Subsequently, the light energy projected from the light source passes through the mask or reticle to expose the photoresist applied on the wafer.
그러나, 이와 같이 구성된 종래의 반도체 노광설비는 웨이퍼를 지지하고 있는 웨이퍼 스테이지 홀더(12)에 먼지가 안착됨으로 이 먼지의 단차 만큼 이 먼지위에 안착되는 웨이퍼에 단차가 발생되어 자외선을 노광시에 이 단차가 생긴 부위만 웨이퍼내 다른 부위와는 다르게 렌즈의 포커스가 맺히게 되어 불량을 발생시키게 된다는 문제점이 있다.However, in the conventional semiconductor exposure apparatus configured as described above, dust is settled on the wafer stage holder 12 supporting the wafer, so that a step is generated on the wafer seated on the dust by the step of the dust, and the step is exposed when the ultraviolet light is exposed. Unlike the other parts in the wafer, only the areas where the defects occur due to the focus of the lens is generated a problem.
본 발명은 상술한 문제점을 해결하기 위하여 안출 된 것으로서, 웨이퍼 스테이지 홀더의 클리닝 상태를 노광 공정 진행 전에 확인 할 수 있도록 구현하여 웨이퍼 제조의 불량률을 감소시키는 반도체 노광설비의 웨이퍼 스테이지 홀더 검사장치를 제공하는 데 있다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and provides a wafer stage holder inspection apparatus for semiconductor exposure facilities that reduces the defect rate of wafer fabrication by implementing the cleaning state of the wafer stage holder before the exposure process. There is.
상기한 목적을 달성하기 위하여 본 발명은 광원, 레티클, 축소투영렌즈 및 반도체기판을 위치시키는 홀더가 마련된 스테이지로 이루어진 광학계와, 상기 홀더의 클린 상태를 감지하는 홀더감지수단과, 상기 홀더감지수단에서 감지된 이미지 상태가 정상인가 비정상인가를 판단하여 그에 대한 각각의 판단결과를 출력하는 컨트롤러와, 상기 컨트롤러의 판단결과에 따라 경보동작을 수행하는 경보수단을 포함하는 것을 특징으로 한다.In order to achieve the above object, the present invention provides a light source, a reticle, a reduction projection lens and an optical system consisting of a stage provided with a holder for positioning the semiconductor substrate, a holder sensing means for sensing a clean state of the holder, and in the holder sensing means And a controller for determining whether the sensed image state is normal or abnormal and outputting respective determination results thereof, and an alarm means for performing an alarm operation according to the determination result of the controller.
도 1은 일반적인 반도체 노광설비의 웨이퍼 스테이지의 구성을 도시한 사시도,1 is a perspective view showing the configuration of a wafer stage of a general semiconductor exposure apparatus;
도 2는 본 발명에 의한 반도체 노광설비의 구성을 개략적으로 도시한 구성도이다.2 is a configuration diagram schematically showing a configuration of a semiconductor exposure apparatus according to the present invention.
<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for the main parts of the drawings>
20 : 스테퍼21 : 광원20: stepper 21: light source
22 : 레티클23 : 축소투영렌즈22: reticle 23: zoom projection lens
30 : 스테이지31 : 홀더30: stage 31: holder
W : 웨이퍼41 : 컨트롤러W: Wafer 41: Controller
43 : 경보수단45 : 스테퍼컨트롤러43: alarm means 45: stepper controller
이하, 첨부된 도면 도 2를 참조하여 본 발명의 일 실시 예에 의한 구성 및작용에 대해서 설명한다.Hereinafter, with reference to the accompanying drawings Figure 2 will be described the configuration and operation according to an embodiment of the present invention.
상기 도면에 도시된 바와 같이 본 발명에 의한 반도체 노광설비는 특정파장의 빛을 주사하는 광원(21)과, 상기 광원(21)의 하부에 설치되어 특정패턴을 형성하는 레티클(22)과, 상기 레티클(22)의 하부에 설치되어 상기 레티클(22) 패턴을 축소 투영하는 축소투영렌즈(23)로 이루어진 스테퍼(20)와, 상기 축소투영렌즈(23)의 하부에 설치되어 웨이퍼(W)를 위치시키는 홀더(31)가 마련된 스테이지(30)로 구성된 광학계(O)를 기본으로 하며, 상기 홀더(31)의 클린 상태를 노광공정이 진행되기 전에 체크하는 홀더감지수단(40)이 컨트롤러(41)에 연결되도록 구성된다.As shown in the drawing, the semiconductor exposure apparatus according to the present invention includes a light source 21 for scanning light having a specific wavelength, a reticle 22 installed under the light source 21 to form a specific pattern, and A stepper 20 formed at a lower portion of the reticle 22 and made of a reduced projection lens 23 for projecting a reduced pattern of the reticle 22, and a lower portion of the reduced projection lens 23 to provide a wafer W. The holder sensing means 40 which checks the clean state of the holder 31 before an exposure process is based on the optical system O which consists of the stage 30 provided with the holder 31 to position is the controller 41 It is configured to connect to).
상기 컨트롤러(41)는 상기 홀더감지수단(40)으로부터 보내진 이미지신호를 입력받아 현재 홀더(31)의 상태가 정상상태인지 비정상상태인지 여부를 판단하고 그에 대하여 각각의 신호를 출력하도록 구성된다.The controller 41 is configured to receive an image signal sent from the holder detecting means 40 and determine whether the current state of the holder 31 is normal or abnormal and output respective signals thereto.
상기 컨트롤러(41)에서는 홀더의 정상상태의 이미지 데이터가 입력되어 비교 판단 하게되고, 상기 컨트롤러(41)로부터 비정상상태로 판별될 경우 그 신호가 전달되어 경보수단(43)을 동작시켜 이상상태를 알리도록 구성되며, 이상상태로 판단 된 경우 스테퍼컨트롤러(45)에 신호를 전달하여 스테퍼(20)가 정지하도록 구성된다.In the controller 41, image data of the normal state of the holder is input and compared, and when it is determined that the abnormal state is received from the controller 41, the signal is transmitted to operate the alarm means 43 to notify the abnormal state. If it is determined that the abnormal state is transmitted to the stepper controller 45, the stepper 20 is configured to stop.
상기 경보수단(43)으로는 부저와 같은 발음장치 또는 램프표시장치로 구성함이 바람직하다.The alarm means 43 is preferably composed of a sounding device such as a buzzer or a lamp display device.
상기 홀더감지수단(40)은 카메라 시스템으로 구성된다.The holder detecting means 40 is composed of a camera system.
상기 스테이지(30)는 X·Y축상으로 이동하는 X스테이지(32) 및Y스테이지(33)로 구성된다.The stage 30 is composed of an X stage 32 and a Y stage 33 moving on the X and Y axes.
다음은 상기와 같이 구성된 본 발명에 의한 반도체 노광설비용 웨이퍼 스테이지 홀더의 검사장치의 동작원리에 대해서 설명한다.Next, the operation principle of the inspection apparatus of the wafer stage holder for semiconductor exposure apparatus by this invention comprised as mentioned above is demonstrated.
먼저, 홀더감지수단(40)이 동작되어 홀더(31)의 상태를 읽게 되면, 그 이미지 신호가 컨트롤러(41)에 전달된다.First, when the holder detecting means 40 is operated to read the state of the holder 31, the image signal is transmitted to the controller 41.
상기와 같이 홀더감지수단(40)으로부터 이미지 신호가 전달되면, 컨트롤러(41)에서는 이미 입력된 정상상태의 데이터와 비교 판단하여 이상상태로 판단할 경우 경보수단(43)에 신호를 전달하고 스테퍼콘트롤러(45)에 신호를 전달하여 스테퍼(20)가 동작되는 것을 멈추게 한다.When the image signal is transmitted from the holder detecting means 40 as described above, the controller 41 compares the data with the normal state data already input and transmits the signal to the alarm means 43 when determining that the abnormal state is an abnormal step. The signal is transmitted to 45 to stop the stepper 20 from operating.
상기 경보수단(43)은 부저음을 울리거나 그 밖에 표시램프를 깜박임으로써 그 이상상태를 알리게 된다.The alarm means 43 notifies the abnormal state by sounding a buzzer or flashing the display lamp.
상술한 내용에 있어서, 홀더감지수단(40) 및 홀더(31)의 얼라인은 상기 X·Y축 스테이지(32,33)에 의함이 바람직할 것이다.In the above description, it is preferable that the alignment of the holder detecting means 40 and the holder 31 is based on the X and Y axis stages 32 and 33.
한편, 정상상태일 경우는 정해진 공정과정에 따라 노광작업을 진행하게 되는 것이다.On the other hand, if the steady state is to perform the exposure operation according to a predetermined process.
즉, 포토레지스트를 도포한 반도체 기판(웨이퍼: W)을 스테이지(30)의 홀더(31)상에 위치시킨다.That is, a semiconductor substrate (wafer W) coated with photoresist is placed on the holder 31 of the stage 30.
이때, 상기 웨이퍼(W)는 X축스테이지(32) 및 Y축스테이지(33)에 의해 위치 변동하여 적정위치에 얼라인(Alignment)된다.At this time, the wafer W is aligned by the X-axis stage 32 and the Y-axis stage 33 and aligned at an appropriate position.
상기와 같이 얼라인 된 웨이퍼(W)상에 광원(21)에서 조사되는 빛의 파장, 축소투영렌즈(23)의 배율 등의 여러 가지 노광조건을 변화시켜 노광공정을 진행하여 도포 된 포토레지스트를 감광시키게 된다.The photoresist coated by the exposure process is performed by changing various exposure conditions such as the wavelength of light irradiated from the light source 21 and the magnification of the reduction projection lens 23 on the aligned wafer W as described above. Are exposed.
상술한 바와 같이 웨이퍼(W)의 노광공정을 진행하기 전에 홀더(31)의 클린 상태를 미리 확인하여 상기 홀더(31)의 상면에 먼지가 존재하는 것을 해소시킴에 따라 로컬 포커스가 발생하게 되어 웨이퍼 제조 공정 불량이 발생하는 것을 해소시키게 되는 것이다.As described above, before the exposure process of the wafer W is performed, the clean state of the holder 31 is confirmed in advance, thereby eliminating the presence of dust on the upper surface of the holder 31, thereby generating a local focus. It is to eliminate the occurrence of manufacturing process defects.
상술한 바와 같이 웨이퍼를 고정하는 홀더의 클린 상태를 노광공정이 진행되기 전에 판단하도록 구현하여 먼지의 단차 만큼 웨이퍼에서도 단차가 발생되어 자외선 노광시에 이 단차가 있는 부위에 렌즈의 포커스가 맺혀 반도체 공정 불량을 초래하는 것을 감소키는 이점이 있다.As described above, the clean state of the holder holding the wafer is determined to be determined before the exposure process proceeds. Thus, a step is generated in the wafer as much as the level of dust. There is an advantage in reducing the incidence of failure.
따라서, 수율을 월등히 향상시키는 이점이 있다.Therefore, there is an advantage of significantly improving the yield.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020000066175A KR20020036152A (en) | 2000-11-08 | 2000-11-08 | Wafer Stage Holder Examination Device of Semiconductor Lithography Apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020000066175A KR20020036152A (en) | 2000-11-08 | 2000-11-08 | Wafer Stage Holder Examination Device of Semiconductor Lithography Apparatus |
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KR20020036152A true KR20020036152A (en) | 2002-05-16 |
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KR1020000066175A KR20020036152A (en) | 2000-11-08 | 2000-11-08 | Wafer Stage Holder Examination Device of Semiconductor Lithography Apparatus |
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2000
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WITN | Withdrawal due to no request for examination |