KR20020030375A - Apparatus for measuring diameter of hole of printed circuit board and method for measuring the same - Google Patents

Abstract

PURPOSE: A device for measuring diameter of hole on printed circuit board and measuring method of the same are provided to rapidly measure the diameter of the hole and to accurately determine whether the diameter is within tolerance. CONSTITUTION: A device includes a main body(100); a moving frame(120); multiple supporting tables(130); a measuring part(160); a laser part(140); and a detecting part(150). The main body has a controller(110) installed thereon and a concave part on an upper surface thereof. The moving frame is installed on the upper surface of the main body to be horizontally and vertically movable controlled by the controller. The supporting tables are installed on an upper surface of the moving frame to vertically movable independently of each other so that a printed circuit board(170) is supported by and placed between the adjacent supporting tables. The measuring part is placed above the concave part and has a head part rotatably installed on the main body and multiple diameter needles with different diameters installed on the head part to move up and down to be inserted into hole(171) formed on the printed circuit board. The laser part is installed to the main body to be placed above the concave part and has a first radiating part(141) and a second radiating part(142) irradiating light to the printed circuit board placed on the supporting tables and the diameter needles, respectively. The detecting part receives light irradiated from the laser part to detect positions of the printed circuit board and the diameter needles inserted into the holes of the printed circuit board.

Description

Substrate hole measuring device and measuring method {APPARATUS FOR MEASURING DIAMETER OF HOLE OF PRINTED CIRCUIT BOARD AND METHOD FOR MEASURING THE SAME}

The present invention relates to a diameter measuring apparatus of a substrate hole and a measuring method thereof for accurately determining the size of the diameter of the hole formed in the substrate.

HIC (Hybrid Integrated Circuit) refers to an integrated circuit in which active component chips are attached to a surface by using a passive material such as ceramics as a substrate. A plurality of holes are formed in the substrate of the HIC for electrical connection and heat dissipation of the circuit. The diameter of the hole should be accurately formed according to the design value so that the characteristics of the substrate due to the high frequency have little change.

A conventional method of measuring the diameter of a substrate hole will be described with reference to FIGS. 4A and 4B. 4A and 4B show a conventional method for measuring the diameter of a hole.

Referring to FIG. 4A, the holes 11 of the substrate 10 to be measured are found in the image of the microscope and then focused. Then, the coordinate values of three points P1, P2 and P3 which are considered to be the circumference of the hole 11 are read, and a virtual circle is drawn using the coordinate values of the three points P1, P2 and P3. Then, the diameter of the imaginary circle is measured and regarded as the diameter of the hole 11.

The conventional method as described above manually finds and focuses on the hole 11 to be measured. As a result, it takes a long time and a long time to calculate the diameter of the virtual circle.

Referring to FIG. 4B, the hole 11 of the substrate 10 is located and focused by the CRT camera. Thereafter, the coordinate values of the two points Q1 and Q2 considered to be the diameters of the holes 11 are read, and the distance L between the two points Q1 and Q2 is calculated to be regarded as the diameter of the hole 11.

The conventional method as described above also finds the holes 11 to be measured manually, which causes disadvantages in that a lot of work time is required. In addition, the measured two points Q1 and Q2 may not be accurate due to contrast. Therefore, there is a disadvantage that it is difficult to consider the distance L between the measured two points Q1 and Q2 as the diameter of the hole 11.

The present invention was created to solve the above problems, an object of the present invention is to measure the diameter of the hole quickly and at the same time can accurately determine whether the diameter of the hole within the tolerance of the substrate measuring apparatus and The measurement method is provided.

1 is a perspective view of a measuring device according to an embodiment of the present invention.

2 is a perspective view of a measuring unit according to an embodiment of the present invention.

3 is a flowchart showing a method of measuring a diameter of a substrate hole according to an embodiment of the present invention.

4A and 4B show a conventional method of measuring the diameter of a hole.

* Description of the symbols for the main parts of the drawings *

100: main body 110: control unit

120: moving frame 130: support table

140: laser unit 150: detection unit

160 measurement unit 170 substrate

The apparatus for measuring the diameter of a substrate hole according to the present invention for achieving the above object includes a main body having a control unit and having a depression formed on an upper surface thereof, and installed on the upper surface of the main body so as to be movable forward, backward, left and right. A plurality of support tables on which the movable frame is controlled, the upper and lower surfaces of the movable frame are movable independently of each other, and a substrate is supported and mounted between the adjacent ones, and the main body is located above the depression. A measuring part having a diameter needle inserted into a hole formed in the substrate, the measuring part having a plurality of heads rotatably mounted on the head part and being rotatably mounted on the head part, and having a diameter needle inserted into a hole formed in the substrate; A first device installed on the support table and irradiating light to the substrate and the diameter needle side, respectively; A laser unit having a light emitting unit and a second light emitting unit, and a sensing unit for receiving the light irradiated from the laser unit for detecting the position of the substrate and the position of the diameter needle inserted into the hole of the substrate.

In the method for measuring the diameter of the substrate hole according to the present invention for achieving the above object, in the method for measuring the diameter of the hole of the substrate,

Mounting a substrate on an upper surface of a main body provided with a control unit; Irradiating light toward the substrate from a laser unit installed in the main body; The substrate is installed to be rotatable and liftable on the main body, and the light receiving unit for receiving light is attached to the outer peripheral surface of the central portion, and the lower portion of the substrate is positioned so that the hole of the substrate to be measured is located directly below the diameter needle formed to decrease in diameter toward the lower end. Sensing the light passing through the hole of the substrate and moving the substrate to the front, back, left and right; Irradiating light to the diameter side of the laser unit; The diameter needle is inserted into the hole of the substrate and the size of the diameter of the hole of the substrate is determined by sensing the light received by the light receiving unit.

Hereinafter, an apparatus for measuring a diameter of a substrate hole and a measuring method thereof according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, the measuring apparatus according to the present embodiment will be described with reference to FIGS. 1 and 2. 1 is a perspective view of a measuring apparatus according to an embodiment of the present invention, Figure 2 is a perspective view of a measuring unit according to an embodiment of the present invention.

As shown in the drawing, the control unit 110 is provided with a main body 100 having a recess 103 formed thereon. The upper surface of the main body 100 is provided with a moving frame 120 which is installed to be moved forward, backward and left and right and controlled by the controller 110. The central portion of the moving frame 120 is opened 121.

On the upper surface of the moving frame 120, a plurality of support tables 130 on which the substrate 170 is mounted and supported are installed, and the support tables 130 are independently installed to be movable left and right. Thus, the substrate is mounted between the support tables 130 adjacent to each other. To this end, end surfaces 131 on which opposing surfaces of the support tables 130 adjacent to each other are mounted and contacted are respectively formed. That is, when the substrate 170 is mounted on the end surfaces 131 of the support tables 130 adjacent to each other, and the support tables 130 adjacent to each other are pushed toward the substrate 170, the substrate 170 is connected to the support table 130. It is supported and mounted. The support table 130 may be automatically moved by the controller 110 or may be manually moved.

The laser unit 140 for irradiating light is installed in the main body 100 so as to be positioned above the recess 103. The laser unit 140 includes a first light emitting unit 141 for irradiating light to the substrate 170 mounted on the support table 130 and a second light emitting unit 143 for irradiating light with a diameter needle 163 to be described later. Has

The main body 100 is provided with a detection unit 150 for receiving the light emitted from the laser unit 140 and transmits it to the control unit 110. The detector 150 receives the light emitted from the laser unit 140 to detect the position of the substrate 170 and the position of the hole 171 of the substrate 170 into which the diameter needle 163 is inserted. To this end, the sensing unit 150 is provided on the upper surface of the recess 103, the projection plate 151 for receiving the light of the first light emitting unit 141 transmitted through the hole 171 of the substrate 170, and the diameter The light receiving unit 153 is provided on an outer circumferential surface of the needle 163 to receive light from the second light emitting unit 143.

The measuring unit 160 measuring the diameter of the hole 171 of the substrate 170 is installed in the main body 100 so as to be positioned above the depression 103. The measuring unit 160 has a cylindrical head portion 161 rotatably installed on the main body 100 and a diameter needle 163 for elevating the inner and outer sides of the head portion 161. The diameter needles 163 may be inserted into the holes 171 formed in the substrate 170 by providing a plurality of diameters different from each other.

The structure of the diameter needle 163 will be described in more detail. The diameter needle 163 is installed on the head 161 so as to be elevated, and extends from the end of the first body 163a and the first body 163a to cooperate with the head 161 and the light receiving portion 153 is an outer peripheral surface. A second body 163b attached to the second body 163b and a third body 163c extending from an end of the second body 163b and having a diameter smaller than that of the second body 163b. The third body 163c is inserted into the hole 171 of the substrate 170 to contact the inner circumferential surface of the hole 171. The diameter needle 163 extends from the end of the third body 163c and has a fourth body 163d that is smaller in diameter toward the end. Reference numeral 180 is a motor for rotating the measuring unit.

A method of measuring the diameter of the substrate hole with the measuring apparatus according to the present embodiment configured as described above will be described with reference to FIGS. 1 to 3. 3 is a flowchart illustrating a method of measuring a diameter of a substrate hole according to an exemplary embodiment of the present invention.

In step S100, the substrate 170 is mounted between the support tables 130 provided on the upper surface of the main body 100, and light is emitted from the first light emitting unit 141 of the laser unit 140 to the substrate 170. (S110). Then, the light passing through the hole 171 of the substrate 170 is irradiated to the projection plate 151, the detection unit 150 detects this and transmits it to the control unit 110. Then, the controller 110 recognizes the positions of the holes 171 of the substrate 170 to be measured, and moves the moving frame 120 so that the hole 171 to be measured is located immediately below the diameter needle 163. To move (S120). Thereafter, light is irradiated from the second light emitting part 143 to the light receiving part 153 attached to the diameter needle 163 (S130), and the diameter needle 163 is lowered to have a diameter in the hole 171 of the substrate 170. The needle 163 is inserted (S140).

In step S150, is light of the second light emitter 143 received by the light receiver 153? By detecting whether it is not received, if light is not received, the diameter needle 163 is replaced (S160). That is, the diameter needle 163 is lowered and inserted into the hole 171 of the substrate 170. When the portion of the fourth body 163d of the diameter needle 163 is inserted into the hole 171, the light is received by the light receiving unit 153. Is not received. In this case, since the diameter of the hole 171 of the substrate 170 is smaller than the set value, it is replaced with another diameter needle 163 having a smaller diameter (S160). Thereafter, step S130 is performed again.

When the light of the second light emitting unit 143 is received by the light receiving unit 153 in step S150, is the light received by the light receiving unit 153 again after a predetermined time elapses (S170)? Is not received? (S180).

If light continues to be received at the light receiving unit 153 in step S180, the portion of the third body 163c of the diameter needle 163 is inserted into the hole 171 of the substrate 170 to further insert the diameter needle 163. The state does not fall down. Therefore, in this state, the diameter of the diameter needle 163 may be measured to measure the diameter of the hole 171 of the substrate 170 (S190).

However, when light is not received at the light receiving unit 153 in step S180, since the second body 163b portion of the diameter needle 163 is a state inserted into the hole 171 of the substrate 170, the substrate The diameter of the hole 171 of 170 is larger than the set value. In this case, another diameter needle 163 having a larger diameter is replaced (S160), and step S130 is performed again.

As described above, the diameter measuring apparatus of the substrate hole and the measuring method according to the present invention can accurately and quickly measure the size of the diameter of the hole formed in the substrate. In other words, it is possible to automatically and accurately determine whether or not the size of the hole passed, the work efficiency is improved.

In the above, the present invention has been described in accordance with one embodiment of the present invention, but those skilled in the art to which the present invention pertains have been changed and modified without departing from the spirit of the present invention. Of course.

Claims (6)

The control unit is installed and the main body having a depression on the upper surface, A moving frame installed on the upper surface of the main body so as to be movable forward, backward, left and right and controlled by the controller; A plurality of support tables installed on the upper surface of the movable frame to be movable independently left and right, and having substrates supported and mounted between adjacent ones; A measuring part having a diameter needle inserted into a hole formed in the substrate, the head part being rotatably installed in the main body so as to be positioned above the depression, and being rotatably installed in the head part and having a plurality of mutually different diameters; A laser unit installed on the main body so as to be positioned above the recessed part, the laser unit having a first light emitting part and a second light emitting part respectively irradiating light onto the substrate and the diameter needle side mounted on the support table; And a sensing unit configured to receive light emitted from the laser unit and detect a position of the substrate and a position of the diameter needle inserted into the hole of the substrate. The method of claim 1, An apparatus for measuring a diameter of a substrate hole, each having a cross section on which opposing surfaces of the support tables adjacent to each other are formed in contact with and supported on each side of the substrate. The method of claim 1, wherein the detection unit, A projection plate provided on an upper surface of the recessed part to receive and transmit light of the first light emitting part that has passed through the hole of the substrate to the control part; A device for measuring the diameter of a substrate hole having a light receiving unit to be transmitted to. The method of claim 2, wherein the diameter needle, A first body provided to be movable up and down in the head portion, a second body extending from an end of the first body and to which the light receiving unit is attached, a diameter extending from an end of the second body and smaller than a diameter of the second body And a third body having a third body in contact with an inner circumferential surface of the hole of the substrate, and a fourth body extending from an end of the third body and smaller in diameter toward the end. In the method of measuring the diameter of the hole of the substrate, Mounting a substrate on an upper surface of a main body provided with a control unit; Irradiating light toward the substrate from a laser unit installed in the main body; The substrate is installed to be rotatable and liftable on the main body, and the light receiving unit for receiving light is attached to the outer peripheral surface of the central portion, and the lower portion of the substrate is positioned so that the hole of the substrate to be measured is located directly below the diameter needle formed to decrease in diameter toward the lower end. Sensing the light passing through the hole of the substrate and moving the substrate to the front, back, left and right; Irradiating light to the diameter side of the laser unit; And inserting a diameter needle into the hole of the substrate and determining the size of the diameter of the hole of the substrate by sensing light received by the light receiving unit. The method of claim 5, If the light irradiated by the diaphragm from the laser unit is not received by the light receiving unit, the diameter of the hole of the substrate is smaller than a set value, and when the light irradiated by the diaphragm from the laser unit is received by the light receiving unit, the diameter of the hole of the substrate is Is a set value, and if the light irradiated with the diameter needle from the laser unit is not received after being received by the light receiving unit, the diameter of the hole of the substrate is larger than the set value.