KR20020026957A - 침윤된 유리섬유 스트랜드 및 이를 포함한 제품 - Google Patents
침윤된 유리섬유 스트랜드 및 이를 포함한 제품 Download PDFInfo
- Publication number
- KR20020026957A KR20020026957A KR1020027001325A KR20027001325A KR20020026957A KR 20020026957 A KR20020026957 A KR 20020026957A KR 1020027001325 A KR1020027001325 A KR 1020027001325A KR 20027001325 A KR20027001325 A KR 20027001325A KR 20020026957 A KR20020026957 A KR 20020026957A
- Authority
- KR
- South Korea
- Prior art keywords
- fabric
- particles
- coating composition
- resin
- materials
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/465—Coatings containing composite materials
- C03C25/47—Coatings containing composite materials containing particles, fibres or flakes, e.g. in a continuous phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
- C03C25/10—Coating
- C03C25/48—Coating with two or more coatings having different compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0239—Coupling agent for particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (21)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14660599P | 1999-07-30 | 1999-07-30 | |
US14633799P | 1999-07-30 | 1999-07-30 | |
US60/146,337 | 1999-07-30 | ||
US60/146605 | 1999-07-30 | ||
US14686299P | 1999-08-03 | 1999-08-03 | |
US60/146,862 | 1999-08-03 | ||
PCT/US1999/021443 WO2000021900A1 (en) | 1998-10-13 | 1999-10-08 | Glass fiber-reinforced prepregs, laminates, electronic circuit boards and methods for assembling a fabric |
PCT/US1999/021442 WO2000021899A1 (en) | 1998-10-13 | 1999-10-08 | Impregnated glass fiber strands and products including the same |
US99/21442 | 1999-10-08 | ||
US99/21443 | 1999-10-08 | ||
US18356200P | 2000-02-18 | 2000-02-18 | |
US60/183,562 | 2000-02-18 | ||
US52703400A | 2000-03-16 | 2000-03-16 | |
US09/527,034 | 2000-03-16 | ||
US54837900A | 2000-04-12 | 2000-04-12 | |
US09/548,379 | 2000-04-12 | ||
US56891600A | 2000-05-11 | 2000-05-11 | |
US09/568,916 | 2000-05-11 | ||
US62052500A | 2000-07-20 | 2000-07-20 | |
US09/620,525 | 2000-07-20 | ||
PCT/US2000/020539 WO2001009226A1 (en) | 1999-07-30 | 2000-07-28 | Impregnated glass fiber strands and products including the same |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20020026957A true KR20020026957A (ko) | 2002-04-12 |
Family
ID=27574951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020027001325A KR20020026957A (ko) | 1999-07-30 | 2000-07-28 | 침윤된 유리섬유 스트랜드 및 이를 포함한 제품 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1204698A1 (ja) |
JP (1) | JP2004500488A (ja) |
KR (1) | KR20020026957A (ja) |
AU (1) | AU6386200A (ja) |
HK (1) | HK1046702A1 (ja) |
MX (1) | MXPA02001090A (ja) |
WO (1) | WO2001009226A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8105690B2 (en) * | 1998-03-03 | 2012-01-31 | Ppg Industries Ohio, Inc | Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding |
US7354641B2 (en) * | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
CN102173026B (zh) * | 2010-12-16 | 2015-01-14 | 施汉林 | 一种新型导热复合材料与led壳体的复合注塑工艺 |
CN102219399B (zh) * | 2011-03-31 | 2012-11-14 | 山东玻纤复合材料有限公司 | 单丝涂塑用纱专用浸润剂及其配制方法 |
CN105355616B (zh) * | 2015-11-20 | 2017-12-19 | 广东梅雁吉祥实业投资股份有限公司 | 一种抗氧化金属制品 |
WO2019202151A1 (en) * | 2018-04-20 | 2019-10-24 | Mermet | Composite yarn, manufacturing process and textile surface comprising such a yarn |
FR3080387B1 (fr) * | 2018-04-20 | 2020-11-13 | Mermet | Fil composite renforce, procede de preparation et textile comprenant un tel fil |
JP7371122B2 (ja) * | 2019-12-16 | 2023-10-30 | 旭化成株式会社 | ガラスクロス、プリプレグ、及びプリント配線板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3312569A (en) * | 1965-05-07 | 1967-04-04 | Owens Corning Fiberglass Corp | Compatible fibrous glass reinforcements of superior bonding and wetting characteristics |
US5217778A (en) * | 1982-10-21 | 1993-06-08 | Raymark Industries, Inc. | Composite fiber friction facing |
JP2545957B2 (ja) * | 1988-12-15 | 1996-10-23 | 日東紡績株式会社 | プリント配線基板及び同基板用織物 |
JP3520604B2 (ja) * | 1995-05-23 | 2004-04-19 | 日立化成工業株式会社 | コンポジット積層板 |
US5773146A (en) * | 1995-06-05 | 1998-06-30 | Ppg Industries, Inc. | Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers |
JPH0977937A (ja) * | 1995-09-12 | 1997-03-25 | Idemitsu Petrochem Co Ltd | プリント配線板用プリプレグ及びプリント配線用基板 |
JP3151397B2 (ja) * | 1995-10-26 | 2001-04-03 | 松下電工株式会社 | プリプレグ及び金属箔張り積層板 |
ID26528A (id) * | 1998-03-03 | 2001-01-11 | Ppg Ind Ohio Inc | Laminasi serat gelas-yang diperkuat, papan sirkuit elektronik dan metode penyusunan suatu struktur jalinan |
AU2876599A (en) * | 1998-03-03 | 1999-09-20 | Ppg Industries Ohio, Inc. | Inorganic particle-coated glass fiber strands and products including the same |
JP2002505388A (ja) * | 1998-03-03 | 2002-02-19 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | ガラス繊維ストランドの摩損の抑制方法 |
CN101117275B (zh) * | 1998-10-13 | 2012-10-24 | Ppg工业俄亥俄公司 | 玻璃纤维补强的预浸渍片、层压件、电路板以及装配织物的方法 |
JP2002527333A (ja) * | 1998-10-13 | 2002-08-27 | ピーピージー インダストリーズ オハイオ, インコーポレイテッド | 含浸ガラス繊維ストランドおよびこれを含む製品 |
-
2000
- 2000-07-28 JP JP2001514030A patent/JP2004500488A/ja not_active Withdrawn
- 2000-07-28 WO PCT/US2000/020539 patent/WO2001009226A1/en not_active Application Discontinuation
- 2000-07-28 EP EP00950817A patent/EP1204698A1/en not_active Withdrawn
- 2000-07-28 MX MXPA02001090A patent/MXPA02001090A/es unknown
- 2000-07-28 KR KR1020027001325A patent/KR20020026957A/ko not_active Application Discontinuation
- 2000-07-28 AU AU63862/00A patent/AU6386200A/en not_active Abandoned
-
2002
- 2002-11-13 HK HK02108231.0A patent/HK1046702A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
AU6386200A (en) | 2001-02-19 |
HK1046702A1 (zh) | 2003-01-24 |
EP1204698A1 (en) | 2002-05-15 |
MXPA02001090A (es) | 2003-07-21 |
JP2004500488A (ja) | 2004-01-08 |
WO2001009226A1 (en) | 2001-02-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |