KR20020024490A - Thin film solar cell and method for its manufacture - Google Patents
Thin film solar cell and method for its manufacture Download PDFInfo
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- KR20020024490A KR20020024490A KR1020000056268A KR20000056268A KR20020024490A KR 20020024490 A KR20020024490 A KR 20020024490A KR 1020000056268 A KR1020000056268 A KR 1020000056268A KR 20000056268 A KR20000056268 A KR 20000056268A KR 20020024490 A KR20020024490 A KR 20020024490A
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- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 75
- 230000005641 tunneling Effects 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 239000011521 glass Substances 0.000 claims abstract description 16
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 11
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 11
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 49
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 49
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical group C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 29
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 6
- 239000010408 film Substances 0.000 claims description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 6
- 230000031700 light absorption Effects 0.000 claims description 5
- SKJCKYVIQGBWTN-UHFFFAOYSA-N (4-hydroxyphenyl) methanesulfonate Chemical compound CS(=O)(=O)OC1=CC=C(O)C=C1 SKJCKYVIQGBWTN-UHFFFAOYSA-N 0.000 claims description 4
- YKYOUMDCQGMQQO-UHFFFAOYSA-L cadmium dichloride Chemical compound Cl[Cd]Cl YKYOUMDCQGMQQO-UHFFFAOYSA-L 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- MODGUXHMLLXODK-UHFFFAOYSA-N [Br].CO Chemical compound [Br].CO MODGUXHMLLXODK-UHFFFAOYSA-N 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 claims description 2
- MCMSPRNYOJJPIZ-UHFFFAOYSA-N cadmium;mercury;tellurium Chemical compound [Cd]=[Te]=[Hg] MCMSPRNYOJJPIZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- UIPVMGDJUWUZEI-UHFFFAOYSA-N copper;selanylideneindium Chemical compound [Cu].[In]=[Se] UIPVMGDJUWUZEI-UHFFFAOYSA-N 0.000 claims description 2
- LCUOIYYHNRBAFS-UHFFFAOYSA-N copper;sulfanylideneindium Chemical compound [Cu].[In]=S LCUOIYYHNRBAFS-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000011669 selenium Substances 0.000 claims description 2
- DDJAGKOCVFYQOV-UHFFFAOYSA-N tellanylideneantimony Chemical compound [Te]=[Sb] DDJAGKOCVFYQOV-UHFFFAOYSA-N 0.000 claims description 2
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- QNWMNMIVDYETIG-UHFFFAOYSA-N gallium(ii) selenide Chemical compound [Se]=[Ga] QNWMNMIVDYETIG-UHFFFAOYSA-N 0.000 claims 1
- 238000000137 annealing Methods 0.000 abstract description 6
- 229910001887 tin oxide Inorganic materials 0.000 abstract 1
- 238000000224 chemical solution deposition Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 240000002329 Inga feuillei Species 0.000 description 1
- GGKWFDKOOQELAU-UHFFFAOYSA-N [K].[Se].[In].[Cu] Chemical compound [K].[Se].[In].[Cu] GGKWFDKOOQELAU-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012144 step-by-step procedure Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
- H01L31/073—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type comprising only AIIBVI compound semiconductors, e.g. CdS/CdTe solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/543—Solar cells from Group II-VI materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
본 발명은 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지 및 그 제조방법에 관한 것이다. 더욱 상세하게는 본 발명은, 전면 전극인 인듐주석산화막(In2O3/Sn doped; 이하 "ITO"라함)과 n형 반도체층인 황화카드뮴(이하 "CdS"라함) 사이에 카드뮴(이하 "Cd"라함)을 도포한 후 어닐링 하여 n+영역을 형성함으로써 ITO와 CdS사이에 전기적인 전도성 터널링 접합(tunneling contact)을 하여 전도도를 향상시킬 수 있는 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지 및 그 제조방법에 관한 것이다.The present invention relates to a thin film photovoltaic cell using a tunneling junction at an ITO / n type semiconductor layer interface and a method of manufacturing the same. More specifically, the present invention provides a cadmium (hereinafter referred to as "CdS") between an indium tin oxide film (In 2 O 3 / Sn doped; "ITO") as a front electrode and cadmium sulfide (hereinafter referred to as "CdS") as an n-type semiconductor layer. Cd ") is applied and then annealed to form n + regions, thereby enabling electrical conduction tunneling contact between ITO and CdS to improve conductivity, using tunneling junctions at the interface of ITO / n type semiconductor layers. A thin film photovoltaic cell and a method of manufacturing the same.
일반적으로, 광전지는 반도체의 p-n 접합의 특성을 이용하여 태양의 빛에너지를 전기에너지로 변환시키는 장치이다. 카드뮴 텔루라이드(이하 "CdTe"라함)를 사용한 태양전지는 상온에서 1.5eV 정도의 밴드 갭 에너지(band gap energy)를 갖는 Ⅱ-Ⅵ족 화합물 반도체로서 태양 빛 스펙트럼과 잘 맞는 이상적인 밴드 갭 에너지와 높은 광흡수도 때문에 박막형 태양전지 재료로 유용하다. 그러나, CdTe는 높은 광 흡수도와 높은 전기 비저항 때문에 동종접합(homojunction)을 피하고 CdS와 같은 n형 반도체와 이종접합(heterojunction)구조로 제작한다. CdS는 CdTe와 격자상수의 차이가 적고 2.42eV 정도의 비교적 큰 밴드 갭 에너지를 가지므로 대부분의태양 빛을 흡수층인 CdTe로 투과시키는 투과층(window layer)로 사용한다. 태양전지의 직렬저항을 줄이기 위하여 전면전극(front electrode)으로 ITO를 사용한다.In general, photovoltaic cells are devices that convert light energy from the sun into electrical energy using the characteristics of p-n junctions in semiconductors. A solar cell using cadmium telluride (hereinafter referred to as "CdTe") is a group II-VI compound semiconductor having a band gap energy of about 1.5 eV at room temperature, and has an ideal band gap energy and high Due to its light absorption, it is useful as a thin film solar cell material. However, CdTe avoids homojunctions due to high light absorption and high electrical resistivity, and is fabricated in heterojunction structures with n-type semiconductors such as CdS. Since CdS has a small difference between CdTe and lattice constant and has a relatively large band gap energy of about 2.42eV, CdS is used as a window layer that transmits most of the sunlight to CdTe as an absorbing layer. In order to reduce the series resistance of the solar cell, ITO is used as the front electrode.
최근, 전면 전극인 ITO와 n형 반도체인 CdS의 접합에 관한 연구가 활발히 전개되고 있으며, ITO와 CdS는 오믹접합(ohmic contact)을 하고 있는 것으로 알려져 있다(J. Phys. D : Appl.33(2000)L1-L4, S.N. Alamri and A.W. Brinkman).Recently, research on the junction of ITO, which is the front electrode, and CdS, which is an n-type semiconductor, is being actively conducted, and it is known that ITO and CdS make ohmic contacts (J. Phys. D: Appl. 33 ( 2000) L1-L4, SN Alamri and AW Brinkman).
도 1은 종래 기술로서 박막 광전지의 개략적인 측면도로서, 유리 기판(1) 상에 ITO로 전면적극(3)을 형성하고 상기 전면 전극(3)인 ITO 상에 n형 반도체층(5)인 CdS를 형성한다. 상기 CdS 상에 p형 반도체층(7)인 CdTe과 후면전극(9)을 차례로 형성한다.1 is a schematic side view of a thin film photovoltaic cell according to the prior art, in which a front electrode 3 is formed of ITO on a glass substrate 1 and an n-type semiconductor layer 5 of CdS is formed on ITO, which is the front electrode 3. To form. CdTe, which is a p-type semiconductor layer 7, and a back electrode 9 are sequentially formed on the CdS.
태양광은 상기 유리 기판(1), ITO(3) 및 n형 반도체층(5)을 차례로 투과한 후 p형 반도체층(7)에서 흡수된다.The sunlight passes through the glass substrate 1, the ITO 3 and the n-type semiconductor layer 5 in turn, and is then absorbed by the p-type semiconductor layer 7.
도 2는 종래 기술의 개략적인 에너지 밴드도로서 이에 의하면, 열적 평형 상태에서 p형 반도체 CdTe와 n형 반도체 CdS의 접합으로 이루어진 다이오드(diode)에서는 캐리어(carrier)의 농도 구배에 의한 확산으로 차지 언밸런스(Charge unbalance)가 생기고 이로 인해 전기장이 형성되어 확산의 효과를 상충한다. 즉, 농도 구배에 의한 확산과 전기장에 의한 드리프트(drift)의 기여로 생기는 전류의 크기는 같고 방향이 반대여서 전류의 차이는 0이 된다.FIG. 2 is a schematic energy band diagram of the prior art, which shows that in a diode made up of a junction of a p-type semiconductor CdTe and an n-type semiconductor CdS in thermal equilibrium, charge unbalance is caused by diffusion due to a concentration gradient of carriers. (Charge unbalance) results in the formation of an electric field that conflicts with the effects of diffusion. That is, the magnitude of the current caused by the diffusion due to the concentration gradient and the contribution of the drift by the electric field is the same and the direction is opposite, so the difference in the current is zero.
도 3은 종래 기술의 빛을 받지 않은 상태에서의 전류-전압 곡선을 도시한 도면이다.3 is a diagram illustrating a current-voltage curve in a state of no light in the prior art.
도 3a에서 보면, 유리 기판 상에 ITO와 CdS를 차례로 형성하고, CdS 상에 오믹 접합으로 인듐(In)을 형성한 후 상온에서 빛을 받지 않은 상태에서 측정한 전류-전압 곡선을 나타낸다. 전류-전압 곡선은 ITO와 CdS의 접합에서 바람직하게 오믹 접합을 형성한다.Referring to FIG. 3A, ITO and CdS are sequentially formed on a glass substrate, and indium (In) is formed by an ohmic junction on CdS, and then a current-voltage curve measured in a state without light at room temperature is shown. The current-voltage curve preferably forms an ohmic junction at the junction of ITO and CdS.
도 3b에서 보면, 유리 기판 상에 ITO와 CdS를 차례로 형성한 후, 염화카드뮴(CdCl2)에 침적한 후 400℃에서 30분간 어닐링(annealing)한 후, 인듐으로 오믹 접합을 형성하였다. 전류-전압 곡선은 바람직하지 않은 정류(rectifying) 혹은 샤키 다이오드(schottky diode)를 나태내고 있다.In FIG. 3B, ITO and CdS were sequentially formed on the glass substrate, and then immersed in cadmium chloride (CdCl 2 ), followed by annealing at 400 ° C. for 30 minutes, to form an ohmic junction with indium. Current-voltage curves indicate undesirable rectifying or schottky diodes.
이러한 상기 종래 방법에 따르면, 후속공정에서 열처리로 인한 ITO와 CdS의 접합이 샤키 다이오드를 나타냄으로서 전기 전도도를 저하시키는 원인을 초래하며 광전지의 직렬 저항을 증가시켜서 광전지의 효율을 현저히 감소시키는 단점이 있다.According to the above conventional method, the junction of ITO and CdS due to heat treatment in a subsequent process causes a decrease in electrical conductivity by showing a Shaki diode and has a disadvantage in that the efficiency of the photovoltaic cell is significantly reduced by increasing the series resistance of the photovoltaic cell. .
따라서, 본 발명의 목적은 상술한 문제점을 해소하기 위하여 본 발명에서는 전면 전극인 ITO와 n형 반도체층인 CdS 사이에 카드뮴(Cd)을 도포한 후 어닐링 하여 n+영역을 형성함으로써 ITO와 CdS사이에 전기적인 전도성 터널링 접합을 하여 전도도를 증가시키고, 직렬 저항을 줄여서 광전지 효율을 향상시킬 수 있는 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지와 그 제조방법을 제공하는 데 있다. 본 발명의 다른 목적은 상기 방법에 의하여 제조된 박막광전지를 제공하는데 있다.Accordingly, an object of the present invention is to solve the above-mentioned problems in the present invention by applying cadmium (Cd) between the front electrode ITO and the n-type semiconductor layer CdS and then annealing to form an n + region between the ITO and CdS The present invention provides a thin film photovoltaic cell using a tunneling junction and a method of manufacturing the same at an interface of an ITO / n-type semiconductor layer that can increase conductivity by electrically conducting tunneling junctions and reduce series resistance. Another object of the present invention is to provide a thin film photocell manufactured by the above method.
본 발명의 상기 목적은 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지를 제조함에 있어서, 유리 기판(galss substrate) 상에 광투과도가 높은 전면 전극과 상기 전면 전극과 n형 반도체층 사이에서 전기적인 전도성 터널링 접촉을 위한 n+영역과 상기 n+영역과 접촉하며 밴드갭 에너지가 넓어서 광투과층으로 작용하는 n형 반도체층과 상기 n형 반도체층과 p/n 접합을 형성하며 광흡수층으로 작용하는 p형 반도체층 및 상기 p형 반도체층과 오믹 접촉을 하는 후면 전극으로 구성함으로써 달성하였다.The above object of the present invention is to manufacture a thin film photovoltaic cell using tunneling junction at the interface of ITO / n type semiconductor layer, wherein the front electrode having high light transmittance on the glass substrate (galss substrate) and between the front electrode and n type semiconductor layer N + region for the electrically conductive tunneling contact and the n + region is in contact with the n + region and has a wide bandgap energy to form a p / n junction with the n-type semiconductor layer and the n-type semiconductor layer as a light absorption layer. A p-type semiconductor layer acting and a back electrode in ohmic contact with the p-type semiconductor layer were achieved.
도 1은 종래 기술의 박막 광전지의 개략적인 단면도이다.1 is a schematic cross-sectional view of a thin film photovoltaic cell of the prior art.
도 2는 종래 기술의 개략적인 에너지 밴드도를 보인 것이다.Figure 2 shows a schematic energy band diagram of the prior art.
도 3은 종래 기술의 빛을 받지 않은 상태에서의 전류-전압 곡선을 도시한 것이다.Figure 3 shows a current-voltage curve in the state without light of the prior art.
도 4는 본 발명의 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지의 개략적인 단면도이다.4 is a schematic cross-sectional view of a thin film photovoltaic cell using tunneling junctions at an ITO / n type semiconductor layer interface of the present invention.
도 5는 본 발명의 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지 제조방법의 단계별 순서를 보인 공정도이다.5 is a process chart showing a step-by-step sequence of a method for manufacturing a thin film photovoltaic cell using tunneling junctions at an ITO / n type semiconductor layer interface of the present invention.
* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
11 : 유리 기판 13 : 전면 전극,11: glass substrate 13: front electrode,
14 : n+영역 15 : n형 반도체층,14: n + region 15: n-type semiconductor layer,
17 : p형 반도체층 19 : 후면 전극17 p-type semiconductor layer 19 back electrode
본 발명의 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지 및 그 제조방법은 유리 기판 상에 인듐주석산화막(ITO)을 도포하는 단계와 상기 인듐주석산화막(ITO) 상에 균일한 두께로 카드뮴(Cd)을 도포하는 단계와 상기 카드뮴(Cd) 상에 n형 반도체인 황화카드뮴(CdS)을 도포하는 단계와 상기 황화카드뮴(CdS)이 도포된 유리 기판을 제 1 열처리하여 상기 카드뮴(Cd)이 상기 n형 반도체인 황화카드뮴(CdS)으로 확산하여 n+영역을 형성하는 단계와 상기 n형 반도체인 황화카드뮴(CdS) 상에 카드뮴텔루라이드(CdTe)를 도포하는 단계와 상기 카드뮴텔루라이드(CdTe)가 도포된 유리 기판을 염화카드뮴(이하 CdCl2라 칭함) 용액에 침적한 후 제 2 열처리하는 단계 및 상기 제 2 열처리된 카드뮴텔루라이드(CdTe) 상에 브롬-메탄올 용액으로 식각한 후 후면전극을 형성하는 단계를 포함하는 것을 그 특징으로 한다.The thin film photovoltaic cell using the tunneling junction at the ITO / n type semiconductor layer interface of the present invention and a method of manufacturing the same are coated with an indium tin oxide film (ITO) on a glass substrate and a uniform thickness on the indium tin oxide film (ITO). Applying cadmium (Cd), applying cadmium sulfide (CdS), which is an n-type semiconductor, on the cadmium (Cd), and performing a first heat treatment on the glass substrate coated with the cadmium sulfide (CdS). ) Is diffused into the n-type semiconductor cadmium sulfide (CdS) to form an n + region and the step of applying cadmium telluride (CdTe) on the n-type semiconductor cadmium sulfide (CdS) and the cadmium telluride (CdTe) coated glass substrates were immersed in a solution of cadmium chloride (hereinafter referred to as CdCl 2 ) and then subjected to a second heat treatment and etched with a bromine-methanol solution on the second heat treated cadmium telluride (CdTe). Back electrode And in that it comprises a step of its features.
이하, 본 발명의 바람직한 실시예를 첨부한 도면에 의하여 더욱 상세히 설명한다.Hereinafter, with reference to the accompanying drawings, preferred embodiments of the present invention will be described in more detail.
도 4는 본 발명의 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지의 개략적인 측면도이다. 도 4에 따르면, 본 발명의 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지는 유리 기판(11) 상에 광투과도가 높은 ITO로 전면 전극(13)을 형성한다. 상기 전면 전극(13) 상에 카드뮴(이하, "Cd"라함)을 도포한 후, 황화카드뮴(CdS)으로 n형 반도체층(15)을 형성한다. 특히, 상기 n형 반도체층(15)은 광투과층으로서 두께는 0.1∼5㎛가 바람직하나 2000Å이 가장 바람직하다.4 is a schematic side view of a thin film photovoltaic cell using tunneling junctions at an ITO / n type semiconductor layer interface of the present invention. According to FIG. 4, the thin film photovoltaic cell using the tunneling junction at the ITO / n type semiconductor layer interface of the present invention forms the front electrode 13 with ITO having high light transmittance on the glass substrate 11. After applying cadmium (hereinafter referred to as "Cd") on the front electrode 13, an n-type semiconductor layer 15 is formed of cadmium sulfide (CdS). Particularly, the n-type semiconductor layer 15 is preferably a light transmitting layer with a thickness of 0.1 to 5 탆, but most preferably 2000 ns.
다음, 상기 n형 반도체층(15)이 형성된 기판을 어닐링 하여, 상기 Cd이 상기 n형 반도체층으로 확산하도록 하여 상기 전면 전극(13)과 상기 n형 반도체층(15) 사이에 n+영역(14)을 형성한다. 따라서, 상기 n+영역(14)은 황화카드뮴(Cd1-xSx)으로 형성되며 비화학양론 X값이 0.4 이하가 바람직하고, 상기 전면 전극(13)과 상기 n형 반도체층(15)의 접합에서 터널링 접합을 나타내도록 하는 것을 특징으로 한다. 바람직한 실시예로서, 상기 n+영역(14)은 Cd0.7S0.3형성하며, 그 두께는 10∼200Å이 바람직하나 100Å이 가장 바람직하다. 상기 n형 반도체층(15)상에 CdTe로 p형반도체층(17)을 형성한다. 상기 p형 반도체층(17)은 광흡수층으로 카드뮴텔루라이드(CdTe), 수은카드뮴텔루라이드(Hg1-xCdxTe), 구리인듐셀레니움(CuInSe)2, 구리인듐칼륨셀레니움[Cu(InGa)Se2] 또는 황화구리인듐(CuInS2) 중 어느 하나를 사용하며, 그 두께는 2∼7㎛가 바람직하나 5㎛로 형성함이 가장 좋다. 상기 p형 반도체층(17) 상에 오믹 접합으로 후면전극(19)을 형성한다. 상기 후면 전극(19)은 구리가 도핑된 카본(C paste /Cu doped)으로 하고 이밖에 안티몬텔루라이드(Sb2Te3), 아연텔루라이드(ZnTe) 또는 금(Au) 중 선택 사용 할 수 있다.Next, the substrate on which the n-type semiconductor layer 15 is formed is annealed so that the Cd diffuses into the n-type semiconductor layer so that the n + region between the front electrode 13 and the n-type semiconductor layer 15 ( 14). Accordingly, the n + region 14 is formed of cadmium sulfide (Cd 1-x S x ), and has a non-stoichiometric X value of 0.4 or less, and the front electrode 13 and the n-type semiconductor layer 15 It is characterized in that to indicate the tunneling junction in the junction. In a preferred embodiment, the n + region 14 is formed with Cd 0.7 S 0.3 , the thickness of which is preferably 10 to 200 mV, most preferably 100 mV. The p-type semiconductor layer 17 is formed of CdTe on the n-type semiconductor layer 15. The p-type semiconductor layer 17 is a light absorption layer cadmium telluride (CdTe), mercury cadmium telluride (Hg 1-x Cd x Te), copper indium selenium (CuInSe) 2 , copper indium potassium selenium [Cu (InGa) Se 2 ] or copper indium sulfide (CuInS 2 ) is used, the thickness is preferably 2 ~ 7㎛ but is best formed in 5㎛. The back electrode 19 is formed on the p-type semiconductor layer 17 by an ohmic junction. The rear electrode 19 may be made of copper doped carbon (C paste / Cu doped), and may be selected from among antimony telluride (Sb 2 Te 3 ), zinc telluride (ZnTe), and gold (Au). .
도 5는 본 발명의 ITO/n형 반도체층 계면에서 터널링 접합을 이용한 박막 광전지의 제조방법의 단계별 순서를 보인 공정도이다.5 is a process chart showing a step-by-step procedure of a method for manufacturing a thin film photovoltaic cell using tunneling junctions at an ITO / n type semiconductor layer interface of the present invention.
도 5에 따르면, 먼저 유리 기판(glass substrate) 상에 스퍼터링 방식(ion beam sputtering)으로 ITO를 형성한다 다음, 상기 ITO 상에 균일한 두께로 Cd을 형성한다. 상기 Cd 상에 화학용액증착법(chemical bath deposition, 이하 CBD라고 칭함)으로 CdS를 형성한다. CBD 방법으로 상기 CdS를 증착함에 있어서, 상기 Cd은 시드층(seed layer)로서 용액내에서 기판에 CdS의 핵생성사이트를 증가시킴으로서 CdS의 불균일핵생성(heterogeneous nucleation)을 촉진시키며 계면간에 완충막으로 작용한다. 특히, 상기 n형 반도체층과 상기 p형 반도체층의 계면 접합 향상을 위해 CdCl2에 침적한 후 제 1 열처리(annealing)를 하여 n+영역을 형성한다. 상기 제 1 열처리는 온도를 200∼600℃에서 시간은 10∼60분으로 하며 가장 바람직하기로는온도를 400℃에서 시간은 10분간 수행하는 것이 좋다. 상기 Cd는 제 1 열처리 할 경우 확산하여 ITO와 n형 반도체층의 계면에만 형성하여, CdS의 고갈영역(depletion region)을 감소시킴으로서 전기적으로 전도성 터널링 접합을 하는 것이 바람직하다. 일반적으로, 상기 Cd는 제 1 열처리시에 ITO로 확산하지 않는다. 상기 어닐링 후에, CdS 상에 근접승화법(closed space sublimation)으로 CdTe를 형성한다. 진성(intrinsic) 반도체인 CdTe가 형성된 기판을 CdCl2에 침적한 후 제 2 열처리한다. 상기 제 2 열처리로 인해 Te가 풍부(rich)함으로서 CdTe가 p형 반도체층으로 형성된다. 상기 제 2 열처리는 온도를 200∼600℃에서 시간은 10∼60분으로 하며 가장 바람직하기로는 온도를 400℃에서 시간은 30분간 수행하는 것이 좋다. 상기 CdTe가 형성된 기판을 브롬-메탄올(Br-CH3OH) 용액에 담군 후 즉각 세척한다. 상기 식각 세척된 CdTe 상에 후면 전극을 형성한다.According to FIG. 5, ITO is first formed on a glass substrate by ion beam sputtering, and then Cd is formed on the ITO with a uniform thickness. CdS is formed on the Cd by chemical bath deposition (hereinafter referred to as CBD). In depositing the CdS by the CBD method, the Cd is a seed layer, which promotes heterogeneous nucleation of CdS by increasing the nucleation site of CdS in the substrate in solution, and as a buffer layer between interfaces. Works. In particular, in order to improve the interfacial bonding between the n-type semiconductor layer and the p-type semiconductor layer, the n + region is formed by first annealing after immersion in CdCl 2 . In the first heat treatment, the temperature is set to 10 to 60 minutes at a temperature of 200 to 600 ° C., and most preferably, the temperature is performed at 400 ° C. for 10 minutes. The Cd is preferably formed only at the interface between the ITO and the n-type semiconductor layer during the first heat treatment to reduce the depletion region of the CdS, thereby electrically conducting the tunneling junction. In general, the Cd does not diffuse into ITO during the first heat treatment. After the annealing, CdTe is formed on the CdS by a closed space sublimation. The substrate on which CdTe, which is an intrinsic semiconductor, is formed is deposited on CdCl 2 and then subjected to a second heat treatment. Te is rich due to the second heat treatment to form CdTe as a p-type semiconductor layer. In the second heat treatment, the temperature is 10 to 60 minutes at 200 to 600 ° C., and most preferably, the temperature is performed at 400 ° C. for 30 minutes. The substrate on which the CdTe is formed is immersed in a bromine-methanol (Br-CH 3 OH) solution and immediately washed. A back electrode is formed on the etched CdTe.
이상 도면 및 상세한 설명을 통하여 본 발명의 바람직한 실시예를 설명했으나, 이는 이하의 청구범위에 개시되어 있는 발명의 범주로 이를 제한하고자 하는 목적이 아니다. 따라서 본 발명은 특허청구의 범위에 한정되지 않고 당업자의 수준에서 그 변형 및 개량이 얼마든지 가능하며 그와 같은 공정순서 및 수치의 변경은 본 발명의 권리범위에 포함되는 것은 물론이다.Although the preferred embodiments of the present invention have been described with reference to the drawings and the detailed description, this is not intended to limit the scope of the invention disclosed in the claims below. Therefore, the present invention is not limited to the scope of the claims, and modifications and improvements are possible at the level of those skilled in the art, and such changes in process order and numerical value are of course included in the scope of the present invention.
이상 설명한 바에 의하여 명백한 바와 같이, 본 발명은 전면 전극인 ITO와 n형 반도체층인 CdS 사이에 카드뮴을 도포한 후 어닐링 하여 n+영역을 형성함으로써 ITO와 CdS사이에 전기적인 전도성 터널링 접합(Tunneling Contact)을 하여 전도도를 증가시키는 효과가 있을 뿐만 아니라, 직렬 저항을 줄여서 광전지 효율을 크게 향상시킬 수 있는 뛰어난 효과가 있으므로 반도체 산업상 매우 유용한 발명인 것이다.As apparent from the above description, the present invention provides an electrically conductive tunneling junction between ITO and CdS by forming an n + region by applying cadmium between the front electrode ITO and CdS, an n-type semiconductor layer, and then annealing them. Not only does it increase the conductivity, but it is also a very useful invention for the semiconductor industry because it has an excellent effect of greatly improving the photovoltaic efficiency by reducing the series resistance.
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