KR20020022636A - A chemicals mixed liquid supply apparatus for etching or cleaning semiconductor wafer - Google Patents

Abstract

PURPOSE: An apparatus for supplying chemical mixture liquid for etching or cleaning a semiconductor wafer is provided to greatly reduce a volume necessary for installing the apparatus, by eliminating the necessity of an agitator installed in a plurality of pumps or agitating baths and a motor for driving the agitator. CONSTITUTION: A water supplying unit(5) supplies water to the inside of the agitating bath(1). A chemical supplying unit(11a,11b) supplies chemical to the inside of the agitating bath. A gas supplying unit for generating vortex injects inert gas from a portion under the agitating bath to the inside of the agitating bath to uniformly mix the supplied water with the supplied chemical. An exhausting unit exhausts the inert gas supplied to the inside of the agitating bath to the exterior. A mixture liquid supplying unit(23) supplies the mixture liquid uniformly mixed in the agitating bath to an etching or cleaning apparatus.

Description

Chemical mixed liquid supply apparatus and method for etching or cleaning semiconductor wafers

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical mixed liquid supply apparatus and method for etching or cleaning semiconductor wafers. The present invention is particularly simple in structure and small in volume, and can be easily installed separately in a wafer cleaning apparatus requiring a chemical mixed liquid. The present invention relates to a chemical mixed liquid supply apparatus and method for etching or cleaning a semiconductor wafer, wherein the mixture is uniformly mixed in various compositions and suitable for supplying the same to an etching or cleaning apparatus.

Generally, impurity particles, reaction by-products, and impurities introduced from the etching process are removed in order to remove unnecessary oxides on the semiconductor wafer or to form a predetermined pattern on the wafer in the semiconductor manufacturing process. The wafer is cleaned to remove it.

At this time, since chemicals made of fluorine, hydrochloric acid, sulfuric acid, hydrogen peroxide and ammonia water are uniformly diluted or mixed with water at the correct concentration and mixed with each other, the chemicals and water are uniformly mixed and supplied to an etching or cleaning equipment. A chemical mixture feeder is used.

1 is a block diagram showing a conventional chemical mixed liquid supply apparatus for etching or cleaning a semiconductor wafer.

As shown in the drawing, the conventional chemical liquid mixture supply apparatus has a large-capacity stirring tank 101 capable of containing water and chemicals, and a pen-type stirrer for mixing water and chemicals supplied from the stirring tank 101 ( 103), a chemical volume meter 105 for accurately measuring the amount of chemical supplied to the stirring vessel 101, and a plurality of pumps (107a, 107b, 107c) for circulation and supply of the water and chemicals Consists of

By this configuration, first, a large amount of water and chemicals are contained in the stirring tank 101 at a predetermined ratio, and then, when the stirrer 103 is rotated to generate vortices in the stirring tank 101, the water and chemicals This is mixed evenly.

Thereafter, the mixed solution of water and chemical, which were uniformly mixed, could be supplied to a semiconductor wafer etching or cleaning equipment that requires it.

However, the conventional chemical mixture liquid supply apparatus for the conventional semiconductor wafer cleaning equipment and etching equipment that requires a large amount of mixed chemicals at one time is used for the circulation and supply of the stirrer 103 located in the stirring vessel 101 and water and chemical. Since several pumps 107a, 107b, and 107c are essentially installed, its configuration is inevitably complicated and bulky.

For the same reason as above, the conventional chemical liquid mixture supply device cannot be installed together with semiconductor wafer etching or cleaning equipment, but has to be installed at a long distance.

Therefore, after mixing a large amount of water and chemical at once, this chemical mixture solution had to be supplied to the wafer etching or cleaning equipment located at a distance through a pipe.

Such a conventional method is not a big problem in a batch equipment for etching and cleaning several wafers in one set.

In the case of the batch type equipment, some large amount of chemical mixture is filled in several large cleaning baths for etching or cleaning, and a cassette in which dozens of wafers are stacked is sequentially deposited on the chemical mixture for cleaning or etching. It is because

However, according to recent technical trends, small sheet type equipment for cleaning semiconductor wafers one by one is widely used, and the single sheet type cleaning equipment has been considerably miniaturized as compared to conventional batch equipment, and thus the amount of chemical mixture used. It is characterized by being reduced to 1/50 to 1/100 of this conventional batch type equipment.

In addition, since the mixing ratio and type of chemicals used in the cleaning equipment may vary depending on each process, it is essential to supply various mixing ratios and types of chemicals.

Therefore, the conventional chemical mixture solution supplying device which is bulky and limited to supply various kinds of mixing ratios and types of chemicals has a problem that is difficult to use in semiconductor wafer etching or cleaning equipment such as the sheet type.

Accordingly, the present invention has been proposed to solve the conventional problems as described above, the object of the present invention is to increase the volume in a simple configuration without a motor for driving the stirrer and the stirrer in a plurality of pumps or agitator for circulation and supply The present invention provides a chemical liquid supply device for etching or cleaning semiconductor wafers that can be individually installed in each semiconductor wafer cleaning equipment requiring a chemical mixture.

In addition, another object of the present invention is to provide a chemical mixture liquid supplying apparatus and method for etching or cleaning a semiconductor wafer which easily supplies various mixed ratios and types of chemical mixtures required by each semiconductor wafer etching or cleaning equipment. have.

1 is a block diagram showing a conventional chemical liquid mixture supply device.

Figure 2a is a block diagram showing a chemical mixed liquid supply apparatus for etching or cleaning the semiconductor wafer of the present invention.

FIG. 2B is a block diagram showing a modified embodiment of FIG. 2A.

Figure 3a is a schematic diagram showing a method for supplying a chemical mixed solution for etching or cleaning a semiconductor wafer of the present invention.

Figure 3b is a schematic diagram showing a method for supplying two kinds of chemical mixture solution of the present invention.

* Description of the symbols for the main parts of the drawings *

1: stirring tank 3: water supply piping

5: Water supply valve 7a, 7b: Check valve

9: Chemical quantity measuring instrument 11: Chemical supply valve

13: transfer gas supply pipe 15: transfer gas supply valve

17: vortex generating gas supply piping 19: vortex generating gas supply valve

21: mixed liquid supply piping 23: mixed liquid supply valve

25: drain pipe 27: drain valve

29 exhaust pipe 31 exhaust valve

In order to achieve the above object, a semiconductor wafer etching or cleaning chemical mixture liquid supply apparatus according to the technical idea of the present invention includes a stirring tank, water supply means for supplying water into the stirring tank, and chemical supply into the stirring tank. When the chemical supply means and the water and the chemical are supplied into the stirring tank, in order to uniformly mix the supplied water and the chemical, the inert gas is injected into the inside of the stirring tank to supply the vortex generating gas to generate the vortex Means, exhaust means for exhausting the inert gas supplied into the stirring tank to the outside, and a mixed liquid supply means for supplying a mixture of the water and the chemical uniformly mixed in the stirring tank to an etching or washing apparatus. do.

Here, the chemical supply means is connected to the chemical amount measuring device for measuring the amount of the chemical supplied into the stirring tank, the chemical amount measuring device and the external chemical supply destination and the stirring tank in three directions, the both sides of the chemical from the chemical supply source A chemical supply unit including a chemical supply valve configured to be selectively opened and closed by an open / closed signal transmitted to supply the chemical to the regular or to supply the chemical from the chemical volume meter to the stirring vessel; It is connected to an external transport gas supply destination and an exhaust port in three directions so that the gas discharged from the chemical quantity meter can be exhausted to the exhaust port or inert gas can be injected from the transport gas supply destination to the chemical volume meter. Composed of 3-way valve selectively opened and closed by signal To include in a gas supply valve for transferring the chemical periodic bilateral the chemical fill a predetermined amount of the chemical to the drawing the parts of the transporting gas for supply to the pressure transferred into the stirring tank is preferred.

Here, the chemical amount measuring device is provided with two or more to measure the amount of different types of chemical, the chemical supply unit includes two or more chemical supply valves respectively connected to the chemical amount measuring device, the transfer The gas supply unit may include two or more transfer gas supply valves respectively connected to the chemical volume meter, so that two or more kinds of chemicals may be supplied into the stirring tank at a predetermined mixing ratio.

On the other hand, for etching and cleaning the semiconductor wafer, a method of supplying a chemical mixture liquid for etching or cleaning the semiconductor wafer for mixing the water and chemical, and supplying it to the semiconductor wafer etching or cleaning equipment, by supplying a predetermined amount of water into the stirring tank Filling water supply step, a chemical supply step of supplying a predetermined amount of chemical from the external chemical supply source to the chemical volume meter, and after the chemical supply step, the transfer gas supply unit injects an inert gas into the chemical volume meter to the chemical Chemical conveying step of pressurized transfer into a stirring tank and, after the chemical transfer step, inert gas is injected into the lower part of the stirring tank to generate a vortex in the water and the chemical supplied into the mixing tank to mix uniformly And after the chemical mixing step, the transfer gas supply unit is turned into the stirring tank. By injecting gases, it is configured to include a mixture liquid supply step of pressure transferring the uniformly mixed in the mixing bath of the mixture of water and a chemical etching process or a wet station located outside.

Here, the chemical supply step, the different types of chemicals from two or more chemical supply source to each of the two or more chemical volume meter, the chemical transfer step, by injecting an inert gas to the two or more chemical volume meter Different types of chemicals may be pressurized into the stirring tank to mix different types of chemicals at a predetermined mixing ratio.

Hereinafter, an embodiment according to the spirit of the present invention as described above will be described in detail with reference to the accompanying drawings.

Figure 2a is a block diagram showing a chemical mixed liquid supply apparatus for etching or cleaning the semiconductor wafer of the present invention.

As shown, the present invention, unlike the prior art, without having a plurality of pumps or agitators, it is possible to mix the water and the chemical in various ratios, it is possible to supply to the equipment in need thereof. (However, the chemical here means a number of chemicals, such as hydrofluoric acid, hydrochloric acid, sulfuric acid, hydrogen peroxide, ammonia water, the chemical used in the present invention is usually a liquid).

In the present invention, a stirring vessel 1 is provided which provides a space necessary for mixing chemical and water.

In addition, the water supply means 10 for supplying water for mixing with the chemical into the stirring tank (1) includes a water supply pipe (3), a water supply valve (5) and a check valve (7a) It is connected to one side of (1) and installed.

Here, the water supply means 10 is configured to include a water supply pipe (3) connected to the water supply destination and the stirring tank (1) not shown, and a water supply valve (5) for adjusting the supply amount of water. .

In addition, a check valve 7a may be installed in the water supply pipe 3 so as to prevent backflow of the water to be supplied.

In addition, the chemical supply means 20A for supplying the chemical into the stirring vessel 1 from an external chemical supply source (not shown) includes a chemical quantity measuring device 9 and a chemical supply valve 11 which is a three-way valve. It includes a chemical supply unit and the transfer gas supply unit 20B including a transfer gas supply valve 15.

Here, the chemical supply means 20A is provided with a chemical amount measuring device 9 for measuring the exact amount of the chemical in order to supply a predetermined amount of chemical desired by the operator to the stirring vessel 1, and both sides of the chemical The regular 9 is supplied with chemicals conveyed from a chemical supplier, not shown.

In addition, the chemical supply unit including a chemical supply valve 11 which is a three-way valve (3way valve) is installed at the pipe branch point connected in three directions with the chemical supply destination, the chemical quantity measuring instrument 9 and the stirring tank (1). do.

Here, the three-way valve mentioned below is a chemical supply valve 11, a transfer gas supply valve 15, a drain valve 27, the first chemical supply valve (11a), the second chemical supply valve (11b), There is a 1st transfer gas supply valve 15a and the 2nd transfer gas supply valve 15b, and they are each installed in the branch point of the pipe connected in three directions.

In addition, all three-way valves (11, 15, 11a, 11b, 15a, 15b, 27) described above are normally closed in the first direction shown by arrows, and then in the first direction by an open / close signal transmitted. Open and close the direction 1 and 2 selectively by opening and closing direction 2.

Thus, the three-way valve (11, 15, 11a, 11b, 15a, 15b, 27) serves to block the flow of the fluid or to change the flow direction of the fluid.

On the other hand, the transfer gas supply unit 20B for injecting the inert gas for the pressure transfer in order to pressurize the chemical supplied to the chemical volume meter 9 to the stirring tank (1) is provided.

Here, the transport gas supply unit 20B includes a transport gas supply pipe 13 connected to an external transport gas supply destination and the chemical quantity meter 9 that is not shown.

In addition, the supply pressure gas supply is a three-way valve for reducing the pressure when filling the chemical volume meter (9) on the pipe, and pressurized the chemical in the chemical meter (9) to the stirring vessel (1) The valve 15 is installed.

That is, the chemical supply valve 11 is opened in the first direction when the chemical quantity measuring device 9 is supplied with the chemical, so that the chemical gas supply valve 15 is in the open state in the second direction. As the gas inside the quantum meter 9 escapes in the second direction of the transfer gas supply valve 15, the pressure inside the chemical volume meter 9 is reduced.

In this way, since the second direction of the transfer gas supply valve 15 is normally open, the supplied chemical can be smoothly filled in the chemical quantity measuring device 9.

On the other hand, when the first direction of the transfer gas supply valve 15, which is normally closed, is opened, the second direction is closed, and the inert gas flows into the chemical volume meter 9 through the transfer gas supply pipe 13. Supplied.

In this case, the internal pressure of the chemical volume meter 9 is increased, and the chemicals filled in the chemical volume meter 9 are pressurized to the stirring tank 1.

According to such a structure, several transfer pumps conventionally used as a means for conveying and supplying the said chemical to the said stirring tank 1 do not need to be installed.

Then, when water and chemical are supplied into the stirring tank 1, in order to uniformly mix the supplied water and the chemical, the vortex generation for injecting an inert gas into the inside of the stirring tank 1 to generate a vortex The gas supply means 30 includes a vortex generating gas supply pipe 17, a vortex generating supply valve 19, and a check valve 7b.

Here, the vortex generating gas supply means 30 is provided with a vortex generating gas supply pipe 17 connected to the lower portion of the stirring tank (1) and the supply destination of an inert gas (not shown).

In addition, the vortex generating gas supply pipe 17 is provided on the vortex generating gas supply pipe 17, thereby adjusting the amount of inert gas supplied from the inert gas supply.

In addition, a check valve 7b may be installed in the vortex generating gas supply pipe 17 to prevent a back flow of the inert gas supplied.

In this case, if the inert gas is strongly injected once or twice from the lower portion of the stirring tank 1 by the vortex generating gas supply means 30, vortices are generated to partially mix the water and the chemical. This is mixed uniformly in an instant.

Therefore, in order to uniformly mix water and chemical, it becomes possible to take the simple structure which does not need to install the drive motor which drives a stirrer and a stirrer like conventionally.

Here, the vortex generating gas supply means 30 is sprayed with an inert gas into the water and chemical in the stirring tank 1 from the lower portion in the stirring tank 1 to effectively generate the vortex, although not shown in the aperture A distributor having a small number of injection nozzles may be provided, and the inert gas may be strongly injected one or two times upwardly through the injection nozzles.

On the other hand, the exhaust means 50 for exhausting the inert gas supplied into the stirring tank 1 to the outside is provided with an exhaust pipe 29 and an exhaust valve 31.

The exhaust means 50 includes an exhaust pipe 29 connected to an upper portion of the stirring vessel 1 to exhaust the inert gas supplied into the stirring vessel 1 to the outside.

In addition, an exhaust valve 31 for controlling the amount of inert gas exhausted is provided on the exhaust pipe 29.

By such a configuration, the inert gas for the feed supplied into the stirring tank 1 and the inert gas injected into the stirring tank 1 to generate the vortex in the stirring tank 1 to supply the chemical are The exhaust valve 31 is discharged through the exhaust pipe 29 in the open state.

Here, the exhaust means 50 is a gas in the stirring tank when the inert gas for transfer is supplied together with the stirring tank (1) for the transfer of the chemical from the chemical volume meter (9) to the stirring tank (1) By exhausting the pressure in the stirring tank (1) to reduce the pressure transfer of the chemical smoothly.

In addition, the mixed liquid supply means 40 for supplying the mixed liquid of the water and chemical uniformly mixed in the stirring tank 1 to the semiconductor wafer etching or cleaning equipment (not shown) is the mixed liquid supply pipe 21 and the mixed liquid supply valve ( 23) and the drain valve 27 is provided.

Here, the mixed liquid supply means 40 is provided with a mixed liquid supply pipe 21 connected to the stirring vessel 1 and the semiconductor wafer etching or cleaning equipment.

In addition, on the mixed liquid supply pipe 21, a mixed liquid supply valve 23 for controlling the supply amount of the chemical mixed liquid supplied through the mixed liquid supply pipe 21 is installed.

By such a configuration, when the transfer gas supply unit 20B injects the inert gas for transfer into the stirring vessel 1, the pressure in the stirring vessel 1 is increased so that the chemical mixture is supplied with the mixed solution. The pressure is transferred to the semiconductor wafer etching or cleaning equipment through the pipe 21.

At this time, the mixed liquid supply valve 23 is in an open state, and the exhaust valve 31 of the exhaust means 50 is in a closed state to perform pressure transfer of the chemical mixed liquid.

In addition, the mixed liquid supply means 40 is preferably provided with a drain pipe (25) branched from the mixed liquid supply pipe (21), in this case at the branch point of the mixed liquid supply pipe 21 and the drain pipe (25) A drain valve 27 that is a three-way valve can be provided.

As such, when the drain valve 27 is installed, the mixed liquid or liquid contained in the stirring vessel 1 may be selectively supplied to the semiconductor wafer cleaning equipment or discharged to the outside, if necessary.

On the other hand, it is preferable that the inert gas for conveyance used for conveying a chemical or chemical liquid mixture or the inert gas used for vortex generation in the said stirring tank 1 is nitrogen.

The nitrogen is chemically stable and does not cause unnecessary reaction with the chemical at room temperature, and does not dissolve well in water supplied to the stirring tank 1.

In addition, nitrogen is generally colorless, tasteless, and odorless gas, which is not harmful to the human body, and because it is abundant and easy to obtain, it is suitable as an inert gas used for transporting chemical or chemical mixtures or for vortex generation.

Here, the inert gas for conveying and vortex generation may not necessarily be nitrogen as long as it has the above-mentioned characteristics.

Figure 3a is a schematic diagram showing a method for supplying a chemical mixed solution for etching or cleaning a semiconductor wafer of the present invention.

As shown, the present invention is to uniformly mix the water and the chemical through each step, and to supply it to the semiconductor wafer etching or cleaning equipment.

Hereinafter, referring to FIGS. 2A and 3A, a method of supplying a chemical mixture solution for mixing water and chemicals for etching and cleaning a semiconductor wafer and supplying the same to a semiconductor wafer etching or cleaning apparatus will be described below.

In the method of supplying a chemical mixed liquid for etching or cleaning a semiconductor wafer of the present invention, first, a water supply step (ST100) of supplying and filling a predetermined amount of water into a stirring tank is performed.

When the water supply step (ST100) is in progress, a predetermined amount of water required for mixing the chemical in the small capacity stirring tank (1) is supplied from a water supply source (not shown) to fill the stirring tank (1).

To this end, the closed water supply valve 5 is opened to close the water supply valve 5 when a predetermined amount of water is filled in the stirring vessel 1.

Subsequently, a chemical supply step (ST200) of supplying a predetermined amount of chemical to the chemical quantity measuring device 9 from an external chemical supply source (not shown) is performed.

The chemical supplying step (ST200) is a step of supplying chemicals from an external chemical supply source (not shown) and supplying the chemicals to the chemical quantity measuring device 9 to fill an accurate amount of chemicals desired by an operator.

To this end, the direction of arrow 1 of the closed chemical supply valve 11 is opened for a predetermined time so that the chemical is filled in the chemical quantity measuring device 9 in a predetermined amount.

Thereafter, the chemical supply valve 11 closes the first direction to stop the chemical supply.

In addition, after the chemical supply step (ST200), a chemical transport step (ST300) is carried out by the transport gas supply unit 20B injects an inert gas into the chemical volume meter (9) to pressurize the chemical into the stirring tank. .

To this end, when the first direction of the transfer gas supply valve 15 which is a three-way valve is opened, an inert gas is supplied to the chemical volume meter 9 from a transfer gas supply destination (not shown).

Accordingly, the chemical filled in the chemical volume meter is pushed into the stirring vessel 1 by the pressure of the inert gas injected into the chemical volume meter 9.

At this time, the exhaust valve 31 of the exhaust means 50 connected to the upper part of the stirring tank 1 is opened and the inert gas supplied into the stirring tank 1 is exhausted together with the chemical which is transferred only before and after the chemical. The pressure difference is generated to facilitate the transfer of the chemical.

As such, when the chemical is smoothly transferred to the stirring vessel 1, the first direction of the transfer gas supply valve 15 is closed as it is.

In addition, after the water supply step (ST100) and the chemical transfer step (ST300), inert gas is injected into the lower portion of the stirring tank (1) to uniformly supply the water and the chemical supplied into the stirring tank (1). The chemical mixing step ST400 is performed.

To this end, when the vortex generating gas supply valve 19 located below the stirring tank 1 is closed one or two times, an inert gas is injected from the lower part of the stirring tank 1, and only a part of the rising inert gas is raised. Vortex is strongly generated in water and chemicals in the mixed state.

As a result, the water and the chemical are instantly and uniformly mixed.

On the other hand, at this time, the inert gas supplied into the stirring tank 1 to generate the vortex is exhausted through the exhaust pipe 29 in the state in which the exhaust valve 31 is open.

In addition, after the chemical mixing step (ST400), the transport gas supply unit 20B injects an inert gas into the stirring tank (1), the mixed liquid of water and chemical uniformly mixed in the stirring tank (1) Mixing liquid supply step (ST500) of the pressure transfer to the etching or cleaning equipment not shown located outside.

To this end, the open exhaust valve 31 is closed.

Further, the transfer gas supply valve 15 and the mixed solution supply valve 23 of the mixed solution supply means 40 of the transfer gas supply unit 20B, which are closed in the first direction, are opened.

In this case, while the inert gas is supplied from the transfer gas supply unit 20B to the stirring tank 1, the mixed solution of water and chemical uniformly mixed in the stirring tank 1 is pressurized and transferred by the inert gas. It is supplied to the semiconductor wafer etching or cleaning equipment.

Thereafter, when the mixed liquid is supplied to all of the semiconductor wafer etching or cleaning equipment, the closed exhaust valve 31 is opened as it is, and the transfer gas supply valve 15 is closed in the first direction, and in the second direction. Open.

In addition, the mixed liquid supply valve 23 of the mixed liquid supply means 40 is closed.

On the other hand, when it is necessary to discharge the liquid in the stirring tank 1 to the outside, such as when an abnormality occurs in the mixing of water and chemical, the mixed liquid supply valve 23 that is closed in the mixed liquid supply step (ST500) Opening the first direction of the drain valve 27 instead of opening the) is the liquid inside the stirring tank (1) is discharged to the outside.

On the other hand, Figure 2b is a block diagram showing a modified embodiment of the present invention.

As shown, in the modified embodiment, there is one more chemical quantity meter 33, 35 for measuring the amount of chemical.

In this way, if one chemical quantity measuring device (33, 35) is further provided, when mixing the water and the chemical, it is possible to supply the two types of chemical to the stirring tank (1) to mix.

Therefore, it is possible to supply various mixing ratios and types of chemical mixtures required by each semiconductor wafer etching or cleaning equipment.

When the two chemical quantity measuring devices 33 and 35 are provided as described above, the branching points of the pipes thus formed have the configuration of installing appropriate three-way valves 11a, 11b, 15a, and 15b.

According to the configuration, one of the first chemical amount measuring device 33 and the second chemical amount measuring device 35 is to share the role of measuring the amount of the chemical and transfer to the stirring tank (1), the remaining chemical amount measuring device May be used to serve as part of an exhaust pipe 29 for exhausting the inert gas supplied into the stirring vessel 1 together with the chemical to the outside.

In addition, the two chemical volume measuring units 33 and 35 share the above-described roles, and can alternately supply roles to the stirring tank 1 as well as one type of chemical while changing roles. .

Figure 3b is a schematic diagram showing a method for supplying two kinds of chemical mixture solution of the present invention.

As shown, the present invention has respective steps for mixing different kinds of chemicals in various mixing ratios and supplying them to semiconductor wafer etching or cleaning equipment.

2B and 3B, specific methods of mixing different kinds of chemicals in various mixing ratios and supplying them to the semiconductor wafer etching or cleaning equipment will be described below.

First, a water supply step ST100 is performed in which a predetermined amount of water is supplied and filled into the stirring tank 1 in the same manner as the water supply step ST100 of the first embodiment described above.

In addition, a first chemical supply step ST200a is performed to supply the first chemical quantity meter 33 with a predetermined amount of first chemical from an external first chemical supply source (not shown).

For the first chemical supply step ST200a, the direction of arrow 1 of the first chemical supply valve 11a is opened for a predetermined time so that the first chemical is filled in the first chemical quantity meter 33 by a predetermined amount.

Thereafter, the first chemical supply valve 11a closes the first direction to stop supply of the first chemical.

In addition, after the first chemical supplying step (ST200a), by injecting an inert gas into the first chemical amount measuring device 33, the first chemical transfer step (ST300a) to pressurize the first chemical into the stirring tank (1) Proceeds.

To this end, when the first direction closed by the first transfer gas supply valve 15a is opened, an inert gas is supplied to the first chemical quantity meter 33 from a transfer gas supply destination (not shown).

Accordingly, the first chemical filled in the first chemical quantity meter 33 is transferred to the stirring vessel 1 by the pressure of the inert gas supplied to the first chemical quantity meter 33.

At this time, the inert gas injected together with the first chemical in the stirring tank 1 is exhaust pipe in a state in which the second chemical supply valve 11b and the second transfer gas supply valve 15b are opened in the second direction. It is exhausted via 29b.

As such, when the first chemical is smoothly transferred to the stirring vessel 1, the first chemical gas supply valve 15a is closed in the first direction to stop the supply of the inert gas for the transfer.

Subsequently, after the first chemical supplying step ST200a and the first chemical conveying step ST300a, a predetermined amount of the second chemical is supplied to the second chemical quantity meter 35 from an external second chemical supplying source (not shown). The second chemical supply step ST200b is performed.

For the second chemical supply step ST200b, the arrow 1 direction of the second chemical supply valve 11b is opened for a predetermined time so that the second chemical is filled in the second chemical amount meter 35 in a predetermined amount.

Thereafter, the second chemical supply valve 11b closes the first direction to stop the second chemical supply.

In addition, after the second chemical supply step (ST200b), by injecting an inert gas into the second chemical volume meter 35, the second chemical transfer step (ST300b) to pressurize the second chemical into the stirring tank (1) Proceeds.

To this end, when the second transfer gas supply valve 15b is opened in the closed first direction, an inert gas is supplied from the transfer gas supply destination (not shown) to the second chemical volume meter 35.

Accordingly, the second chemical filled in the second chemical quantity meter 35 is transferred to the stirring vessel 1 by the pressure of the inert gas supplied to the second chemical quantity meter 35.

At this time, the inert gas supplied with the second chemical in the stirring tank 1 is exhaust pipe in a state in which the first chemical supply valve 11a and the first transfer gas supply valve 15a are opened in the second direction. It is exhausted via 29a.

As such, when the second chemical is smoothly transferred to the stirring vessel 1, the second chemical gas supply valve 15b is closed in the first direction to stop the supply of the inert gas for the transfer.

By proceeding with these steps, it is possible to adjust the amount of the water and the first chemical and the second chemical supplied to the stirring tank (1) can be supplied to the stirring tank (1) in various ratios.

Then, a chemical mixing step (ST400) of injecting an inert gas into the lower portion of the stirring tank 1 to uniformly mix the water and the first chemical and the second chemical supplied in the stirring tank 1 is carried out. .

To this end, as in the above-described embodiment, when the vortex generating gas supply valve 19 located below the stirring tank 1 is opened once or twice, an inert gas is injected from the lower part of the stirring tank 1. In addition, vortices are strongly generated in water and two kinds of chemicals in which only part of the inert gas rising in the liquid is mixed.

Thereby, the said water and two types of chemicals are instantaneously mixed uniformly.

On the other hand, at this time, the inert gas supplied to the stirring tank (1) for the generation of vortex is passed through the first transfer gas supply valve 15a and the second transfer gas supply valve 15b opened in the second direction. Exhaust is exhausted through exhaust pipes 29a and 29b.

In addition, after the chemical mixing step (ST400), by injecting the inert gas for transport into the stirring tank (1), the mixture of water and chemicals uniformly mixed in the stirring tank (1) is located outside The mixed liquid supplying step (ST500) for the pressure transfer to the etching or cleaning equipment is not performed.

To this end, the first transfer gas supply valve 15a and the second transfer gas supply valve 15b are simultaneously opened in the closed first direction.

At the same time, the mixed liquid supply valve 23 is opened.

In this case, while the inert gas is supplied to the stirring tank (1), the pressure inside the stirring tank (1) increases, the mixed solution of water and chemical uniformly mixed with the semiconductor is located outside through the mixed solution supply pipe (21) Pressurized to wafer etching or cleaning equipment.

Thereafter, when the chemical mixed liquid is supplied to the semiconductor wafer etching or cleaning equipment, the mixed liquid supply valve 23 of the mixed liquid supply means 40 is closed, and the first feed gas supply valve 15a and the second transfer are used. The inlet gas is stopped by closing in the first direction of the gas supply valve 15b.

On the other hand, when it is necessary to discharge the liquid in the stirring tank 1 to the outside, in the mixed liquid supply step (ST500), instead of opening the closed liquid mixture supply valve 23 in the first direction of the drain valve 27 When opened in the liquid inside the stirring tank (1) is discharged to the outside.

As described above, two different types of chemicals may be uniformly mixed and supplied to the semiconductor wafer etching or cleaning equipment that requires the same.

According to this method, the chemical supply source, the chemical type, and the chemical quantity measuring device are not limited to two, but various types of chemicals can be mixed and supplied to the semiconductor wafer etching or cleaning equipment.

To this end, the chemical supply step (ST200) and the chemical transfer step (ST300) as in the modified embodiment may be repeated by the type of chemical.

In this case, of course, the operator may be supplied with various types of chemicals desired by the chemical supplier, and may further include a chemical quantity measuring instrument according to the type of the chemical, and additionally install the pipe and the three-way valve accordingly.

This is similar to the apparatus and method of the modified example in which two types of chemicals are mixed and supplied, and thus detailed description thereof will be omitted.

As described above, the present invention supplies the chemical to the chemical volume meter and the agitation tank, and then uses the inert gas for the pressure transfer to supply the chemical mixture of the agitation vessel to the semiconductor wafer etching or cleaning equipment. No pump is required.

In addition, in order to uniformly mix water and chemical in the stirring tank, an inert gas is injected from the lower part of the stirring tank to generate vortices so that a stirrer is not required.

Therefore, the present invention can be installed and used directly in each semiconductor wafer etching or cleaning equipment by greatly reducing the volume by the simple configuration as described above.

In addition, since the present invention is configured to supply and mix various kinds of chemicals into the stirring vessel, it is possible to easily supply various mixing ratios and kinds of chemical mixtures required by semiconductor wafer cleaning equipment.

The preferred embodiment of the present invention has been described above. The present invention may use various changes, modifications, and equivalents. It is clear that the present invention can be applied in the same manner by appropriately modifying the above embodiments. Therefore, the above description does not limit the scope of the present invention as defined by the limitations of the following claims.

As described above, the semiconductor wafer etching or cleaning chemical mixture supply device according to the present invention has a large volume with a simple configuration without a motor for driving an agitator and agitator installed in a plurality of pumps or agitators for supply and circulation. It can be reduced, so that it can be individually installed in each semiconductor wafer etching or cleaning equipment requiring a chemical mixture.

In addition, since various kinds of chemicals can be easily supplied and mixed in various ratios in the mixing vessel, they can be quickly applied to each semiconductor etching or cleaning equipment requiring different mixing ratios and types of chemical mixtures. It works.

Claims (5)

A stirring tank; Water supply means for supplying water into the stirring tank; Chemical supply means for supplying chemical into the stirring tank; Vortex generation gas supply means for injecting inert gas into the inside of the stirring vessel to generate vortices when water and chemical are supplied into the stirring vessel to uniformly mix the supplied water and the chemical; Exhaust means for exhausting the inert gas supplied into the stirring vessel to the outside; A chemical mixed liquid supplying device for a semiconductor wafer etching or cleaning comprising a mixed liquid supplying means for supplying the mixed liquid of the water and chemical uniformly mixed in the stirring tank to an etching or cleaning equipment. The method of claim 1, wherein the chemical supply means, A chemical amount measuring device for measuring an amount of the chemical supplied into the stirring vessel; 3-way connection with the chemical volume meter and the external chemical supply source and the stirring tank, so that the chemical can be supplied from the chemical supply source to the chemical volume meter or the chemical can be supplied from the chemical volume meter to the agitator tank to the opening and closing signal transmitted. A chemical supply unit including a chemical supply valve configured to be selectively opened and closed by a three-way valve; It is connected in three directions with the chemical quantity meter and the external gas supply source and the exhaust port, it is possible to exhaust the gas discharged from the chemical volume meter to the exhaust port or inert gas from the transport gas supply source to the chemical volume meter. A transport gas supply valve comprising a three-way valve configured to be selectively opened and closed by an opening / closing signal to be transmitted. When the chemical quantity meter is filled with a predetermined amount of the chemical, the transport gas pressurizes the chemical into the stirring tank. Chemical mixed liquid supply apparatus for semiconductor wafer etching or cleaning comprising a supply unit The method of claim 2, The chemical amount measuring device is provided with two or more to measure the amount of different types of chemicals, The chemical supply unit includes at least two chemical supply valves respectively connected to the chemical volume meter, The transport gas supply unit comprises two or more transport gas supply valves respectively connected to the chemical volume meter, and can supply two or more types of chemicals in the stirring tank at a predetermined mixing ratio. Chemical mixed liquid supply apparatus for semiconductor wafer etching or cleaning. A method of supplying a chemical liquid mixture for etching or cleaning semiconductor wafers, which mixes water and chemicals for etching and cleaning semiconductor wafers, and supplies them to semiconductor wafer etching or cleaning equipment. A water supply step of supplying and filling a predetermined amount of water into the stirring tank; A chemical supply step of supplying a predetermined amount of chemical to the chemical quantity meter from an external chemical supply source; A chemical transfer step of transferring the chemical gas into the stirring tank by injecting an inert gas into the chemical volume measuring unit after the chemical supplying step; A chemical mixing step of injecting an inert gas into the lower part of the stirring tank after the chemical transfer step to generate a vortex in the water and the chemical supplied into the stirring tank and to uniformly mix it; After the chemical mixing step, the transfer gas supply unit injects an inert gas into the stirring tank, supplying a mixed liquid to pressurized and transport the mixed solution of water and chemical uniformly mixed in the stirring tank to an etching or washing apparatus located outside Method for supplying a chemical mixture for etching or cleaning a semiconductor wafer comprising a step. The method of claim 4, wherein In the chemical supplying step, different kinds of chemicals are supplied to two or more chemical quantity meters from two or more chemical suppliers, respectively. The chemical transfer step is a semiconductor wafer, characterized in that by injecting an inert gas into the two or more chemical volume meter to pressurize and transfer different types of chemicals into a stirring tank to mix different types of chemicals in a predetermined mixing ratio Chemical supply method for etching or cleaning.