KR20020017257A - A device for forming through hole in pcb - Google Patents

Abstract

PURPOSE: A via-hole forming apparatus of a printed circuit board is provided to prevent characteristic variation of an inner pattern and deterioration of product reliability by preventing increase of process steps and manufacture cost due to change of tables and damage to a substrate due to reflected laser beam. CONSTITUTION: A via-hole forming apparatus of a printed circuit board comprises a table(100) and a laser radiating device(130) including a laser emitter(120). The laser emitter(120) is allocated over the table for emitting a YAG laser. A substrate(160) is arranged to form a via-hole(150) by a laser beam(B) radiated from the laser emitter(120). A jig(190) is arranged on the table. The jig(190) has a beam absorbing hole(170). The beam absorbing hole(170) has its diameter four times larger than the via-hole(150) and its depth two times larger than the entire height of the jig(190). The jig(190) is made by compounding glass fiber with epoxy. The substrate(160) is aligned by an alignment pin(200) that is protruded from the jig(190).

Description

Through-hole forming apparatus for printed circuit boards {A DEVICE FOR FORMING THROUGH HOLE IN PCB}

According to the present invention, a jig in which a beam absorption hole is formed on the upper side of a table is installed on the upper side of the table in order to prevent a table from forming when through holes are formed in the multilayer board by laser processing. It relates to a through-hole forming apparatus of a printed circuit board.

Conventionally known conventional printed circuit board through-hole forming apparatus as shown in Figure 1, the laser emitter 20 to emit a yag (YAG) laser on the upper side of the table 10 is installed below the laser processing machine 50 When the multi-layer substrate 30 is placed on the table 10, the laser beam B is transmitted to form the through hole 40 in the substrate 30.

However, the through-hole forming apparatus of the printed circuit board as described above not only forms the through-hole 40 in the substrate 30 but also penetrates the table 10 itself, thereby frequently replacing the table 10. And increase the production cost, damage the periphery of the lower end of the through-hole 40 by the laser beam (B) reflected by the table 10, resulting in a characteristic variation in the internal pattern, which impairs the reliability of the product There was.

The present invention is to improve the conventional problems as described above, the object is to install a jig in which the beam absorption hole is formed on the upper side of the table to prevent damage to the table by increasing the process and production cost of the table replacement It is to provide a through-hole forming apparatus of a printed circuit board to prevent the rise, to prevent the damage of the substrate by the reflected laser beam, and to prevent the characteristic pattern in the internal pattern to reduce the reliability of the product.

1 is a schematic view showing a through-hole formation state of a conventional printed circuit multilayer board

Figure 2 is a schematic diagram showing a through-hole forming apparatus of a printed circuit board according to the present invention

Figure 3 is an enlarged view of the main portion of the through-hole forming apparatus according to the present invention

Explanation of symbols on the main parts of the drawings

100 ... table 120 ... laser emitter

150 ... through hole 160 ... substrate

170.Beam absorption hole 190 ... Jig

As a technical configuration for achieving the above object, the present invention, a laser emitter is installed so as to be spaced apart from the table installed in the lower portion of the main body portion to discharge the yagra laser in the vertical direction, the beam absorption hole in the upper side of the table By providing a printed circuit board through-hole forming apparatus consisting of a configuration in which the jig to be formed is provided.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a schematic diagram showing a through-hole forming apparatus of a printed circuit board according to the present invention, Figure 3 is an enlarged view of the main portion of the through-hole forming apparatus according to the present invention, the present invention, the vertical direction spaced apart from the table 100 The laser irradiation device 130 is installed on the laser emitter 120 is installed so as to discharge the yagra laser.

The substrate 160 is formed to form the through hole 150 as the laser beam B irradiated from the laser emitter 120 to the upper side of the table 100.

At this time, the jig 190 in which the beam absorbing hole 170 is formed is installed on the upper side of the substrate 160, the beam absorbing hole 170 is formed to have a clearance of four times the diameter of the through-hole 150. It is formed to have a depth of twice the overall height of the jig 190.

In addition, the jig 190 is made of a configuration in which the epoxy is bonded to the glass fiber.

Reference numeral 200 denotes a positioning pin.

Referring to the operation of the present invention made of such a configuration as follows.

As shown in Figs. 2 and 3, the jig 190 in which the positioning pin 200 is installed is mounted on the upper side of the table 100 while the jig 190 is mounted.

When the substrate 160 is mounted inside the positioning pin 200 protruding above the jig 190, the center of the through hole 150 and the beam absorbing hole 170 are drilled to the substrate 160. Is matched.

In addition, when the laser emitter 120 is operated while the substrate 160 is mounted on the jig 190, the yaw laser is emitted to form the through hole 150 at a predetermined position of the substrate 160.

Subsequently, when the laser beam is irradiated through the laser emitter 120 through a trypan method for a predetermined time, a through hole 150 is formed. At this time, the laser beam traveling while passing through the through hole 150 is jig ( By minimizing the reflection by the beam absorbing hole 170 formed in the 190 to prevent damage to the substrate 160.

In addition, the diameter of the beam absorption hole 170 is formed to have a size four times larger than the diameter of the through-hole 150 to easily absorb the reflected beam.

In addition, the jig 190 is formed to have a depth of 1/2 times the height of the jig 190 to minimize reflection by the laser beam and to facilitate reflection and absorption of the beam.

As described above, according to the through-hole forming apparatus of the printed circuit board, the jig in which the beam absorbing hole is formed is installed on the upper side of the table to prevent damage to the table, thereby increasing the process and production cost according to the replacement of the table. There is an excellent effect, such as to prevent the rise, to prevent damage to the substrate by the reflected laser beam, to prevent variations in the internal pattern to reduce the reliability of the product.

Claims (3)

A laser irradiation device 130 in which a laser emitter 120 is installed at an upper side thereof in a vertical direction so as to form a through hole 150 in the substrate 160 mounted on the table 100, The through-hole forming apparatus of the printed circuit board, characterized in that it comprises a jig 190 is fixed to support the substrate 160 on the upper side of the table 100, the beam absorption hole 170 is formed integrally. The method of claim 1, wherein the beam absorbing hole 170 is formed so as to have a diameter four times larger than the diameter of the through-hole 150 while being formed so as to coincide with the center point in the vertical direction of the through-hole 150. Through-hole forming apparatus of a printed circuit board The apparatus of claim 1, wherein the jig 190 is formed by incorporating epoxy into glass fibers.