KR20020011817A - Test handler for testing semiconductor device - Google Patents

Abstract

PURPOSE: A semiconductor device test handler is provided to minimize the temperature nonuniformity within a test chamber by forcedly convecting gas locally heated by a heater unit, thereby preventing the fail of semiconductor devices. CONSTITUTION: A tray in which semiconductor device to be tested are seated is loaded in a semiconductor device loader, A semiconductor device handler unit feeds the semiconductor devices to designated places. A temperature measuring unit measures the temperature within a test chamber(352). In the test chamber(352), a gas heating unit(410), a convecting unit(420) for convecting gas heated by the gas heating unit(410) within the test chamber, and a controller comparing the measured temperature and a preset temperature to control the temperature measuring unit and the gas heating unit.

Description

Test handler for testing semiconductor device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device test handler. In particular, a test of a semiconductor device is performed at a predetermined temperature by precisely adjusting a temperature of a semiconductor device to be tested in a test handler in a short time and correcting a locally different temperature deviation in a short time. And to a semiconductor device test handler.

In general, semiconductor devices collectively refer to products that store massive data in a very small area and process massive data in a short time by using characteristics of the semiconductor.

The process of manufacturing such a semiconductor device is a process of manufacturing a semiconductor chip in which a semiconductor device performs a function of storing or processing data by forming a plurality of semiconductor thin films to form an integrated circuit on a pure silicon substrate, and a semiconductor. The packaging process allows the chip to be connected to various devices to perform signal input and output, and the test process to test whether the packaged semiconductor device operates normally in various environments.

In this case, the test process is a very important process for determining whether the semiconductor device operates normally in a very poor environment, for example, an artificial high temperature environment, and a condition that a test facility for performing such a test process should have is applied to the semiconductor device. Losing temperature should be minimized as well as reaching the specified temperature in the shortest time.

Recently, in order to satisfy the conditions of the test equipment, a concept of controlling the temperature inside the test equipment by controlling the power applied to the built-in electric heater that generates heat by electric energy in the test equipment has been introduced. have.

However, when the temperature inside the test facility is controlled by an electric heater, the temperature gradient according to the characteristics of the test facility, that is, the central part of the test facility is active naturally, and the natural side convection is active on the side wall of the test facility. The heat dissipation in the central portion of the test fixture is small, whereas the heat loss is generated in the sidewall of the test fixture, resulting in a temperature gradient between the center portion of the test fixture and the sidewall of the test fixture. In other words, this means that the test equipment locally causes a large temperature difference, for example, between the central part of the test equipment and the side wall of the test equipment.

Accordingly, the present invention has been made in view of such a conventional problem, and an object of the present invention is to minimize the local temperature gradient inside the test facility.

In addition, another object of the present invention is to minimize the time to reach the specified temperature while minimizing the temperature gradient of the test fixture.

Another object of the present invention will become more apparent from the detailed description of the present invention to be described later in detail.

1 is a conceptual diagram of a semiconductor device test handler according to the present invention;

2 is a conceptual diagram for explaining a first embodiment according to the present invention;

3 is a conceptual diagram for explaining a second embodiment according to the present invention;

4 is a conceptual diagram for explaining a third embodiment according to the present invention;

5 is a conceptual diagram for explaining a fourth embodiment according to the present invention;

Figure 6 is a block diagram of a convection type temperature control system according to the present invention.

The semiconductor device test handler according to the present invention for achieving the object of the present invention comprises a semiconductor device loader loaded with a tray containing the semiconductor device to be tested, a semiconductor device handler unit for transferring the semiconductor device to a designated position, and a semiconductor And a test facility having a test chamber for testing the semiconductor device transferred by the device handler unit, comprising: temperature measuring means for measuring a temperature inside the test chamber, gas heating means having a predetermined amount of heat in the test chamber, and gas heating means Convection means for convection the gas heated by the inside of the test chamber, and a control means for controlling the temperature measuring means and the gas heating means by comparing the temperature inside the test chamber measured by the temperature measuring means with the set test chamber temperature. do.

Hereinafter, a semiconductor device test handler according to the present invention will be described with reference to the accompanying drawings.

1, a semiconductor device test handler 500 is shown. The semiconductor device test handler 500 generally includes the semiconductor device loader 100, the semiconductor device handler unit 200, the test facility 300, and the present device. Convection type temperature control system 400, which is a key part of the invention.

In the semiconductor device loader 100, after a previous process, for example, a process of manufacturing a semiconductor chip and a package process of packaging a manufactured semiconductor chip is completed, the semiconductor device to be tested is stored in a tray and waiting for a process. In general, a plurality of trays are stacked and stored in a unit.

After the semiconductor device is stored in the semiconductor device loader 100, or the semiconductor device accommodated in the tray is transferred to the test facility 300 by the semiconductor device handler unit 200, a test is performed.

In this case, the test facility 300 includes a test chamber that provides a space for testing a semiconductor device and a test unit 350 that performs a test.

Meanwhile, a convection type temperature control system 400 is installed in the test facility 300 to allow the test unit 350 to test a semiconductor device in a designated test environment.

Hereinafter, a specific embodiment of the convection type temperature control system 400 will be described with reference to <Example 1> to <Example 4>.

<Example 1>

2, 3, and 6, one embodiment of a test installation 350 to which the convection type temperature control system 400 according to the present invention is applied is conceptually illustrated.

The test facility 350 shown in FIGS. 2, 3, and 6 is configured to move the tray in a horizontal state from the semiconductor device loader 100 so that the semiconductor device handler unit 200 is in a vertical state so that the semiconductor device does not fall to the outside. Thereafter, all semiconductor devices loaded into the test chamber 352 and stored in the tray can be tested simultaneously.

As described above, in order to simultaneously test a plurality of semiconductor devices in a state in which a plurality of semiconductor devices are simultaneously loaded in the test facility 350, the temperature inside the test facility 350 must have a temperature suitable for the test in a uniform and short time.

In order to implement this, the convection type temperature control system 400 is installed in the test facility 350.

The convection type temperature control system 400 according to the <first embodiment> is installed in the test chamber 352 as shown in FIGS. 2 and 6 to have a heater unit 410 having a predetermined amount of heat per hour, The convection unit 420 installed above the heater unit 410 to convection the air heated by the heater unit 410, the temperature sensor 430 and the heater unit 410 installed inside the test chamber 352. And a controller 440 for controlling the convection unit 420 in combination.

More specifically, the heater unit 410 may use a heating method in which the amount of heat is controlled by electric energy, and the convection unit 420 may be a convection fan having a plurality of rotor blades 422 in a cylindrical shape.

That is, the convection unit 420 forces convection of the gas heated locally around the heater unit 410 in the test chamber 352, and at the same time, the temperature inside the test chamber 352 reaches a predetermined temperature within a short time. The feedback control is preferably performed so that the inside of the test chamber 352 has a uniform temperature distribution in a short time.

In FIG. 3, a <Second Embodiment> different from the <First Embodiment> is shown.

Second Embodiment

The first embodiment has a particularly useful effect when the internal area of the test chamber 352 is relatively small, but the heater unit 410 of the test chamber 352 increases when the internal area of the test chamber 352 increases. ) And a temperature difference between a part far from the heater unit 410 occurs.

That is, as the internal area of the test chamber 352 increases as described above, a temperature deviation occurs. The heat loss of the center portion of the test chamber 352 is small and the heat loss of the side wall portion of the test chamber 352 is large. This is because the temperature of the side wall portion of the chamber 352 is relatively low.

In order to overcome such a problem, the second embodiment divides the heater unit 410 into a plurality of parts 411, 412, and 413 so that the temperature distribution of the test chamber 352 is uneven, for example, of the test chamber 352. By arranging a part of the sidewall portion, it is possible to correct the temperature deviation in the place where the temperature variation is severe in the test chamber 352 to be minimum.

In the present invention, the heater unit 410 is divided into three as a preferred embodiment.

At this time, at least two or more temperature sensors 433 and 434 may be mounted in the test chamber 352 to minimize the temperature sensing deviation inside the test chamber 352.

<Example 3>

Although the above-described <Example 1> and <Example 2> transfer the trays to the test facility 350 in a state where a plurality of semiconductor devices are stored in the trays, the plurality of semiconductor devices are simultaneously tested. As shown in FIGS. 4 and 5, in some test facilities 350, semiconductor devices may be unloaded one by one from a tray and individually tested.

In this case, the semiconductor devices individually input to the test facility 350 must be heated to a temperature suitable for the test individually.

In order to implement this, the convection type temperature control system 400 is installed in the test chamber 352 of the test facility 350 shown in FIG. 4.

Convection type temperature control system 400 shown in FIG. 4 is composed of convection duct 460, convection unit 470, heater unit 480, and temperature sensor 490 having an overall “L” shape.

More specifically, inside the upper end of the convection duct 460, a convection unit 470 that sucks gas having a predetermined temperature from the outside of the opening of the convection duct 460 and blows the gas in the lower direction of the convection duct 460 is provided. The heater unit 480 having a predetermined amount of heat generated per hour is built in the convection duct 460 corresponding to the lower portion of the convection unit 470.

On the other hand, the gas heated to a predetermined temperature while passing through the heater unit 480 is discharged through the gas discharge port 465 formed in the convection duct 460.

In this case, a test pad 454 is formed at a position close to the gas outlet 465, and a temperature sensor 490 is installed between the test pads 454.

At this time, the temperature of the gas discharged to the test pad 454 through the gas outlet 465 is varied according to the exothermic temperature generated by the heater unit 480 and the blowing speed of the convection unit 470, the gas outlet 465 The high and low temperature of the gas discharged through the air is controlled by controlling the temperature of the heater unit 480 and the blowing speed of the convection unit 470 by a control signal generated from the controller.

<Example 4>

<Embodiment 4> divides the heater unit 480 which is essential for controlling the temperature of the gas provided to the semiconductor device by the Embodiment 3 into 481,482,483, for example, the convection duct which has a large heat loss ( The heater unit 480 divided in the side wall portion of the 460 is concentrated so as to overcome the temperature irregularity caused by various causes.

As described in detail above, in order to adjust the temperature inside the test chamber to a preset temperature, the test is performed by convection of a gas heated locally around the heater unit in the test chamber, instead of simply installing a heater unit inside the test chamber. The temperature unevenness within the chamber is minimized, and the temperature inside the test chamber can reach a predetermined temperature within a short time, thereby preventing a defect caused by a poor test temperature setting while the semiconductor device is being tested.

Claims (3)

A semiconductor device loader loaded with a tray containing the semiconductor device to be tested; A semiconductor device handler unit for transferring the semiconductor device to a designated position; A test fixture having a test chamber for testing the semiconductor device transferred by the semiconductor device handler unit, Temperature measuring means for measuring a temperature inside the test chamber; The test chamber includes gas heating means having a predetermined amount of heat; Convection means for convection the gas heated by said gas heating means within said test chamber; And control means for controlling the temperature measuring means and the gas heating means by comparing the temperature inside the test chamber measured by the temperature measuring means with a set test chamber temperature. The semiconductor device test handler according to claim 1, wherein the convection means is a convection fan having a plurality of rotary blades in a cylindrical shape, and the gas heating means is a heater unit in which the amount of heat is controlled by electrical energy. 3. The semiconductor device test handler of claim 2, wherein the heater unit is divided into at least one or more, and some of the divided heater units are installed in close proximity to sidewalls of a test chamber in which heat loss occurs. .