KR200175410Y1 - Removal system of photo resist - Google Patents

Abstract

The present invention relates to a process solution dispensing apparatus capable of dispensing a uniform amount of process solution and preventing the leakage of constant temperature water and process solution, the tube of the arm portion for discharging the process solution on the surface of the rotating wafer Process nozzle can be uniformly applied by installing nozzle mounting part that can be equipped with nozzle at the tip, and water jacket part is equipped with swage locknut, which is a sealing means, between the water jacket, which is a member, and the process solution tube. Leakage of the solution was prevented. In addition, by configuring the valve assembly as a single valve to configure the diameter of the inlet of the valve smaller than the diameter of the outlet was configured to supply the process solution flowing at high speed to the tube of the jacket portion.

Description

Process solution discharge device

The present invention relates to a process solution discharging device consisting of an arm portion, a water jacket portion, and a valve assembly.

In the semiconductor manufacturing process, various process solutions, for example, a device for discharging photoresist onto a wafer surface, are largely composed of an arm, a water jacket, and a valve assembnly. .

The arm portion is a portion for discharging the photoresist on the rotating wafer surface. The water jacket part includes a water jacket and a tube, and constant temperature water is supplied to the water jacket to maintain the photoresist at an appropriate temperature. The water jacket portion and the arm portion are connected by a tube, and the photoresist supplied to the arm portion through the tube maintains a proper temperature by the constant temperature water supplied to the water jacket. The valve assembly is a part for controlling the supply of the photoresist and is connected to an external photoresist storage tank. The photoresist passing through the valve assembly is supplied to the arm portion through the tube.

Details of the photoresist ejection apparatus and problems that occur are as follows.

The arm portion is generally made of 1/4 inch Teflon tube, and its tip is not equipped with a nozzle for discharging the photoresist. Therefore, it is impossible to adjust the discharge amount of the photoresist, and the photoresist easily hardens at the tip of the tube for discharging the photoresist, making it difficult to expect a uniform photoresist coating effect. And it consists of four members and the connection surface of the member is staggered, damaging the water jacket.

The water jacket part comprises a water jacket supplied with constant temperature water and a tube connecting the water jacket and the arm part. Since the tube of the water jacket consists of a 1/4 inch tube (photoresist supply tube) and an external 3/8 inch tube (constant water flow tube) connected to the arm portion, a tube filled with constant temperature water is desired. In the process of rotating to the position a number of problems, that is, overload of the rotary motor occurs. In addition, the tube of the water jacket part usually has three joint parts to facilitate the rotational transfer of the arm part. Therefore, the tube is divided into three parts and interconnected, of course, leakage of constant temperature water and photoresist occurs. In addition, the water jacket to which the constant temperature water is supplied is made of a vinyl material, and thus, the water jacket is corroded by a solvent such as a photoresist and acetone solution passing through the inside thereof, and thus the constant temperature water and the photoresist flow out.

The valve assembly consists of an on / off valve for controlling the supply of the photoresist and a suck valve for forcing the photoresist introduced into the assembly into the tube of the water jacket. Therefore, since two types of valves are used, it is difficult to supply an appropriate amount of photoresist. In particular, when a large amount of bubbles in the photoresist, the amount of photoresist sucked through the suction valve is uneven, so it is difficult to expect a good photoresist coating effect.

Accordingly, the present invention is to solve the above-mentioned problems arising in the conventional process solution (photoresist) discharging apparatus caused by a problem of a plurality of members or materials, to enable a uniform amount of process solution discharge. In addition, an object of the present invention is to provide a process solution discharging device capable of preventing leakage of constant temperature water and process solution.

The present invention for achieving the above object consists of an arm portion for discharging the process solution to the rotating wafer surface consisting of a tube, a water jacket and a tube connected to the arm portion and supplied with constant temperature water supplied to the water jacket A process solution dispensing apparatus comprising a water jacket portion for maintaining a solution at an appropriate temperature, and a valve assembly for supplying a process solution to the tube, wherein the water jacket portion and the arm portion are connected by a tube, wherein the arm portion is provided at the tip of the tube. It is equipped with a nozzle mounting part for mounting a nozzle to uniformly apply the process solution, and the water jacket part is equipped with a sway lock nut as a sealing means between the water jacket and the process solution tube to prevent leakage of process solution. The valve assembly consists of a single valve and the diameter of the inlet port of the valve is greater than that of the outlet port. It is characterized in that it is configured to supply a process solution introduced at a high speed to the tube of the water jacket portion.

1 is a front view of the present invention.

2 is a partial plan view of FIG.

3 is a cross-sectional view of the nozzle mounting portion used in the present invention.

* Explanation of symbols for the main parts of the drawings

10: arm part 20: water jacket part

30: valve assembly

Hereinafter, with reference to the accompanying drawings the present invention will be described in detail.

The process solution (photoresist) ejection apparatus according to the present invention also includes the same constituent members as the general process solution ejection apparatus as described above. That is, the water for maintaining the photoresist at an appropriate temperature by constant temperature water supplied by the arm portion 10 for discharging the photoresist on the rotating wafer surface, the water jacket 21 and the tube 22. A jacket assembly 20 and a valve assembly 30 for controlling the supply of the photoresist. (The specific function is the same as the above, so duplicate description is omitted.)

FIG. 1 is a front view of the present invention, and FIG. 2 is a partial plan view of the present invention. The structural features of the present invention are as follows.

(A) Arm part 10-A nozzle fitting part 12 was attached to the front-end | tip of the tube 11 which comprises the arm part 10, and it was comprised so that the nozzle 13 could be mounted. That is, one end of the nozzle mounting portion 12 as shown in FIG. 3 showing the end of the tube 11 of the arm portion 10 in detail in cross section is mounted to the front end of the tube 11, and the other end of the nozzle 13 is mounted. Therefore, an appropriate amount of photoresist can be applied uniformly.

(B) Water Jacket 20-Tube 22, which is a member constituting the water jacket 20, is corroded by a solvent such as a photoresist and acetone solution passing through the inside by using a tigon tube. Can be prevented. In addition, by installing a swage lock nut as a sealing means between the water jacket 21 and the photoresist flow tube 22, leakage of the photoresist is prevented.

(C) VALVE ASSEMBLY 30-In this embodiment, the diameters of the inlet and outlet of the valve used in the valve assembly 30 are different from each other to allow forced flow of the photoresist due to the flow rate. That is, by configuring the diameter of the inlet (photoresist storage container counterpart) of the valve smaller than the diameter of the outlet, the photoresist flowing at high speed can be effectively supplied to the tube of the water jacket.

The present invention as described above can be expected to enable the uniform spraying of the process solution and to prevent the leakage of the process solution and constant temperature water. In addition, by configuring the valve assembly as a single valve can be easily performed assembly and disassembly can of course improve the work efficiency.

Claims (1)

An arm part for discharging the process solution onto the rotating wafer surface consisting of a tube, and a water jacket and a water jacket part for maintaining the process solution supplied with the constant temperature water supplied to the water jacket at an appropriate temperature. And, the water jacket portion and the arm portion are connected by a tube and have a valve assembly for supplying the process solution to the tube, wherein the arm portion is equipped with a nozzle mounting portion for mounting the nozzle at the tip of the tube. It is possible to apply the process solution uniformly, and the water jacket part is fitted with a swage lock nut as a sealing means between the water jacket and the process solution tube as a constituent member to prevent the leakage of the process solution, the valve assembly is a single valve It is made and the process of flowing in at high speed by making the diameter of the inlet of the valve smaller than the diameter of the outlet Process solution discharge device, characterized in that for supplying a liquid to the water jacket tube portion.