KR200173916Y1 - Heating system using heat pipe - Google Patents

Heating system using heat pipe Download PDF

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Publication number
KR200173916Y1
KR200173916Y1 KR2019970045776U KR19970045776U KR200173916Y1 KR 200173916 Y1 KR200173916 Y1 KR 200173916Y1 KR 2019970045776 U KR2019970045776 U KR 2019970045776U KR 19970045776 U KR19970045776 U KR 19970045776U KR 200173916 Y1 KR200173916 Y1 KR 200173916Y1
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KR
South Korea
Prior art keywords
heat pipe
heat
copper plate
heating device
floor
Prior art date
Application number
KR2019970045776U
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Korean (ko)
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KR19990032972U (en
Inventor
양철훈
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양철훈
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Publication date
Application filed by 양철훈 filed Critical 양철훈
Priority to KR2019970045776U priority Critical patent/KR200173916Y1/en
Publication of KR19990032972U publication Critical patent/KR19990032972U/en
Application granted granted Critical
Publication of KR200173916Y1 publication Critical patent/KR200173916Y1/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D13/00—Electric heating systems
    • F24D13/04—Electric heating systems using electric heating of heat-transfer fluid in separate units of the system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D19/00—Details
    • F24D19/02—Arrangement of mountings or supports for radiators
    • F24D19/0203—Types of supporting means
    • F24D19/0213—Floor mounted supporting means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2200/00—Heat sources or energy sources
    • F24D2200/08—Electric heater
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D2220/00—Components of central heating installations excluding heat sources
    • F24D2220/07—Heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/148—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor with heat spreading plates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/149—Tube-laying devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Central Heating Systems (AREA)
  • Steam Or Hot-Water Central Heating Systems (AREA)

Abstract

종래의 히트파이프를 이용한 난방장치는 방바닥 속에 히트파이프가 묻혀있는 결과가 되어 열전도가 우수한 히트파이프가 지나는 부분만 따뜻할 뿐 히트파이프가 지나가지 않는 곳은 그다지 따뜻하지 않은 폐단을 갖는 것이다.The heating device using a conventional heat pipe is a result of the heat pipe buried in the floor, so that only the portion where the heat pipe with excellent heat conduction passes is warm, but the heat pipe does not pass where the end is not so warm.

본 고안은 동판을 다수개의 요홈이 형성되도록 절곡하고, 상기 요홈에 히트파이프 가열장치에 결합된 히트파이프가 안착되도록 하되, 상기 동판의 저면 요홈의 사이사이에는 단열판이 내장되도록 하므로써 동판의 처짐을 방지하고 동판의 아랫쪽으로 흡수되는 열을 차단되도록 하므로써 가열장치에서 발생한 열이 히트파이프와 동판을 통해 본고안이 내장된 방바닥이나 보료, 침대 등을 데울 수 있도록 하였다.The present invention bends the copper plate so that a plurality of grooves are formed, and the heat pipe coupled to the heat pipe heating device is seated on the grooves, but prevents sagging of the copper plate by allowing a heat insulation plate to be embedded between the bottom grooves of the copper plate. By blocking the heat absorbed to the lower side of the copper plate, the heat generated from the heating device can heat the floor, the material, the bed, etc., in which the main body is built through the heat pipe and the copper plate.

Description

히트파이프를 이용한 난방장치Heating device using heat pipe

본 고안은 히트파이프를 이용한 난방장치에 관한 것으로, 특히 열효율이 높고, 보료나 침대, 방바닥 등에 다양하게 사용할 수 있는 히트파이프를 이용한 난방장치에 관한 것이다.The present invention relates to a heating device using a heat pipe, and more particularly, to a heating device using a heat pipe that has high thermal efficiency and can be used for various purposes such as maintenance, bed, and floor.

히트파이프는 파이프 내에 열전도율이 매우 높은 액상의 열매체를 내장한 것으로써, 매우 열효율이 높고 경제적이므로 이를 이용한 난방장치는 널리 사용되고 있다. 그러나 방바닥이나 벽체에 히트파이프를 깔고 시멘트를 덮어 난방하는 종래의 방법은 시멘트 속에 히트파이프가 묻혀버린 결과가 되어 열전도가 우수한 히트파이프가 지나는 부분만 따뜻할 뿐 히트파이프에서 약간 떨어진 곳은 오히려 단열기능을 하는 시멘트 때문에 열이 전달되지 못해 그다지 따뜻하지 않는 폐단을 갖게되는 것이다.The heat pipe is a liquid medium having a very high thermal conductivity in the pipe, and the heating device using the heat pipe is widely used because it is very thermally efficient and economical. However, the conventional method of heating a heat pipe on a floor or a wall and covering it with cement results in the heat pipe being buried in the cement. Because of cement, heat cannot be transferred, which leads to a waste that is not very warm.

따라서 본 고안은 상기한 바와 같이 히트파이프가 지나는 부분만 따뜻한 종래의 폐단을 해결하기 위하여 동판을 다수개의 요홈이 형성되도록 절곡하고, 상기 요홈에 히트파이프 가열장치에 결합된 히트파이프가 안착되도록 하되, 상기 동판의 저면 요홈의 사이사이에는 단열판이 내장되도록 하므로써 동판의 처짐을 방지하고 동판의 아랫쪽으로 흡수되는 열을 차단되도록 하므로써 동판 상부에 열이 집중될 수 있도록 하였다.Therefore, the present invention is to bend the copper plate so that a plurality of grooves are formed in order to solve the conventional closed end only the portion where the heat pipe passes as described above, the heat pipe coupled to the heat pipe heating apparatus is seated in the groove, The insulation plate is built between the bottom grooves of the copper plate to prevent sagging of the copper plate and to block heat absorbed to the bottom of the copper plate so that heat can be concentrated on the upper plate.

제1도는 본 고안의 분리사시도.1 is an exploded perspective view of the present invention.

제2도는 본 고안 일부분의 종단면도.2 is a longitudinal cross-sectional view of a portion of the present invention.

제3도는 본 고안의 사용상태참고도.3 is a reference state of use of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10 : 히트파이프 가열장치(이하 가열장치라 한다) 20 : 히트파이프10: heat pipe heating device (hereinafter referred to as heating device) 20: heat pipe

30 : 동판 31 : 요홈30: copper plate 31: groove

40 : 단열판 50 : 충진재40: insulation plate 50: filler

본 고안의 구성을 첨부한 도면에 의해 상세히 설명하면 다음과 같다. 제1도는 본 고안의 분리사시도이고, 제2도는 본 고안 일부분의 종단면도이며, 제3도는 본 고안의 사용상태참고도이다.Referring to the configuration of the subject innovation in detail as follows. 1 is an exploded perspective view of the present invention, Figure 2 is a longitudinal cross-sectional view of a portion of the present invention, Figure 3 is a reference state of use of the present invention.

본 고안은 크게 히트파이프(20)와, 상기 히트파이프에 열원을 제공하는 히트파이프 가열장치(10)와, 다수개의 요홈(31)이 형성되도록 절곡한 동판(30)과, 상기 요홈(31)에 히트파이프(20)가 안착되도록 하며 상기 동판(30)의 저면 요홈(31)의 사이사이에는 단열판(40)이 내장되도록 구성된 것으로써, 상기와 같은 구성을 갖는 본 고안을 방바닥이나 보료나 침대등에 내장하여 난방을 할 수 있도록 한 것이다.The present invention is largely a heat pipe 20, a heat pipe heating device 10 for providing a heat source to the heat pipe, a copper plate 30 bent to form a plurality of grooves 31, and the groove 31 The heat pipe 20 is to be seated in the insulating plate 40 between the bottom groove 31 of the copper plate 30 is configured to be built, the present invention having the configuration as described above the floor or a bed or bed It is built in the back to allow heating.

상기 히트파이프(20)는 케이스 내부에 전열선과 히트파이프 내삽관, 분말층 진물등이 내장된 구성의 가열장치(10)에 결합되어 열원을 공급받게 되며, 또한 상기 히트파이프(20)는 다수개의 요홈(31)이 형성된 절곡된 동판(30)의 상기 요홈(31)에 안착되므로써 동판(30)에 열을 전달하게 된다. 따라서 열전도율이 높은 동판(30)은 히트파이프(20)로부터 전달된 열을 다시 방바닥이나 보료 및 침대의 표면에 전달하게 되므로 저전력으로도 매우 효율적인 난방을 할 수 있게 되는 것이다.The heat pipe 20 is coupled to a heating device 10 having a heating wire, a heat pipe interpolation pipe, powder layer dust, and the like inside the case to receive a heat source, and the heat pipe 20 includes a plurality of heat pipes. Since the recess 31 is seated in the recess 31 of the bent copper plate 30 on which the recess 31 is formed, heat is transferred to the copper plate 30. Therefore, the copper plate 30 having a high thermal conductivity transfers the heat transferred from the heat pipe 20 to the surface of the floor or the supplement and the bed, thereby enabling very efficient heating even at low power.

특히 상기 동판(30)은 유해전자파와 수맥을 차단하므로 인체에 유익하며, 동판(30)의 저면 요홈(31)의 사이사이에는 단열판(40)이 내장되도록 구성하므로써 동판의 처짐이나 꺼짐을 방지하면서, 열이 방바닥에 흡수되지 않고 표면만으로 전달하므로써 열효율을 극대화 시킬 수 있는 것이다.In particular, the copper plate 30 is beneficial to the human body because it blocks harmful electromagnetic waves and water vein, while preventing the sag or turn off of the copper plate by the insulation plate 40 is built between the bottom groove 31 of the copper plate 30. Therefore, heat efficiency is maximized by transferring heat to the surface instead of absorbing the floor.

열전도율이 높은 히트파이프와 동판을 이용한 본 고안 난방장치를 방바닥이나 보료, 침대에 내장하므로써 적은 전력으로도 동판이 미치는 부분은 전체적으로 데울 수 있으므로 매우 경제적이며, 특히 동판은 유해전자파와 수맥을 차단하므로써 인체에 유익한 효과를 갖는 것이다.By incorporating the heating device of the present invention using heat pipe and copper plate with high thermal conductivity on the floor, floor, bed and so on, the area covered by copper plate can be warmed with a small amount of electricity, so it is very economical. It will have a beneficial effect on.

Claims (1)

히트파이프를 이용한 난방장치에 있어서 히트파이프(20)와, 상기 히트파이프에 열원을 제공하는 히트파이프 가열장치(10)와, 다수개의 요홈(31)이 형성되도록 절곡한 동판(30)과, 상기 요홈(31)에 히트파이프(20)가 안착되도록 하며 상기 동판(30)의 저면 요홈(31)의 사이사이에는 단열판(40)이 내장되도록 구성함을 특징으로 하는 히트파이프를 이용한 난방장치.In a heating apparatus using a heat pipe, a heat pipe 20, a heat pipe heating device 10 for providing a heat source to the heat pipe, a copper plate 30 bent to form a plurality of grooves 31, and Heat pipe 20 is to be seated in the groove 31 and the heating device using a heat pipe, characterized in that the heat insulating plate 40 is built between the bottom groove 31 of the copper plate 30.
KR2019970045776U 1997-12-31 1997-12-31 Heating system using heat pipe KR200173916Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019970045776U KR200173916Y1 (en) 1997-12-31 1997-12-31 Heating system using heat pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019970045776U KR200173916Y1 (en) 1997-12-31 1997-12-31 Heating system using heat pipe

Publications (2)

Publication Number Publication Date
KR19990032972U KR19990032972U (en) 1999-07-26
KR200173916Y1 true KR200173916Y1 (en) 2000-04-01

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ID=19520851

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019970045776U KR200173916Y1 (en) 1997-12-31 1997-12-31 Heating system using heat pipe

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Publication number Publication date
KR19990032972U (en) 1999-07-26

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