KR20010110973A - Continuous plating method using electric supply rollers each constituted of divided electrodes and apparatus therefor - Google Patents

Abstract

In continuous plating using a feed roller, the adhesion of the plated material to the surface of the feed roller can be efficiently removed, so that a smooth plated surface can be obtained over the plated material over a long period of time.

A feed roller 24 formed by dividing the circumferential surface into a plurality of electrode portions 26 and 27 is disposed in various places in the plating tank 20, and the plated material 21 is continuously used using the feed roller 24. In the plating method while transferring to the surface, the plating operation is performed by one rectifier 29 using two rectifiers 29 and 32 and the surface of the feed roller 24 by the other rectifier 32. A method and apparatus characterized by eluting the extra plating material attached to the. The rectifier 32 for eluting excess plating material may be applied with a pulse voltage. In addition, the negative electrode used to elute the extra plating material shall be isolate | separated by a diaphragm so that a metal ion may not be consumed, or shall be a material which does not consume a metal ion.

Description

Continuous plating method using electric supply rollers each constituted of divided electrodes and apparatus therefor}

The present invention relates to a continuous plating method and apparatus using a feed roller having a split electrode portion.

Conventionally, in order to plate on a plate-shaped plated object, a plurality of plated objects are attached to the frame connected to the cathode one by one as fasteners, immersed in a plating tank, and the plated object is finished after plating. Although they were separated from the frame by piece, this method was a time-consuming work and was one cause of impairing the efficiency of the plating work.

Therefore, in recent years, the work to be fixed to the frame of the plated object is avoided, and the plated material is continuously fed into the plating tank one by one individually, and the plated material is moved horizontally in the plating tank in a vertical state. A method of plating continuously and efficiently has been proposed.

Fig. 6 is a cross-sectional view of the continuous plating apparatus of one example, in which a plate-like plated object 3, such as a printed board, is placed on a rail 2 extending perpendicular to the ground, near the center bottom portion of the plating tank 1; To the vertical position, the lower end of the feed object (3) is sandwiched by the feed roller (5) fixedly attached to the rotating cathode rod (4) in the longitudinal direction, and the feed roller (5) By rotation, the inside of the plating tank 1 is moved horizontally along the rail 2 in the state which immersed the to-be-plated object 3 in the plating liquid 6. In the plating liquid 6, an anode 8 which can move up and down by the cylinder 7 and a shielding plate 9 covering the disturbance of the current are provided.

The wheel 10 is attached to the appropriate portion of the rotary cathode rod 4, and the pressing body 12 pressed by the spring 11 is brought into contact with the wheel 10. The pressing force of the spring 11 is transmitted from the wheel 10 to the feed roller 5 through the rotary cathode rod 4, to ensure the contact between the feed roller 5 and the plated object 3, The current flow to the surface of the plated material 3 is made uniform.

As a result, the surface of the plated object 3 is pressurized from the rotary cathode rod 4 to the negative potential through the feed roller 5, and a current flows between the anode 8 so that plating is continuously performed. .

The peripheral surface of the feed roller 5 that is in contact with the plated object 3 forms a protective film made of titanium nitride on the target coating film, for example, a harder coating material, for example, a nickel plated film. The brush 14 is pressed against the circumferential surface of the feed roller 5 by the spring 13 to remove the plating adhering formed on the circumferential surface of the feed roller 5.

However, it is difficult to remove the plated deposits on the entire surface of the feed roller 5 with the brush 14 alone, and the feed rollers 5 are roughly damaged due to the deposited plated deposits, resulting in a short service life, and thus the plated material 3 There was a problem that current did not flow evenly and uniform plating could not be performed.

Thus, first, the feed rollers are divided into a plurality of sections in the circumferential direction with an electric insulator, and each section is electrically connected with the feed section on the top of the feed rollers and each section so as to energize by applying a negative potential to the sections when the sections contact the plated object. A method of plating was conducted by successively passing through. At this time, in the division which does not come into contact with the plated object, a method of eluting and removing the plated portion that is extraly attached to the portion by pressing the positive potential has been developed.

It is an object of the present invention to further develop the above development method and to efficiently remove the adhesion of the plated material to the feed roller surface, thereby obtaining a smooth plated surface for the plated object over a long period of time.

1 is a plan view illustrating an embodiment of the present invention;

2 is a perspective view of an embodiment of a feed roller used in the present invention;

3 shows the shape of the feed terminal for the power supply plate, (a) is an example of a narrow width of the negative feed terminal, (b) is a diagram showing a case where the width of the negative feed terminal is similarly wide,

4 is an explanatory diagram of a peeling cathode;

5 is a perspective view for explaining the concept of the arrangement of the apparatus of the present invention;

6 is an explanatory view of the prior art.

<Explanation of symbols for the main parts of the drawings>

20: plating tank 21: plated object

22, 23: liquid-tight slit 24: feed roller

25: electric insulator 26, 27: division

28: anode 29, 32: rectifier

30 cathode 31: diaphragm

32a: rotating cathode rod 33: bevel gear

34: rotating drive shaft 35: bevel gear

36: power supply plate 37: insulator

38: Feeding terminal

This invention consists of the following structures.

(1) A feeding roller formed by dividing a circumferential surface into a plurality of electrode portions is placed in various places in a plating tank, and the plating roller is used to transfer the plated material continuously by using the feeding roller. One rectifier is used to apply a voltage between the negative electrode portion in contact with the plated object of the feed roller and the anode disposed in the plating tank opposite thereto, and the plated object of the feed roller is applied by the other rectifier. 12. A continuous plating method using a feed roller having a splitting electrode portion, which is plated by applying a voltage between an anode portion which is not in contact with the cathode portion and an anode which is formed so as not to consume metal ions in the plating tank.

(2) A feeding roller formed by dividing a circumferential surface into a plurality of electrode portions in various places in a plating tank, and using the feeding roller to plate while continuously transferring a plated object, the split electrode of the feeding roller. A negative electrode is formed to be in contact with the plated object, and a cathode is formed to be separated from the plated object. An anode facing the negative electrode of the feed roller and a cathode facing the anode of the feed roller are arranged in the plating tank. The cathode facing the anode of the feed roller is formed so as not to consume metal ions, and also has two rectifiers, one rectifier to apply a voltage between the feed roller and the cathode and the anode opposite thereto, and the other The rectifier of the side divides the electrode portion, characterized in that to apply a voltage between the anode of the feed roller and the cathode opposite thereto Continuous plating apparatus using a feed roller with.

(3) In the above (1) or (2), the voltage applied between the anode of the feed roller and the cathode opposite thereto is a pulse.

That is, the present invention utilizes two rectifiers, between the rotating roller section in contact with the plated object and the anode, and between the rotating roller section not in contact with the plated object and the cathode formed so as not to pass the metal ion. In the former, plating is performed on the plated object in the former, and in the latter, the plating attached to the surface of the rotating roller is eluted, and the surface of the clean rotating roller always comes into contact with the plated object, thereby smoothly plating for a long time. A surface can be obtained. In the latter case, a pulse voltage may be used instead of DC. The application of the pulse voltage has a portion where the plating is partially thickened by a strong current in the cathode roller portion, and the portion can be peeled evenly like other portions.

At this time, the negative electrode on the peeling side may be separated from the electrolyte in the plating tank by a cylindrical body of a diaphragm or an initial baking that does not allow metal ions to pass therethrough. The cathode may be a material which does not dissolve in dilute sulfuric acid solution such as stainless steel plate, nickel plate, or copper plate. The use of a diaphragm or the like is because the metal ions do not pass through, and therefore, since unnecessary salts such as copper sulfate ions do not precipitate on the cathode, the negative electrode plate can be used as a semi-permanent plate. In addition, a dilute sulfuric acid solution is charged around the cathode inside the diaphragm to secure the energization, thereby eliminating unnecessary copper sulfate ions. If a ceramic electrode, a ferrite electrode, or the like is used, there is no need for a diaphragm because no metal ions are consumed.

Embodiment

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

1 is a plan view for explaining the outline of the present invention. In the figure, reference numeral 20 denotes a plating tank, in which a plated object 21 is fed into the tank through the liquid-tight slit 22 formed on the tank wall, and is sent out of the tank from the liquid-tight slit 23 formed on the tank wall on the opposite side. . The plated object 21 is sent to the rotating roller in the plating tank 20. Rotating rollers are installed in the proper number on both sides of the plated object 21 in the tank, it is possible to install a mixture of the rotary roller and the feeder roller 24 serving as an electrode for the appropriate mixing. In FIG. 1, only the feeding roller 24 which also served as the electrode is shown for convenience. The feed roller 24 has the electrical insulator 25 described later, but is divided into four in the axial direction, for example, and is divided into the division section 26 coming into contact with the plated object 21 by rotation. Is applied, and a positive voltage is applied to the section separated from the plated object 21. Reference numeral 28 denotes a positive electrode in which the negative voltage is applied in the feed roller 24, and a current flows between the divisions 26, which become negative electrodes, and chemical plating is performed on the surface of the plated object 21 in contact with the negative electrode. Conduct. The application of this voltage is performed by the rectifier 29.

On the other hand, a positive voltage is applied to the divided section 27 coming to the position away from the plated object 21 by the rotation of the feed roller 24, and the cathode 30 as the counter electrode is surrounded by the diaphragm 31, Do not allow metal ions to pass through. A pulse voltage is applied by the rectifier 32 between the division section 27 as the anode and the cathode 30. As a result, the extra plating adhering to the surface of the division 27 is eluted. Further, since the metal ions do not touch the cathode 30, there is no contamination damage on the surface of the cathode.

By doing in this way, plating is carried out continuously to the to-be-plated object 21 which moves continuously in the plating tank 20, and the surface of the feed roller 24 is maintained uniformly.

In addition, although the anode 28 and the cathode 30 are shown in parallel in FIG. 1, they may be alternately arranged in a straight line, and may divide into each other by the partition plate.

2 shows an example of the feed roller 24. The bevel gear 33 is attached to the upper end of the longitudinal rotating cathode rod 32a, and is engaged with the bevel gear 35 attached to the rotating drive shaft 34 to rotate the rotating cathode rod 32a. .

The feed rollers 24 and 24 are attached to the part which enters into the plating tank 20 under the rotary cathode rod 32a at intervals. And immediately below the bevel gear 33 of the rotating cathode rod 32a, the power supply plate 36 corresponding to the number of the feeding rollers 24 is provided. In this example, two feed rollers 24 are attached to the upper and lower sides, and each of them is disposed so as to be located near the upper and lower ends of the plated object 21. Since the to-be-plated object 21 has various heights, the upper feed roller 24 may be made to be able to slide up and down. There may be only one feed roller 24 at the lower end. Alternatively, three or more feed rollers 24 may be attached to one rotary cathode rod 32a by being attached to an intermediate portion.

The power supply plate 36 and the power feeding roller 24 each have an insulator 37 and are divided in four in the axial direction. The divided sections of the power supply plate 36 and the power feeding roller 24 are electrically connected to each other via a conductive portion inside the rotary cathode rod 32a. The conductive part inside the rotating cathode rod 32a may be a type in which the conductor is divided in the axial direction, or may be a type in which the conductor is connected by a conductive line. In either case, the division 26 'of the power supply plate 36 and the division roller 26 of the feed roller 24, the division division 27' of the power supply plate 36 and the division roller of the feed roller 24 are either. 27 is electrically connected.

As shown in Fig. 3, the power supply plate 36 is fed by contacting the feed terminals 38 (minus) and 39 (plus), but as shown in Fig. 3A, the negative feed terminal 38 is supplied. If the width of N) is narrow, the supply of current is first cut when coinciding with the insulator 37 portion of the power supply plate 36, and gold enters the plating layer. Since there is a possibility that the appearance is slightly inferior even if there is no problem in terms of quality, the power feeding terminal 38 is widened as shown in FIG. 3 (b), and the power is fed over two adjacent divisions. As a result, the current does not break in the middle, and a beautiful plating surface can be obtained.

4 is an explanatory diagram around the cathode 30, in which the cathode 30 is isolated and immersed in a plating solution, for example, copper sulfate solution, by a diaphragm 31. The diaphragm 31 does not allow metal ions to pass and does not allow copper ions in the plating liquid to pass therethrough. The electricity around the inside of the diaphragm of the cathode 30 is secured by dilute sulfuric acid. Therefore, since the metal ion does not exist around the cathode 30, the cathode is not contaminated and damaged. As the material of the negative electrode 30, any metal that does not dissolve in acids such as stainless steel, copper, titanium, and ferrite can be used. The diaphragm 31 may be a super ball. If the diaphragm is not used, since the copper ions in the plating liquid are precipitated in addition to the copper ions separated from the feed roller on the cathode, the cathode becomes thick and consumes unnecessary copper ions. In addition, the weight of the negative electrode becomes heavy, and there is a fear that the hanger for the negative electrode cannot support and collapse.

Fig. 5 is a perspective view conceptually showing the arrangement relationship of each member in the above embodiment. Black arrows indicate the flow of plating fractionation, and white arrows indicate the flow of peeling current.

In the above embodiment, an example in which the feed roller 24 is divided into four is shown, but there may be a state such as two divisions, three divisions, five divisions, six divisions, and the like.

In the present invention, two rectifiers are used, one of which is used as a voltage load for the plating operation, the other is used as a voltage load for removing the extra plating film adhering to the surface of the feed roller, While the continuous plating is applied, the extra plating film is prevented from adhering to the feed roller, and the roughness of the plating surface on the plated material caused by the extra plating film is prevented to form a smooth plating surface over a long period of time. It becomes possible.

In addition, since the negative electrode for exfoliation of the plating is not isolated by the diaphragm or selects the electrode material so as not to consume the metal ions, the damage caused by the adhesion of the metal ions is eliminated, and it is not damaged or consumed over a long period of time. It can be used efficiently.

In addition, when a pulse voltage is applied to the rectifier used for removing the extra plated film, the extra plated film can be removed more efficiently.

Claims (4)

In a method in which a feed roller formed by dividing a circumferential surface into a plurality of electrode portions is placed in various places in a plating tank, and the plated material is plated while the plated material is continuously transferred using this feed roller, one of the two rectifiers is used. Voltage is applied between the negative electrode portion of the feed roller, which is in contact with the plated object of the feed roller, and the anode disposed in the plating tank opposite thereto, and the other rectifier does not touch the plated object of the feed roller. A plating method using a feed roller having a splitting electrode portion, characterized in that the plating is applied by applying a voltage between the anode portion and the cathode opposed to the cathode formed so as not to consume metal ions in the plating tank. In a device in which a feed roller formed by dividing a circumferential surface into a plurality of electrode portions is placed in various places in a plating tank, and the plated material is plated while the plated material is continuously transferred using the feed roller, the divided electrode of the feed roller It is configured to be a negative electrode when contacted with a forbidden object, and to be an anode when separated from a plated object. In the plating tank, an anode facing the negative electrode of the feed roller and a cathode facing the anode of the feed roller are arranged. The cathode facing the anode of is formed so as not to consume metal ions, and also has two rectifiers, and one rectifier is configured to apply a voltage between the cathode of the feed roller and the anode opposite thereto, and the other rectifier. The split electrode portion is characterized in that a voltage is applied between the anode of the feed roller and the cathode opposite thereto. Continuous plating apparatus using a binary feed roller. The continuous plating method according to claim 1, wherein the voltage applied between the anode of the feed roller and the cathode opposite thereto is a pulse. The continuous plating apparatus according to claim 2, wherein the voltage applied between the anode of the feed roller and the cathode opposite thereto is a pulse.