KR20010107277A - Grinding pad with groove - Google Patents
Grinding pad with groove Download PDFInfo
- Publication number
- KR20010107277A KR20010107277A KR1020000028663A KR20000028663A KR20010107277A KR 20010107277 A KR20010107277 A KR 20010107277A KR 1020000028663 A KR1020000028663 A KR 1020000028663A KR 20000028663 A KR20000028663 A KR 20000028663A KR 20010107277 A KR20010107277 A KR 20010107277A
- Authority
- KR
- South Korea
- Prior art keywords
- polishing
- pad
- polishing pad
- grooves
- groove
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Abstract
본 발명은 반도체 웨이퍼나 브라운관 표면 등 극히 정밀한 연마가 필요한 가공에 사용되는 연마패드에 관한 것으로, 특히 연마유공급용 요홈을 슬러지 발생을 억제되게하여 더욱 정밀한 연마가 가능하게 한 연마패드에 관한 것으로,BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad used for a process requiring extremely precise polishing, such as a surface of a semiconductor wafer or a cathode ray tube, and more particularly, to a polishing pad which enables more precise polishing by suppressing sludge generation in a groove for supplying abrasive oil.
부직포에 폴리우레탄이 함침되어 경화 형성된 연마용 패드에 있어서, 그 패드의 밑면에 일정간격과 깊이의 슬러지 요홈을 반복 형성한 것이다.In a polishing pad formed by curing impregnated polyurethane with a nonwoven fabric, sludge grooves having a predetermined interval and depth are repeatedly formed on the bottom surface of the pad.
Description
본 발명은 반도체 웨이퍼나 브라운관 표면 등 극히 정밀한 연마가 필요한 가공에 사용되는 연마패드에 관한 것으로, 특히 요홈을 형성하여 연마유가 잘 순환되게 하여 더욱 정밀한 연마가 가능하게 한 연마패드에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a polishing pad used for a process requiring extremely precise polishing, such as a surface of a semiconductor wafer or a cathode ray tube, and more particularly, to a polishing pad which forms grooves to allow the polishing oil to circulate well, thereby enabling more accurate polishing.
연마패드는 단섬유에 의한 부직포상의 섬유를 폴리우레탄으로 된 탄성체 용액에 함침시켜 숙성시킨 후 이를 다시 적층하여 접착시킨 상태에서 숙성 건조된 판체를 절단 사용하는 것이다.The polishing pad impregnates the nonwoven fabric of short fibers by impregnating the elastic solution of polyurethane, and then aged and cut and used the aged dried plate body in the state of being laminated and bonded again.
이렇게 절단된 패드는 도 4 의 도시와 같이 디스크의 밑판에 부착한 랩으로 만들어 연마면에 대고 연마유를 공급하면서 회전시켜 피연마물을 연마가공하는 것이다.The pad thus cut is made of a wrap attached to the bottom plate of the disk as shown in FIG. 4 to rotate while supplying abrasive oil to the polishing surface to polish the polished object.
그러나 전기한 연마패드는 평판으로 밀착될 경우 연마유의 공급이 원활치 못하고, 연마조건상 재질이 비교적 경도가 약한 섬유 및 폴리우레탄 등으로 형성되어 있어 연마중에 슬러지가 많이 발생하는 특성이 있다.However, the above-described polishing pads are not smoothly supplied with the polishing oil when they are in close contact with the flat plate, and due to the polishing conditions, the material is formed of fibers and polyurethanes having relatively low hardness, so that sludge is generated during polishing.
그러므로 그 슬러지가 피연마물과 연마패드의 사이에서 뭉쳐 이동되게 되면 이것이 저항체로 작용하여 정밀해야 될 연마면에 흠집발생의 요인이 되고, 마찰열을 더욱 상승시키는 문제가 있다.Therefore, when the sludge is agglomerated and moved between the polishing object and the polishing pad, this acts as a resistor and causes scratches on the polished surface to be precise, thereby increasing the friction heat.
본 발명은 연마용 패드에 있어서, 전기한 문제점을 제거코저 패드면에 서로 연통된 요홈을 형성하여 연마중 연마유를 원활하게 공급하여 슬러지 발생을 최대한 억제할 뿐 아니라, 발생된 슬러지도 그 홈으로 배출되게 하여 저항요소를 없애서 정밀한 연마가 가능한 연마패드를 제공함에 그 발명의 목적이 있다.The present invention, in the polishing pad, eliminates the above-mentioned problem, by forming grooves in communication with each other on the surface of the nose pad to smoothly supply abrasive oil during polishing to suppress sludge generation as much as possible, and also generate sludge into the grooves. It is an object of the present invention to provide a polishing pad capable of precise polishing by discharging the resistive element.
도 1 은 본 발명의 사시도1 is a perspective view of the present invention
도 2 는 본 발명의 단면도2 is a cross-sectional view of the present invention
도 3 은 본 발명의 타실시예도Figure 3 is another embodiment of the present invention
도 4 는 본 발명의 사용상태도4 is a state diagram used in the present invention
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
1 : 연마용 패드 1a, 1b : 패드편1 polishing pad 1a, 1b: pad piece
2, 2' : 요홈2, 2 ': groove
이하, 본 발명의 실시예를 첨부도면에 의하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail by the accompanying drawings.
도 1 은 본 발명 연마용 패드의 사시도이고, 도 2 는 그 단면설명도이다.1 is a perspective view of a polishing pad of the present invention, Figure 2 is a cross-sectional view thereof.
단섬유에 의한 부직포를 폴리우레탄에 함침시켜 기존의 방법으로 형성한 연마용 패드(1)에 대하여, 패드(1)의 밑면에 일정간격과 깊이의 요홈(2)(2')을 반복적으로 형성한 것이다.In the polishing pad 1 formed by impregnating a non-woven fabric made of short fibers with polyurethane, grooves 2 and 2 'of a predetermined interval and depth are repeatedly formed on the bottom surface of the pad 1. It is.
그 요홈(2)(2')의 형성방법은 패드(1)의 성형후 파내는 절삭 가공도 가능하고, 별도의 절단패드(1a)(1b)를 간격을 두고 부착 조립하는 것도 가능하다.The grooves 2 and 2 'can be formed by cutting the pad 1 after molding, and can also attach and separate separate cutting pads 1a and 1b at intervals.
또한 도 3 의 도시와 같이 요홈(2)(2')의 배열을 경사상뿐만 아니라 직선형(도 3a)과 크로스형(도 3b)등 그 형태에 관계없이 서로 연통되어 연마유를 골고루 공급할 수 있는 형태면 모두 가능하며, 그 홈의 깊이 또한 사용목적에 따라 얕게 또는 깊게 조절사용할 수 있다.In addition, as shown in FIG. 3, the arrangement of the grooves 2 and 2 'is not only inclined but also in communication with each other regardless of their shape, such as a straight line (FIG. 3A) and a cross shape (FIG. 3B). It can be used in any form, and the depth of the groove can be adjusted shallowly or deeply depending on the purpose of use.
이와 같이 구성된 패드는 도 4 의 도시와 같이 회전디스크의 밑면에 부착하여 회전구에 결합 사용하므로서 그 중앙의 연마유 공급구를 통해 연마유를 공급하면서 회전에 의해 정밀도를 요하는 연마제품으 표면을 연마하는 것이다.The pad configured as described above is attached to the bottom of the rotating disk as shown in FIG. 4 and used to connect to the rotating hole, thereby supplying the abrasive oil through the grinding oil supply port in the center thereof, thereby providing the surface of the abrasive product requiring precision by rotation. To polish.
이때 연마패드와 피연마제품이 모두 평면적이어서 서로 밀착되더라도 연통된 요홈(2)(2')에 의해 연마유를 골고루 공급하므로서 마찰열을 최소화하므로서 억제하여 슬러지 발생을 최대한 억제하고, 발생하더라도 슬러지가 마찰면의 사이에 잔류하지 않고, 그 요홈(2)(2')에 내입되므로서 연마면에 악영향을 미치지 않게 되어 정밀하고 우수한 연마가 가능하여지는 것이다.At this time, even though both the polishing pad and the to-be-polished product are planar, the abrasive oil is evenly supplied by the indented grooves (2) and (2 ') so as to minimize the heat of friction by minimizing the frictional heat and to minimize the occurrence of sludge. Since it does not remain between the surfaces and is embedded in the grooves 2 and 2 ', it does not adversely affect the polishing surface, thereby enabling accurate and excellent polishing.
이상과 같이 본 발명의 연마패드는 그 연마표면에 요홈을 형성하여, 이에 의해 평면적인 작업의 경우에도 연마유를 골고루 공급하므로서 연마시 슬러지 발생을 억제하여 정밀연마가 가능하고 연마효율을 높힐 수 있는 효과가 있다.As described above, the polishing pad of the present invention forms grooves on the polishing surface, thereby evenly supplying polishing oil even in the case of planar operation, thereby suppressing sludge generation during polishing, which enables precise polishing and improves polishing efficiency. It works.
Claims (3)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2020000014953U KR200201117Y1 (en) | 2000-05-26 | 2000-05-26 | Grinding pad with groove |
| KR1020000028663A KR20010107277A (en) | 2000-05-26 | 2000-05-26 | Grinding pad with groove |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000028663A KR20010107277A (en) | 2000-05-26 | 2000-05-26 | Grinding pad with groove |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2020000014953U Division KR200201117Y1 (en) | 2000-05-26 | 2000-05-26 | Grinding pad with groove |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20010107277A true KR20010107277A (en) | 2001-12-07 |
Family
ID=19670465
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000028663A KR20010107277A (en) | 2000-05-26 | 2000-05-26 | Grinding pad with groove |
| KR2020000014953U KR200201117Y1 (en) | 2000-05-26 | 2000-05-26 | Grinding pad with groove |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2020000014953U KR200201117Y1 (en) | 2000-05-26 | 2000-05-26 | Grinding pad with groove |
Country Status (1)
| Country | Link |
|---|---|
| KR (2) | KR20010107277A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918872A (en) * | 1984-05-14 | 1990-04-24 | Kanebo Limited | Surface grinding apparatus |
| JPH0419766U (en) * | 1990-06-08 | 1992-02-19 | ||
| US5527215A (en) * | 1992-01-10 | 1996-06-18 | Schlegel Corporation | Foam buffing pad having a finishing surface with a splash reducing configuration |
| KR100252820B1 (en) * | 1994-03-23 | 2000-04-15 | 후지무라 마사지카, 아키모토 유미 | Truing apparatus for wafer polishing pad |
-
2000
- 2000-05-26 KR KR1020000028663A patent/KR20010107277A/en not_active Application Discontinuation
- 2000-05-26 KR KR2020000014953U patent/KR200201117Y1/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4918872A (en) * | 1984-05-14 | 1990-04-24 | Kanebo Limited | Surface grinding apparatus |
| JPH0419766U (en) * | 1990-06-08 | 1992-02-19 | ||
| US5527215A (en) * | 1992-01-10 | 1996-06-18 | Schlegel Corporation | Foam buffing pad having a finishing surface with a splash reducing configuration |
| KR100252820B1 (en) * | 1994-03-23 | 2000-04-15 | 후지무라 마사지카, 아키모토 유미 | Truing apparatus for wafer polishing pad |
Also Published As
| Publication number | Publication date |
|---|---|
| KR200201117Y1 (en) | 2000-11-01 |
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| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |