CN219113751U - Grinding disc - Google Patents

Abstract

The application discloses an abrasive disk. The grinding disc comprises a grinding disc main body and a grinding layer; the grinding disc main body is provided with a grinding surface; the grinding layer is adhered to the grinding surface of the grinding disc main body and is used for grinding the diamond on the blade. By adopting the grinding disc, the bonding agent on the blade is removed, and the diamonds on the blade are synchronously removed, so that the diamonds on the blade are not easy to protrude out of the bonding agent, the smoothness of the blade is improved, and the blade is in an optimal use state. The product processed by the blade ground by the grinding disc can improve the quality indexes such as the dimensional accuracy, the surface flatness, the double-side parallelism and the like of the product.

Description

Grinding disc

Technical Field

The application relates to the technical field of grinding processing of consumable blades in the semiconductor field, in particular to a grinding disc.

Background

In the technical field of semiconductor grinding processing, a consumable blade is generally ground by utilizing a grinding disc before being cut by the consumable blade, and the blade ground by the grinding disc commonly used at present has poor surface finish, high side diamond bulge degree and large bonding agent loss, so that the phenomenon of poor cutting such as narrowing or widening of a cutter mark, poor cutting quality, short service life of the blade and the like can be caused in the cutting process of the grinded consumable blade. Accordingly, there is a need for improvements to existing polishing disks to improve the quality of consumable blades polished by the polishing disk.

Disclosure of Invention

In view of the foregoing, there is a need for a polishing pad that improves the efficiency of use polishing and is used to polish consumable blades to a lower roughness.

The embodiment of the application provides a grinding disc, which comprises a grinding disc main body and a grinding layer; the grinding disc main body is provided with a grinding surface; the grinding layer is adhered to the grinding surface of the grinding disc main body and is used for grinding the diamond on the blade.

The blade is typically composed of diamond and a bonding agent. In the existing processing mode, only the grinding disc main body is generally used for grinding the blade, the grinding disc main body is generally made of metal materials such as cast iron, the hardness of the cast iron is smaller than that of diamond, and the cast iron does not have the shedding capability, so that when the grinding disc main body is used for processing the blade, the thickness of the bonding agent of the blade is easier to reduce, the diamond on the blade protrudes out of the surface of the bonding agent, the surface of the blade is roughened, and the quality of a product processed by the blade is lower. By using the above-described abrasive disk, the abrasive layer is used to process the diamond in the blade. Therefore, when the grinding layer grinds the blade, the grinding layer grinds the bonding agent on the blade and grinds the diamond in the blade, so that the bonding agent on the blade is removed, the diamond on the blade is synchronously removed, the diamond on the blade is not easy to bulge out of the bonding agent, the blade also has thicker bonding agent under the condition of specified thickness, the blade with lower roughness is processed, and the blade grinded by the grinding disc has higher cutting quality and longer cutting life. In addition, the grinding layer can grind the diamond, so that the grinding efficiency of the grinding disc is improved, and the thickness of the blade is further reduced rapidly by the grinding disc.

In some embodiments, the grinding surface is provided with a first grid groove, and the grinding layer is provided with a first groove corresponding to the grid groove.

In some embodiments, the grinding layer is provided with a second groove in a grid shape, and the second groove is located at one side of the grinding layer, which is away from the grinding disc main body.

In some embodiments, the grinding surface is provided with a second grid groove, the grinding layer is provided with a plurality of through holes arranged at intervals, and a plurality of through holes are communicated with the second grid groove.

In some embodiments, the grinding disc main body is provided with a plurality of transverse grooves and a plurality of longitudinal grooves, the transverse grooves are arranged at equal intervals, the longitudinal grooves are arranged at equal intervals, and the transverse grooves and the longitudinal grooves are staggered to form the grid grooves.

In some embodiments, the cross-sectional shape of the transverse slot and the longitudinal slot are both U-shaped.

In some embodiments, the transverse grooves and the longitudinal grooves each have a groove width of no more than 1.5mm.

In some embodiments, the number of transverse grooves and longitudinal grooves is at least 10, respectively.

In some embodiments, the grinding surface is a smooth surface.

In some embodiments, the abrasive layer comprises a layer of diamond and a resin, the diamond for abrading the blade; the diamond is doped in the resin layer.

Drawings

Fig. 1 is a schematic perspective view of a polishing disc according to a first embodiment of the present application.

Fig. 2 is a schematic perspective view of the polishing disc body shown in fig. 1.

Fig. 3 is a side view of the abrasive disk shown in fig. 1.

Fig. 4 is a top view of the abrasive disk shown in fig. 1.

Fig. 5 is a schematic perspective view of a polishing disc according to a second embodiment of the present application.

Fig. 6 is a schematic perspective view of a polishing disc according to a third embodiment of the present application.

Description of the main reference signs

Abrasive disk 100

Abrasive disk body 10

Grinding surface 11

First grid slot 12

Transverse groove 121

Longitudinal groove 122

Second grid groove 13

Grinding layer 20

First groove 21

Second groove 22

First groove 221

Second groove 222

Through hole 23

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, it is to be noted that the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; the two components can be connected in a mechanical mode, can be electrically connected or can be communicated with each other, can be directly connected, can be indirectly connected through an intermediate medium, and can be communicated with each other inside the two components or can be in interaction relation with each other. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

A first embodiment of the present application will be described in detail below with reference to the accompanying drawings.

Referring to fig. 1, a first embodiment of the present application provides a polishing disc 100. The abrasive disk 100 is mainly used for processing a blade in the semiconductor field, and the blade is made of a material such as a bonding agent and diamond. The use of the abrasive disk 100 can improve the machining accuracy of the blade.

Referring to fig. 1 and 2, the polishing pad 100 includes a polishing pad body 10 and a polishing layer 20. The abrasive disk body 10 has a grinding surface 11.

The abrasive layer 20 is adhered to the grinding face 11 of the grinding disk main body 10, and the abrasive layer 20 is used for grinding diamond on the blade.

In one embodiment, the polishing disc body 10 has a disc shape, and the end surface of the polishing disc body 10 is a grinding surface 11. The grinding layer 20 covers the entire surface of the grinding surface 11, and when the grinding plate 100 is used to grind the blade, the grinding layer 20 grinds the bonding agent and diamond on the blade at the same time when the grinding layer 20 contacts the surface of the blade.

In the conventional machining method, only the grinding disc body 10 is generally used for grinding the blade, the grinding disc body 10 is generally made of metal such as cast iron, the hardness of the cast iron is smaller than that of diamond, and the cast iron does not have the shedding capability, so that when the grinding disc body 10 is used for machining the blade, the thickness of the bonding agent of the blade is easier to reduce, the diamond on the blade protrudes out of the surface of the bonding agent, the surface of the blade is roughened, and the quality of a product machined by using the blade is lower.

Whereas in this embodiment the abrasive layer 20 is used to process the diamond in the blade. Therefore, when the grinding layer 20 grinds the blade, the grinding layer 20 grinds the bonding agent in the blade and grinds the diamond in the blade, so that the bonding agent on the blade is removed, the diamond on the blade is synchronously removed, the diamond on the blade is not easy to bulge out of the bonding agent, the blade also has thicker bonding agent under the condition of specified thickness, the blade with lower roughness can be processed by adopting the grinding disc 100, and the blade has lower roughness, so that the smoothness of the blade is improved, thereby the blade reaches the optimal use state, further various quality indexes and service life of blade cutting are improved, and the yield and production process efficiency of the blade are improved. In addition, the abrasive layer 20 is capable of grinding diamond in the blade, compared to the abrasive disc body 10 of cast iron material, thereby facilitating the improvement of the grinding efficiency and the rapid reduction of the thickness of the blade.

Referring to fig. 2 and 3, in some embodiments, a grinding surface 11 of a grinding disc body 10 is provided with a first grid groove 12, and a grinding layer 20 is provided with a first groove 21 corresponding to the first grid groove 12.

When the blade is polished, the polishing liquid enters the first grid groove 12 through the first groove 21, so that the polishing liquid is uniformly distributed on the polishing disc 100, and the polishing effect of the polishing layer 20 is better.

Referring to fig. 2 and 4, in some embodiments, a plurality of transverse grooves 121 and a plurality of longitudinal grooves 122 are formed in the polishing disc main body 10, the plurality of transverse grooves 121 are disposed at equal intervals, the plurality of longitudinal grooves 122 are disposed at equal intervals, and the plurality of transverse grooves 121 and the plurality of longitudinal grooves 122 are staggered to form the first grid groove 12.

By forming the plurality of transverse grooves 121 and the plurality of longitudinal grooves 122 on the grinding disc main body 10, the grinding fluid can be uniformly distributed on the surface of the grinding disc 100 when the grinding disc 100 grinds the blade, so that the surface of the grinding disc 100 maintains uniform wettability, and the blade ground by the grinding disc 100 has better uniformity.

Referring to fig. 2 and 3, in some embodiments, the cross-sectional shapes of the transverse grooves 121 and the longitudinal grooves 122 are each U-shaped. In this embodiment, the bottoms of the horizontal grooves 121 and the vertical grooves 122 are flat bottoms. In other embodiments, the transverse grooves 121 and the longitudinal grooves 122 may also be rounded-bottom. The operator can machine the transverse grooves 121 and the longitudinal grooves 122 in the form of flat bottoms on the grinding disc body 10 by using a conventional milling cutter, so that the machining mode of the transverse grooves 121 and the longitudinal grooves 122 is simple and easy to operate.

Referring to fig. 1, in some embodiments, the number of the transverse grooves 121 and the longitudinal grooves 122 is 10, respectively. In an embodiment, the number of the transverse grooves 121 and the longitudinal grooves 122 is 10, and when the number of the transverse grooves 121 and the longitudinal grooves 122 is greater, the dispersion degree of the polishing liquid on the polishing disc main body 10 is more uniform, and the polishing effect of the polishing disc 100 on the blade is better.

Referring to fig. 4, in some embodiments, the width of each of the transverse grooves 121 and the longitudinal grooves 122 is not more than 1.5mm, and the width of each of the transverse grooves 121 and the longitudinal grooves 122 is specifically shown as H in fig. 4. When the groove widths of the lateral grooves 121 and the longitudinal grooves 122 are larger, the accommodating spaces of the lateral grooves 121 and the longitudinal grooves 122 are larger, and at this time, the lateral grooves 121 and the longitudinal grooves 122 accommodate more polishing liquid, and when excessive polishing liquid is accommodated in the lateral grooves 121 and the longitudinal grooves 122, the polishing liquid on the grinding surface between the grinding layer 20 and the blade is easily lost, so that the temperature on the blade and the grinding disc 100 is increased, thereby affecting the processing of the blade.

The angle between the transverse grooves 121 and the longitudinal grooves 122 is 90 degrees. In other embodiments, the included angle between the transverse groove 121 and the longitudinal groove 122 may be other angles, and in this embodiment, by setting the included angle between the transverse groove 121 and the longitudinal groove 122 to 90 degrees, an operator can directly process the transverse groove 121 and the longitudinal groove 122 without adjusting the angle of the tool on the machine tool, thereby providing convenience for the operator to operate.

Referring to fig. 2, in some embodiments, the grinding surface 11 is a smooth surface. Since the abrasive layer 20 is fixed on the abrasive disc body 10 by bonding, the abrasive disc body 10 is set to have a smooth surface, so that air between the abrasive layer 20 and the abrasive disc body 10 is more easily discharged during bonding, and the bonding surface between the abrasive layer 20 and the abrasive disc body 10 is at a lower air pressure, so that the abrasive layer 20 is more firmly bonded on the abrasive disc body 10.

Referring to fig. 1, in some embodiments, the abrasive layer 20 includes a resin layer and diamond, which is used to abrade the diamond in the blade, the diamond being doped in the resin layer. The abrasive layer 20 in this embodiment includes other fillers and the resin layer serves to bind the diamond and other fillers together. In addition, when the polishing pad 100 polishes the blade, the diamond gradually dulls, and the force applied to the diamond on the polishing pad 100 increases, and when the force is greater than the bonding strength of the resin layer, the old diamond falls from the polishing layer 20, and new diamond is exposed from the polishing layer 20. The grinding layer 20 has better self-shedding capability, so that the grinding layer 20 keeps a sharp state continuously, and the removing capability of the blade is kept consistent all the time, thereby the processed blade can reach higher smoothness.

In addition, the grinding layer 20 and the blade to be processed are made of diamond materials, so when the grinding layer 20 is used for grinding the blade, the diamond in the blade and the diamond in the grinding layer 20 grind each other, the bonding agent on the blade is removed, and meanwhile, the diamond on the blade is synchronously removed, so that the diamond on the blade is not easy to protrude out of the surface of the bonding agent, and the surface of the blade has higher smoothness. In addition, the blade can achieve low roughness, high precision, and superior self-rigidity under the lapping action of the lapping plate 100, so that the blade exhibits excellent quality and long-life blade characteristics during cutting. The product processed by the blade ground by the grinding disc 100 can improve the quality indexes such as the dimensional accuracy, the surface flatness, the double-side parallelism and the like of the product.

The diamond in the abrasive layer 20 can perform a grinding function on the diamond in the blade, thereby being beneficial to improving the grinding efficiency and rapidly reducing the thickness of the blade.

Some embodiments provide an abrasive disk 100 that operates on the general principle of:

the abrasive disk body 10 is provided with an abrasive layer 20, the abrasive layer 20 comprising a resin layer, diamond and other filler, the resin layer bonding the diamond and other filler together to form the complete abrasive layer 20. When the abrasive disk 100 processes the blade, the diamond on the abrasive layer 20 and the diamond on the blade produce an interactive grinding action, so that not only the bonding agent on the blade but also the diamond on the blade are simultaneously removed. In addition, since the first grid groove 12 is formed on the grinding disc main body 10, during the grinding process, the grinding fluid can flow into the first grid groove 12, so that the grinding fluid is uniformly distributed on the surface of the grinding disc 100, and the grinding effect of the blade is better. The blade processed by the abrasive disk 100 can achieve low roughness, high precision, and superior self-rigidity, thereby exhibiting excellent quality and long-lasting blade characteristics during cutting.

The abrasive disc 100 that this embodiment provided, because all contain the diamond material in grinding layer 20 and the blade of processing, consequently when grinding layer 20 at the abrasive machining blade, diamond in the blade and diamond in grinding layer 20 can grind each other for bonding agent and diamond on the blade are got rid of in step, thereby make the difficult protrusion bonding agent of diamond on the blade, with make bonding agent and diamond keep unanimous height, and then process out the blade that roughness is lower, and the product precision that adopts this blade to process out is higher, the quality is also better.

Second embodiment

Referring to fig. 5, the abrasive layer 20 is adhered to the abrasive disc body 10, and the surface of the abrasive disc body 10 for adhesion is a smooth surface, so that when the abrasive layer 20 is adhered to the abrasive disc body 10, air can be exhausted between the abrasive layer 20 and the abrasive disc body 10, thereby making the adhesion of the abrasive layer 20 more firm.

The grinding layer 20 deviates from one side of the grinding disc main body 10 and is provided with a second groove 22, the second groove 22 is in a grid shape, the second groove 22 comprises a first groove 221 and a second groove 222, the number of the first grooves 221 is at least 10, the number of the second grooves 222 is at least 10, a plurality of first grooves 221 are arranged at equal intervals, a plurality of second grooves 222 are arranged at equal intervals, and the first grooves 221 and the second grooves 222 are staggered with each other to form the second groove 22, wherein the groove width of the first grooves 221 and the second grooves 222 is 1.5mm at most. Due to the second grooves 22 arranged on the grinding layer 20, the grinding liquid can be uniformly distributed on the grinding layer 20 when the grinding layer 20 grinds the blade, so that the grinding effect is better.

Third embodiment

Referring to fig. 6, the grinding surface of the grinding disc main body 10 is provided with a second grid groove 13, and the arrangement form of the second grid groove 13 is the same as that of the first grid groove 12 in the first embodiment, which is not described herein. The grinding layer 20 is adhered to the side of the grinding disc main body 10 where the second grid grooves 13 are formed, and a plurality of through holes 23 are formed in the grinding layer 20 at intervals, the plurality of through holes 23 are uniformly distributed on the grinding layer 20, the shape of the through holes 23 is not limited, and the through holes 23 can be any shape. Each through hole 23 communicates with the second mesh slot 13.

When the grinding layer 20 grinds the blade, the grinding fluid may enter the second mesh groove 13 through the through holes 23, thereby uniformly distributing the grinding fluid on the grinding disk 100. Compared to the polishing layer 20 of the first embodiment, the polishing disc 100 of the present embodiment has a larger polishing area on the premise of containing the polishing liquid, and the polishing layer 20 of the present embodiment is advantageous for improving the polishing efficiency of the blade.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Finally, it should be noted that the above embodiments are merely for illustrating the technical solution of the present application and not for limiting, and although the present application has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present application may be modified or substituted without departing from the spirit and scope of the technical solution of the present application.

Claims (6)

1. An abrasive disk comprising:

a grinding disc body having a grinding surface;

the grinding layer is adhered to the grinding surface of the grinding disc main body and is used for grinding the diamond on the blade;

the grinding surface is provided with a first grid groove, and the grinding layer is provided with a first groove corresponding to the first grid groove;

the grinding disc comprises a grinding disc body, wherein a plurality of transverse grooves and a plurality of longitudinal grooves are formed in the grinding disc body, the transverse grooves are arranged at equal intervals, the longitudinal grooves are arranged at equal intervals, and the transverse grooves and the longitudinal grooves are staggered to form first grid grooves.

2. The abrasive disk of claim 1 wherein the abrasive disk comprises a plurality of abrasive disks,

the cross section shape of the transverse groove and the cross section shape of the longitudinal groove are U-shaped.

3. The abrasive disk of claim 1 wherein the abrasive disk comprises a plurality of abrasive disks,

the groove widths of the transverse grooves and the longitudinal grooves are not more than 1.5mm.

4. The abrasive disk of claim 1 wherein the abrasive disk comprises a plurality of abrasive disks,

the number of the transverse grooves and the longitudinal grooves is 10 respectively.

5. The abrasive disk of claim 1 wherein the abrasive disk comprises a plurality of abrasive disks,

the grinding surface is a smooth surface.

6. The abrasive disk of claim 1 wherein the abrasive disk comprises a plurality of abrasive disks,

the abrasive layer comprises:

diamond for grinding the blade;

and a resin layer in which the diamond is doped.

Images