KR20010100931A - Method for manufacturing piezoelectric resonator with a built capacitor, and Lead terminal - Google Patents

Abstract

The present invention simplifies the soldering process and provides a method of manufacturing a piezoelectric resonator with a capacitor that can cope with miniaturization.

Forming a solder film on the third lead terminal 3 when manufacturing the piezoelectric resonator component including the capacitor formed by soldering the piezoelectric resonance element 6 and the capacitor element to the first to third lead terminals; A process of soldering the piezoelectric resonating elements 6 to the first and second lead terminals 1 and 2 and forming a solder film on the surface to which the capacitor elements of the first and second lead terminals 1 and 2 are attached. ; Bonding the capacitor element with the first to third lead terminals by inserting the capacitor element between the first and second lead terminals (1, 2) and the third lead terminal (3) and remelting the solder film; Method of manufacturing a capacitor embedded piezoelectric resonator comprising a

Description

Method for manufacturing piezoelectric resonator with a built capacitor, and Lead terminal}

The present invention relates to, for example, a piezoelectric resonator with a capacitor used as a piezoelectric oscillator, and more particularly, to a method of manufacturing a lead-type capacitor with a piezoelectric resonator in which a plurality of lead terminals are joined to a piezoelectric resonant element and a capacitor element. And a lead terminal used in the manufacturing method.

In the past, various piezoelectric resonators with a capacitor formed by combining a piezoelectric resonant element and a capacitor element have been proposed (for example, Japanese Patent Application Laid-open No. Hei 7-183137, Japanese Utility Model No. Hei 6-26318, Japanese Patent Laid-Open No. Hei 7-106889, etc.).

8 is a perspective view illustrating one example of a piezoelectric resonator with a capacitor. In the piezoelectric resonator 101 with a capacitor, a plate-shaped piezoelectric resonator element 102 and a plate-shaped capacitor element 103 are used. Lead terminals 104 and 105 having U-shaped cup portions are attached to the piezoelectric resonating element 102. That is, the lead terminals 104 and 105 have cup portions 104a and 105a at one end side, and the piezoelectric resonating element 102 has an end portion of the piezoelectric resonating element 102 in the cup portions 104a and 105a. Is bonded to the lead terminals 104 and 105 by soldering. And the plate-shaped capacitor element 103 is joined to the outer peripheral surfaces of the cup parts 104a and 105a. The third lead terminal 106 is joined to the center of the main surface on the opposite side of the capacitor element 103.

After the lead terminals 104 to 106 are bonded to the piezoelectric resonating component 101, a resin sheath is applied as indicated by the double-dot chain line A. FIG.

When joining the lead terminals 104 to 106, the method shown in Figs. 9 to 11 has conventionally been adopted. That is, as shown in FIG. 9, the lead terminals 104-106 are comprised so that it may be integrated with the metal hoop 107. As shown in FIG. The piezoelectric resonating element 102 is inserted between the cup portions 104a and 105a of the tip portions of the lead terminals 104 and 105. Thereafter, the soldering iron 107 having the molten solder adhered to the surface is brought into contact with the inside of the cup portions 104a and 105a, and the piezoelectric resonating element 102 and the cup portions 104a and 105a are soldered. In this way, the piezoelectric resonating element 102 is joined to the lead terminals 104 and 105.

Next, as shown in FIG. 10, the soldering iron 108 having the molten solder adhered to the tip portion is brought into contact with the outer surfaces of the cup portions 104a and 105a so that solder is applied to the outer surfaces of the cup portions 104a and 105a. Supply.

Thereafter, the plate-shaped capacitor element 103 is supported by the outer surfaces of the cup portions 104a and 105a to which the solder is attached and the lead terminals 106, and the solder attached by the reflow soldering method is remelted. The capacitor | condenser element 103 is bonded together (refer FIG. 11). In addition, in FIG. 11, 111-113 represent the solder which joined the capacitor element to the 1st-3rd lead terminals 104-106.

In the conventional manufacturing method, when the piezoelectric resonator element 102 is attached to the capacitor element 103, (1) soldering the piezoelectric resonator 102 to the lead terminal using the soldering iron 107, ② manufacture of the capacitor element Prior to this, a process of supplying solder to the outside of the cup portion by using the soldering iron 108, and a process of soldering the capacitor element by reflow solder after inserting the capacitor element ③, have been complicated.

In addition, when miniaturization of the piezoelectric resonator with a capacitor is advanced, the outer surfaces of the U-shaped cup portions 104a and 105a are reduced. However, when the outer surfaces of the cup portions 104a and 105a become smaller, the solder is likely to flow into the cup portions 104a and 105a when the solder is supplied to the soldering iron. Therefore, it is necessary to reduce the cross sectional area of the tip of the soldering iron. However, as the area of the cross section of the tip of the soldering iron is reduced, the stability is greatly impaired when supplying molten solder to the tip of the soldering iron. Therefore, there is a limitation in the conventional manufacturing method to miniaturize the piezoelectric resonator with a capacitor.

In addition, although the lead terminals 104 and 105 have U-shaped cup portions, the same problem occurs when a lead terminal having a V-shaped or L-shaped tip portion is used.

The object of the present invention is to solve the above-mentioned drawbacks of the prior art, to facilitate the manufacturing process, and to stably and reliably join the lead terminal, the piezoelectric resonating element, and the capacitor element even when miniaturization of the piezoelectric resonator with a capacitor is carried out. The present invention provides a method for manufacturing a piezoelectric resonator with a capacitor, and a lead terminal used in the method.

1 is a perspective view showing a state in which the first and second lead terminals and the piezoelectric resonant elements are joined, and the capacitor elements are joined to the first to third lead terminals in one embodiment of the present invention.

2A and 2B are perspective views illustrating piezoelectric resonant elements and capacitor elements.

3 is a perspective view for explaining the first to third lead terminals used in one embodiment of the present invention.

4 is a plan view showing a state in which the first to third lead terminals manufactured in one embodiment of the present invention are joined to a metal hoop.

5 is a perspective view illustrating a state in which a second lead terminal is immersed in molten solder in order to form a solder film on the second lead terminal.

FIG. 6 is a front view seen from a lead terminal end portion showing a state in which the piezoelectric resonating element is supported on the supporting portions of the first and second lead terminals in one embodiment of the present invention. FIG.

FIG. 7 is a partial cutaway perspective view for explaining a process of contacting a soldering iron to join the piezoelectric resonating elements to the first and second lead terminals in one embodiment of the present invention.

8 is a perspective view for explaining one example of a conventional piezoelectric resonant component with a capacitor.

FIG. 9 is a partial cutaway perspective view illustrating a process of soldering a piezoelectric resonant element inserted between a pair of lead terminals having a cup portion to a cup portion of the lead terminal in a conventional manufacturing method.

10 is a partial cutaway perspective view illustrating a process of supplying solder to a cup portion of a lead terminal in a conventional manufacturing method.

Fig. 11 is a schematic cross-sectional view seen from the terminal tip side showing a state in which a capacitor element is bonded to a lead terminal having a cup portion and a third lead terminal in the conventional manufacturing method.

<Brief description of the main parts of the drawing>

1 First lead terminal 2 Second lead terminal

3 Third lead terminal 1a L-shaped support

2a L-shaped support 3a Capacitor attachment

4 molten solder 6 piezoelectric resonant element

6a piezoelectric substrate 6b, 6c resonant electrode

7 Solder Film 8,9 Solder

10a, 10b Solder Film 12 Capacitor Devices

12a capacitor board

12b to 12d first to third capacitor electrodes

According to a broad aspect of the present invention, a plate-shaped piezoelectric resonance element; First and second lead terminals bonded to the piezoelectric resonating element; A plate-shaped capacitor element joined to a surface on the side opposite to the side to which the piezoelectric resonating elements of the first and second lead terminals are joined; A third lead terminal bonded to a surface opposite to the side bonded to the first and second lead terminals of the capacitor element; A method of manufacturing a capacitor-embedded piezoelectric resonator comprising: forming a solder film to bond a capacitor element to a third lead terminal; Soldering the first and second lead terminals and the piezoelectric resonant elements, and forming a solder film on the surface to which the capacitor elements of the first and second lead terminals are joined; Bonding the capacitor element with the first to third lead terminals by inserting the capacitor element between the first and second lead terminals and the third lead terminal and remelting the solder film; Provided is a method of manufacturing a capacitor-embedded piezoelectric resonator comprising a.

In a particular aspect of the manufacturing method according to the present invention, the first to third lead terminals have a round rod shape except at least the capacitor junction portion, and the capacitor junction portion is plate-shaped.

In another particular aspect of the manufacturing method of the present invention, the capacitor element comprises: a capacitor substrate having plate-shaped first and second main surfaces; First and second capacitor electrodes formed on the first main surface; A third capacitor electrode formed substantially in the center of the second main surface and facing the first and second capacitor electrodes through the capacitor electrode; Has

In another particular aspect of the manufacturing method of the present invention, when soldering and forming a solder film, flux having a solid content concentration of 20% by weight or more is used.

In another particular aspect of the manufacturing method according to the present invention, a soldering iron in which the solder liquidus temperature is adjusted to a temperature of 130 ° C. or more is used when the solder film is remelted and soldered.

The lead terminal according to the present invention is used in the manufacturing method of the present invention, and is a lead terminal having a round rod shape and at least a portion to which a capacitor element is joined is a flat plate.

EMBODIMENT OF THE INVENTION Below, with reference to drawings, the specific Example of this invention is described and this invention is clarified.

A method of manufacturing a capacitor-embedded piezoelectric resonator according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 7.

In this embodiment, first, the first to third lead terminals 1 to 3 shown in Figs. 3 and 4 are prepared. One end of the first to third lead terminals 1 to 3 is connected to a strip-shaped metal hoop 4. The first to third lead terminals 1 to 3 generally have a substantially round rod shape. L-shaped support portions 1a and 2a are formed by pressing a round rod portion at the distal end portion of the lead terminals 1 and 2 and bending them. The L-shaped support portions 1a and 2a are formed in the vicinity of the tip portions 1b and 2b in this embodiment, but do not have to reach the tip portions 1b and 2b. Further, the lead terminals 1 to 3 are formed with flat capacitor element attaching portions 1c, 2c, and 3c by the same pressing process.

In addition, the capacitor element attaching portions 1c and 2c of the lead terminals 1 and 2 are located on the same plane, and the capacitor element attaching portion 3a of the third lead terminal 3 is the capacitor element attaching portion 1c, It is formed in a plane different from 2c). This is to secure a space for inserting the capacitor element described later between the capacitor element attaching portions 1c and 2c of the lead terminals 1 and 2 and the capacitor element attaching portion 3a of the third lead terminal 3. Thus, the distance between the capacitor element attaching portions 1c and 2c and the side opposite the capacitor element attaching portion 3a is equal to the thickness of the capacitor element being inserted.

The material forming the lead terminals 1 to 3 is not particularly limited, and suitable metal materials such as aluminum and copper can be used.

Next, as schematically shown in FIG. 5, the tip portion of the third lead terminal 3 is immersed in the molten solder 4 held at a temperature of the solder liquid phase line temperature of 30 ° C. and lifted up. In this way, preliminary solder is provided to the capacitor element attachment portion 3a of the lead terminal 3.

In addition, the solder liquidus line temperature means a temperature at which the solder completely turns into a liquid. When attaching this preliminary solder, it is not limited to the molten solder of 30 degreeC of solder liquidus line temperature, The molten solder of about 20-70 degreeC solder liquid line temperature can be used.

Next, flux is applied inside the L-shaped support portions 1a and 2a of the tip portions of the first and second lead terminals 1 and 2. As the flux, it is preferable to use a flux having a solid concentration of 20 wt% of the RMA type.

Since the activity of the RMA type flux having a solid content concentration of 20% by weight is high, solder can be reliably supplied to the side opposite to the side to which the piezoelectric resonating elements 6 of the L-shaped supports 1d and 2d are joined.

After the flux is applied, the plate-shaped piezoelectric resonating element 6 is supported between the L-shaped support portions 1a and 2a as shown in the figure seen from the front end side of the lead terminal. And 7 shows the solder film deposited by the process shown in FIG.

As shown in Fig. 2A, the piezoelectric resonator 6 is a piezoelectric resonator using the thickness termination mode in this embodiment, and has a spherical plate-like piezoelectric substrate 6a. Resonant electrodes 6b and 6c are formed so as to face the piezoelectric substrate 6a on both main surfaces of the piezoelectric substrate 6a. The resonant electrodes 6b and 6c may be formed so as to reach the main surface on the opposite side through the cross section, but in the present invention, the resonant electrodes 6b are provided by having the L-shaped support portions 1a and 2a at the front end side of the lead terminal. Even if 6c is not formed so as to reach the main surface on the opposite side through the cross section, sufficient electrical and mechanical connection is possible. Therefore, one resonant electrode is brought into contact with each of the L-shaped supports 1a and 2a.

Then, as shown in FIG. 7, the L-shaped support parts 1a and 2a and the piezoelectric resonating element 6 are soldered using the soldering irons 8 and 9. The front end of the soldering irons 8 and 9 is previously bonded with molten solder having a temperature of 130 ° C or higher in the solder liquid phase line temperature. Then, by contacting the tip ends of the soldering irons 8 and 9 with the L-shaped support portions 1a and 2a, molten solder is supplied to the electrodes of the piezoelectric resonator element 6 and the L-shaped support portions 1a and 2a so as to provide both. Is bonded. At this time, solder flows into the surface on the opposite side to the surface to which the piezoelectric resonating elements 6 of the L-shaped support portions 1a and 2a are joined.

Therefore, as is clear from FIG. 7, solder films 10a and 10b are formed on the surface opposite to the surface to which the piezoelectric resonating elements 6 of the lead terminals 1 and 2 are joined. As described above, a solder film 7 made of preliminary solder is formed in the lead terminal 3.

Next, the capacitor element 12 is inserted into a gap between the first and second lead terminals 1 and 2 and the third lead terminal 3.

As shown in Fig. 2B, the capacitor element 12 includes a spherical plate-shaped capacitor substrate 12a made of a dielectric ceramic; First and second capacitor electrodes 12b and 12c formed on the first main surface of the capacitor substrate; A third capacitor electrode 12d formed on the second main surface; Has The first and second capacitor electrodes 12b and 12c and the third capacitor electrode 12d face each other through the capacitor substrate 12a. In addition, the third capacitor electrode 12d is formed approximately at the center of the second main surface of the capacitor substrate 12a.

Thereafter, the solder film is melted by the reflow method so that the entire temperature becomes a temperature of 20 ° C. or higher at the solder liquid line temperature, and the capacitor element 12 is attached.

In this way, as shown in FIG. 1, the piezoelectric resonating element 6, the capacitor element 12, and the 1st-3rd lead terminals 1-3 are made. In the joining process, a soldering iron is not required when soldering the capacitor element 12, so that the manufacturing process can be simplified.

In addition, since the soldering irons 8 and 9 are brought into contact with the front end faces of the L-shaped support portions 1a and 2a of the lead terminals 1 and 2, the piezoelectric resonator 1 can be miniaturized and the L-shaped Even when the sizes of the support portions 1a and 2a are reduced, the required amount of molten solder can be reliably supplied from the soldering irons 8 and 9, and excess solder is hardly supplied to the piezoelectric resonator 6. Therefore, the piezoelectric resonant component with a capacitor with a lead can also be miniaturized.

In the manufacturing method of this embodiment, after completion of the soldering process as described above, the resin sheathing is carried out in accordance with a known method around the portion where the piezoelectric resonating element 6 and the capacitor element 12 are joined, and thus the lead A piezoelectric resonant component with a capacitor embedded therein is obtained.

In the above embodiment, an energy confined piezoelectric resonator using a thickness termination mode is used. The piezoelectric resonator used in the present invention is not limited thereto, and an energy confined piezoelectric resonator using another vibration mode may be used. In the first and second lead terminals, although the capacitor element attaching portion is flat, as described above, a round rod-shaped lead terminal that is not flat may be used. In order to reliably form the solder film required for joining the capacitor elements, it is preferable that the capacitor element attaching portion is formed in a flat plate shape as in the above embodiment.

In the above embodiment, a solder film is formed by immersing the third lead terminal in molten solder in advance, but in the process of soldering the first and second lead terminals and the piezoelectric resonator, a different soldering iron is used for the third lead terminal. May be supplied.

In the method for manufacturing a capacitor-embedded piezoelectric resonant component according to the present invention, a solder film is formed on the capacitor element attaching portion of the third lead terminal, and the first and second lead terminals and the piezoelectric resonant element are soldered, and the first and the second Since a solder film is formed on the surface to which the capacitor elements of the lead terminal are joined, the capacitor elements are inserted between the first and second lead terminals and the third lead terminal, and the respective solder films are remelted to form the capacitor elements. Can be joined to three lead terminals.

Therefore, when manufacturing the piezoelectric resonator with a capacitor, the number of operations using a soldering iron can be reduced, and the manufacturing method of the piezoelectric resonator with a capacitor can be simplified.

When soldering the first and second lead terminals to the piezoelectric resonant element, if solder is supplied from the front end side of the lead terminal, the capacitor element is joined to the surface opposite to the side to which the lead terminals of the first and second lead terminals are attached. The molten solder for the solder film can be easily supplied. Therefore, even when the size of the portion where the piezoelectric resonating elements are attached to the first and second lead terminals is reduced, the molten solder on the side to which the capacitor element is attached is also supplied at the same time, so that molten solder can be stably supplied to the tip of the soldering iron. Can be. It also contributes to miniaturization of the piezoelectric resonator with a capacitor.

In the case where the first to third lead terminals are made of a substantially round rod-shaped material and at least the capacitor attachment portion is pressed and processed, the molten solder can be reliably stored in the capacitor attachment portion of the first to third lead terminals. The solder film can be formed stably.

If the capacitor element has a capacitor substrate and first to third capacitor electrodes, and the third capacitor electrode is formed at approximately the center of the second main surface of the second capacitor substrate, the capacitor element is approximately at the center between the first and second lead terminals. Since the third lead terminal may be disposed, insertion of the capacitor element is easy, and stability of the capacitor element when the capacitor element is inserted can be improved.

When soldering, when the RMA type solids concentration of flux of 20 wt% or more is used for the soldered portion of the lead terminal, the soldered portion is effectively activated, and thus the side where the piezoelectric resonating elements of the first and second lead terminals are joined. The molten solder can be supplied to the surface on the opposite side more reliably, and the solder film can be formed more reliably.

When a molten solder having a solder liquid line temperature of 130 ° C. or higher is supplied near the distal end of the first and second lead terminals using a soldering iron, the concentration of the soldering iron is high, so that the piezoelectric resonance of the first and second lead terminals is high. The molten solder for attaching the capacitor element can be stably supplied to the surface on the side opposite to the surface on which the elements are joined. Therefore, soldering of a capacitor element is performed more stably.

The lead terminals used in the method of manufacturing the piezoelectric resonant component with built-in capacitor according to the present invention have a substantially round rod shape, but at least the capacitor attachment portion is pressed and processed to form a flat plate. The molten solder can be easily stored. Therefore, by remelting the solder film formed by the solidification of the molten solder, the capacitor element can be bonded stably and easily.

Claims (6)

Plate-shaped piezoelectric resonance elements; First and second lead terminals bonded to the piezoelectric resonating element; A plate-shaped capacitor element bonded to a surface opposite to the side to which the piezoelectric resonating elements of the first and second lead terminals are joined; And A third lead terminal bonded to a surface on the side opposite to the side joined to the first and second lead terminals of the capacitor element; In the manufacturing method of a capacitor built-in piezoelectric resonator comprising: Forming a solder film to bond the capacitor element to the third lead terminal; Soldering the first and second lead terminals and the piezoelectric resonant elements and forming a solder film on a surface to which the capacitor elements of the first and second lead terminals are joined; Inserting the capacitor element between the first and second lead terminals and the third lead terminal and remelting the solder film to bond the capacitor element with the first to third lead terminals; Capacitor embedded piezoelectric resonator manufacturing method comprising a. The method of manufacturing a piezoelectric resonator with a capacitor according to claim 1, wherein the first to third lead terminals have a round rod shape except at least the capacitor junction portion, and the capacitor junction portion has a flat plate shape. The semiconductor device of claim 1, wherein the capacitor device comprises: a capacitor substrate having plate-shaped first and second main surfaces; First and second capacitor electrodes formed on the first main surface; A third capacitive electrode formed substantially in the center of the second main surface and facing the first and second capacitive electrodes through the capacitor substrate; Method of manufacturing a piezoelectric resonator with a capacitor, characterized in that it has a. The method of manufacturing a piezoelectric resonator with a capacitor according to any one of claims 1 to 3, wherein a flux having a solid content concentration of 20% by weight or more is used when forming the soldering and the solder film. The piezoelectric capacitor embedded in any one of claims 1 to 4, wherein, when the solder film is remelted and soldered, a soldering iron adjusted to a solder liquid phase line temperature of 130 ° C or higher is brought into contact with a lead terminal. Method of manufacturing resonators. A lead terminal for use in the method of manufacturing a capacitor-embedded piezoelectric resonator according to claim 1, wherein the lead terminal has a round rod shape and at least a portion to which a capacitor element is joined is a flat plate shape.