KR20010056391A - A Method for Manufacturing Metal-BGA Package Substrate - Google Patents

Abstract

PURPOSE: A method for manufacturing a substrate of a metal ball grid array package is provided with a simplified process and a reduced cost while maintaining required thermal characteristics. CONSTITUTION: The method includes forming circuits in a build-up manner. In the method, after a basic hole and an inner circuit are formed in a heat dissipating plate of copper or aluminum, the heat dissipating plate is plated for buffering and finished in black. Next, an insulating layer is formed for formation of the circuits, and then a via hole is formed, textured and plated. Next, the circuits are formed and inspected. Then, the formation of the insulating layer, the via hole and the circuits is repeated to make required layers of the circuits. Next, a solder resist is printed on an uppermost layer, then typically finished and inspected.

Description

A Method for Manufacturing Metal-BGA Package Substrate

The present invention relates to a method for manufacturing a package substrate having a heat sink, and more particularly, to a method for manufacturing a package substrate by laminating on a heat sink in a buildup manner.

As the electronic industry is becoming more and more advanced, electronic products have begun to be miniaturized and large-capacity. Accordingly, the development of IC chips has led to an increase in the I / O count. When the I / O count of a semiconductor increases, a lot of heat is generated in an I / C chip when driving it. In order to solve this problem, a conventional cooling fan is attached, which is an obstacle to the miniaturization of electronic products, so a new package is found. Packages designed for this purpose are S-BGA (Super-Ball Grid Array) and E-BGA (Enhanced-BGA) substrates with copper metal attached to a heatsink. It is to release heat generated by metal attached directly to the outside.

Looking at the existing S-BGA manufacturing process, the heat sink is used as 2 metal (metal), the heat sink is used to lay up in the middle of the process, the heat sink is subjected to a separate process to add to the intermediate process. A general process of such S-BGA preparation is shown in FIG. 1.

As shown in Fig. 1, since the heat sink must enter the second layer, it proceeds to the second and third lamination, in which the heat sink is proceeded to the "2" process and the "3" process separately from this process, It applies and progresses at the time of lamination | stacking of a process. That is, in the second lamination, the CCL and the heat sink are attached to each other using Cu metal and prepreg prepared in the "2" process. In this case, a general V-press is used. In addition, during the third lamination, the heat sink manufactured by the “3” process is attached to the product having the gold plating completed by using the preflag. Again use the normal V-press.

However, the S-BGA substrate has excellent heat dissipation performance and reliability, but the manufacturing process is complicated and it is difficult to form a fine pattern circuit. This problem is also included in the E-BGA substrate. As a result, the cost of manufacturing substrates such as S-BGA and E-BGA increases, and therefore, assembly companies need substrates with excellent thermal performance and reliability and low cost.

Accordingly, the present inventors have repeatedly studied and experimented to obtain a package substrate to which a simple process can be applied while showing excellent thermal performance and reliability, and proposed the present invention based on the results. By forming a circuit and forming a circuit in a build-up manner, it is intended to provide a new BGA package that can be manufactured at a lower cost because the manufacturing process is simple while showing the thermal characteristics required in the past.

1 is a process diagram showing a general manufacturing process of S-BGA

The present invention for achieving the above object is a step of forming a reference hole and the inner layer circuit in the heat sink; Performing a plating process for buffering on the heat sink and performing a blackening process; Forming an insulating layer for forming a circuit; Four steps of forming a via hole and performing texturing; 5 steps of plating for conduction; Forming a circuit and inspecting the formed circuit; 7 steps of repeating the process from step 3 to step 6 according to the desired number of floors; It relates to a method of manufacturing an M-BGA package substrate comprising a; 8 steps of forming a circuit to the desired number of layers and then printing the solder resist on the top layer and processing and inspection in a normal process.

Hereinafter, the present invention will be described in detail.

The package substrate according to the present invention is a metal-ball grid array (hereinafter, simply referred to as "M-BGA") manufactured by a build-up method without a lamination process, and many processes are reduced by applying the build-up method. . Therefore, the conventional S-BGA and E-BGA substrate manufacturing process, for example, four-layer lamination proceeds three or once lamination, the M-BGA substrate according to the present invention does not perform the lamination process Therefore, it can be manufactured by a simpler process. Next, the present invention by the build-up method will be described step by step.

First, in the present invention, the process of forming the reference hole and the inner layer circuit in the heat sink.

The heat sink may be made of a material such as Cu, Al, and the like, and an inner layer circuit is formed after the reference hole is formed in the heat sink.

In addition, in the present invention, a plating process for a buffering action is performed on the heat sink and a blackening process is performed.

The plating process is performed to prevent damage to the circuit and is performed by Ni or the like. The blackening process is performed to secure surface roughness.

Further, in the present invention, a process of forming an insulating layer for forming a circuit is performed, a process of forming a via hole and a texturing process, and a process of plating for conduction, and a circuit is formed and formed. Inspect the circuit.

The insulating layer is formed using a resin coating, that is, a photosensitive / thermosetting ink, and is formed every time a layer is formed.

The via hole may be performed by applying a laser, photoresist, or the like, and the roughening may be performed by applying a conventional method. After the roughening treatment, plating is performed by Cu or the like for conduction.

The circuit formation is formed in a desired pattern and undergoes a process of inspecting it.

In addition, in the present invention, the "circuit test" process is repeated in the "insulation layer formation" process according to the desired number of layers.

One layer is formed by a circuit inspection process in the insulating layer forming process, and the present invention is directly performed by a build-up method on the heat sink. Such layering is repeated according to the desired number of layers.

In addition, in the present invention, after forming a circuit in accordance with the desired number of layers, the solder resist (S / R) is printed on the uppermost layer and subjected to a process of processing and inspection in a normal process.

After the printing of the solder resist is subjected to the usual processes such as plating, V-cut, water washing, inspection, drying.

As described above, the present invention is to attach a heat sink, which is a conventional method, later, the build-up method Resin Coated Copper foil (RCC), a thermosetting ink is coated on the laser via (Laser Via) and mechanical (Mechanical) method After the hole is formed or the resin ink coating for forming the photo via is performed, plating may be performed on the thermosetting ink and the photo via ink in an additive manner. Therefore, it is possible to form a fine pattern when forming a circuit.

That is, while the existing surface Cu thickness is about 25-30 μm, the surface Cu thickness can be kept low at 20-25 μm by the application of the additive method, and thus the fine pattern circuit can be formed.

Hereinafter, the present invention will be described in more detail with reference to Examples.

Example

After manufacturing the four-layer M-BGA by the build-up method through the manufacturing process as follows, it was compared with the four-layer S-BGA and E-BGA by the conventional method.

[Reference hole formation in Cu metal (heat sink)] → [Inner circuit formation (heat sink)] → [Ni plating] → [Blackening (Oxide)] → [ 1 layer resin coating (thermosetting ink)] → [Beer hole formation ( Laser)] [Texturing] → [Conducting Cu Plating] → [Circuit Formation] → [Circuit Inspection] → [ 2 Layer Resin Coating (Thermosetting Ink)] → [Beer Hole Formation (Laser)] → [ [Texturing] → [Conducting Cu Plating] → [Circuit Formation] → [Circuit Inspection] → [ 3 Layer Resin Coating (Thermosetting Ink)] → [Beer Hole Formation (Laser)] → [Texturing] ] → [Conducting Cu Plating] → [Circuit Forming] → [Circuit Inspection] → [ 4 Layer Resin Coating (Thermosetting Ink)] → [Beer Hole Formation (Laser)] → [Texturing] → [Conducting] Cu Plating] → [Circuit Formation] → [Circuit Inspection] → [S / R Printing] → [Gold Plating] → [V-Cut] → [Single Piece Wash] → [Final Inspection] → [Drying]

The M-BGA produced through the process as described above was compared with the S-BGA produced by the conventional method and the E-BGA. In comparison, the thermal characteristics were similar.

However, as can be seen from the above process, the manufacturing process is very simple compared to the existing S-BGA or E-BGA and the manufacturing cost is about 20-30% cheaper.

In addition, M-BGA was prepared by applying the manufacturing process of the present invention to a surface Cu thickness of 20 μm. Evaluation of the post-fabrication characteristics was excellent, which shows that the circuit of the fine pattern can be formed by applying the method of the present invention.

According to the present invention as described above, by applying the build-up method for manufacturing the BGA package substrate, the overall manufacturing process is simplified because the lamination process is omitted without the thermal characteristics are inferior to the existing S-BGA and E-BGA In addition to reducing the cost required, it is possible to provide a fine pattern circuit.

Claims (2)

Forming a reference hole and an inner layer circuit in the heat sink; Performing a plating process for buffering on the heat sink and performing a blackening process; Forming an insulating layer for forming a circuit; Four steps of forming a via hole and performing texturing; 5 steps of plating for conduction; Forming a circuit and inspecting the formed circuit; 7 steps of repeating the process from step 3 to step 6 according to the desired number of floors; Forming a circuit in accordance with the desired number of layers after the step of printing a solder resist on the top layer and processing and inspection in a normal process; manufacturing method of M-BGA package substrate comprising a The method of claim 1, The heat sink is a manufacturing method of the M-BGA package substrate, characterized in that the material is Cu or Al