KR20010036519A - Liquid Jetting Apparatus - Google Patents

Abstract

PURPOSE: A liquid spraying apparatus is provided to uniformly etch a glass by constantly maintaining flow rate of a mixed solution. CONSTITUTION: The liquid spraying apparatus comprises a mesh network (70) installed at a lower transition (66) of the process carrier for constantly maintaining flow rate of the mixed solution in a liquid spraying apparatus equipped with an etchant tank (50) containing an etchant, an ionic solution tank (40) containing an ionic solution for washing the etchant, a process carrier (60) where glasses (62) are etched, a liquid injection pipe through which a mixed solution of the etchant and the ionic solution is transferred to the process carrier (60), and a liquid discharging pipe through which the mixed solution from the process carrier (60) is discharged.

Description

Liquid Jetting Apparatus

The present invention relates to a liquid spraying apparatus used for wet etching, and more particularly, to a liquid spraying apparatus configured to uniformly inject a mixed liquid.

Typically, etching is divided into wet etching and dry etching depending on the method. Wet etching is mainly applied to isotropic etching using chemicals with the characteristic of 'chemical reaction'. Dry etching is mainly applied to anisotropic etching using the reaction in the state of 'plasma'. Among them, the wet etching system is composed of a plurality of chemical tanks containing chemical solutions and ionic liquid tanks containing ionic solutions for cleaning chemical solutions. Hereinafter, a configuration of a conventional liquid injection device will be described with reference to FIG. 1.

Referring to FIG. 1, a conventional liquid spraying device is used to pattern an etchant tank 20 containing an etchant, an ion solution tank 10 containing an ionic solution for cleaning the etchant, and a metal of the glass 32. The process carrier 30 to be etched, the liquid injection pipe 12 through which the etchant and the ionic solution are transferred to the process carrier 30, and the liquid drain pipe 38 through which the etchant and ionic solution via the process carrier 30 are discharged. ). In order to perform wet etching, first, the ion solution stored in the ion solution tank 10 is supplied to the process carrier 30. The ion solution moves to the process carrier 30 via the liquid injection tube 12 to clean the glass 32 installed inside the process carrier 30. At this time, the flow rate of the ionic liquid in the liquid injection pipe 12 is shown at 1 '. An etching process is required to pattern a desired pattern on the glass 32, and the glass is used in a liquid crystal display device or the like. When the cleaning of the glass 32 is completed, the etchant stored in the etchant tank 20 is introduced into the liquid injection pipe 12 with a flow rate equal to 3 'by opening the valve 22. Accordingly, the mixed solution of the etchant + ion solution having a flow rate such as 5 'is supplied to the process carrier 30 to wet etch the metal pattern of the glass 32. Subsequently, the etched mixed liquid is discharged to the outside with a flow rate equal to 9 'via the upper transition 64 and the liquid drainage pipe 38. At this time, the mixed liquid flow rate in the lower transition 36 is shown as 7 '. That is, it can be seen that the flow velocity of the mixed liquid in the lower transition 36 has the fastest flow velocity in the center portion and the slower flow velocity in the peripheral portion. Accordingly, the glasses 32 located at the center of the process carrier 30 are etched quickly and more, while the glasses 32 located at the periphery are slower and less etched. As a result, there is a problem that the etching of the glass located in the process carrier is not uniform.

In order to solve such a problem, a method of installing a net having a uniform perforated shape in the lower transition 36 has been proposed, but even in this case, a problem in that uniform etching cannot be expected due to a different flow rate of the mixed solution.

Accordingly, it is an object of the present invention to provide a liquid spraying device configured to inject liquid uniformly.

1 is a view showing the configuration of a conventional liquid injection device.

2 is a view showing the configuration of a liquid spray device of the present invention.

3 shows a first embodiment of the mesh shown in FIG.

4 shows a second embodiment of the mesh shown in FIG.

FIG. 5 shows a third embodiment of the mesh shown in FIG.

<Description of the code | symbol about the principal part of drawing>

10,40: Ion solution tank 12,42: liquid injection pipe

20,50: etchant tank 22,52: valve

30,60: process carrier 32,62: glass

34,64: upper transition 36,66: lower transition

70: netting

In order to achieve the above object, the liquid spraying device of the present invention is provided at a lower transition of the process carrier and has a mesh for maintaining a constant flow rate of the mixed liquid.

Other objects and features of the present invention other than the above object will become apparent from the description of the embodiments with reference to the accompanying drawings.

With reference to Figures 2 to 3 will be described a preferred embodiment of the present invention.

Referring to FIG. 2, the liquid spraying device of the present invention includes an etchant tank 50 containing an etchant, an ion solution tank 40 containing an ionic solution for cleaning the etchant, a metal of the glass 62, and the like. A process carrier 60 to be etched to be patterned, a radiation-shaped netting 70 provided at the lower transition 66, a liquid injection pipe 42 through which the etching solution and the ionic solution are transferred to the process carrier 60, and a process carrier A liquid drain pipe 68 for discharging the etching liquid and the ionic solution via (60) is provided. Since the function and operation of the liquid spraying device have been sufficiently described in FIG. 1, detailed descriptions thereof will be omitted. On the other hand, the mesh 70 is located in the lower transition 66 so that the mixed liquid has a uniform flow rate, such as 11 '. To this end, the mesh 70 is formed in a radiation shape using Teflon as shown in Figs. This will be described in detail.

Referring to FIG. 3, the mesh 70 according to the first embodiment has a radiation shape in which grooves of a predetermined size are formed from the center to the outer portion. In this case, since the flow velocity of the mixed solution is kept constant by the mesh formed in the radiation shape, uniform etching is possible.

Referring to FIG. 4, perforations 71 having the same diameter are formed in the mesh 70 according to the second embodiment. The perforations 71 guide the mixed solution supplied from the ion solution tank 40 toward the glass 62 in the process carrier 60 and adjust the flow rate of the mixed solution. The perforations 71 located at the center of the net 70 are arranged with a large gap (high density), while the gaps of the perforations 71 are densely arranged (small density) toward the outer portion. The mixed liquid passes through the perforations 71 arranged at different densities of the central portion and the outer portion, and is then supplied to the glass 62 at a uniform flow rate at the central portion and the outer portion.

Referring to FIG. 5, perforations 72 having different diameters are formed in the mesh according to the third embodiment. The perforations 72 guide the mixed solution supplied from the ion solution tank 40 toward the glass 62 in the process carrier 60 and adjust the flow rate of the mixed solution. The diameters of the perforations 72 located at the center of the mesh 70 are smaller than those located at the periphery, and the diameters of the perforations 72 become larger toward the periphery. The mixed liquid passes through the perforations 72 having different diameters in the center portion and the outer portion, and is then supplied to the glass 62 at a uniform flow rate in the center portion and the outer portion.

The arrangement and diameter of the perforations 71 and 72 as shown in FIGS. 4 and 5 can be mixed, and the diameter of the perforations can be set as well as the diameter can be set smaller in the central portion of the mesh 70 than the outer portion. to be.

As described above, the liquid spraying device of the present invention has an advantage of enabling uniform etching by maintaining a constant flow rate of the mixed liquid.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (5)

An etchant tank containing an etchant, an ion solution tank containing an ionic solution for cleaning the etchant, a process carrier for etching glass, and a liquid injection tube through which a mixed solution of an etchant and an ionic solution is transferred to the process carrier, A liquid ejecting apparatus comprising a liquid drainage pipe through which the mixed liquid is discharged through a process carrier, And a mesh net installed at a lower transition of the process carrier to maintain a constant flow rate of the mixed liquid. The method of claim 1, Liquid spray device, characterized in that the material of the mesh is Teflon. The method of claim 1, Liquid spray device, characterized in that the net is formed in a radial shape grooves of a predetermined size in the outer portion from the central portion. The method of claim 1, Liquid net spraying device characterized in that the perforations of a predetermined size formed in the mesh from the central portion to the outer portion. The method of claim 1, And the net is formed in a radiation shape in which the size of the perforation increases from the central portion to the outer portion.