KR20010034149A - Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package - Google Patents

Abstract

The present invention relates to a passive electrical component structure (10) for use with a combination of various insulators (16) and insulating materials to provide one or more separate and shared mode filters (12) for the suppression and surge protection of electromagnetic emissions. . This structure allows a single or multiple component 22 to be assembled into a single package 10, such as an integrated circuit or connector. The part structure is an inductive entity and is provided for integrating various electrical properties within a single part to perform single or combination filtering, separation, association and surge protection functions.

Description

MULTI-LAYERED DIELECTRIC INDEPENDENT PASSIVE COMPONENT ARCHITECTURE RESULTING IN DIFFERENTIAL AND COMMON MODE FILTERING WITH SURGE PROTECTION IN ONE INTEGRATED PACKAGE}

Most electronic components produced today, particularly computers, communications systems, automobiles, military detectors, stereo and home entertainment equipment, televisions, and other applications, are miniaturized components to perform new high-speed functions, and electromagnetic interference or electricity. It includes electrical connections that are very sensitive to stray electrical energy formed by transient voltages in the wiring, depending on their material or small size. Transient voltages can seriously damage or destroy these microelectronic components, rendering them inoperable and requiring expensive repair and / or replacement.

Electromagnetic interference in the form of EMI or RFI is induced into the electrical wiring from its source, such as a radio broadcast antenna or other electromagnetic wave generator. EMI can also be generated from electrical circuitry that is also considered to be shielded from EMI. Separate and shared mode currents are typically generated in cable and circuit board tracks. In many cases, electromagnetic fields are radiated from these electrical conductors that act as antennas. Controlling such conducted / emitted emissions is necessary to prevent interference with the rest of the circuitry or other circuitry that produces or is undesirable noise. Other sources of interference come from electrical wiring, such as computers, switching power supplies, and other devices connected to various systems, which may cause significant interference that would be desirable to eliminate to meet international emissions and / or dielectric conditions. have.

Transient voltages generated in electrical wiring can be induced by all-optical generating very large potential in a very short time. In a similar way, nuclear electromagnetic pulses (EMPs) generate larger voltage spikes with faster fast rise time pulses over a wide frequency band, which is detrimental to most electronic devices. To be. Other sources of large transient voltages have been found to be related to surge voltages that occur when switching off or switching on some electronic power supplies and ground loop interference caused by changing ground potentials. Existing protection devices do not provide adequate protection within a single integrated device, mainly because of their structure and basic materials.

Based on known electromagnetic emission phenomena and excessive surge voltages, various filter and surge suppression circuit configurations have been designed as prior art. Detailed descriptions of various inventions of the prior art are described in US Pat. No. 5,142,430, which is incorporated by reference as part of the invention.

The 430 patent itself relates to power wiring filters and surge protection circuit components and the circuits used to form protection devices for electrical appliances. This circuit component comprises a wafer or disk of material having desired electrical properties, for example varistor or capacitor characteristics. The disks have an electrode pattern and an insulating band on their surface, which interact with the holes formed in the disk to easily and effectively electrically connect the components and the electrical conductor of the system. These electrode patterns work together to form a common electrode of a material interposed therebetween. This 430 patent was primarily concerned with filtering paired wires. The present invention improves and develops the concept for low voltage low current communication wiring and high voltage industrial and household applications such as three phase power wiring, electric motor noise filtering, LAN and other devices directed to computers and electronic devices. Improve the wiring concept.

Accordingly, the applicant's invention is presented in view of the above-mentioned problems of the prior art.

Based on the above-described problems, it is possible to provide a multifunctional electronic component that reduces electromagnetic emissions caused by individual and shared mode currents flowing in electronic circuits, single wiring, paired wiring and multiple twisted pairs. I have found it necessary.

Because of the sensitive nature of electronic technology, there is also a need to incorporate electromagnetic filtering with surge protection so that it is not affected by overvoltage and emissions from the outside. Because today's electronics industry is highly competitive, things like discrete and shared mode filter / surge protectors must be highly integrated to be cheap, miniaturized, inexpensive, and available for many electronic products.

Accordingly, it is a primary object of the present invention to provide a multifunctional electronic component that filters electromagnetic emissions caused by individual and shared mode currents and is easy to manufacture and apply.

It is still another object of the present invention to provide a protection circuit device that can be mass produced and can be applied to include one or more protection circuits in one component device to provide protection against transient voltages and overvoltage and electromagnetic interference. .

It is still another object of the present invention to provide protection circuits having intrinsic grounding functions that provide a passage for reducing EMI and overvoltage, without the need for connecting hybrid electronic components to circuits or grounding bodies.

This and other objects and advantages of the present invention are achieved by using a plurality of common ground conducting plates, each of which surrounds electrode plates separated by a material showing one of a plurality of preset electrical properties or a combination thereof. Is achieved. By connecting a pair of conductors to a plurality of common ground conducting plates and selectively connecting the conductors to the electrode plates, a line-to-line and line-to-ground component connection is obtained, filtering individual and shared mode electromagnetic interference And / or provide surge protection. The circuit arrangement includes at least one line conditioning circuit component composed of plates. An electrode pattern is provided on the surface of one plate, at which time the electrode surfaces are electrically connected to the electrical conductors of the circuit. The electrode pattern, the dielectric material used and the common grounding conduction plate form a coherence between the electrodes for the electrical conductors, which are connected line-to-line between the electrical conductors and line-to-ground from the individual electrical conductors. Create a balanced (same but opposite) circuit arrangement with electrical components.

The specific electrical effects of the individual and shared mode filters are determined by the choice of material between the electrode plates and the use of a ground shield that effectively houses the electrode plates in one or more Faraday cages. If one particular dielectric material is selected, the result will be a capacitive device. Jointly coupled with electrode plates and common ground conducting plates, the dielectric material produces a line-to-line capacitor and a line-to-ground capacitor from each individual electrical conductor. If a metal oxide varistor (MOV) material is used, the filter will be a capacitive filter with overcurrent and surge protection properties provided by the MOV type of material. In the case of high transient conditions, the common ground conducting plate and electrode plate will also form line-to-line and line-to-ground capacitive plates that provide separate and shared mode filtering. Varistor materials of the MOV type, which are used to suppress high transient voltages during these conditions and are essentially nonlinear resistors, will have the effect of limiting the voltage that can appear between electrical conductors.

In other embodiments, the ferrite material may be used to impart additional inductance to the individual and shared mode filter devices. As before, common ground conducting plates and electrode plates form line-to-line and line-to-ground capacitive plates, while ferrite material imparts inductance to the device. The use of ferrite material also provides transient protection in that the ferrite material is conductored at any branch voltage value and the excess transient is classified as a common grounding conduction plate, effectively limiting the voltage in the electrical conductor. .

Numerous other devices and arrangements have also been described, which achieve the above-described objects and advantages of the present invention and show the variety and application of individual and shared mode filters within the scope of the present invention.

This application is a partial continuing application of US Patent Application No. 09 / 056,379, filed April 7, 1998, which filed a partial continuing application of US Patent Application No. 09 / 008,769, filed January 19, 1998. This patent application is partly filed in US Patent Application No. 08 / 841,940, filed April 8,1997. The present invention relates to a filter for protecting electronic circuits from overvoltage, electromagnetic interference (EMI) and preventing electromagnetic emissions. More specifically, the present invention relates to a multifunctional electronic component having a physical structure which suppresses the release of electromagnetic generated internally in the electronic network by the individual and common mode currents and the electromagnetic received from other sources. In addition, due to the physical structure and material composition of the electronic component, the overvoltage surge protection function and the magnetic property may be integrally included in the individual and shared mode filtering functions.

1 is an exploded perspective view of a separate and shared mode filter according to the present invention,

Figure 1a is an exploded perspective view of a modified embodiment of the filter shown in Figure 1,

FIG. 2 is a schematic diagram of the filter shown in FIG. 1, FIG. 2A is a simple schematic diagram, FIG. 2B is a schematic diagram of a physical structure,

FIG. 3 is a logarithmic graph comparing the filter of FIG. 1 with a conventional chip capacitor showing insertion loss as a function of signal frequency, FIG.

4 is an exploded perspective view of multiple conductor individual and shared mode filters used in splice applications;

5 is a schematic diagram of a filter according to the prior art and a separate and shared mode filter, FIG. 5A is a multi-condenser component as seen in the prior art, and FIG. 5B is an electrical representation of a physical embodiment of the discrete and shared mode filter of FIG. It is a drawing that shows how to express,

6 is a plan view of a plurality of common ground conducting plates and electrode plates constituting embodiments of high density multiple conductor individual and common filters,

FIG. 6A is a plan view of a plurality of common ground conductive plates and electrode plates constituting a variant embodiment of the high density multiple conductor individual and common filter shown in FIG. 6, FIG.

7 is a front view of the electrode plate, and FIGS. 7A and 7B are front and rear sides of the electrode plate,

8 is a side view of a modified embodiment of the individual and shared mode filter of FIG. 1 employing the electrode plate of FIG.

9 is a front view of the filter of FIG. 8,

10 is a surface mount chip embodiment of a separate and shared mode filter, FIG. 10A is a perspective view thereof, FIG. 10B is an exploded perspective view thereof,

FIG. 11 is another embodiment of the filter shown in FIG. 10, FIG. 11A is a partially cutaway perspective view of the filter, FIG. 11B is a schematic view thereof,

12 is a multiple filter surface mounting component, FIG. 12A is a top view of the filter, FIGS. 12B-12D are a top view of the inner electrode layers, FIG. 12E is a front view of the cross section of the filter shown in FIG. 12A,

13 is not included,

14 is an exploded perspective view of an individual film plate including other embodiments of separate and shared mode filters,

15 is a front view of a cross section of the film plate of FIG. 14 in operation,

FIG. 16 is another variant of a separate and shared mode filter configured primarily for use in an electric motor, FIG. 16A is a top view of a motor filter embodiment, FIG. 16B is a side view thereof, FIG. 16C is a side view of its cross section, FIG. 16d is an electrical representation of a physical embodiment of the filter shown in FIG.

FIG. 17 shows motor individual and shared mode filters electrically physically connected to an electric motor, FIG. 17A is a top view of the filter connected to the motor, FIG. 17B is a side view thereof,

FIG. 18 is a log plot comparing emission levels in dBuV / m as a function of frequency for an electric motor employing a standard filter and an electric motor employing the individual and shared mode filters of FIG.

19 is another modified embodiment of a motor individual and shared mode filter, FIG. 19A is a plan view of a plurality of electrode plates, FIG. 19B is an exploded perspective view of an electrode plate connected to a plurality of electrical conductors, and FIG. 19C is a motor individual and sharing A physical embodiment of the mode filter is a diagram showing an electrical representation,

20 is a high power embodiment of separate and shared mode filters, FIG. 20A is a schematic diagram thereof, FIG. 20B is a partial schematic block diagram thereof,

21 is a high power discrete and shared mode filter, FIG. 21A is a partially assembled perspective view, FIG. 21B is a schematic view thereof,

FIG. 22 is another modified embodiment of the present invention, FIG. 22A is an exploded perspective view of a variant of the multi-conductor individual and shared mode filter used in the connector application, and FIG. 22B is a front view of the filter shown in FIG. 22A, FIG. 22c is an electrical representation of a physical embodiment of the filter shown in FIG. 22a, FIG. 22d is a diagram showing another electrical representation of a physical embodiment of the filter shown in FIG. 22a,

FIG. 23 is an application of the filter of the present invention, and FIG. 23A is an electrical representation of a physical embodiment of a combined independent surge interference and electromagnetic interference (EMI) device, as shown in FIG. 23B.

FIG. 24 is another application example of the filter of the present invention, and FIG. 24A is an electrical representation of a physical embodiment of a surge protection device combined with a capacitor shown in FIG. 24B.

FIG. 25 is another application of the filter of the present invention, FIG. 25A is a physical embodiment of a separate and shared mode common filter combined with multiple surge protectors, and FIG. 25B is an electrical coupling of the combination shown in FIG. 25A. The drawing is represented by the expression

26 is an elevation view of a modified embodiment of the electrode plate, FIGS. 26A and 26C are front and rear views of the electrode plate, respectively, and FIG. 26B is a side view of the cross section of the same electrode plate,

FIG. 27 is a side view of a cross section of an application in which two electrodes as shown in FIG. 26 are used in an electronic circuit;

FIG. 28 is a side view of a cross section of another application in which two electrodes and a ground plate as shown in FIG. 26 are used in an electronic circuit;

FIG. 29 is an exploded view of the individual inner layers where each inner layer shown constitutes a multi-component strip filter represented by the bottom view of the layer,

FIG. 30 is the multi-component strip filter shown in FIG. 29, FIG. 30A is a top view, FIG. 30B is a front view, FIG. 30C is a rear view, FIG. 30D is a bottom view,

FIG. 31 is an exploded view of the individual inner layers constituting a variation of the multi-part strip filter, wherein each inner layer shown is represented by the bottom view of the layer,

FIG. 32 is an exploded view of the individual inner layers constituting a variant of the multi-component strip filter, wherein each inner layer shown is represented by the bottom view of the layer,

33 is the multi-component strip filter shown in FIG. 32, FIG. 33A is a top view, FIG. 33B is a front view, FIG. 33C is a rear view, FIG. 33D is a bottom view, FIG. 33E is a view showing the end,

FIG. 34 is an exploded view of the individual inner layers constituting a variation of the multi-component strip filter, wherein each inner layer shown is represented by the bottom view of the layer,

FIG. 35 is the multi-component strip filter shown in FIG. 34, FIG. 35A is a top view, FIG. 35B is a front view, FIG. 35C is a rear view, FIG. 35D is a bottom view, FIG. 35E is a view showing the end,

FIG. 36 is an exploded view of the individual inner layers constituting a variant of the multi-component strip filter, wherein each inner layer shown is represented by the bottom view of the layer,

FIG. 37 is the multi-component strip filter shown in FIG. 36, FIG. 37A is a top view, FIG. 37B is a front view, FIG. 37C is a rear view, FIG. 37D is a bottom view, FIG. 37E is a view showing the end,

FIG. 38 is an exploded view of the individual inner layers where each inner layer shown constitutes a multi-part filter represented by the bottom view of the layer,

FIG. 39 is a schematic diagram of the multi-component filter shown in FIG. 38,

40 is an isometric view of the multi-component filter shown in FIG. 38, FIG. 40A is a plan view of the filter, FIG. 40B is a front view of the filter, FIG. 40C is a side view of the filter,

FIG. 41 is another embodiment of the multi-component filter shown in FIG. 38 with an additional ground plane for improved performance, FIG. 41A is an exploded view of individual inner layers of the multi-component filter, and FIG. 41B is a schematic diagram of the multi-component filter. 41C is a chart of attenuation values of the multi-component filter at various test frequencies, FIG. 41D is a graph of the attenuation values of the multi-component filter at various test frequencies listed in FIG. 41C,

42 is another application of a surface mount chip embodiment of separate and shared mode filters, FIG. 42A is a perspective view of another application that includes a partially disassembled T phase network integrated passive filter, and FIG. 42B is a T phase network integration Schematic diagram of a passive filter.

Due to the use of electronics in everyday life and the continual increase in the amount of electromagnetic interference (EMI) and emissions generated, the new global electromagnetic compatibility (EMC) requirements have also led to a variety of digital and analog applications such as homes, hospitals, automobiles and aircraft. It is changing daily for use in the satellite industry. The present invention relates to physical structures for electronic components that provide EMI suppression, broad band I / O-line filtering, EMI shielding noise reduction and surge protection in one assembly.

In order for electromagnetic energy to propagate, two fields, an electric field and a magnetic field are required. The electric field couples energy into the circuit through the voltage difference between two or more points. The magnetic field couples energy into the circuit through inductive coupling. The magnetic field simply results from the current flowing through the passage which may have loop wires. There are both fields in this loop, both of which are also contained in the circuit traces shown on the printed circuit board. These fields begin to branch at frequencies around 1 MHz.

As mentioned above, the propagated electromagnetic energy is a cross product of two fields: electric and magnetic. Typically, it is important to filter the EMI from circuit conductors carrying direct current (DC) with high frequency noise. This is for two reasons, firstly because changing the electric field in free space causes a magnetic field, and secondly, the time-varying magnetic flux causes an electric field. As a result, no pure time varying electric or magnetic field can exist. A field is either an electric field or a magnetic field, but neither can exist except the other.

The main cause of the emission problem is due to two types of conduction currents: current in separate and shared mode. The field generated by this current causes EMI emissions. Discrete mode (DM) currents are those currents that flow in circular paths in wires, circuit boards, and other conductors, and the field caused by these currents originates in the loop formed by the conductors.

The shared and discrete mode currents differ in that they flow in different circuit paths. Shared mode noise currents are surface phenomena relative to the ground, such as, for example, movement outside the grounded cable to the chassis. In order to reduce, minimize or suppress noise, it is necessary to provide a low impedance path to ground while shorting the entire noise current loop.

1, an exploded perspective view of the physical structure of the individual and shared mode filter 10 is shown. The filter 10 has a plurality of common ground conductive plates 14 in at least two electrode plates 16a and 16b, each electrode plate 16 being placed between two common ground conductive plates 14. . At least one pair of electrical conductors 12a, 12b is located in the insulating holes 18 or coupling holes 20 of the plurality of common ground conductive plates 14 and electrode plates 16a, 16b. 12b is also selectively connected to the coupling hole 20 of the electrode plates 16a and 16b. The common ground conducting plate 14 comprises an entirely conductive material, for example a material such as metal in the preferred embodiment. At least one or more pairs of insulating holes 18 are laid through each common ground conductive plate 14 such that the electrical conductor 12 remains electrically isolated between the common ground conductive plate 14 and the electrical conductor 12. Let it flow The plurality of common ground conductive plates 14 may optionally have coupling holes 22 arranged in a predetermined matching position, such that each of the plurality of common ground conductive plates 14 is a standard fastening means such as screws and bolts. To be firmly coupled to one another. The engagement holes 22 can also be used to secure the individual and shared mode filters 10 to other surfaces, such as seals or chassis of the electronics filter 10 used in conjunction therewith.

The electrode plates 16a and 16b are similar in that they are made of a conductive material with the common ground conductive plate 14 and have electrical conductors 12a and 12b placed through the holes. Unlike the common ground conducting plate 14, the electrode plates 16a, 16b are selectively electrically coupled to one of the two electrical conductors 12. As shown in FIG. 1, the electrode plates 16 are shown to be smaller than the common ground conducting plate 14, which is not a requirement, and in this configuration, the electrode plate 16 is physically connected to the coupling hole 22. In order to avoid interference with phosphorus coupling means.

The electrical conductors 12 provide a current path that flows in the direction indicated by arrows located at one end of the electrical conductor 12 as shown in FIG. The electrical conductor 12a refers to the electrical signal movement passage, and the electrical conductor 12b refers to the signal feedback passage. Although only a pair of electrical conductors 12a and 12b are shown, Applicants have determined that individual and shared mode filters 10 provide filtering functionality for multiple pairs of electrical conductors forming high density multi-conductor individual and shared mode filters. Considering being constructed.

The final element forming the individual and shared mode filter 10 is a material 28 having one or more electrical properties and surrounding the central common ground conducting plate 14, wherein the electrode plates 16a, 16b and the electrical conductor The parts of 12a and 12b are completely insulated from each other between all two plates and conductors except for the connection formed by the conductors 12a and 12b and the coupling holes 20 between the two common ground conductive plates 14. Pass in a closed state. The electrical properties of the individual and shared mode filter 10 are determined by the choice of material 28. If a dielectric material is selected, filter 10 will primarily have capacitive properties. Material 28 will also be a metal oxide varistor material that will provide capacitive and surge protective properties. Other materials, such as ferrite and sintered polycrystalline, may also be used, which provide improved covalent mode noise cancellation, inherent inductance and surge protection due to the mutual coupling cancellation effect. . Sintered polycrystalline material materials provide conductivity, dielectric and magnetic properties. Sintered polycrystalline materials are described in detail in US Pat. No. 5,500,629, incorporated herein by reference.

Another material that can be used is a composite of high permittivity ferroelectric material and high permeability ferromagnetic material, which is well disclosed in US Pat. No. 5,512,196, incorporated herein by reference. These ferroelectric ferromagnetic composite materials can be formed from a compact single element, each having both inductive and capacitive properties, functioning as an LC type electric filter. The compactness, shape advantages and filtering capacity of these elements are useful for suppressing electromagnetic interference. In one embodiment, the ferroelectric material is barium titanate, and the ferromagnetic material is a ferrite material such as, for example, ferrite based on copper zinc ferrite. The capacitive and flowable properties of ferroelectric ferromagnetic composites show attenuation capabilities that do not exhibit leveling off at frequencies of 1 Ghz. The geometry of ferroelectric ferromagnetic composites has an important effect on the maximum capacitive and inductive properties of electrical filters employing such composites. This compound can be adjusted during the manufacture of the filter so that the specific properties of the filter provide adequate attenuation for specific applications and specific environments.

Continuing with reference to FIG. 1, the physical relationship between the common ground conducting plate 14, the electrode plates 16a and 16b, the electrical conductors 12a and 12b and the material 28 will be described in more detail. First, the central common ground conducting plate 14. The midplane 14 has a pair of electrical conductors 12, which are laid through separate insulating holes 18, with insulating holes 18 electrically insulating between the common ground conducting plate 14 and the two electrical conductors 12a and 12b. Maintaining state Located above and below the central common ground conducting plate 14 are electrode plates 16a and 16b, respectively, having a pair of electrical conductors 12a and 12b laid through themselves. Unlike the central common ground conductive plate 14, only one electrical conductor 12a or 12b is insulated from each electrode plate 16a or 16b by an insulating hole 18. One of the pairs of electrical conductors 12a or 12b is electrically coupled to the associated electrode plate 16a or 16b through coupling holes 20, respectively. The engagement holes 20 interface with one of the pairs of electrical conductors 12 by standard connection methods such as, for example, solder welding, resistive fit or other methods of providing a robust and robust electrical connection. In order for the individual and shared mode filter 10 to function properly, the upper electrode plate 16a is electrically connected to the electrical conductor 12a to which the lower electrode plate 16b is electrically coupled, i.e., opposite the electrical conductor 12b. Must be combined. Individual and shared mode filters 10 optionally include a plurality of outer common ground conducting plates 14. The outer common ground conduction plate 14 provides a very large ground plane, which helps to dampen electromagnetic emissions and provides a larger surface area to dissipate overvoltage and surges. This is a specific case and is true when multiple common ground conducting plates 14 are not electrically overlapped with circuits or grounds but must rely on providing intrinsic ground. As described above, it is the material 28 that is inserted and maintained between the common ground conductive plates 14 and the two electrode plates 16a and 16b, which may be one or more having different electrical characteristics.

FIG. 1A shows a variant of the filter 10 that includes another means for coupling electrical conductors or circuit board connectors to the filter 10. In essence, the plurality of common ground conducting plates 14 are each electrically connected to an outer edge conductive band or surface 14a. Each electrode plate 16 is provided so as to provide electrical insulation between the other portions of the filter 10 while maintaining electrical connection between the electrode plates 16a and 16b and the conductive bands 40a and 40b associated therewith. Becomes rectangular, and the rectangular portion of the electrode plate 16a is positioned so as to be oriented in the direction opposite to the direction in which the electrode plate 16b is directed. In addition, the rectangular portions of the electrode plate 16 extend beyond the extended length of the plurality of common ground conducting plates 14, and the portions beyond the outer edge conductive bands 40a and 40b by the additional material 28. Insulated. The electrical connection between each band and its associated plates is achieved by physical contact between each band and its associated common ground conducting plate and electrode plate.

2 shows two separate and shared mode filters 10. 2A shows a line-to-line capacitor 30 in which filter 10 is coupled between them, between electrical conductors 12a and 12b, each of which is between one of electrical conductor pairs 12 and intrinsic ground 34. Is a schematic diagram showing providing two line-to-ground capacitors 32 coupled to the circuit. Also indicated by the dashed line is the inductance 36 provided if the material 28 comprises a ferrite material which will be described in more detail later.

FIG. 2B is a quasi-schematic diagram of how the physical component of the filter 10 interacts with the capacitive component shown in FIG. 2A. The line-to-line capacitor 30 includes electrode plates 16a and 16b, where the electrode plate 16a is connected to one of the pairs of electrical conductors 12a and the other electrode plate 16b is opposite. Is connected to an electrical conductor 12b to provide two parallel plates needed to form a capacitor. The central common ground conducting plate 14 functions as the intrinsic grounding body 34 and also serves as one of two parallel plates for each line-to-ground condenser 32.

The second parallel plate required for each line-to-ground capacitor 32 is supplied by the corresponding electrode plate 16. 1 and 2b, the relationship between the capacitive plates becomes clear. When the central common ground conducting plate 14 is insulated from each electrode plate 16a or 16b with a material 28 having electrical properties, the result is a shared mode bypass capacitor extending between the electrical conductors 12a, 12b. a capacitive network having a mode bypass capacitor 30, and a line-to-ground decoupling capacitor connected from each electrical conductor 12a, 12b to the intrinsic ground 34; 32).

The intrinsic grounding 34 will be described in more detail later, but for now it will be easier to assume that it is the same as ground ground or circuit ground. In order to connect the intrinsic grounding body 34 formed by the central and additional common grounding conducting plates 14, one or more common grounding conducting plates 14 are connected via conventional means, for example solder or coupling holes 22. It is connected to the circuit or ground ground by means of a screw which is inserted into which the fastening means is connected to the grounded chassis of the enclosure or electronic element. While the individual and shared mode filters 10 operate identically to the intrinsic grounding 34 connected to the ground or circuit grounding, one advantage of the physical structure of the filter 10 is that no physical grounding connection is required.

Referring again to FIG. 1, another feature of the individual and shared mode filter 10 is shown by clockwise and counterclockwise flux fields 24, 26. By applying Ampere's Law and using the right hand law, the direction of an individual flux field can be determined and drawn. In doing so, as indicated by the arrows at the ends of the conductors, each of them places their thumbs pointing parallel to the direction of the current flowing through the electrical conductors 12a or 12b. If the thumb points in the same direction as the flow of current, the direction in which the remaining fingers of the hand are bent means the direction of rotation of the flux field. Current into and out of the individual and shared mode filter 10, as the electrical conductors 12a, 12b are located next to each other and form a single current loop as seen in many input / output (I / O) and data line configurations. Are opposite directions, forming opposite flux fields that cancel each other and minimize inductance. Low inductance is advantageous in I / O devices and high-speed data lines in modems, with unacceptable voltage spikes that can only be controlled by inductance surge devices with increased switching speeds and fast pulse rice times of modem devices. This is because

It is also clear that the use of separate and shared mode filters 10 provides an easy and cost-effective manufacturing method compared to the combination of discrete components found in the prior art. The connection is made only at one end of the electrical conductor 12, providing a separate mode coupling capacitor and two shared mode separation capacitors, thereby saving time and space.

Figure 3 shows the fertilizer of the insertion loss change with respect to the frequency of the individual and shared mode filter 10 of the present invention and several chip capacitors in the prior art. The graph shows that the chip capacitor 50, configured line-to-line and having a value of 82 pF, and the chip capacitor 56, line-to-ground and having a value of 82 pF, change with nonlinear characteristics. On the other hand, a filter 10 composed of one of the following forms very low linear insertion loss even at a frequency of about 100 MHz: (1) a line having the same value compared to a conventional capacitor 50 having a value of 82 pF- Large-line condenser 54; (2) a line-to-ground capacitor 58 having the same value compared to a conventional capacitor 56 having a 82 pF value; (3) Line-to-ground capacitor 52 having a value of 41 pF compared to conventional capacitors 50 and 56.

An alternative embodiment of the invention is the individual and shared mode multi-conductor filter 110 shown in FIG. The filter 110 has a plurality of common ground conducting plates 112 and a plurality of conducting electrodes 118a to 118h, which are not shown in FIG. 4 but also the electrical conductors 12a and 12b of FIGS. It is similar to the filter 10 of FIGS. 1 and 1A in that it forms a separate mode coupling capacitor and a shared mode split capacitor device operating in a plurality of electrical conductor pairs. As described above with respect to the single pair conductor filter 10 shown in FIG. 1, the conducting electrode 118 and the plurality of electrical conductors are insulated from each other by a preselected material 122 having set electrical properties. Dielectric materials, ferrite materials, MOV type materials and sintered polycrystalline material materials. Each of the plurality of common ground conductive plates 112 has a plurality of insulated holes 114 in which electrical conductors pass while maintaining electrical insulation with the associated common ground conductive plate 112. In order to accommodate multiple pairs of electrical conductors, the individual and shared mode filters 110 must employ a modified form of the electrode plate described in FIGS. 1 and 1A.

In order to provide multiple independent conducting electrodes for each of the conductor conductor pairs, a support material 116 is used that includes one of the materials 122 containing the desired electrical properties. The support plate 116a includes a plurality of conductive electrodes 118b, 118c, 118e, and 118h printed on one side of the support plate 116a, one electrode having one coupling hole 120. The support plate 116b also includes a plurality of conductive electrodes 118a, 118d, 118f, 118g printed on one side of the support plate 116b. The support plates 116a and 116b are separated and surrounded by a plurality of common ground conducting plates 112. Each of the interstitial electrical conductor pairs has a corresponding electrode pair in filter 110. Although not shown, the electrical conductor passes through the common ground conducting plate 112 and associated conducting electrodes. The connection may or may not be made through the selection of the coupling hole 120 and the insulating hole 114. In cooperation with the conducting electrodes 118a through 118h, the common ground conducting plates 112 perform essentially the same functions as the electrode plates 16a and 16b of FIGS. 1 and 1A.

5 shows a schematic diagram of a multiple capacitor component according to the prior art and a separate and shared mode multiple conductor filter 110 of the present invention. 5A is a schematic prior art capacitor arrangement 130. In essence, a plurality of capacitors 132 are formed and coupled to each other to provide a common ground 136 for the arrangement 130, with an open terminal 134 provided for connecting electrical conductors to each capacitor 132. do. When the open terminal 134 of each condenser 132 was electrically connected to a separate electrical conductor, this prior art condenser arrangement enabled the shared mode separation of the individual electrical conductors.

FIG. 5B schematically illustrates a separate and shared mode multi-conductor filter 110 with four separate and common mode filter pin pair pack arrangements. A horizontal line extending through each pair of electrodes means a common ground conductive plate 112, and a line surrounding the pairs is an insulating bar 112a. The insulating bar 112a is electrically coupled to the common ground conducting plate 112 which provides an intrinsic ground grid separating the electrode plates 118a to 118h from each other. Corresponding conductive electrodes 118a through 118h located on the support material plates 116a and 116b located above and below both sides of the central common ground conducting plate 112 form a line-to-ground shared mode separation capacitor. Each of the common ground plate 112 and the support material plates 116a and 116b are separated from each other by the dielectric material 122. When the filter 110 is connected to the paired electrical conductors by such coupling holes 120 shown in the electrode plates 118a and 118c, the filter 110 forms a line-to-line discrete mode filtering capacitor.

Referring again to FIG. 4, a multiple conductor filter 110 is shown having a central common ground conducting plate 112 and an outer common ground conducting plate 112. As described in relation to FIGS. 1 and 1A, these outer common ground conducting plates 112 aid in electromagnetic emission attenuation, provide a larger surface area for canceling and / or absorbing overvoltage, surges and noise, and providing effective Faraday It provides a very large ground plane for the filter 110 which acts as a Faraday shield. This is a specific case when multiple common ground conducting plates 112 are not electrically coupled to a circuit or ground, but instead must be relied upon to provide intrinsic ground.

Another variant of the present invention is the individual and shared mode multiple conductor filter 680 shown in FIG. Filter 680 has been optimized for computers and telecommunications devices, in particular for RJ 45 connectors. To achieve improved filter performance, filter 680 includes built-in chassis and circuit board low frequency noise blocking capacitors in addition to a number of individual and shared mode filters. As shown in FIG. 22A, the physical configuration of the filter 680 is substantially similar to the filter 110 shown in FIG. 4 and includes a first having a plurality of common ground conducting plates 112 and a plurality of conducting electrodes. And second electrode plates 676 and 678 to form multiple discrete and shared mode filters including chassis and board blocking capacitors. As described in the previous embodiment, the conducting electrodes 686, 688, 690, 692, the blocking electrodes 682, 684, electrical conductors (not shown) passing through the various plates are connected to each other by the material 122. Are insulated against. In order to realize the defined electrical properties in the filter 680, as in all other embodiments of the present invention, the material 122 may be composed of a dielectric material, ferrite, MOV type material or sintered polycrystalline material. Each common ground conducting plate 112 includes a plurality of insulating holes 114 through which electrical conductors remain insulated from the common ground conducting plate 112. To obtain another chassis and board noise blocking capacitor, the filter 680 employs a variation of the electrode plate of FIG.

As described in FIG. 4, to provide multiple independent components for multiple pairs of electrical conductors, material 122 may also be used as a support material used to fabricate first and second electrode plates 676, 678. 116). The first electrode plate 676 is made of first and second conductive electrodes 682 and 686 and a blocking electrode 688, both of which are printed on one side of the support material 116. The second electrode plate 678 is made of the first and second conductive electrodes 684 and 690 and the blocking electrode 692, both of which are printed on one side of the support material 116. The first and second electrode plates 676, 678 are then separated and surrounded by a common ground conducting plate 112. The difference between the filter 680 and the previous embodiment considering the combination of individual and shared mode filters with a built-in chassis and board noise blocking capacitor is that the first and second conducting electrodes and the first and second electrode plates 676. 678) is the structure of the blocking electrode above. Each of the first and second conductive electrodes 686 and 688 of the first electrode plate 676 includes one coupling hole 120 positioned in the electrode. The blocking electrode 682 is formed to partially surround the first and second conductive electrodes 686 and 688, and includes a plurality of insulating holes 114 and coupling holes 120. The second electrode plate 678 is the same as the first electrode plate 676, the first and second conductive electrodes 690 and 692 correspond to the first and second conductive electrodes 686 and 688, and the blocking electrode. 684 corresponds to the blocking electrode 682. As best shown in FIG. 22A, when coupled between the various common ground conducting plates 112, the first and second electrode plates 676, 678 are placed in opposite directions. This particular arrangement of the first and second electrode plates 676, 678 has a traditional RJ 45 pinout configuration when the filter 680 is used for the contactor. Applicants are contemplating different configurations of conducting and blocking electrodes depending on the desired pinout or wire device, and it should be appreciated that no device of the inverted form of the first and second electrode plates 676, 678 is required.

As in other embodiments, the plurality of electrical conductors will pass through the common ground conducting plate 112 and the first and second electrode plates 676, 678. Although there is no electrical conductor, FIG. 22B shows that this specific embodiment of the filter 680 is adapted to accommodate eight conductors according to the RJ 45 connector standard. The interaction of the various conducting electrodes in the filter 680 will be described with reference to FIGS. 22A-22D, and FIG. 22B is also included to correlate the electrical representation and physical embodiments of the filter 680. 22D is another electrical representation of filter 680 to be mentioned as needed. The signal ground (SG) of the filter 680 is provided by a combination of common ground conducting plates 112 that function as a unique ground body. The physical separation of the various conducting electrodes of the first and second electrode plates 676, 678 by the conducting plane of the common ground conducting plate 112 essentially serves as a grounding body while providing a substantial ground plane that will aid in the attenuation of electromagnetic emissions. An effective Faraday shield that provides a filter 680, provides a larger surface area to cancel and / or absorb overvoltage, surges and noise, protects the filter from external electrical noise and prevents electrical noise by the filter 680 It functions as a faraday shield.

22B, 22C, and 22D, referring to numerals 1 through 8 of various electrical conductors (not shown), electrical conductors 3, 5 are formed through first and second coupling holes 120. Two conducting electrodes 686 and 688, respectively. The electrical conductors 4, 6 are connected to the first and second conductive electrodes 690, 692, respectively, via coupling holes 120. The electrical conductors 1 and 7 are respectively connected to the blocking electrode 684 through the coupling holes 120, and the electrical conductors 2 and 8 are respectively connected to the blocking electrodes 682 through the coupling holes 120. Referring to FIG. 22D, the electrical conductors 3, 6 are differentially filtered by the interaction of the first and second conductive electrodes 686, 692, where the first and second conductive electrodes 686, 692 are opposed. It functions as a plate to form a line-to-line capacitor between the electrical conductors 3 and 6. Each of the same electrical conductors is subjected to shared mode filtering through a line-to-ground capacitor formed by the interaction of the first and second conductive electrodes 686 and 692 with the common ground conducting plate 112. 112 forms a line-to-ground capacitor between each electrical conductor and the intrinsic ground, which is formed by a plurality of common ground conducting plates 112.

The same relationship exists in the electrical conductors 4, 5 connected to the first and second conductive electrodes 690, 688, respectively. The first and second conducting electrodes 690, 688 form a line-to-line capacitor and each interact with the common ground conducting plate 112 to form a shared mode filter capacitor for each electrical conductor. In addition to a number of individual and shared mode filters created by the interaction between the various conducting electrodes and the common ground conducting plates, the chassis and board noise blocking capacitors are also common ground conducting plates 112 and blocking electrodes 682, 684. Is formed by the interaction of For example, the chassis grounding body is connected to the electrical conductors 1 and 7, both of which are connected to the blocking electrode 682 through the coupling holes 120 to form a plate of the noise blocking capacitor. The other plate of the noise blocking capacitor is formed by the common ground conducting plate 112 which interacts with the blocking electrode 682. Although replaceable, the electrical conductors 2, 8 also provide a board noise blocking capacitor formed by the interaction of the common ground conducting plate 112 and the blocking electrode 682. Chassis and board noise blocking capacitors block low-frequency electrical noise from the signal-carrying conductor by causing the intrinsic ground formed by the common ground conducting plate 112 to be disconnected. This essentially eliminates the inherent ground formed by the common ground conduction plate 112 to improve the performance of the individual and shared mode filters.

Figure 6 illustrates another embodiment of the present invention that provides input / output data line pair filtering for a large number of electrical conductor pairs in today's high density information and data buses. The individual and shared mode high density filter 150 has a plurality of common ground conducting plates 112 having a plurality of insulating holes 114, and an electrode pattern 118, an insulating hole 114, and a coupling hole 120, respectively. Conductive electrode plates 116a and 116b. The stacking order is shown in FIG. 6, allowing the dielectric material to surround the individual plates, as described in the previous example.

FIG. 6A illustrates a variation in which individual and shared mode high density filters 150 have been developed with higher capacitance and ground-to-line using tri-coupling of electrodes. In addition, the filter 150 includes a plurality of common ground conductive plates 112 each having a plurality of insulating holes 114, and conductive electrode plates 119a to 119c each having electrode patterns 117a to 117c. Each conductive electrode plate 119a through 119c has a plurality of insulating holes 114 and coupling holes 120 at set positions to selectively couple the electrical conductor pairs to pass through them to form the desired filter structure. . The stacking order of the plates shown in FIG. 6A is similar to that shown in FIGS. 1, 1A, 4, and 6, and the set dielectric material 122 surrounds each of the individual plates of different thicknesses.

7-9 show the use of such plates in a single hole electrode plate 70 and variations of the individual and shared mode filters of the present invention. 7 shows two sides of the electrode plate 70, FIG. 7A is the front side, and FIG. 7B is the rear side. Referring to FIG. 7A, electrode plate 70 comprises a material 72 having certain electrical properties, such as ferroelectricity, or other material as previously described, which material 72 is molded into a desired shape, In this case, it is molded in a disk shape. The hole 78 is placed through the electrode plate 70 to pass the electrical conductor. The front face of the electrode plate 70 is partially covered by a conductive surface to form an insulating band 82 around the outer periphery of the electrode plate 70. Enclosure hole 78 is a solder band 80 that, once heated, adheres to an electrical conductor placed through hole 78 to electrically connect the conductor to conductive surface 74. Referring to FIG. 7B, the back side of the electrode plate 70 is similar to the front side in that the conductive surface 74 is secured to the material 72 to provide an insulating band 82 around its periphery. The difference from the front side is that the hole 78 is surrounded by the insulating band 76 to prevent any connection between the electrical conductor and the conducting surface 74 on the back of the electrode plate 70.

8 and 9 show how multiple electrode plates 70 can be used to form individual and shared mode filters 90. The construction of the filter 90 differs from the previous embodiment in that the common grounding conducting plate 98 is provided between the at least two electrode plates 70 to provide a parallel plate arrangement required to form a plurality of capacitive elements. similar. As shown in FIG. 9, one electrode plate 70 is coupled to one side of the common ground conductive plate 98, and the second electrode plate 70 is coupled to the opposite side of the conductive plate 98. Compensate for a distance sufficient to allow conductors 92a and 92b to pass through one electrode plate 70 without interfering with another electrode plate 70 coupled to the opposite side of common ground conductive plate 98. Although not shown, the common ground conducting plate 98 may include holes in a set position corresponding to the associated holes of the electrode plate 70 to allow electrical conductors 92a and 92b to pass through as shown in FIG. 8. It can be clearly seen.

The common ground conducting plate 98 functions as and provides a unique ground 96, which may be connected to ground or signal ground if desired. The engagement hole 22 allows the filter 90 to be mechanically coupled to the structure. One means for physically coupling the electrode plate 70 to the common ground conductive plate 98 is shown in FIG. 8. Interposed between the common ground conductive plate 98 and the rear surface of the electrode plate 70 is fixed to the surface of the common ground conductive plate 98 corresponding to the conductive surface 74 of the rear surface of the electrode plate 70 when heated. It is the solder welding point 84 which becomes. When connecting the electrode plate 70 to the common ground conducting plate 98, the backside of the electrode plate 70 always faces the corresponding side of the common ground conducting plate 98. The same mechanical coupling means is used for the two electrode plates. Solder band 80 for electrode plate 70 is shown, which connects only one of the two electrical conductors 92a, 92b to its associated electrode plate. The common grounding conduction plate 98 and electrode plate 70 arrangements provide line-to-line discrete mode filtering between the electrical conductors 92a and 92b and line-to-ground separation for each of them. Individual mode filtering is achieved by conducting surfaces 74 on the front of the two electrode plates 70, which are either parallel to the plates of the condenser coupled between the electrical conductors 92a and 92b or line-to-line. Function. Line-to-ground separation is provided by each electrode plate 70 serving as one capacitive plate and a common ground conducting plate 98 serving as the other parallel capacitive plate. The parallel capacitive plate provided by the common ground conducting plate 98 and functioning as the intrinsic ground 96 provides a ground disconnect connection for each electrical conductor 92a, 92b.

The individual and shared mode filters 90 shown in Figs. 8 and 9 are relatively simple in structure, and the voltage and current determining capacity are limited only by their physical structure so that they can be easily expanded or reduced according to desired characteristics. Has the advantage in that it can.

26, 27, and 28 illustrate the use of a dual hole electrode plate 600 and multiple such plates in another variation of the individual and shared mode filters of the present invention. Referring to FIG. 26A, electrode plate 600 includes a material 616 having defined electrical properties, which is molded into a desired shape as shown here by a disk. The first side of the dual hole electrode plate 600 is shown in FIG. 26A, which includes first and second holes 602 and 604, each having an insulating band 606, the insulating band being in contact with the hole. The first conductive surface 608 is separated. The second side of the dual hole electrode plate 600 is shown in FIG. 26C, which is a first hole 602 with an insulating band 606 and an insulating band extending along the outer periphery of the electrode plate 600. A second hole 604 is directly connected to the second conductive surface 610 that lies over most of the second side of the dual hole electrode plate 600 except 612. FIG. 26B shows a first conductive surface 608 electrically coupled to a side conductive surface 614 that surrounds the dual hole electrode plate 600. An insulating band 612 located along the periphery of the second side of the dual hole electrode plate 600 physically separates and electrically insulates the first and second conductive surfaces 608, 610 from each other.

When two electrical conductors pass through the first and second holes 602, 604, only the electrical conductor passing through the hole 604 will be electrically connected to the second conductive surface 610. The function of the dual hole electrode plate 600 is the same as that of the single hole electrode plate 70 shown in FIG. For example, the electrode plates 600 do not need to be arranged in an offset form.

FIG. 27 shows how the multiple dual hole electrode plate 600 is used to form the individual and shared mode filter 626, where the individual and shared mode filter comprises two dual hole electrode plates 600. As shown in FIG. Obtained by electrical connection, with the result that the first side of each electrode plate 600 shown in FIG. 26A faces the first side of the opposing electrode plate 600, and the first electrode of each electrode plate 600. The figure 608 is electrically connected through a means known in the art, for example, the molten solder 622 between two first conductive surfaces 608. Two electrical conductors 618, 620 pass through the aligned holes of each of the dual hole electrode plates 600, wherein the electrical conductors 618 are connected to the second conductive surface 610b of the electrode plate 600b. The electrical conductor 620 is electrically connected to the second conductive surface 610a of the electrode plate 600a. In the same principle as for the individual and shared mode structures of the present invention, the first conductive surfaces 608a, 608b form a common ground conductive plate that provides intrinsic ground for the individual and shared mode filters 626 and the like. Function The second conducting surfaces 610a, 610b of each electrode plate 600a, 600b function as individual conducting electrodes forming two plates that form individual capacitors connected between the electrical conductors 618, 620. In addition, the second conductive surfaces 610a and 610b together with the first conductive surfaces 608a and 608b serving as intrinsic grounds form a shared mode separation capacitor. One advantage of the dual hole electrode plate 600 compared to the single hole electrode plate 70 shown in FIG. 7 is that an independent common ground conducting plate is not required. The first conductive surfaces 608a and 608b form a common ground conductive plate and function as such. If necessary, an independent common ground conducting plate 624 with aligned insulating holes is placed on the double hole electrode plates 600a, 600b as shown in FIG. 28 to provide a larger ground area for distributing electrical noise and heat. It is possible to provide an improved inherent ground with

One trend found through modern electronic devices is the continued miniaturization of devices and the electronic components that form them. Capacitors, a key component of individual and shared mode filters, are no exception, and their size has continued to decrease to the extent that they are made of silicon and planted in an integrated circuit that can only be seen under a microscope. One fairly common miniature capacitor is a chip capacitor, which is much smaller than a standard through hole or leaded capacitor. Chip capacitors use surface mount technology to physically and electrically connect the electrical conductors and traces of the circuit board. The structural diversity of the individual and shared mode filters of the present invention extends to the surface mounting technique shown in FIG. The surface mount individual and shared mode filter 400 is shown in FIG. 10A and its internal structure is shown in FIG. 10B. Referring to FIG. 10B, the common ground conductive plate 412 is positioned between the first individual plate 410 and the second individual plate 414. The common ground conducting plate 412 and the first and second individual plates 410 and 414 each comprise a material 430 having the desired electrical properties determined by the selection of the material. As with all embodiments of the present invention, Applicants are not limited to various materials such as dielectric materials, MOV type materials, ferrite materials, new foreign materials such as sintered polycrystalline materials and Mylar. Consider the use of film.

The first individual plate 410 has a conductive electrode connected to the top surface of the material 430 such that the insulating band 418 surrounds the outer circumference of the first individual plate 410 along three of the four sides thereof. 416). The insulating band 418 is a portion formed along the edge of the material 430 and is not covered by the conductive electrode 416. The second individual plate 414 is essentially similar to the first individual plate 410, but has a different physical orientation from the first individual plate 410. The second individual plate 414 has a conductive electrode connected to the top surface of the material 430 such that the insulating band 428 surrounds the outer circumference of the second individual plate 414 along three of its four sides. 426). An important point to know about the physical orientation of the first and second individual plates 410 and 414 with respect to each other is that the sides of the insulation bands 418 and 428 which are not in contact with the outside in each plate are 180 ° relative to each other. Is spaced apart. This orientation allows each electrical conductor to be coupled to either one of the individual plates 410 or 414 but not both.

The common plate 412 is structurally similar to the first and second individual plates 410 and 414 in that the common conducting electrode 424 includes a material 430 coupled to its top surface. As can be seen from FIG. 10B, the common plate 412 has two insulating bands 420, 422 located at opposite ends. The common plate 412 is aligned between the first and second individual plates 410 and 414 so that the insulating bands 420 and 422 have ends of the first and second individual plates 410 and 414 having no insulating bands. Is sorted on. The common plate 412 and the first and second individual plates 410 and 414, all three plates, do not have a conducting surface on the lower surface thereof, so that when the plates are stacked in layers, the conducting electrode 426 becomes The backside of 412 is insulated from the common conducting electrode 424. In the same way, the conductive electrode 424 is insulated from the conductive electrode 416 by the backside of the first individual plate 410 comprising the material 430.

With reference to FIG. 10A, the structure of the surface mount discrete and shared mode filter 400 is further described. If the common plate 412 and the first second individual plates 410 and 414 are sandwiched together according to the arrangement shown in FIG. 10B, means for coupling the electrical conductors to different electrodes should be included. The electrical conductors are coupled to the surface mount discrete and shared mode filter 400 via a first discrete conductive band 404 and a second discrete conductive band 406, with the conductive bands located between the bands 402, 404, 406. The insulating band 408 is insulated from the common conductive band 402. The common conductive band 402 and the insulating band 408 extend 360 degrees around the body of the filter 400, providing insulation on all four sides. The first and second individual conductive bands 404, 406 extend 360 degrees around the filter 400 as well as cover the ends 432, 434, respectively.

10A and 10B, the coupling between the bands and the plates can be seen. The first individual conductive band 404 including the end 434 maintains electrical coupling with a conductive electrode 416 having no insulating band 418 extending at the end of the first individual plate 410. The second individual conductive bands 406 are electrically insulated by the insulating bands 422 and 428 with respect to the common plate 412 and the first individual plate 410, respectively. In a manner similar to that just described, the second individual conductive band 406 having the end 432 is electrically coupled to the conducting electrode 426 of the second individual plate 414. By the insulating bands 420, 418 and the first individual plate 410 of the common plate 412, the second individual conductive band 406 is electrically connected to the first individual plate 410 and the common plate 412. Insulated.

Electrically coupling the common conductive band 402 to the common plate 412 allows the sides 436 of the common conductive band 402 to the common conductive electrode 424 lacking an insulating band along the sides of the common plate 412. It is obtained by physically combining. In order to maintain electrical insulation with respect to the first and second individual conductive bands 404, 406 of the common conducting electrode 424, the insulating bands 420, 422 of the common plate 412 have a first and a second individual conductivity. Ends 432 and 434 of the bands 404 and 406 prevent physical coupling to the common conducting electrode 424.

As with other embodiments of the discrete and shared mode filters of the present invention, the conducting electrodes 416, 426 of the first and second discrete plates 410, 414 have electrical conductors of the first and second discrete conductive bands 404. And, when coupled to 406, function like a line-to-line discrete mode capacitor. A line-to-ground separation capacitor is formed between each of the conducting electrodes 416, 426 and the common conducting electrode 424 providing intrinsic ground.

FIG. 11 illustrates a surface mounted discrete and shared mode filter 438 which is another embodiment of the filter shown in FIG. 10. Some cutaway perspective views illustrate how the first and second individual conductive bands 446, 450 are electrically connected to the electrode plates 448, 452. Also shown is an electrical connection between the common conductive band 442 and the common ground conducting plate 440, where the common conductive band 442 is the body of the surface mount filter 438, as shown in FIG. 10. The difference is that they do not extend continuously around 360 °.

Another noticeable difference between the filter 438 of FIG. 11 and the filter 400 of FIG. 10 is that the filter 438 includes a plurality of electrodes and common ground conduction plates 448, 452, 440. An advantage of using multiple common ground conducting plates and electrode plates is that larger capacitance can be obtained while keeping the size of the surface mount filter 438 to a minimum. Condensers, such as resistors, can be placed in series in parallel. The total resistance value of a series of multiple resistors is the sum of the individual values, and the opposite relationship holds for the capacitor. In order to achieve the additional effect, the capacitors must be positioned parallel to one another as the filter 438 connects the plurality of plates to the first and second individual conductive bands 446, 450 and the common conductive band 442. As in the previous embodiment, the material 454 with the desired electrical properties surrounds the plurality of electrode plates 448 and 452 and the common ground conducting plate 440 to insulate them from each other, and corresponding electrical properties. To the individual and shared mode filter devices. FIG. 11B shows a schematic equivalent diagram of the relationship between surface mount individual and shared mode filters 438 and multiple common ground conduction plates 440 and multiple electrode plates 448, 452.

Electrode plates 448 and 452 are electrically coupled to associated conductive bands 450 and 446, respectively. The electrical conductors are then coupled to the first and second individual conductive bands 446, 450, and the plurality of electrode plates 448, 452 arranged in parallel provide electrical conductors that provide line-to-line discrete mode coupling. Function to provide the total capacitance value coupled between them. Multiple common ground conducting plates 440 cooperate with electrode plates 448 and 452 to provide a line-to-ground separating capacitor between each electrical conductor and common conductive band 442. Multiple common ground conducting plates 440 function as a unique ground that may also be connected to signal ground or ground ground via common conductive band 442. Again, the physical structure of the present invention has been made in consideration of various changes, and by varying the number of plates and / or the size thereof, a wide range of capacitance values and filter characteristics can be obtained.

FIG. 12 shows a variant of a multi-part surface mounted discrete and shared mode filter incorporating two separate filters and one electronic component. It should be understood that any number of individual filters can be merged into a single electronic component, and the present invention is not limited to two filters. 12A shows one connection device, and FIGS. 12B-12E disclose an internal electrode and a common ground conductive layer. The first and second individual conductive bands 154, 156 are coupled to the electrode plates 153, 155, respectively, and similarly, the bands 154 ′, 156 ′ are coupled to the electrode plates 153 ′, 155 ′. It is. As previously described, the multi-component surface mount filter 160 includes a material 166 having certain electrical properties distributed between the plurality of electrodes and the common ground conductive layer. The common ground conductive band 164 is electrically connected to the common ground conductive plate 163. Applicants are considering multiple components in a single electronic package, and the shape, placement and / or length and width of the first and second individual conductive bands 154 and 156 and the common conductive band 164 are desirable for any type of printing. It should be appreciated that it may be modified to accommodate the circuit board footprint. The conductive and common bands are only required to be electrically coupled to the associated electrode plate and common ground conductive plate 163 while maintaining electrical isolation from each other. The concept shown in FIG. 12 can be very easily extended to including 10, 20 or 100 individual and shared mode filters if necessary. Multi-part surface mount discrete and shared mode filters 160 are particularly useful for providing filtering functionality on large data buses, typically having 32 or 64 data lines. These data buses are also extremely susceptible to overvoltage and surge voltages that handle digital information at extreme high frequencies that emit a lot of electromagnetic energy and damage circuits and distort data.

Figures 23 and 24 show an application to the previously described surface mount filter shown in Figure 11, which includes an electrical representation. FIG. 23 shows a combination with a discrete and shared mode capacitive filter 400b that provides discrete and shared mode surge protection of the coupled and shared mode MOV filter 400a coupled in parallel, with the increased capacitance being the MOV element. It is not obtained alone. FIG. 23B shows that the filters 400a and 400b are physically stacked together so that the first individual conductive bands 446a and 446b are electrically coupled to each other, and the second individual conductive bands 450a and 450b are electrically coupled to each other. Common conductive ground bands 442a and 442b are shown electrically coupled to each other, as represented by 443. The insulating bands 444a and 444b of the two filters are also aligned because the physical structures of the filters 400a and 400b are identical except for the electrical properties of the materials used to separate the various conductive electrodes, respectively. Although not shown, Applicants are contemplating parts of the invention that are not only physically identical, but also stacked and merged according to the specific application in which the parts are used. An advantage of the physical construction of the surface mount filters or components of the present invention is that they can be stacked while saving space in the circuit, which is consistent with the modern electronics trend of miniaturization.

The result is shown in FIG. 23A, where an electrical conductor (not shown) is coupled between the first individual conductive bands 446a and 446b and the second individual conductive bands 450a and 450b to separate and share modes. Provide filtering and surge suppression. This combination improves the overall filter response due to the increased capacitance combined with overvoltage and surge protection. 24 shows the electrical representation resulting from surface mount capacitor 720 coupled between first and second individual conductive bands 446 and 450 of individual and shared mode MOV surge / filter 400a. Another application showing the line-to-line capacitance provided is shown. The circuit configuration is also increasing the resulting capacitance of the individual and shared mode MOV surge / filter 400a. As in FIG. 23, an electrical conductor (not shown) includes a combination of a first individual conductive band 446 and a first conductive band 724, and a second individual conductive band 450a and a second conductive band 722. Are combined between the combinations of

38-40 show two more steps of stacking the components shown in FIGS. 23 and 24 by stacking two or more individual and shared mode filters in a single component package. The multi-component filter 806 shown in FIG. 38 is the same as many other embodiments of the present invention, except that the number of plates is doubled, tripled, or multiplied by the same number of components stacked in a single component package. It is composed of methods. FIG. 38 illustrates various plates forming first and second filters 814, 816 of a multi-component filter 806 with their branch points between two filters, shown by dashed lines 818. The first and second filters 814, 816 are structured in a similar manner. Each filter includes a plurality of common ground conducting plates 808, the first and second electrode plates 810, 812 for the filter 814, and for the filter 814, for the filter 814. Different first and second electrode plates 811 and 813 are sandwiched between the various common ground conductive plates 808. Each of the common ground conducting plate 808 and the second electrode plates 810-813 are stamped or etched onto a support material having defined electrical properties using various techniques well known in the art. When the various layers are stacked, additional materials (not shown) with defined electrical properties are placed therebetween to electrically insulate the various ground and electrode plates from each other.

As shown in FIG. 39, two or more individual and shared mode filters are combined in parallel as a result of stacking the first and second filters 814 and 816 therein. The multi-component filter 806 shown in FIGS. 39 and 40 consists of first and second filters 814, 816, wherein the first electrode plate 810, 811 of each filter has a first individual conductive band 822. ), The second electrode plates 812, 813 of each filter are coupled together to a second individual conductive band 824, and all of the various common ground conductive plates are joined together to the common ground conductive band 820. Are combined. 40 illustrates an isometric view of a surface mount component package with a multi component filter 806 contained therein. The package is covered by an insulated outer casing 826 except for the various conductive bands used to electrically couple the outer circuit and filter 806.

Although only two filters are shown stacked in a single component package, Applicant is considering additional components stacked internally and is not intended to be limited to the embodiment shown in FIGS. 38-40. One specific application of the internal stacking technique is shown in the combination of a high capacitance filter combined with a low capacitance filter, which results in a wide band filter with improved filtering performance over a wider frequency range. Referring to FIG. 38, the first and second discrete plates 811, 813 of the second filter 816 include a conducting surface 830 that is smaller than the conducting surface 828 seen in the first filter 814. do. By varying the size of the conducting surfaces of the first and second discrete plates, the actual capacitance of the filter can be varied. The multi-component filter 806 is a combination of the high capacitance filter 814 and the low capacitance filter 816, which combination provides a single multi component filter 806 that provides the advantages of a high capacitance filter with improved high frequency performance. To provide.

41A-41D are variations of individual and shared mode filters stacked in the single component package shown in FIGS. 38-40. The multi-component filter 900 shown in FIG. 41A is constructed in the same manner as the stacked discrete and shared mode filters of FIG. 38, with additional common grounding conduction plates 912. FIG. 41A shows various metalized layers or plates that make up the first and second filters 914, 916 of the multi-component filter 900 with their branching points positioned between two filters indicated by dashed lines. have. The first and second filters 914, 916 are constructed in a similar manner. Each filter includes a plurality of common ground conducting plates 902, the first and second electrode plates 904, 906 for the filter 914, and for the filter 914 for the filter 914. Different first and second electrode plates 905 and 907 are sandwiched between the various common ground conductive plates 902. Each of the common ground conducting plate 902 and the first and second electrode plates 904-907 are stamped or etched onto a support material having defined electrical properties using various techniques well known in the art. When the various layers are stacked, additional materials (not shown) with defined electrical properties are placed therebetween to electrically insulate the various ground and electrode plates from each other.

As shown in FIG. 41B and as in the previous embodiment, two or more individual and shared mode filters are coupled in parallel as a result of stacking the first and second filters 914, 916 therein. As shown in FIG. 40 for the previous embodiment of the multi-component filter 900, the filter 900 consists of first and second filters 914, 916, the first electrode plate 904 of each filter. , 905 are coupled together to the first individual conductive band 918, and the second electrode plates 906, 907 of each filter are coupled together to the second individual conductive band 920, and all of the various common ground conduction The plates are coupled together to the common ground conductive band 924. Various conductive bands are identified only in connection with the schematic representation shown in FIG. 41B. Although not shown, the surface mount packaging of the multi-component filter 900 is the same as that shown in FIG. 40 for the filter 806, where the first individual conductive band 822 is equivalent to the band 918. The second individual conductive band 824 is equivalent to the band 920, and the common ground conductive band 820 is equivalent to the band 924.

41C and 41D show graphically the attenuation characteristics of a single discrete and shared mode filter of the present invention and the multi-component filter 900 shown in FIGS. 41A and 41B. The first column of the chart in FIG. 41C shows the test frequency range from 1 MHz to 2000 MHz in which the attenuation characteristics of both filters are measured. In FIG. 41C the second and third columns refer to the attenuation measurements measured from a single individual and shared mode filter configured to have a value of 0.1 ?? F. In FIG. 41A, a single 0.1 μF discrete and shared mode filter is shown at 916. Columns 4 and 5 of FIG. 41C show the attenuation characteristics of a multi-component filter including 0.1 FF filter 916 and 4.8 nF filter 914 stacked and coupled in parallel to form filter 900. Characteristic details of columns 2 to 5 in FIG. 41C represent attenuation values in decibels. Column 2 is the attenuation characteristic measured from line-to-ground or X-to-ground, as shown in FIG. 41B. Column 3 is the attenuation characteristic measured from the X-to-ground when points X and Y in FIG. 41B were shorted. Columns 4 and 5 were measured in the same way as columns 2 and 3, with column 4 being line-to-ground and column 5 shorting points X and Y and from or to line The attenuation value measured from -to-ground.

41D is a graph of the attenuation curves for the two filters. As can be seen from FIG. 41D, as a result of the additional common ground conduction plate 912 between the first and second filters 914, 916 and between the upper and lower layers of the filter 900, The resonance point of filter 900 has increased to a higher frequency. The additional insulation provided by the common ground conduction plate 912 provides the filter 900 with improved noise and ground bounce performance, while any filter 900 is coupled from its ground. A printed circuit board of removes additional fields lined up between the hot facing sides of the filter 900. An additional common ground conducting plate 912 provided as the upper layer and lower layer of the filter 900 also maintains separate and shared mode fields within the plate 912 to create a Faraday cage effect.

FIG. 25 merges the individual and shared mode filters 10 as shown in FIG. 1 coupled to two MOV electrode plates 700, one on the top of the filter 10 and one on the bottom of the filter 10. Another variant application for forming a filter incorporating a separate and shared mode surge protection function and a capacitive filtering function as shown in FIG. 23 is disclosed. The combination as shown in FIG. 25A provides the additional advantage that both the filter and the MOV component can be coupled while enabling through coupling of the electrical conductors 12a, 12b. The embodiment shown in FIG. 23 does not require a separate MOV since it is configured for the surface mounting technique according to the present invention. Since the MOV component having through coupling holes is generally not usable due to the disturbing effect, the embodiment shown in FIG. 25A is necessary, which impairs the MOV characteristics as the holes have in full operation. In order to allow the MOV 700 to be electrically connected to the electrode plates in the individual and shared mode filters 10 shown in FIG. 1, several modifications to the surface of the filter 10 are necessary. The top and bottom surfaces 820 and 822 of the individual and shared mode filter 10 are deformed as shown in FIG. 25C so that one insulating hole 18 is a through-hole plated coupling aperture 718. Replaced by The through plate coupling holes 718 of the upper surface 820 and the lower surface 822 are positioned such that each corresponds to the opposing electrical conductor 12a or 12b. Although not shown, each through plate coupling hole 718 is electrically connected to one of two electrode plates planted in the individual and shared mode filter 10, such that the electrical conductors 12a and 12b are connected to the conductors 12a and 12b. It is possible to be electrically connected to the associated electrode plate which forms a line-to-line individual capacitor between them. To enable the MOV 700 to be coupled to the top and bottom surfaces of the individual and shared mode filters 10, the through plate coupling hole 718 includes a strip 824 of conductive material, wherein One of two contact points of each MOV 700 is electrically connected. Each MOV 700 includes two terminals 828 and 830, to which other circuits are electrically coupled. As shown in FIG. 25A, the terminals 830 of the two MOVs 700 are physically and electrically coupled to the conducting surface 826 of the individual and shared mode filter 10 through standard means such as solder applications. do. The conducting surface 826 of the individual and shared mode filter 10 is electrically coupled to the common ground conducting plate 14 as shown in FIG. 1. The terminals 828 of each MOV 700 are physically and electrically coupled to a conductive strip 824 that connects the terminal 828 to the associated electrical conductors 12a, 12b by solder 710, in turn being individually and It is connected to the internal electrode plate of the shared mode filter 10. The result is shown in FIG. 25B, which shows the discrete and shared mode MOV surge protection and the discrete and shared mode capacitive filtering between terminals 716a and 716b electrically coupled to electrical conductors 12a and 12b. Combinations.

29 and 30 illustrate another variant of a multi-part surface mount individual and shared mode filter designed to provide a strip of filters for varied uses. The particular design is for multiple conductor electrical connectors. As in another embodiment of the invention, the strip filter 642 includes a plurality of common ground conductive plates 656, wherein the first and second electrode plates 662, 664 are various common ground conductive plates 656. Sandwiched in between. The strip filter 642 shown in FIG. 29 has four separate and shared mode filter sets. As described throughout the specification, each common ground conducting plate 656 is etched onto a support material 616 having defined electrical properties, such that portions of the material 616 are formed of each common ground conducting plate 656. It functions as an insulator on either side, where only ground extension 660 extends to the edge of support material 616. Various first and second electrode plates 662, 664 are also formed over strips of support material 616, with each electrode plate except for electrode extension 666 extending to the edge of support material 616. Is surrounded by material 616. As can be seen from FIG. 29, each electrode extension 666 of the first electrode plate 662 extends in the opposite direction to the electrode extension 666 of the corresponding second electrode plate 664. The placement of ground extension 660 and electrode extension 666 can be reconfigured in a variety of patterns as long as a convenient layout for electrical conductor coupling is formed. As in various other embodiments of the present invention, each individual and shared mode filter included in the strip filter 642 may include first and second electrode plates 662 and 664 sandwiched between the common ground conductive plate 656. In which additional materials (not shown) having defined electrical properties are placed between the various ground and electrode plates to insulate them from each other. FIG. 30 shows the top, bottom, and side surfaces of strip filter 642 having first and second individual conductive bands 652, 654 extending perpendicular to the longitudinal direction of support material 616. As shown in FIG. 30A, it is slightly superimposed on the top surface of the strip filter 642. As shown in FIG. 30D, the bottom of the strip filter 642 is the same as the top surface in consideration of the surface mounting of the strip filter 642. The common ground conductive band 650 extends vertically to the end and onto the top and bottom surfaces of the strip filter 642, as indicated by reference numeral 650 in FIGS. 30A and 30D. Additional common ground conductive bands 650 are also shown above and below the strip filter 642, which do not extend along the sides in this configuration. The first and second individual conductive bands 652, 654 extend along corresponding sides of the strip filter 642 such that various electrode extensions 666 of each of the first and second electrode plates 662, 664 can be formed. It is electrically coupled to an associated conductive band to enable external electrical conductors to be connected to various internal electrode plates of strip filter 642. For clarity, the corresponding first and second electrode plates 662 and 664 and the first and second individual conductive bands 652 and 654 include suffixes a through d, which are strip filters 642. Each of the four individual and shared mode filters contained within 31 is another example of a strip filter including an additional first electrode plate 662e. By adding additional electrode plates, strip filter 642 can now accept odd electrical conductors. Applications requiring an odd number of electrical conductors typically provide filtering for a D-sub connector with 9 or 15 conductors. Although not shown, the only difference in the top, bottom, and sides of the strip filter 642 shown in FIG. 31 is that an additional conductive band 652 and one or more common ground conductive bands 650 allow for the coupling of additional conductors. Was added to accommodate. By adding the first electrode plate 662e without a corresponding second electrode plate, the electrode plate 662e forms a line-to-ground capacitor between itself and the plurality of common ground conductive plates 656. There is no second electrode plate corresponding to the first electrode plate 662e, but between any one of the electrical conductors connected to the first electrode plate 662e and any of the electrical conductors coupled to the second electrode plates 664a to 664d. Separate and shared mode filtering still occurs.

32-37 show various variations of the multi-part surface mount individual and shared mode strip filters shown in FIGS. 29-31. 32 and 33, the strip filter 800 includes a plurality of common ground conductive plates 656 in which the first and second electrode plates 662 and 664 are sandwiched between various common ground conductive plates 656. It includes. As in the previous embodiment, the strip filter 800 includes individual and shared mode filters 1A, 4A, 5A, and 8A for the electrode plate 662, and individual and shared mode filters for the electrode plate 664. 4 pairs of contacts for 2B, 3B, 6B, 7B), where the individual and shared mode filters are identical. As described throughout the specification, each common ground conducting plate 656 is etched onto a support material 616 having defined electrical properties, such that portions of the material 616 are formed of each common ground conducting plate 656. It functions as an insulator on either side. Unlike the embodiment shown in FIGS. 29-31, each of the common grounding plate 656 has portions of material 616 extending longitudinally over either side of the common grounding plate 656. The first and second electrode plates 662, 664 are also formed over the strip of support material 616 and surrounded by material 616 except for the electrode extension 666 extending to the edge of the support material 616. Lose. Additional materials with defined electrical properties (not shown) are located between the various common ground conducting plates 656 and electrode plates 662 and 664 to insulate them from each other. The strip filter 800 is advantageous in that it provides a more versatile connection structure with low inductance.

FIG. 33 shows the top, bottom, and side surfaces of strip filter 800 having first and second individual conductive bands 652, 654 extending perpendicular to the longitudinal direction of support material 616. As shown in FIG. 33A, it is slightly superimposed on the top surface of the strip filter 800. As shown in FIG. 33D, the bottom of the strip filter 800 is the same as the top surface in consideration of the surface mounting of the strip filter 800. The common ground conductive band 650 extends vertically to the end and above and above the top and bottom surfaces of the strip filter 800, as shown in FIGS. 33A, 33D and 33E. The first and second individual conductive bands 652, 654 extend along corresponding sides of the strip filter 800 such that various electrode extensions 666 of each of the first and second electrode plates 662, 664 can be formed. It is electrically coupled to an associated conductive band to enable external electrical conductors to be connected to the first and second internal electrode plates of strip filter 642.

34 and 35 show yet another embodiment of the invention in a strip filter, the difference being the substantial construction of each of the various electrode extensions 666 of the first and second electrode plates 662, 664 and In orientation. As clearly shown in FIGS. 32-35, the connection or pinout configuration of the strip filter may be arranged to suit the application. As shown in Figures 36 and 37, strip filter 804 is another embodiment that emphasizes common ground connection. Referring to FIG. 36, each common ground conducting plate 656 is stamped or etched into a support material having defined electrical properties through techniques well known in the art, such that a rectangular strip of material 616 is applied to each common ground conduction. It functions as an insulator along one side of the plate 656. The electrode extensions 666 of the first and second electrode plates 662 and 664 extend from the side of the same electrode plate as the insulating strip 616 extends over each common ground conducting plate 656. The first and second electrode plates 662 and 664 are essentially the same as in the previous embodiment. FIG. 37 shows the top, bottom, and side surfaces of strip filter 804 having first and second individual conductive bands 652, 654 extending perpendicular to the longitudinal direction of support material 616. As shown in FIG. 37A, it is slightly superimposed on the top surface of the strip filter 804. As shown in FIG. 37D, the bottom of the strip filter 804 is the same as the top surface in consideration of the surface mounting of the strip filter 804. In this embodiment, the common grounding conductive band 650 extends vertically to the end and over the top and bottom surfaces of the strip filter 804, as shown in FIG. 37C, to cover one side of the strip filter 804. Surround it as a whole. Like the first and second individual conductive bands 652, 654, the common ground conductive band 650 also extends over the top and bottom surfaces of the strip filter 804 along it over the entire length of the covered side. The configuration of the strip filter 804 is particularly useful in applications that function as a shield and require a large ground plane that can absorb and dissipate greater amounts of heat and electromagnetic interference.

14 and 15 disclose yet another embodiment of individual and shared mode filters formed on a medium such as a film or myra. This embodiment includes a film medium and includes a common ground conductive plate 480, followed by a first electrode plate 460, and then another common ground plate 480 and a second electrode plate. 500 and the next common ground conductive plate 480. Each plate essentially comprises a film 472, and the film itself may include, but is not limited to, a number of materials, such as Myra, wherein the film 472 is completely metal-clad on one side of the metal. Form a coating plate. A portion of the metallized material using a laser is removed from the metallization to a predetermined pattern to form an insulating wall. The first discrete plate 460 has two laser edge disolation barriers 462 and 466, which define the first discrete plate 460 with three conductive areas, the electrode 464, and the insulated electrode. 468 and the common electrode 470. The second individual plate 500 includes two insulating walls 506 and 504 that divide the second individual plate 500 into three conducting areas, namely the electrode 510, the insulated electrode 502 and the common electrode 508. It is the same as the 1st individual board 460 in that it has a. For the first and second individual plates 460, 500, the insulating walls 462, 506 are essentially U-shaped, so that the electrodes surrounding the large area of the first and second plates 460, 500 ( 464, 510. The U-shaped insulating walls 462 and 506 allow the electrodes 464 and 510 to extend to the ends of the ends 476 and 514, respectively. Members 474 and 512 extend from insulating walls 462 and 506 and members 473 and 513 extend from insulating walls 466 and 504. The members 474 and 512 extend vertically outward from the ends of the U-shaped insulating walls at points closest to the ends 476 and 514, and the members 473 and 513 move the common electrodes 470 and 508. In order to sufficiently insulate the ends 476 and 514, they extend vertically outward from the U-shaped insulating wall. Further, the first and second individual plates 460 and 480 have insulated electrodes 468 and 502 formed at opposite portions of the ends 476 and 514 by the insulating walls 466 and 504.

The common grounding conducting plate 480 is an insulating wall 482, 492 that divides the common grounding conducting plate 480 into three conducting surfaces, that is, the common electrode 488, the insulated electrode 484, and the insulated electrode 494. ) Is included. As shown, the insulating walls 482, 492 are perpendicularly adjacent and extend parallel to the right and left edges of the common ground conductive plate 480. In addition, the insulating walls 482 and 492 include a member 496 extending vertically outward from the vertical portions of the insulating walls 482 and 492, and when the plates 460 and 480 500 are stacked, the plates are removed. The first and second individual plates 460 and 500 are positioned to be aligned with the horizontal portions of the U-shaped insulating walls 462 and 506.

Another feature is that the common ground conduction plate 480 can be optimized for use in filtering alternating or direct current signals. Insulating walls 482 and 492 as described above are optimized to filter direct current signals. For direct current operation, the insulated electrodes 484 and 494 require little area in the common ground conducting plate 480. When the filter comprises a film medium and is used to filter the alternating signal, the insulated electrodes 484 and 494 require a larger area obtained by etching the deformed insulating walls 486 and 490. The vertically extending insulating walls 484 and 494 are etched closer to each other and closer to the center of the common ground conducting plate 480. To accommodate this deformation, the member 496 extending vertically outward from the vertical portion is made longer than in the form of direct current. Although any configuration provides filtering for both types of current, larger area insulated electrodes 484 and 494 provide better alternating current filtering characteristics.

FIG. 15 is a cross-sectional view of a film media individual and shared mode filter 540 that includes multiple plates similar to the plates shown in FIG. 14. As in the case of the surface mounted chip embodiment shown in FIG. 11, the film individual and shared mode filter 540 also has five or more plates that substantially couple the capacitors in parallel to increase the overall capacitance.

The top and bottom surfaces of the individual and shared mode filters 540 consist of a protective cover layer 555. Located below the top protective cover layer 555 is a common grounding conducting plate 480, below which is an electrode plate 460, below which another common grounding conducting plate 480, and below which an electrode plate 500 is located. And another common ground conducting plate 480. The above arrangement in which the ground and the electrode plate alternately appear can be repeated to obtain additional capacitors. As shown in the cross section, each electrode or plate comprises a film 558 having a conductive metal clad top 556, which is formed with a cutout in the metal surface with a laser-generated insulating pattern 554. Has Terminal conductive blocks 550 and 552 include a pure aluminum portion deposited over the edge and penetrated into the film extension to provide a highly conductive termination, such as a metal. The extensions described are created by stacking different plates, which are stacked in a sequence such that all electrode plates 460 are surrounded by common ground conductive plates 48-, as shown in FIG. The electrode plates 460 and 500 are biased against each other and with respect to the common ground conducting plate to facilitate edge termination.

16-19 relate to discrete and shared mode filter embodiments configured and optimized for an electric motor. Electric motors are a very large source of electromagnetic emissions. This is evident for non-experts, as most people have seen working with a vacuum cleaner in front of an on-screen television and seeing snow fill the screen. This interference to the television is due to electromagnetic emissions from the motor. Vacuum cleaners are by no means the only source of electromagnetic emissions. Electric motors are widely used in many home appliances such as washing machines, dryers, dishwashers, blenders, and hair dryers. Most cars also have multiple electric motors to control windshield wipers, power window openers, self-adjusting mirrors, auto antennas, and many other functions. Because of the widespread use of electric motors and extended electromagnetic emission standards, there is a need for separate and shared mode filtering functions.

The electric motor filter 180 may be manufactured in any form, but in the preferred embodiment shown in FIG. 16 is an essentially rectangular block having a material 182 having one of a number of defined electrical properties. FIG. 16A shows the exterior of a filter 180 that is a rectangular block of specific material 182, which material is insulated through the center hole of the filter 180 and insulated shaft holes 188, which are conductive. The bands 184 and 194 and the common conductive band 186 are provided. FIG. 16B shows the side of the filter 180 where the arrangements of the conductive bands 184, 194 and the common conductive band 186 are physically insulated from each other by portions of the material 182 located between the various vans. It is. FIG. 16C shows a cross section taken along line A of FIG. 16A. As in the previous embodiment, the physical structure of the present invention includes conducting electrodes 181 and 185 and a common conducting electrode 183 sandwiched therebetween. Material 182 having defined electrical properties is positioned at intervals between all electrodes to prevent electrical connection between the various conductive electrodes 181, 185 and the common conductive electrode 183. Similar to that of surface mount embodiments of the present invention, filter 180 employs conductive bands 184 and 194 to electrically couple the internal electrodes of filter 180 to external conductors. Conductive electrode 181 extends sufficiently to contact conductive band 184 to provide the necessary electrical interface. As shown in FIG. 16C, the conductive electrode 181 is not extended enough to contact the conductive band 194 coupled to the conductive electrode 185. Although not shown, the common conductive electrode 183 extends sufficiently between the common conductive bands 186 without contacting the conductive bands 184, 194. In addition, by coupling the common conductive band 186 to signal ground or ground ground, “true” ground is possible rather than the inherent ground provided by the common conducting electrode 184.

FIG. 16D shows two necessary parallel plates for a line-to-line discrete mode coupling capacitor, while having a common conducting electrode 183 acting in common with the common conducting electrode 183 and functioning as an intrinsic ground. Schematic diagram of individual and shared mode electric motor filter 180 showing conducting electrodes 181, 185 providing a line-to-ground shared mode separation capacitor. Conductive bands 184 and 194 and common conductive band 186 are shown to allow the electric motor filter 180 to be connected to external electrical conductors. Although the preferred embodiment of FIG. 16 shows only one common conducting electrode 183 and two conducting electrodes 181, 185, the capacitance value can be changed through the additional effect of a parallel capacitor similar to that described in the previous embodiment. It is contemplated to use multiple electrodes to change.

17 shows a separate and shared mode electric motor filter 180 electrically and physically coupled to the electric motor 200. As shown in FIG. 17A, the electric motor filter 180 is located on top of the electric motor 200 with the motor shaft 202 extending outward. The motor shaft 202 is placed through the shaft hole 188 of the filter 180, the conductive bands 184, 194 are insulated from each other and the rotor of the electric motor 200 and the connection terminal 196 Are electrically coupled to each other. Although not shown, the individual connection terminals 196 are then electrically connected to an electrical supply line for powering the electric motor 200. Once the electric motor filter 180 is connected / coupled to the electric motor 200, the motor faceplate 208 is positioned on top of the motor 200 and the filter 180, and the motor shaft 202 is located on the motor faceplate 208. It will pass through a similar hole in the center of the box. The faceplate 208 is then physically coupled to the body of the motor 200 using the clamp 206. Although not shown, the common conductive band 186 may be coupled to the enclosure of the motor, or connected by wire directly to circuit ground or ground ground, so that the filter 180 may be used with intrinsic ground.

FIG. 18 is a logarithmic graph comparing the electromagnetic emission magnitude of an electric motor 200 as a function of frequency, showing the results of an electric motor with a standard filter labeled 200 and the results of an individual and shared mode electric motor filter 180 labeled 202. Comparing. The graph shows that between 0.01 MHz and about 10 MHz, there is at least 20 dB of electromagnetic emission suppression throughout the range, with a marked decrease in the range of 0.1 to 1 MHz. At high frequencies above 10 to 20 MHz, the reduction in electromagnetic emissions is not greater than at low frequencies, but this is not critical because most electric motors operate below the frequency range, so the electric motor filter 180 is the most suitable for most applications. It can be seen that it provides improved performance with reduced electromagnetic emissions.

The individual and shared mode electric motor filter 230 shown in FIG. 19 is another embodiment of the filter of FIG. In the multi-plate implementation of FIG. 19, the shapes of the plurality of plates are different, and each of the plates has a motor shaft hole 242 such that the plurality of plates and the filters 230 of the electric motor do not interfere with the motor shaft and its rotation. It is almost identical to the filter embodiment shown and described in FIG. 1 except that it can be coupled on top. 19A shows individual plates of filter 230 having a common grounded conducting plate 232 with motor shaft holes 242 and a plurality of conducting plates 246. If the common ground conductive plate 232 includes a conductive material, in the preferred embodiment is formed of a metal piece. The three plates have at least two holes 252 for receiving the electrical conductor 244 as shown in FIG. 19B. The two conducting plates 246 of FIG. 19A show opposing surfaces of the plate 246. As in the previous embodiment described above, the conducting plate 246 is made of a material 254 having defined electrical properties, one side of the plate 246 being covered by the conducting surface 236, the other side being non-conductive Covered by 234. To electrically couple between each electrical conductor 244 and the appropriate conductive surface 236 of each conductive plate 246, one of the two holes 252 is a coupling hole 240 and the other hole 252. Is surrounded by an insulating ring 238. The two holes 252 of the common ground conducting plate 232 are surrounded by insulating rings 238 to prevent electrical connection between the common ground conducting plate 232 and any electrical conductor 244.

19B illustrates the physical coupling of the common ground conducting plate 232 and the conducting plate 246 in operation. The common grounding conducting plate 232 is sandwiched between the conducting plates 246, wherein the non-conductive drawing 234 of each conducting plate 246 faces and contacts one surface of the common grounding conducting plate 232. . The conductive plates 246 are also positioned such that the insulating rings 238 of each plate 246 are positioned such that only one of the two electrical conductors 244 is coupled to either conductive surface 236 of the conductive plate 246. Arranged. Once the common ground conduction plate 232 and the plurality of conduction plates 246 are physically coupled, the entire device forming the individual and shared mode electric motor filter 230 is positioned on top of the electric motor. It extends through the shaft hole 242 of each plate.

19C is a schematic diagram of a filter component showing how the individual conducting surfaces of multiple plates interact to form the line-to-line and line-to-ground capacitors that form the filter 230. Since multiple conductive plates 246 are essentially identical and arranged differently with respect to the common ground conductive plate 232, the schematic diagram of FIG. 19C is a prime drawing to show the conductive surface 236 of the individual conductive plates 246. Use the sign.

20 and 21 show a high power embodiment of the individual and shared mode filters of the present invention. FIG. 20A is a quasi schematic diagram of the physical arrangement of the plates constituting the filter shown in FIG. 20B. Referring to FIGS. 20A and 20B, it can be seen that the common ground conductive plate 292 is sandwiched between two conductive electrode plates 270 and 270 ', where the conductive electrode plates are respectively formed of electrical conductors 275a, a. 275b). Each of the conductive electrode plates 270 and 270 'is composed of a material 264 having a predetermined electrical property, and then each of the plates has a conductive surface on which electrical connection is made. After the electrical conductors 275a and 275b are connected to the conductive electrode plates 270 and 270 ', the conductive surface is coated with insulation. Conductive electrode plates 270 and 270 'are physically coupled to common ground conductive plate 292 by typical adhesive materials known in the art. The high power discrete and shared mode filter 260 is shown more clearly in FIG. 21, where FIG. 21A shows a physical embodiment and FIG. 21B shows a schematic representation. As shown in FIG. 21A, filter 260 includes a common ground conducting plate 262 sandwiched between wheels of material 264 having defined electrical properties. The wheel of material 264 is placed through a plurality of holes 266, not shown, of the coupling shaft 278, and the conductive electrode 270, 270 with the wheel 264 and the common ground conducting plate 262. Held in place by '). To maintain high current and voltage conditions, filter 260 is designed for common ground conducting plate 262, conducting plates 270, 270 ', and wheels of material 264 are typically prior embodiments of the present invention. Has a larger size. In order for the filter 260 to be connected to the outer electrical conductors, the conducting electrode 270 extends therefrom and is mechanically coupled to the connecting terminals 275a and 275b via common means such as a tightening screw and washer. Has a connecting member 284. The connection terminals 275a and 275b are installed on the upper surface of the lid 282 of the case and consist of the case lid 282, the common ground conduction plate 262, the conducting electrodes 270 and 270 ′, and the wheel 264 of material. Form an assembly of one body. This single part is located in the part case 276, which has flanges 272 extending from the common ground conducting plate 262 coupled to the case mounting hole 280. This device provides a means for coupling the inherent ground provided by the common ground conducting plate 262 to a circuit ground or ground ground if desired. FIG. 21B illustrates the relationship of the other physical components of FIG. 21A to form the filter 260 schematically shown. As in another previous embodiment of the present invention, the conducting electrode 270 represented without the prime symbol to indicate the separated surfaces is the two necessary to form a line-to-line capacitor coupled between the connecting terminals 274. Form parallel plates. Each of the conducting electrodes 270, together with the common conducting electrode 262, forms a line-to-ground shared mode split capacitor in which the common conducting electrode 262 functions as an intrinsic ground.

42A and 42B illustrate a Face T network filter 940, which is another application of the various surface mount discrete and shared mode filters described previously. Face T network filter 940 has separate and shared mode with common ground conductive band 944 and first and second individual conductive bands (not shown) positioned at either end of separate and shared mode filter 942. And a filter 942. Coupled to the common ground conductive band 944 are common ground conductive terminals 950 that are connected to the desired external circuit by solder. Coupled to each end of the individual and shared mode filters 942 are inductive ferrite enclosures 952 and 954, respectively. Each inductive ferrite case 952, 954 includes a solderable ferrite material in which the first and second individual conductive bands (not shown) of the individual and shared mode filters 942 are soldered internally to the associated inductive ferrite case. have. Cases 954 (952 as well) have electrode plate terminals 948 (946) physically coupled to the sides of each case with portions laid through through 960, so that terminals 946, 948 are filters Electrical contact with the first and second individual conductive bands of 942. This device can be better seen from the inversion of the additional case 954 (952) shown by the dashed line 966. FIG. 42B shows multiple inductors 958 coupled to the first and second electrode plate terminals 946, 948 of the individual and shared mode filters 942 to form the face T network filter 940 shown in FIG. 42A. Schematic diagram of a face T network filter 940.

Since the embodiment of the present invention can classify the noise to ground while allowing high signal current to flow through the termination of the device while exhibiting a large noise reduction, the face T network filter 940 is suitable for high signal current and high frequency noise applications. The example has an advantage. The first and second electrode plate terminals 946, 948 provide the high current carrying conductors necessary for the application as described above to the filter 940, with the individual ferrite cases 952, 954 forming a magnetic field. This combination improves the high frequency filter refinement so that the attenuation characteristics of the filter 940 are close to a slope of 40 to 60 dB per ten. Face T network filter 940 is particularly suitable for low impedance circuits.

As can be seen, many other applications of individual and shared mode filter structures are possible and some features common to all embodiments should be considered. First, materials having defined electrical properties include, but are not limited to, dielectric materials, metal oxide varistor materials, ferrite materials, and foreign materials such as myra or sintered polycrystalline materials, one of the numbers in any embodiment Can be. Whichever material is used, the common ground conduction plate and the electrode conduction plate produce a plurality of condensers to connect line-to-line individual coupling capacitors between the electrical conductor pairs and line-to-earth separation capacitors spaced from the electrical conductor pairs. To form. Materials with electrical properties will change the capacitance value and / or additional features such as overvoltage and surge protection or increased inductance, resistance, combinations of the above, and the like.

Second, in all embodiments shown or not shown, the number of plates, i.e., the common conductive plate and the common electrode plate, can be a multiple of them, so that multiple parallel capacitances are added to form an increased capacitance value. Create a last name element.

Third, common ground conducting plates surrounding the combination of the central conducting plate and the plurality of conducting electrodes may be used to provide increased intrinsic ground and surge dissipation area and true Faraday shielding effect in all embodiments. Additional common ground conducting plates may be employed in any of the embodiments shown and the advantages have been fully considered by the applicant.

Finally, from the review of many embodiments, the shape, thickness or size may vary depending on the desired electrical properties or the application environment in which the filter is used, due to the physical structure resulting from the arrangement of the common ground conducting plate and the conducting electrode plates.

Although not shown, in fact, individual and shared mode filters are readily made of silicon and can easily be incorporated directly into integrated circuits for such applications, such as communication chips. Individual and shared-mode filters are embedded to filter communications or data lines connected directly from their circuit board terminal connections, reducing the real estate requirements of the circuit board and simplifying the overall circuit, while simplifying production requirements. Will also be reduced in size. Integrated circuits have already been made with capacitors etched in a silicon base, which allows the structure of the present invention to be easily incorporated into today's available technology.

On the other hand, the above embodiment is merely to describe one preferred embodiment of the present invention, the scope of application of the present invention is not limited to such, and can be changed as appropriate within the scope of the same idea.

Claims (52)

At least one common ground conducting plate having at least two insulating holes; A second electrode plate having at least one insulating hole and at least one coupling hole, and having a first electrode plate stacked below the common ground conductive plate and a second electrode plate stacked above the common ground conductive plate; The plate includes at least two electrode plates sandwiching the at least one central common ground conducting plate; At least two electrical conductors disposed through the common ground conductive plate and the at least two electrode plates and electrically connected to other electrode plates; Has a predetermined electrical characteristic and is maintained between the common ground conducting plate and the at least two electrode plates to prevent direct electrical connection between the plates to create a capacitive element connected between the at least two electrical conductors and Creates two capacitive elements, one of which is connected between one electrical conductor and the common grounding conducting plate, and the other of the elements comprises a material connected between another electrical conductor and the common grounding conducting plate. Line control electrical components. The method of claim 1, The material with certain electrical properties is selected from the group consisting of insulating materials, metal oxide varistor materials, ferrite materials, sintered polycrystalline materials and ferroelectric-ferromagnetic composites, and certain materials have special performance in both filters and surge protection functions. The line conditioning electrical component that determines the. The method of claim 1, At least two common ground conduction plates formed of a first common ground conduction plate stacked on a lower portion of the first electrode plate and a second common ground conduction plate stacked on an upper portion of the second electrode plate, and having at least two insulating holes; Further comprising a plate, wherein the material has a predetermined electrical property maintained between the electrode plate and the at least two common ground conducting plates, wherein the at least two electrical conductors comprise the first and second common ground conducting plates. Line regulation electrical component disposed through the insulating hole of the plate. The method of claim 1, And said at least two electrode plates and said common ground conducting plate are each individually, independently and electrically coupled to separate external conducting surfaces. The method of claim 1, The at least two electrode plates include a plurality of electrode patterns, each of the electrode patterns having at least one insulating hole and at least one coupling hole; The at least one common ground conductive plate has two insulating holes for each of the electrode patterns included in each of the at least two electrode plates; A plurality of electrical conductors are disposed through each of the electrode patterns to create capacitive elements between each pair of electrical conductors and to create two capacitive elements each coupled between one of the electrical conductors and the common ground conductor plate. A line conditioning electrical component disposed through the aperture with a pair of electrical conductors. The method of claim 5, Each of the electrode patterns formed on the electrode plate has at least one coupling hole and at least two insulating holes. The method of claim 1, The at least two electrode plates have equal and balanced electrical properties and the at least two electrical conductors are electrically polarized opposite to each other, the equivalent and cooperating with the at least two electrically opposed polarized conductors. A line regulation electrical component having a line-to-line capacitor having a balanced electrical characteristic equal to approximately half of the line-to-ground capacitor for the line regulation electrical component. The method of claim 1, Three staggered twists of the at least two electrode plates and the at least one common ground conducting plate provide a parody shield that separates and encloses each of the at least two electrical conductors while reducing mutual inductive coupling between the at least two electrical conductors. To produce line conditioning electrical parts. The method of claim 1, The predetermined electrical properties of the material may include capacitive filtering, overvoltage and surge suppression, capacitive and inductive filtering, and the capacitive properties of the particular substrate constituting the material to determine the specific performance of both the filter and the surge protection function, Line regulation electrical component selected from the group consisting of a combination of inductive and restraining properties. At least one common ground conducting plate having a plurality of insulating holes; And a first electrode plate stacked below the common ground conduction plate and a second electrode plate stacked on the common ground conduction plate, wherein the two electrode plates at least sandwich the at least one central common ground conduction plate. Two electrode plates; Said at least two electrode plates each having at least two conducting electrodes each having at least one coupling hole and at least one blocking electrode having a plurality of coupling and insulating holes; A plurality of electrical conductors disposed through the at least one common ground conductive plate and the at least two electrode plates, the plurality of electrical conductors being electrically connected to each of the conductive electrodes and electrically connected to each of the blocking electrodes; And A material having a predetermined electrical characteristic and held between the common ground conducting plate and the at least two electrode plates to prevent direct electrical connection between the plates; Wherein said combination forms a plurality of individual and shared mode filters and a plurality of blocking capacitors. The method of claim 10, The material has certain electrical properties selected from the group consisting of insulating materials, metallized varistor materials, ferrite materials, sintered polycrystalline materials, and ferroelectric-ferromagnetic composites, and certain materials have the special performance of both filters and surge protection. The line conditioning electrical component that is determined. The method of claim 10, At least two common ground conducting plates comprising a first common ground conducting plate stacked on a lower portion of the first electrode plate and a second common ground conducting plate stacked on an upper portion of the second electrode plate, and having a plurality of insulating holes. Wherein the material has a predetermined electrical characteristic maintained between the electrode plate and the at least two common ground conducting plates, wherein the plurality of electrical conductors are formed of the first and second common ground conducting plates. A line regulation electrical component disposed through said insulation hole. At least one common ground conducting plate having at least two insulating holes; At least two electrode plates each made of a material having predetermined electrical characteristics and each having a conductive surface having coupling holes; The at least two respective electrode plates are coupled to both sides of the at least one common ground conducting plate together with the conducting surface of the electrode plate oriented apart from the one common ground conducting plate; The capacitive element connected to and disposed through one of the coupling holes of the electrode plate and disposed through each insulating hole of the at least one common ground conductive plate to form a capacitive element coupled between the pair of electrical conductors. And at least one pair of electrical conductors producing two capacitive elements coupled between the electrical conductor and the common ground conductor plate. The method of claim 13, The material has certain electrical properties selected from the group consisting of insulating materials, metal oxide varistor materials, ferrite materials, sintered polycrystalline materials and ferroelectric-ferromagnetic composites, and certain materials have special performance in both filters and surge protection. The line conditioning electrical component that determines the. A plate having two sides with first and second holes disposed therein and composed of a material having predetermined electrical properties; The first surface of the plate has a first conductive surface, the first hole is electrically coupled with the first conductive surface and the second hole is electrically insulated from the first conductive surface; The second surface of the plate has a second conductive surface, and the first and second holes are electrically insulated from the second conductive surface; And the first and second conductive surfaces are electrically insulated from each other. The method of claim 15, The material has certain electrical properties selected from the group consisting of insulating materials, metal oxide varistor materials, ferrite materials, sintered polycrystalline materials and ferroelectric-ferromagnetic composites, and certain materials have special performance in both filters and surge protection. The line conditioning electrical component that determines the. First and second plates each having two sides with first and second holes disposed therein and composed of a material having predetermined electrical properties; The first surface of the first and second plates has a first conductive surface, the first hole is electrically coupled with the first conductive surface and the second hole is electrically insulated from the first conductive surface. Become; The second surface of the first and second plates has a second conductive surface, and the first and second holes are electrically insulated from the second conductive surface; The first and second conductive surfaces of the respective first and second plates are electrically insulated from each other; The first and second plates are stacked adjacent to the second surface of the first and second plates and electrically coupled to each other; And said apertures in said first and second plates are aligned to receive a plurality of electrical conductors. The method of claim 17, Further comprising a common ground conducting plate having first and second holes disposed in the common ground conducting plate; The common ground conducting plate is electrically coupled between the second surface of the first and second plates; First and second holes of the common ground conducting plate are aligned with the first and second holes of the first and second plates to receive a plurality of electrical conductors. At least one common ground plate having a common conducting electrode and an insulation band at both ends of the at least one common ground plate to widen the width; A conductive plate and an insulating band along three of four surfaces, the first individual plate being stacked on the lower side of the common ground plate and the second individual plate stacked on the upper side of the common ground plate; At least two individual plates whose faces not having an insulating band are arranged in opposite directions and aligned with the insulating band of the common ground plate; A material held between the first common ground plate and the at least two individual plates and having predetermined electrical properties; A first individual band, a second individual band, and a common band, wherein the conductive electrode of the first separate plate is coupled with the first individual band, and the conductive electrode of the second separate plate is the second individual band. And the conducting electrode of the common ground plate is coupled with the common band so that one capacitive element is disposed between the first and second individual bands and between each of the first and second individual bands and the common band. Line conditioning electrical component producing two capacitive elements coupled to the The method of claim 19, Materials with certain electrical properties are selected from the group consisting of insulating materials, metal oxide varistor materials, ferrite materials, sintered polycrystalline materials, and ferroelectric-ferromagnetic composites, and certain materials have the special performance of both filters and surge protection. The line conditioning electrical component that is determined. The method of claim 19, Further comprising a plurality of individual plates and a plurality of common ground plates, each of the individual plates and each common ground plate forming a capacitive element coupled between each pair of the individual plates, wherein each of the individual bands and the common band Line conditioning electrical components that produce capacitive elements coupled between them. The method of claim 19, The at least two electrode plates have equal and balanced electrical properties and the at least two electrical conductors are electrically polarized opposite to each other, the equivalent and cooperating with the at least two electrically opposed polarized conductors. A line regulation electrical component having a line-to-line capacitor having a balanced electrical characteristic equal to approximately half of the line-to-ground capacitor for the line regulation electrical component. The method of claim 19, A staggered twist of the at least two individual plates and the at least one common ground plate separates each of the first and second individual bands while reducing mutually inductive coupling between the at least first and second individual bands. Line conditioning electrical components that create a wrapping parody shield. The method of claim 19, The predetermined electrical properties of the material may include capacitive filtering, overvoltage and surge suppression, capacitive and inductive filtering, and the capacitive properties of the particular substrate constituting the material to determine the specific performance of both the filter and the surge protection function, Line regulation electrical component selected from the group consisting of a combination of inductive and restraining properties. At least one common ground plate having a common conducting electrode and an insulation band at both ends of the at least one common ground plate to widen the width; A conductive plate and an insulating band along three of four surfaces, the first individual plate being stacked on the lower side of the common ground plate and the second individual plate stacked on the upper side of the common ground plate; At least two individual plates whose faces not having an insulating band are arranged in opposite directions and aligned with the insulating band of the common ground plate; A material held between the first common ground plate and the at least two individual plates and having predetermined electrical properties; A first individual band, a second individual band, and a common band, wherein the conductive electrode of the first separate plate is coupled with the first individual band, and the conductive electrode of the second separate plate is the second individual band. And the conducting electrode of the common ground plate is coupled with the common band so that one capacitive element is disposed between the first and second individual bands and between each of the first and second individual bands and the common band. Line conditioning electrical component producing two capacitive elements coupled to the A line regulation electrical assembly comprising at least two line regulation electrical components as set forth in claim 25, wherein the first and second line regulation electrical assemblies are stacked on top of each other; The first individual bands of the first and second line regulation electrical components are electrically coupled to each other, and the second individual bands of the first and second line regulation electrical components are electrically coupled to each other, And said common band of second line regulation electrical components are electrically coupled to each other such that said first and second line regulation electrical components are electrically coupled in parallel. The method of claim 26, And at least two additional common ground planes comprising a first additional common ground plate stacked on top of the line regulation electrical assembly and a second additional common ground plate stacked on the bottom of the line regulation electrical assembly. . The method of claim 26, And a further common ground plate between the at least two line regulation electrical components, thereby providing increased electrical isolation between the first and second line regulation electrical components. A line regulation electrical assembly comprising the line regulation electrical component of claim 25, wherein the line regulation electrical component and the capacitor are stacked on top of each other, And said capacitor is electrically coupled between said first and said second individual bands of said line conditioning electrical component. At least one common ground conducting plate formed on a support material having predetermined electrical properties; A plurality of first and second consisting of a plurality of first electrode plates formed on a first support material having predetermined electrical properties and a plurality of second electrode plates formed on a second support material having predetermined electrical properties An electrode plate; The plurality of first electrode plates are stacked on an upper portion of the at least one common ground conductive plate, and the plurality of second electrode plates are stacked on a lower portion of the at least one common ground conductive plate, and the plurality of first electrodes A plate and said plurality of said second electrode plates are interposed between said at least one central common ground conducting plate; The first support material isolates the common ground conducting plate, and the plurality of first electrode plates and the plurality of second electrode plates prevent direct connection of the plates; And the at least one common ground conducting plate, the plurality of first electrode plates, the plurality of second electrode plates, and the support material form a plurality of individual and shared mode filters. The method of claim 30, The support material with the desired electrical properties is selected from the group consisting of insulating materials, metal oxide varistor materials, ferrite materials, sintered polycrystalline materials and ferroelectric-ferromagnetic composites, and certain materials are characterized by special properties of both filters and surge protection functions. Line conditioning electrical components that determine performance. The method of claim 30, A line further comprising a material having a predetermined electrical property, the line being held between the at least one common ground conducting plate and the plurality of first and second electrode plates as the material to block direct electrical connection between the plates; Adjustable electrical components. The method of claim 30, Further comprising a plurality of first individual bands, a plurality of second individual bands, and a plurality of common bands; Each of the plurality of first electrode plates is electrically connected to one of the plurality of first individual bands; The plurality of respective second electrode plates is electrically connected to one of the plurality of second individual bands; The at least one common ground conducting plate is electrically connected to each of the plurality of common bands, thereby forming a capacitive element between the respective first and second individual bands, wherein the respective first and second individual And a line capacitive element forming two capacitive elements between the band and the plurality of common bands. The method of claim 30, And at least two common ground electrode plates, wherein the first common ground conducting plate is stacked on top of the plurality of first electrode plates and the second common ground conducting plate is formed of the plurality of second electrode plates. Line control electrical parts stacked on the bottom. At least one common ground conducting plate formed on a support material having predetermined electrical properties; First and second electrode plates comprising a first electrode plate formed on a first support material having predetermined electrical properties and a second electrode plate formed on a second support material having predetermined electrical properties; The first electrode plate is stacked on top of the at least one common ground conductive plate, and the second electrode plate is stacked below the at least one common ground conductive plate, and the first electrode plate and the second electrode plate are stacked. Is interposed between said at least one central common ground conducting plate; The first support material isolates the common ground conducting plate, and the first electrode plate and the second electrode plate prevent direct connection of the plates; And said at least one common ground conducting plate, said first electrode plate, said second electrode plate and said support material form a plurality of individual and shared mode filters. The method of claim 35, wherein The support material with the desired electrical properties is selected from the group consisting of insulating materials, metal oxide varistor materials, ferrite materials, sintered polycrystalline materials and ferroelectric-ferromagnetic composites, and certain materials are characterized by special properties of both filters and surge protection functions. Line conditioning electrical components that determine performance. The method of claim 35, wherein Further comprising a plurality of first individual bands, a plurality of second individual bands, and at least one common band; The first electrode plate is electrically connected to one of the plurality of first individual bands, The second electrode plate is electrically connected to one of the plurality of second individual bands, The at least one common ground conducting plate is electrically connected to the at least one common band, thereby forming a capacitive element between the first and second bands, wherein each of the first and second bands and the at least one Line conditioning electrical component forming two capacitive elements between the common bands of the elements. The method of claim 35, wherein And at least two common ground conducting plates, wherein the first common ground conducting plate is stacked on top of the first electrode plate, and the second common ground conducting plate is stacked on the bottom of the second electrode plate. Adjustable electrical components. 39. A line conditioning electrical assembly comprised of at least first and second line regulating electrical components as set forth in claim 38, wherein the first and second line regulating electrical components are stacked on top of each other so that the first and second line regulating electrical components Line conditioning electrical assembly for electrically coupling components in parallel. At least one insulating wall is provided on both ends of the at least one common conductive plate to widen, the conductive surface is disposed on the film, the insulating wall is formed by removing a predetermined portion of the conductive surface A common conducting plate; A first insulating wall and a second insulating wall, wherein the first insulating wall and the second insulating wall are electrically connected to each of the electrode plates together with an area in the first insulating wall forming a main electrode pattern. At least two electrode plates separated into insulated regions; The first electrode plate is stacked below the common conductive plate, the second electrode plate is stacked above the common conductive plate, and the first and second electrode plates are disposed such that their first insulating walls face each other. Aligned so that the at least two electrode plates are interposed between the at least one common conductive plate, A capacitive element coupled between the first and second terminals includes a first terminal coupled to the main electrode pattern of the first electrode plate and a second terminal coupled to the main electrode pattern of the second electrode plate. And at least two conducting terminals for producing two capacitive elements coupled to the respective first and second terminals and the common conducting plate. The method of claim 40, The at least two electrode plates have equal and balanced electrical properties and the at least two electrical conductors are electrically polarized opposite to each other, the equivalent and cooperating with the at least two electrically opposed polarized conductors. A line regulation electrical component having a line-to-line capacitor having a balanced electrical characteristic equal to approximately half of the line-to-ground capacitor for the line regulation electrical component. The method of claim 40, A staggered twist of the at least two individual plates and the at least one common ground plate separates and surrounds each of the first and second individual bands while reducing mutually inductive coupling between the at least first and second individual bands. Line conditioning electrical components to produce parody shields. The method of claim 40, The predetermined electrical properties of the material may include capacitive filtering, overvoltage and surge suppression, capacitive and inductive filtering, and the capacitive properties of the particular substrate constituting the material to determine the specific performance of both the filter and the surge protection function, Line regulation electrical component selected from the group consisting of a combination of inductive and restraining properties. At least one common conducting plate; At least two conductive electrodes formed of a first conductive electrode stacked below the common conductive electrode and a second conductive electrode stacked on the common conductive electrode and sandwiching the at least one common conductive electrode; A material having predetermined electrical characteristics and retained between the at least one common conducting electrode and the at least two conducting electrodes; And a first conductive band, a second conductive band, and a common band, wherein the first conductive band is coupled with the first conductive electrode, the second conductive band is coupled with the second conductive electrode, and the common conductive electrode is Coupled with the common band to create a capacitive element coupled between the first and second conductive bands and two capacitive elements coupled between each of the first and second conductive bands and the common band. Motor line control electric parts. The method of claim 44, The material has certain electrical properties selected from the group consisting of insulating materials, metal oxide varistor materials, ferrite materials, sintered polycrystalline materials and ferroelectric-ferromagnetic composites, and certain materials have special performance in both filters and surge protection. The motor line control electric parts that determine the. At least one common conducting plate; At least two material plates having predetermined electrical properties; And at least two conductive electrode plates, wherein the first conductive electrode plate is stacked below the common conductive plate and the second conductive electrode plate is stacked above the common conductive plate and has the predetermined electrical characteristics. And the material plate is held between the first and second conductive electrode plates to physically separate the common conductive plate. At least one common ground conducting plate having at least two insulating holes; A second electrode plate having at least one insulating hole and at least one coupling hole, and having a first electrode plate stacked below the common ground conductive plate and a second electrode plate stacked above the common ground conductive plate; The plate includes at least two electrode plates sandwiching the at least one central common ground conducting plate; At least two electrical conductors disposed through the common ground conductive plate and the at least two electrode plates and electrically connected to other electrode plates; Has a predetermined electrical characteristic and is maintained between the common ground conducting plate and the at least two electrode plates to prevent direct electrical connection between the plates to create a capacitive element connected between the at least two electrical conductors and Creates two capacitive elements, one of which is connected between one electrical conductor and the common grounding conducting plate, and the other of the elements comprises a material connected between another electrical conductor and the common grounding conducting plate. Line control electrical components. 48. A line regulating electrical component and a first MOV component as set forth in claim 47, wherein the first MOV is laminated on the line regulating electrical component and the first MOV component is electrically connected between the first electrode plate and the common ground conducting plate. Line conditioning electrical assembly combined. The method of claim 48, And a second MOV component, wherein the second MOV component is laminated on the line regulation electrical component and the second MOV component is electrically coupled between the second electrode plate and the second common ground conducting plate. . The method of claim 25, A first inductive seal coupled to the first individual band and a second inductive seal coupled to the second individual band; At least one conducting terminal coupled to the common band; And a plurality of terminals, wherein at least one of the plurality of terminals is coupled with the first inductive seal and at least one of the plurality of terminals is coupled with the second inductive seal. 51. The method of claim 50, And wherein the enclosure has at least one hole in which at least one of the plurality of terminals is disposed to make electrical contact with the corresponding individual band. 51. The method of claim 50, Wherein said first and second inductive seals comprise a ferrite material.