KR20010027877A - Heat pipe heat sink with conduction block - Google Patents
Heat pipe heat sink with conduction block Download PDFInfo
- Publication number
- KR20010027877A KR20010027877A KR1019990039850A KR19990039850A KR20010027877A KR 20010027877 A KR20010027877 A KR 20010027877A KR 1019990039850 A KR1019990039850 A KR 1019990039850A KR 19990039850 A KR19990039850 A KR 19990039850A KR 20010027877 A KR20010027877 A KR 20010027877A
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- heat
- heat pipe
- conductor
- working fluid
- container
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Abstract
Description
본 발명은 전도체 일체형 히트파이프 냉각기에 있어서, 특히 발열소자가 부착되는 전도체 내부를 가공하여 히트파이프 증발부들이 작동유체를 공유하도록 한 전도체 일체형 히트파이프 냉각기에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor integrated heat pipe cooler, in particular a conductor integrated heat pipe cooler in which heat pipe evaporators share a working fluid by processing inside a conductor to which a heating element is attached.
최근 전력ㆍ전자기기의 발전이 급속도로 진행되고 있으며, 여기에 사용되는 전자부품, 특히 반도체 소자는 고집적화, 대용량화 및 고속화로 인하여 소자발생 열 밀도가 증가됨에 따라 효과적인 냉각방법으로 히트파이프를 이용한 냉각기가 이용되고 있다.Recently, the development of power and electronic devices is progressing rapidly, and the electronic parts, especially semiconductor devices, used in the present invention have increased heat density due to high integration, large capacity, and high speed, so that the cooler using heat pipe is an effective cooling method. It is used.
종래의 전도체 일체형 히트파이프의 냉각기는 도 1에 도시된 바와같이,As shown in FIG. 1, a cooler of a conventional conductor integrated heat pipe is shown in FIG.
방열핀(1)이 부착되고 작동유체(3)가 들어있는 히트파이프(2)와, 상기 히트파이프(2)가 발열부위 만큼 삽입되는 삽입홈(4a)을 갖고 발열소자가 취부되는 전도체(4)로 구성된다.A heat pipe (4) having a heat pipe (2) to which a heat dissipation fin (1) is attached, and a heat pipe (2) containing a working fluid (3), and an insertion groove (4a) into which the heat pipe (2) is inserted as much as a heat generating portion. It consists of.
상기와 같이 구성되는 전도체 일체형 히트파이프 냉각기의 작용에 대하여 도 1를 참조하여 설명하면 다음과 같다.Referring to Figure 1 with respect to the action of the conductor-integrated heat pipe cooler configured as described above is as follows.
먼저, 다수개의 히트파이프(2) 외측으로 여러장의 방열핀(1)이 취부되고, 그 내부에 작동유체(3)를 함유하고 있어 작동유체의 증발시 이를 응축시켜 줄수 있게 된다.First, a plurality of heat dissipation fins 1 are mounted to the outside of the plurality of heat pipes 2, and the working fluid 3 is contained therein, so that the working fluid 3 can be condensed when the working fluid evaporates.
그리고, 발열소자에 취부되는 전도체(4)에는 상단부에 가공된 삽입홈(4a)으로 다수개의 히트파이프(2)가 발열부위 만큼 각각 끼워지게 되므로서, 전도체(4)에서 발열소자로 부터 발생되는 열을 작동유체(3)에 전달하여 작동유체(3)에서 해당하는 열만큼 증발(액상에서 기상으로)시켜 준다.In addition, since a plurality of heat pipes 2 are inserted into the conductors 4 mounted on the heat generating element, respectively, as many heat generating portions as the insertion grooves 4a formed at the upper end, the heat generating elements are generated from the heat generating elements in the conductor 4. Heat is transferred to the working fluid (3) to evaporate (from liquid to gas phase) by the corresponding heat in the working fluid (3).
그러면, 전도체(4)와 히트파이프(3)가 결합되는 히트파이프 증발부에서 증발(기상)되는 작동유체(3)는 응축부인 히트파이프(2)에 취부된 방열핀(1)의 방열작용에 의해 방열된 후 다시 액상으로 냉각되는 과정으로 냉각작용을 수행하게 된다.Then, the working fluid 3 evaporated (vaporized) in the heat pipe evaporation unit to which the conductor 4 and the heat pipe 3 are coupled is released by the heat dissipation action of the heat dissipation fin 1 mounted on the heat pipe 2 which is a condensation unit. After the heat dissipation, the cooling is performed by cooling to the liquid phase again.
상기 히트파이프(2)와 전도체(4) 사이의 결합에 의해 접촉 열저항이 존재하며, 그 열저항 값이 클경우 열전달 성능을 저감시키게 된다.The contact heat resistance exists by the coupling between the heat pipe 2 and the conductor 4, and when the heat resistance value is large, the heat transfer performance is reduced.
또한 발열소자의 발열량이 국부적으로 클 경우 작동유체(3)의 드라이 아웃현상이 생겨 냉각효과가 떨어질뿐만 아니라 시스템의 파괴도 초래할수 있다.In addition, if the heating value of the heating element is locally large, the dry-out phenomenon of the working fluid 3 may occur, which may cause not only the cooling effect but also the destruction of the system.
상기와 같은 종래의 문제점을 해결하기 위하여 본 발명은, 방열핀이 부착된 다수개의 히트파이프(heat pipe)의 각 하단을 개방한 다음 파이프지지부에 일체로 결합시키고, 상기 파이프지지부에 밀착 결합하는 전도체 내부에 다수개의 히트파이프가 공유하는 작동유체가 들어있는 컨테이너를 포함하고, 그 컨테이너의 중심부에 여분의 작동유체를 한곳으로 모아줄수 있는 유체홈을 구비하므로서, 발열체로 부터 냉각기까지의 총 열저항 값을 줄일수 있을 뿐만 아니라 발열체에서 국소적으로 고발열이 발생하여도 히트파이프의 드라이 아웃 현상을 방지할수 있어 시스템의 안정화를 기할수 있다.In order to solve the conventional problems as described above, the present invention, after opening the lower end of each of the plurality of heat pipe (heat pipe) is attached to the heat radiation fin and integrally coupled to the pipe support, the inside of the conductor tightly coupled to the pipe support It includes a container containing a working fluid shared by a plurality of heat pipes, and at the center of the container has a fluid groove to collect the extra working fluid in one place, the total heat resistance value from the heating element to the cooler Not only can it reduce, but even if heat is generated locally in the heating element, the heat-out of the heat pipe can be prevented, thereby stabilizing the system.
도 1은 종래 히트파이프 냉각기의 구조를 보인 사시도.1 is a perspective view showing the structure of a conventional heat pipe cooler.
도 2는 본 발명 전도체 일체형 히트파이프 냉각기의 분해 사시도.Figure 2 is an exploded perspective view of a heat pipe cooler of the present invention integrated conductor.
도 3은 본 발명의 다른 실시예로서, 전도체 일체형 히트파이프 냉각기의 결합상태도.Figure 3 is another embodiment of the present invention, the combined state of the conductor integrated heat pipe cooler.
본 발명 전도체 일체형 히트파이프 냉각기의 구조에 대하여 도 2를 참조하여 설명하면 다음과 같다.Referring to FIG. 2, the structure of the present invention, the conductor integrated heat pipe cooler is as follows.
방열핀(11)이 취부된 다수개의 히트파이프(heat pipe)(12)의 하단을 각각 개방시켜 파이프지지부(13)에 일체로 결합시키고, 상기 파이프지지부(13)가 밀폐되도록 접합되어 다수개의 히트파이프(12) 개방부분이 작동유체(15)를 공유하게 하는 컨테이너(14a)가 내부에 가공된 전도체(14)로 이루어진 것을 특징으로 한다.The lower ends of the plurality of heat pipes 12 on which the heat dissipation fins 11 are mounted are respectively opened to be integrally coupled to the pipe support 13, and the pipe support 13 is joined to seal the plurality of heat pipes 12. (12) The container 14a, which allows the open portion to share the working fluid 15, is characterized by being made of a conductor 14 processed therein.
그리고, 상기 컨테이너(14)를 중심부에 여분의 작동유체(15)가 중심으로 모이도록 하는 유체홈(14b)을 구비한 구조이다.In addition, the container 14 has a structure in which a fluid groove 14b for collecting the extra working fluid 15 at the center thereof is collected.
상기와 같이 구성되는 본 발명 전도체 일체형 히트파이프 냉각기의 구조에 대하여 설명하면 도 2와 같다.Referring to the structure of the conductor-integrated heat pipe cooler of the present invention configured as described above is as shown in FIG.
먼저, 여러개의 방열핀(11)이 겹쳐진 상태로 다수개의 히트파이프(12)의 외주변으로 취부하고, 히트파이프(12)의 하단부를 각각 개방시켜 파이프지지부(13)에 일체로 결합시켜 준다.First, the heat dissipation fins 11 are overlapped and mounted to the outer periphery of the plurality of heat pipes 12, and the lower ends of the heat pipes 12 are respectively opened to be integrally coupled to the pipe support 13.
그러면, 파이프지지부(13)의 저면으로 히트파이프(12) 하단이 개방된 상태로 컨테이너(14a)가 가공된 전도체(14)에 접합시켜 주게 되는데,Then, the container 14a is bonded to the processed conductor 14 with the heat pipe 12 lower end open to the bottom surface of the pipe support 13.
상기 전도체(14)의 가공된 콘테이너(14a)는 작동유체(15)가 채워져 있어 히트파이프(12)에서 작동유체(15)를 공유할수 있으며, 또 그 중심부에 가공된 유체홈(14b)이 작동유체가 여분으로 남았을 경우 그 작동유체가 어느 한쪽으로 치우치지 않고 공유하도록 한 구조이다.The processed container 14a of the conductor 14 is filled with the working fluid 15 so as to share the working fluid 15 in the heat pipe 12, and the processed fluid groove 14b at its center is operated. When extra fluid is left, the working fluid is shared without biasing to either side.
그런다음, 상기 파이프지지부(13)와 전도체(14) 상단면으로 용접등으로 접합시켜 컨테이너(14a)의 내부공간을 밀폐시켜 준다.Then, the pipe support 13 and the upper surface of the conductor 14 are bonded to each other by welding or the like to seal the inner space of the container 14a.
그러므로, 발열체등으로 부터 발생되는 발열이 전도체(14)를 통해 전달되면, 컨테이너(14a)에 들어있는 작동유체(15)가 기상되어 히트파이프(12) 증발부를 통해상승하여 히트파이프 응축부에서 응축된다.Therefore, when the heat generated from the heating element or the like is transmitted through the conductor 14, the working fluid 15 contained in the container 14a vaporizes and rises through the heat pipe 12 evaporator to condense in the heat pipe condenser. do.
그런 다음, 그 기상된 작동유체가 다시 히트파이프(12)의 외주변에 부착된 방열핀의 방열작용으로 인해 냉각되어 다시 액상으로 변환되므로 컨테이너(14a) 내부로 하강하게 된다.Then, the vaporized working fluid is cooled again due to the heat radiation action of the heat radiation fins attached to the outer periphery of the heat pipe 12 and converted back into the liquid phase, thereby descending into the container 14a.
또한, 컨테이너(14a) 속에 남아있는 작동유체(15)가 소량일 경우에도 그 중심부에 가공된 유체홈(14b)으로 모이게 되므로 각 히트파이프(12)가 이를 공유하게 되므로, 냉각작용을 항상 수행할수 있다.In addition, even when a small amount of the working fluid 15 remaining in the container 14a is gathered into the fluid groove 14b processed at the center thereof, the heat pipes 12 share this, so that cooling can always be performed. have.
한편, 도 3은 본 발명의 다른 실시예로서, 전도체(23)를 일체형으로 갖는 히트파이프(22)로 일체로 성형하되, 그 내부에 작동유체(24)를 함유시켜 다수개의 히트파이프(22)가 공유되도록 한 구조이다.On the other hand, Figure 3 is another embodiment of the present invention, but integrally molded with a heat pipe 22 having a conductor 23 integrally, a plurality of heat pipes 22 by containing a working fluid 24 therein Is structured to be shared.
미 설명 부호 22는 방열핀이다.Reference numeral 22 is a heat sink fin.
이의 동작은, 여러장의 방열핀(21)이 외측으로 취부되는 다수개의 히트파이프(22)의 하단부분으로 전도체(23)을 일체형을 성형하고, 그 내부에 작동유체(22)를 함유시키므로서, 다수개의 히트파이프(22)에서 작동유체(22)를 공유하도록 하여 냉각작용을 수행하게 된다.This operation is performed by forming an integrated body of the conductor 23 into the lower end portion of the plurality of heat pipes 22 in which the plurality of heat dissipation fins 21 are mounted to the outside, and containing the working fluid 22 therein. The two working heat pipes 22 share the working fluid 22 to perform a cooling operation.
또한 히트파이프(22)를 전도체(23)로 성형시키므로서 냉각작용에 큰 효과가 있다.In addition, by forming the heat pipe 22 into the conductor 23, there is a great effect on the cooling action.
이상에서 설명한 바와같이, 본 발명은 히트파이프를 전도체와 일체형으로 하여 발열소자가 부착되는 전도체 내부를 가공하여 히트파이프 증발부들이 공유되도록 하므로서, 발열체로 부터 냉각기까지의 총 열저항 값을 줄일수 있을뿐만 아니라 발열체에서 국부적으로 고발열이 발생하여도 히트파이프의 드라이아웃 현상을 방지할수 있어 시스템을 안정화 시킬수 있는 효과가 있다.As described above, the present invention can reduce the total heat resistance value from the heating element to the cooler by processing the inside of the conductor to which the heating element is attached by integrating the heat pipe with the conductor so that the heat pipe evaporators are shared. In addition, even if high heat is generated locally in the heating element, the heat-out phenomenon of the heat pipe can be prevented, thereby stabilizing the system.
Claims (3)
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KR10-1999-0039850A KR100468278B1 (en) | 1999-09-16 | 1999-09-16 | Heat pipe heat sink with conduction block |
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KR10-1999-0039850A KR100468278B1 (en) | 1999-09-16 | 1999-09-16 | Heat pipe heat sink with conduction block |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100442888B1 (en) * | 2000-11-30 | 2004-08-02 | 인터내셔널 비지네스 머신즈 코포레이션 | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
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JP2610041B2 (en) * | 1988-12-05 | 1997-05-14 | 古河電気工業株式会社 | Heat pipe radiator |
JPH0629683A (en) * | 1992-03-31 | 1994-02-04 | Furukawa Electric Co Ltd:The | Heat pipe type heat dissipation unit for electronic apparatus |
JPH06120382A (en) * | 1992-10-05 | 1994-04-28 | Toshiba Corp | Semiconductor cooling equipment |
JPH09167819A (en) * | 1995-12-15 | 1997-06-24 | Mitsubishi Cable Ind Ltd | Heat pipe cooler |
KR19980019402A (en) * | 1998-03-16 | 1998-06-05 | 천기완 | CPU COOLING DEVICE OF PC |
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1999
- 1999-09-16 KR KR10-1999-0039850A patent/KR100468278B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100442888B1 (en) * | 2000-11-30 | 2004-08-02 | 인터내셔널 비지네스 머신즈 코포레이션 | Apparatus for dense chip packaging using heat pipes and thermoelectric coolers |
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