KR20010019015A - Plasma polymerization system - Google Patents

Abstract

PURPOSE: A plasma polymerization device is provided to improve use efficiency of gas, deposit a polymerization film of uniformed quality, and effectively decrease sticking of gas particles to inside of a chamber by smoothly and uniformly forming gas flow in a deposition chamber. CONSTITUTION: A plasma polymerization device comprises a gas infusion hole (3) in a deposition chamber (20) and an exhaust port (4) which is symmetrically positioned against the gas infusion hole (3) along the direction of gas flowing (5). A plasma polymerization device of the present invention improve use efficiency of gases and deposit a polymerization film of unformed quality by smoothly and uniformly forming gas flow inside a deposition chamber. Particularly, phenomena that gas particles are stuck to inside the chamber can be effectively decreased.

Description

Plasma Polymerization Processing Unit {PLASMA POLYMERIZATION SYSTEM}

The present invention relates to a plasma polymerization apparatus.

When a thin film is coated on the surface of a sample such as a metal plate using plasma, a coating layer having excellent hardness, wear resistance, and the like is formed. Products with a coating layer are used for magnetic disks, optical disks, ultra hard tools, and the like. In addition, when the coating film formed on the surface of the steel sheet is subjected to plasma treatment, the coated steel sheet is hardened and excellent in durability, corrosion resistance and the like is obtained. In particular, the surface modification effect of improving the hydrophilicity or hydrophobicity can be obtained by polymerizing the surface of the sample, and the surface-modified material has been applied to various ranges.

In the conventional plasma polymerization apparatus shown in Japanese Patent Laid-Open No. 6-136506, a pair of unwinding rolls 11, a winding roll 12, a pair of tension rolls 13, 14, and a supporter 15 A transfer chamber 10 arranged, a deposition chamber 20 in which deposition is performed on the sample, a roll-shaped electrode 21 provided in the deposition chamber, and an opposite electrode 22 disposed opposite to the roll-shaped electrode; An insulating shield plate 30 provided between the transfer chamber and the deposition chamber, two differential pressure ports 31 and 32 formed on the shield plate to maintain a pressure difference between the transfer chamber and the deposition chamber; Vacuum pumps 17 and 18 for controlling the pressure atmosphere of the transfer chamber and the deposition chamber, a gas inlet 23 for injecting raw material gas into the deposition chamber, and exhaust ports 16 and 24 connected to the transfer chamber and the deposition chamber. It consists of).

In the apparatus, the band-shaped metal material 1 which is polymerized is transferred from the unwinding roll in the transfer chamber and introduced into the deposition chamber through one of the differential pressure portions, and moves to the roll-shaped electrode to pass near the counter electrode and then to the other side. It is conveyed by the winding roll in a conveyance chamber past a differential pressure part. The apparatus is characterized in that the pressure atmosphere of the deposition chamber is a glow discharge atmosphere in the process of performing a plasma polymerization treatment by a high frequency discharge on the band metal material transferred from the transfer chamber to the deposition chamber and returning the band metal material to the transfer chamber. The pressure atmosphere of the transfer chamber is characterized by a non-glow discharge atmosphere lower than that of the deposition chamber.

Plasma discharges tend to occur in specific pressure atmospheres corresponding to the type of discharge. For example, the plasma polymerization reaction is generally easy to occur in a pressure atmosphere of 10 ⁻³ to 10 torr, and glow discharge is less likely to occur when the pressure is outside the pressure atmosphere. Therefore, even in the case of polymerizing the band-shaped conductive metal material, the transfer chamber region and the deposition chamber region are divided, and each pressure region is maintained at a different pressure atmosphere by the pressure differential, and the pressure chamber is 10 ^-3 to 10 torr in the deposition chamber. In the transfer chamber, if the pressure atmosphere is outside the above range, glow discharge occurs in the deposition chamber, but glow discharge hardly occurs in the transfer chamber. Therefore, abnormal discharge can be suppressed.

In the conventional plasma polymerization processing apparatus, the gas inlet 23 and the exhaust port (vacuum inlet) 24 are formed asymmetrically so that the flow of gas in the deposition chamber is not uniformly formed throughout the discharge region. In this case, not only the quality of the polymer film deposited on the surface of the sample is poor, but also the use efficiency of the injected gas is deteriorated, and thus there is a problem in that the gas is not reacted and exhausted as it is at high gas density.

Accordingly, an object of the present invention is to provide a plasma polymerization apparatus for uniformly forming a gas flow in a deposition chamber to improve gas utilization efficiency and deposit a polymer film having a uniform quality.

1 is a schematic diagram showing a conventional plasma polymerization processing apparatus.

Figure 2 is a schematic diagram showing a chamber structure according to the prior art,

Figure 2a shows the gas flow from the gas inlet to the exhaust port,

FIG. 2B shows the gas flow shown in FIG. 2A in a different direction.

3 is a schematic view of a plasma polymerization apparatus according to the present invention.

Figure 4 is a schematic diagram showing a chamber structure according to the present invention,

4A shows the gas flow in the chamber,

Figure 4b is an enlarged view of the gas inlet,

FIG. 4C shows the gas flow shown in FIG. 4A in another direction.

*** Explanation of symbols for the main parts of the drawing ***

1: sample 2: gas inlet line

2a: gas injection hole 2b: gas supply

3: gas inlet port 4: exhaust port

5: gas flow 6a: counter electrode

6b: counter electrode 8: loosening chamber

9: winding chamber 10: transfer chamber

11: Unwinding Roll 12: Winding Roll

13: Tension roll 14: Tension roll

15: support 16: exhaust vent

17: vacuum pump 18: vacuum pump

20: deposition chamber 21: electrode on the roll

22: counter electrode 23: gas inlet

24: exhaust vent 30: shield plate

31: Differential pressure port 32: Differential pressure port

The present invention relates to a plasma polymerization apparatus, and to solve the above problems, a plasma including a gas inlet in a deposition chamber and a chamber structure including an exhaust port symmetrically located along a gas flow direction with respect to the gas inlet. Provided is a polymerization apparatus.

The present invention includes a chamber structure in which the gas inlet is a gas inlet line in which a plurality of gas injection holes are formed.

The present invention also includes a chamber structure having two or more exhaust ports.

The present invention also includes a chamber structure in which the gas inlet and the exhaust port are symmetrically installed at the sample inlet and outlet sides of the chamber so that the gas flow direction is parallel to the moving direction of the sample to be surface treated.

Hereinafter, exemplary embodiments will be described in detail with reference to the accompanying drawings.

2a and 2b schematically show a chamber structure in which a gas inlet and an exhaust port have an asymmetrical structure in a conventional plasma polymerization apparatus. 2A shows that the flow 5 of gas from the gas inlet 3 to the exhaust port 4 in the chamber is not uniform. In addition, Figure 2b is shown in Figure 2a in a different direction, the sample in the chamber affects the gas flow (5) to seal the appearance that can not be smoothly discharged. 3, the gas inlet 3 and the exhaust port 4 are symmetrically formed as a chamber structure according to the present invention. The gas inlet is provided at the front of the chamber, and the exhaust port is provided at the rear of the chamber. (In the drawing, the gas inlet is shown below and the exhaust port is shown above.)

As shown in FIG. 2A and FIG. 2B, when there is only one exhaust port 4, the flow flow 5 of the reaction gas becomes uneven in up, down, left, and right sides of the sample. As a result, the uniformity of the plasma process may be reduced, and powder particles, etc., incidentally generated during the plasma reaction may flow along the gas flow and may continue to accumulate on the wall inside the chamber. Therefore, in the above case, if the exhaust port 4 of the reaction gas is set to 2 or more and the outlet position is selected to be symmetrical with the gas inlet line 2, as in the embodiment of the present invention shown in FIGS. 4A and 4C, the sample is polymerized. When moving during processing, the flow of the reaction gas becomes uniform regardless of the position of the sample, and the unreacted gas particles are smoothly discharged, thereby obtaining a uniform polymerized film during the plasma treatment and allowing continuous processing for a long time. 4B is an enlarged view of the gas inlet, and a plurality of gas injection holes 2a are formed in the inlet line 2 to enable uniform gas supply 2b to the chamber.

According to the present invention, by smoothly and uniformly forming a gas flow in the deposition chamber, gas utilization efficiency can be improved and a polymer film having a uniform quality can be deposited, and in particular, gas particles can be effectively stuck inside the chamber.

Claims (1)

And a chamber structure including a gas inlet in the deposition chamber and an exhaust port symmetrically located along the gas flow direction with respect to the gas inlet.