KR20010018838A - Particle removing apparatus for semiconductor package forming tool - Google Patents

Particle removing apparatus for semiconductor package forming tool Download PDF

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Publication number
KR20010018838A
KR20010018838A KR1019990034953A KR19990034953A KR20010018838A KR 20010018838 A KR20010018838 A KR 20010018838A KR 1019990034953 A KR1019990034953 A KR 1019990034953A KR 19990034953 A KR19990034953 A KR 19990034953A KR 20010018838 A KR20010018838 A KR 20010018838A
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KR
South Korea
Prior art keywords
mold
air
lead frame
upper mold
semiconductor package
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Application number
KR1019990034953A
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Korean (ko)
Inventor
정영범
Original Assignee
김영환
현대반도체 주식회사
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Priority to KR1019990034953A priority Critical patent/KR20010018838A/en
Publication of KR20010018838A publication Critical patent/KR20010018838A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Abstract

PURPOSE: An apparatus for eliminating a foreign substance in a foaming mold of a semiconductor package is provided to eliminate a foreign substance such as a resin adhered to a lead frame, by spraying air to the lead frame through an air spraying hole. CONSTITUTION: An upper mold(12) is installed on a lower mold(11) on which a lead frame(10) is placed. A plurality of punches(13) are installed in the upper mold. A stripper plate(14) is installed between the upper and lower molds. Air spraying holes(15) are installed on a lower surface of the punches to spray air to the transferred lead frame and to eliminate a foreign substance. An air supply line for supplying air is connected to a side of the stripper plate so that air can be sprayed into the air spraying holes. A position detecting sensor(17) is installed at a side of the upper mold to recognize a position of the upper mold.

Description

반도체 패키지 포밍금형의 이물질제거장치{PARTICLE REMOVING APPARATUS FOR SEMICONDUCTOR PACKAGE FORMING TOOL}Foreign material removal device of semiconductor package forming mold {PARTICLE REMOVING APPARATUS FOR SEMICONDUCTOR PACKAGE FORMING TOOL}

본 발명은 반도체 패키지 포밍금형의 이물질제거장치에 관한 것으로, 특히 리드프레임에 부착되어 있는 이물질들을 제거하여 포밍작업시 이물질들이 패키지에 고착되는 것을 방지하도록 하는데 적합한 반도체 패키지 포밍금형의 이물질제거장치에 관한 것이다.The present invention relates to a foreign substance removing apparatus of a semiconductor package forming mold, and more particularly, to a foreign substance removing apparatus of a semiconductor package forming mold suitable for removing foreign substances adhering to a lead frame to prevent foreign substances from adhering to the package during forming. will be.

반도체 패키지 제조공정 중 몰딩작업, 트리밍작업, 솔더작업을 마친 다음에는 리드프레임에 연결되어 있는 패키지의 아웃리드들을 일정한 형태로 절곡하는 포밍작업을 실시하게 되는데, 이와 같은 포밍작업을 실시하는 포밍금형이 도 1에 도시되어 있는 바, 이를 간단히 설명하면 다음과 같다.After molding, trimming, and soldering work is performed in the semiconductor package manufacturing process, the forming process of bending outleads of the package connected to the lead frame to a certain shape is performed. As shown in FIG. 1, this is briefly described as follows.

도시된 바와 같이, 종래 포밍금형은 리드프레임(1)이 이송되는 하부금형(2)의 상측에 상부금형(3)이 상,하이동가능하게 설치되어 있고, 그 상부금형(3)에는 1차 리드 컷팅, 포밍, 2차 리드 컷팅을 하기 위한 3개의 펀치(4)들이 나열 설치되어 있으며, 그 펀치(4)들은 상,하부금형(3)(2)의 사이에 설치된 스트리퍼 플레이트(5)에 의하여 가이드되면서 슬라이딩될 수 있도록 되어 있다.As shown, in the conventional forming mold, the upper mold (3) is installed on the upper side of the lower mold (2) to which the lead frame (1) is transported so as to be movable up and down, and the upper mold (3) is primary Three punches 4 for lead cutting, forming, and secondary lead cutting are arranged side by side, and the punches 4 are placed on the stripper plate 5 installed between the upper and lower molds 3 and 2. It can be slid while being guided by.

상기와 같이 구성되어 있는 종래 포밍금형에서 포밍작업이 진행되는 동작을 설명하면 다음과 같다.Referring to the operation of the forming operation in the conventional forming mold configured as described above are as follows.

몰딩작업후에 몰딩부(1a)가 형성되어 있는 스트립 상태의 리드프레임(1)이 하부금형(2)의 상면에 얹혀진 상태에서 도 1에서와 같이 화살표방향으로 이송되면 상부금형(3)이 하강하고, 그와 같이 하강하는 상부금형(3)에 고정되어 있는 펀치(4)들이 스트리퍼 플레이트(5)에 가이드되며 하강하게 되는데, 이와 같이 이동하는 리드프레임(1)의 리드들은 도 2와 같이 1차적으로 첫번째 설치된 펀치(4')에 의하여 리드프레임(1)에서 리드(1b)들을 절단하는 1차 리드컷팅작업이 이루어지고, 두번째 펀치(4")에 의하여 도 3과 같이 리드(1b)들을 일정형태로 포밍하는 포밍작업이 이루어지며, 세번째 펀치(4"')에 의하여 최종치수로 절단하는 2차리드컷팅작업이 이루어진다.After the molding operation, when the lead frame 1 in the strip state in which the molding part 1a is formed is transferred to the arrow direction as shown in FIG. 1 in a state where it is placed on the upper surface of the lower mold 2, the upper mold 3 descends. The punches 4 fixed to the upper mold 3 descending as described above are guided to the stripper plate 5 and lowered. The leads of the lead frame 1 moving as described above are primarily as shown in FIG. 2. The first lead cutting operation is performed to cut the leads 1b in the lead frame 1 by the first installed punch 4 ', and the leads 1b are fixed as shown in FIG. 3 by the second punch 4 ". Forming work is performed in the form of a shape, and the second lead cutting work is performed to cut to the final dimension by the third punch (4 "').

그러나, 상기와 같이 포밍금형에서 포밍작업이 진행되는 리드프레임(1)은 도 5와 같이 전공정인 몰딩작업시 에어밴트 등에 의하여 레진이 부분적으로 부착되어 있고, 그와 같은 레진이 포밍작업시 포밍금형에 의하여 눌려져서 고착되어 후공정에서도 완전제거가 이루어지지 않아서 최종적인 패키지의 외관불량을 발생시키는 요인이 되는 문제점이 있었다.However, the lead frame 1 in which the forming operation is performed in the forming mold as described above, the resin is partially attached by an air vent during molding process as shown in FIG. 5, and such a resin is formed during the forming operation. There is a problem in that it is a factor causing the appearance of the final package is not removed because it is pressed and fixed by the complete process is not completely removed in the post-process.

상기와 같은 문제점을 감안하여 안출한 본 발명의 목적은 포밍작업되는 리드프레임에 부착되어 있는 레진가루와 같은 이물질들을 제거하여 후공정에서 외관불량이 발생되는 것을 방지하도록 하는데 적합한 반도체 패키지 포밍금형의 이물질제거장치를 제공함에 있다.The object of the present invention devised in view of the above problems is to remove foreign substances such as resin powder attached to the lead frame to be formed by forming a foreign matter of a semiconductor package forming mold suitable to prevent appearance defects in a later process In providing a removal device.

도 1은 종래 반도체 포밍금형의 구성을 보인 정면도.1 is a front view showing the configuration of a conventional semiconductor forming mold.

도 2는 종래 포밍금형에서의 1차 리드컷팅작업을 보인 부분단면도.Figure 2 is a partial cross-sectional view showing a primary lead cutting operation in the conventional forming mold.

도 3은 종래 포밍금형에서의 포밍작업을 보인 부분단면도.Figure 3 is a partial cross-sectional view showing a forming operation in the conventional forming mold.

도 4는 종래 포밍금형에서의 2차 리드컷팅작업을 보인 부분단면도.Figure 4 is a partial cross-sectional view showing a secondary lead cutting operation in the conventional forming mold.

도 5는 본 발명의 이물질제거장치가 설치된 포밍금형의 구성을 보인 정면도.Figure 5 is a front view showing the configuration of the forming mold installed foreign matter removal apparatus of the present invention.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

10 : 리드프레임 11 : 하부금형10: lead frame 11: lower mold

12 : 상부금형 13 : 펀치12: upper mold 13: punch

14 : 스트리퍼 플레이트 15 : 에어분사공14 stripper plate 15 air sprayer

16 : 에어공급라인 17 : 위치검출센서16: air supply line 17: position detection sensor

18 : 이물흡입공 19 : 흡입라인18: foreign material suction hole 19: suction line

상기와 같은 본 발명의 목적을 달성하기 위하여 리드프레임이 얹혀지는 하부금형의 상측에 상부금형이 설치되어 있고, 그 상부금형에는 수개의 펀치들이 설치되어 있으며, 상기 상부금형과 하부금형의 사이에는 스트리퍼 플레이트가 설치되어 있는 반도체 패키지 포밍금형에 있어서, 상기 펀치들의 하면에 이송하는 리드프레임으로 에어를 분사하여 이물질을 제거하기 위한 에어분사공을 각각 형성하고, 그 에어분사공으로 에어를 분사할 수 있도록 에어를 공급하기 위한 에어공급라인을 상기 스트리퍼 플레이트의 일측에 연결설치하며, 상기 상부금형의 일측에 상부금형의 위치를 인식하기 위한 위치검출센서를 설치하여서 구성되는 것을 특징으로 하는 반도체 패키지 포밍금형의 이물질제거장치가 제공된다.In order to achieve the above object of the present invention, the upper mold is installed on the upper side of the lower mold on which the lead frame is placed, and the upper mold is provided with several punches, and a stripper between the upper mold and the lower mold. In the semiconductor package forming mold provided with a plate, an air injection hole for removing foreign matter is formed by injecting air into a lead frame that is transported to the lower surface of the punches, and the air can be injected to the air injection hole. The foreign matter of the semiconductor package forming mold, which is installed by connecting an air supply line for supplying to one side of the stripper plate and installing a position detection sensor for recognizing the position of the upper mold on one side of the upper mold. A removal device is provided.

이하, 상기와 같이 구성되어 있는 본 발명 반도체 패키지 포밍금형의 이물질제거장치를 첨부된 도면의 실시예를 참고하여 보다 상세히 설명하면 다음과 같다.Hereinafter, with reference to the embodiment of the accompanying drawings, the foreign material removal apparatus of the present invention semiconductor package forming mold is configured as described above in more detail as follows.

도 5는 본 발명의 이물질제거장치가 설치된 포밍금형의 구성을 보인 정면도이고, 도 6은 본 발명에 따른 포밍펀치를 보인 정면도로서, 도시된 바와 같이, 본 발명의 이물질제거장치가 설치된 포밍금형은 리드프레임(10)이 슬라이딩이동하는 하부금형(11)의 상측에 상,하운동가능하게 상부금형(12)이 설치되어 있고, 그 상부금형(12)에는 1차 리드컷팅, 포밍, 2차리드컷팅을 실시하기 위한 3개의 펀치(13)가 고정되어 있으며, 상기 상부금형(12)과 하부금형(11)의 사이에는 펀치(13)들을 가이드하기 위한 스트리퍼 플레이트(14)가 설치되어 있다.5 is a front view showing the configuration of the forming mold is installed foreign matter removing apparatus of the present invention, Figure 6 is a front view showing a forming punch according to the present invention, as shown, The upper mold 12 is installed on the upper side of the lower mold 11 in which the lead frame 10 is slidably movable, and the upper mold 12 has primary lead cutting, forming, and secondary lead. Three punches 13 for cutting are fixed, and a stripper plate 14 for guiding the punches 13 is provided between the upper mold 12 and the lower mold 11.

상기 펀치(13)들의 하면에는 에어분사공(15)이 각각 형성되어 있고, 그 에어분사공(15)으로 에어를 공급하기 위한 에어공급라인(16)이 상기 스트리퍼 플레이트(14)의 일측에 연결설치되어 있으며, 상기 에어공급라인(16)과 에어분사공(15)은 스트리퍼 플레이트(14)와 펀치(13)들에 연통되게 형성되어 있는 에어연결홀(14a)(13a)에 의하여 에어가 공급될 수 있도록 되어 있고, 상기 상부금형(12)의 일측에는 상부금형(12)의 위치를 검출하기 위한 위치검출센서(17)가 설치되어 있다.Air injection holes 15 are formed on the lower surfaces of the punches 13, and an air supply line 16 for supplying air to the air injection holes 15 is connected to one side of the stripper plate 14. The air supply line 16 and the air injection hole 15 are provided by the air connection holes 14a and 13a which are formed in communication with the stripper plate 14 and the punches 13. The position detection sensor 17 for detecting the position of the upper mold 12 is provided at one side of the upper mold 12.

그리고, 상기 하부금형(11)의 상면에는 다수개의 이물흡입공(18)들을 형성하고, 그 이물흡입공(18)들에 연통되도록 하부금형(11)의 측면에는 흡입라인(19)을 설치하여, 상기 에어분사공(15)에서 분사되는 에어에 의하여 리드프레임(10)에서 제거되는 이물질들을 이물흡입홀(18)들을 통하여 흡입하여 외부로 배출할 수 있도록 되어 있다.In addition, a plurality of foreign matter suction holes 18 are formed on the upper surface of the lower mold 11, and a suction line 19 is installed on the side of the lower mold 11 so as to communicate with the foreign object suction holes 18. In addition, the foreign substances removed from the lead frame 10 by the air injected from the air injection hole 15 may be sucked through the foreign matter suction holes 18 to be discharged to the outside.

상기와 같이 구성되어 있는 본 발명 이물질제거장치가 설치된 반도체 패키지 포밍금형의 동작을 설명하면 다음과 같다.Referring to the operation of the semiconductor package forming mold is installed as the foreign matter removal apparatus of the present invention configured as described above are as follows.

몰딩작업이 완료된 리드프레임(10)이 하부금형(11)의 상면에 로딩한 다음, 상부금형(12)을 하강시켜서 첫번째 펀치(13')에 의하여 1차 리드컷팅작업이 이루어지도록 하고, 리드프레임(10)을 화살표방향으로 계속이송하며 두번째 펀치(13") 및 세번째 펀치(13"')에 의하여 포밍작업 및 2차 리드컷팅작업이 이루어지도록 하며 포밍작업을 실시하는 것은 종래와 유사하다.After the molding operation is completed, the lead frame 10 is loaded on the upper surface of the lower mold 11, and then the upper mold 12 is lowered so that the first lead cutting operation is performed by the first punch 13 ′. The forming operation and the second lead cutting operation are performed by the second punch 13 "and the third punch 13" 'while continuing to move in the direction of the arrow, and the forming operation is similar to the conventional one.

여기서, 상기 상부금형(12)이 상측으로 이동하여 상사점에 이르면 일측의 위치검출센서(17)에서 상부금형(12)의 위치를 검출하고, 이때 상기 에어공급라인(16)을 통하여 에어를 공급하여, 에어분사공(15)들을 통하여 리드프레임(10)에 부착된 레진과 같은 이물질들이 제거되도록 하고, 그와 같이 제거되는 이물질들은 상기 이물흡입공(18)들에 흡입되어 외부로 배출되도록 함으로서, 에어분사공(15)에서 분사되는 에어에 의하여 제거되는 이물질들이 금형의 주변에 부착되어 있다가 다시 부착되는 것을 방지할 수 있도록 되어 있다.Here, when the upper mold 12 moves upward and reaches a top dead center, the position detecting sensor 17 of one side detects the position of the upper mold 12, and at this time, supplies air through the air supply line 16. Thus, foreign matters such as resin attached to the lead frame 10 are removed through the air spray holes 15, and the foreign matters thus removed are sucked into the foreign material suction holes 18 and discharged to the outside. In addition, the foreign matters removed by the air injected from the air spraying hole 15 are attached to the periphery of the mold and can be prevented from being attached again.

이상에서 상세히 설명한 바와 같이, 본 발명 반도체 패키지 포밍금형의 이물질제거장치는 펀치들의 하면에 에어분사공을 각각 형성하고, 상기 스트리퍼 플레이트의 측면에 에어분사공들에 연통되는 에어공급라인을 연결설치하며, 상부금형의 일측에 위치검출센서를 설치하여, 상부금형이 상사점에 위치시에 에어분사공을 통하여 리드프레임에 에어를 분사함으로서, 리드프레임에 부착되어 있는 레진과 같은 이물질들이 제거되어 후공정에서 이물질에 의한 외관불량이 발생되는 것을 방지하는 효과가 있다.As described in detail above, the foreign material removal apparatus of the semiconductor package forming mold of the present invention forms air injection holes on the lower surfaces of the punches, and connects and installs an air supply line communicating with the air injection holes on the side of the stripper plate. By installing a position detection sensor on one side of the upper mold, by spraying air to the lead frame through the air injection hole when the upper mold is located in the top dead center, foreign matters such as resin attached to the lead frame are removed There is an effect to prevent appearance defects caused by foreign substances in the.

Claims (2)

리드프레임이 얹혀지는 하부금형의 상측에 상부금형이 설치되어 있고, 그 상부금형에는 수개의 펀치들이 설치되어 있으며, 상기 상부금형과 하부금형의 사이에는 스트리퍼 플레이트가 설치되어 있는 반도체 패키지 포밍금형에 있어서, 상기 펀치들의 하면에 이송하는 리드프레임으로 에어를 분사하여 이물질을 제거하기 위한 에어분사공을 각각 형성하고, 그 에어분사공으로 에어를 분사할 수 있도록 에어를 공급하기 위한 에어공급라인을 상기 스트리퍼 플레이트의 일측에 연결설치하며, 상기 상부금형의 일측에 상부금형의 위치를 인식하기 위한 위치검출센서를 설치하여서 구성되는 것을 특징으로 하는 반도체 패키지 포밍금형의 이물질제거장치.In the semiconductor package forming mold in which the upper mold is installed on the upper side of the lower mold on which the lead frame is placed, the upper mold is provided with several punches, and the stripper plate is installed between the upper mold and the lower mold. And an air supply line for injecting air into a lead frame which is transported to the lower surfaces of the punches to remove foreign substances, and an air supply line for supplying air to inject air into the air spraying hole. Attached to one side of the installation, the foreign material removal apparatus of the semiconductor package forming mold, characterized in that configured to install a position detection sensor for recognizing the position of the upper mold on one side of the upper mold. 제 1항에 있어서, 상기 하부금형의 상면에는 다수개의 이물흡입공들이 형성되어 있고, 그 이물흡입공들에 연통되도록 하부금형의 일측면에는 흡입라인이 고정설치되어 있는 것을 특징으로 하는 반도체 패키지 포밍금형의 이물질제거장치.The semiconductor package forming of claim 1, wherein a plurality of foreign material suction holes are formed on an upper surface of the lower mold, and a suction line is fixed to one side of the lower mold so as to communicate with the foreign object suction holes. Foreign material removal device of mold.
KR1019990034953A 1999-08-23 1999-08-23 Particle removing apparatus for semiconductor package forming tool KR20010018838A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101503204B1 (en) * 2011-03-25 2015-03-16 후지필름 가부시키가이샤 Method for removing foreign particles adhered to molds

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101503204B1 (en) * 2011-03-25 2015-03-16 후지필름 가부시키가이샤 Method for removing foreign particles adhered to molds

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