KR20010011780A - Radiator of high voltage type DC brushless motor - Google Patents

Abstract

PURPOSE: A radiating device of a high voltage DC commutatorless motor is provided to radiate a high heat efficiently even if a driving device is installed in a high pressure motor. CONSTITUTION: A motor driving device(50) is installed in a motor housing(40). The motor driving device(50) is installed on a printed circuit board(30) engaged with a yoke(1a) of a stator(1) by a screw. A radiating plate(52) is provided on the upper surface of the motor driving device(50). A lead wire(54) is engaged on the printed circuit board(30) by soldering. A heat transferring member(60) is engaged between the heat radiating plate(52) of the motor driving device(50) and a motor housing(40). The lower surface of the heat transferring member(60) is bonded to the surface of the radiating plate(52) of the motor driving device(50).

Description

Radiator of high voltage DC rectifier motor {Radiator of high voltage type DC brushless motor}

The present invention relates to a heat dissipation device of a high-pressure direct current non-rectifier motor, and more particularly, a high-pressure direct current non-commutator for absorbing high heat emitted from a motor driving element embedded in a motor housing to smoothly radiate heat to the outside. It relates to a heat radiating device of the motor.

In general, DC rectifier motors are roughly divided into DC motors requiring a commutator and a brush to convert a phase of a power supply. They are low voltage types requiring a DC voltage of about 40 V and high voltages of about 240 V. It is divided into molds.

As shown in FIG. 1, a conventional low pressure DC direct current rectifier motor is inserted into a stator 1, which is a cylindrical hollow body that generates electric torque through an alternating magnetic field, and is inserted into the stator 1. Rotor 2 integrally coupled to a rotating shaft (not shown) to transmit torque to the load (electrical force mechanical conversion), and a magnet acting as a catalyst for converting pulses according to alternating poles ( Not shown), a printed circuit board 3 coupled to the yoke 1a of the stator 1 and having elements such as a hall sensor for detecting the position of the rotor or the speed, and a bearing 5 on the rotating shaft. It is composed of a motor housing (4) and the like to serve as an outer cover of the motor through the insertion.

In addition, in the case of a low voltage type motor, as shown in FIG. 2, an integrated circuit IC, which is a motor driving element 6, may be attached to the printed circuit board 3, and a plurality of transistors Tr may be around. (7) (7a), such as a high heat dissipation element is attached.

In such a low voltage type motor, although the motor driving element 6 which dissipates relatively low heat due to the low DC voltage can be incorporated in the motor housing 4, the transistors 7 and 7a rather than the circuit driving element 6 are provided. Since the heat dissipation is more, the heat dissipation devices 8 and 8a having a plurality of fins protruding around the transistors 7 and 7a are attached to the heat dissipation device to efficiently dissipate heat. .

However, in the case of a high voltage type motor, since a high heat is emitted from the motor driving element IC due to the application of a high voltage power of about 240 V, the motor driving element cannot be attached to the printed circuit board. It cannot be embedded inside the housing.

Accordingly, the driving element of the high-voltage type motor is embedded in an external circuit part or mounted in a set, and a large heat sink is attached to the surrounding device to solve the heat generation problem.

However, the external motor of the drive part has to repair the entire circuit part even in the case of malfunction of the motor unit, and even if the whole (circuit part) has to be replaced, the lead wire becomes longer as the motor drive part is installed externally. There is a problem that a lot of noise occurs.

Therefore, the form of embedding the driving part of the motor into the motor is becoming more and more common, but in the case of the high-pressure motor, the heat sink to reduce the temperature to the temperature level at which the normal operation can be performed due to the narrow space of the driving element is attached. There is a limit to urgently solve the heat dissipation problem of the drive element.

Therefore, the present invention was created to solve the above-mentioned problems, and an object of the present invention is to provide a high-pressure direct current capable of sufficiently dissipating high heat emitted from the drive even when a driving part (element) is built in the high voltage motor. The present invention provides a heat dissipation device for a non-commutator motor.

In order to achieve the above object, a heat dissipation device of a high voltage DC rectifier motor according to the present invention is a high voltage DC rectifier motor in which a motor driving element is embedded on a printed circuit board inside a motor housing. In the space between the heat sink of the motor drive element is characterized in that the heat transfer member of the metal material which is in surface contact so that the high heat dissipated through the heat sink to the entire outer surface of the housing can be cooled.

1 is a cross-sectional view schematically showing the configuration of a conventional low pressure DC direct current rectifier motor.

FIG. 2 is a plan view illustrating the printed circuit board of FIG. 1; FIG.

Figure 3 is a main portion coupling cross-sectional view showing the configuration of the heat dissipation device of the high-pressure direct current rectifier motor according to the present invention.

Explanation of symbols on the main parts of the drawings

30: printed circuit board, 40: motor housing,

50: motor drive element, 52: heat sink,

60: heat transfer member, 70: insulating paper,

80: silicon dust.

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

3 is a sectional view of the main parts of the coupling of the heat dissipation device of the high-pressure direct current rectifier motor according to the present invention. In the drawings, the same reference numerals and names for the same general components as those of the above-described conventional configurations are given the same for convenience, and detailed description thereof will be omitted in order to avoid duplication.

In the figure, the device of the present invention is applied to a high-voltage direct current rectifier motor, wherein the reference numeral 50 is an integrated circuit (IC) chip which is a motor driving element embedded in the motor housing 40, which is the It is fixedly installed on the printed circuit board 30 screwed on the yoke (1a).

The upper surface of the motor driving device 50 is provided with its own heat sink 52, the lower surface of the lead wire 54 is soldered on the printed circuit board 30 to be fixed to the entire device.

In particular, in the present embodiment, the heat transfer member 60 made of a metal material having a rectangular parallelepiped enclosure shown by reference numeral 60 is further coupled to the space between the heat sink 52 and the motor housing 40 of the motor driving element 50. The bottom surface of the heat transfer member 60 is surface-bonded with the heat sink 52 of the drive element 50 and the top surface thereof is fastened using the motor housing 40 and the screw 90.

Here, the silicon dust (compound) 80 is preferably bonded to the joint surface of the heat sink 52 and the heat transfer member 60 of the motor driving element 50, but the silicon dust 80 ) Is a medium that facilitates heat transfer.

Moreover, when the insulating paper 70 is further inserted in the joint surface between the heat sink 52 and the heat transfer member 60 of the motor drive element 50, the forced breakdown voltage test performed mainly at the time of shipment of the motor product is well performed. It is preferable to withstand it. At this time, the silicon dust 80 should be applied to the upper and lower surfaces of the insulating paper 70.

In addition, the material of the heat transfer member 60 is preferably made of aluminum (Al) because it is relatively inexpensive and has a good thermal conductivity.

The heat dissipation device of the high-pressure type motor according to the present invention provided as described above has a high heat dissipated through the heat dissipation plate 52 of the motor driving element 50 when the motor is driven to the heat transfer member 60, and then contacts the motor. It is directly heated toward the housing 40 to be air cooled from the outside.

In this case, the entire motor housing 40 may serve as a heat sink, and the heat transfer member 60 may serve as a heat transfer medium.

Therefore, with such a heat transfer structure, even if a high-pressure type motor that flows a direct-current voltage of about 240V high pressure, it is not unreasonable to embed the motor drive unit (element) 50 inside the motor housing 40. That is, because the relatively narrow space can be utilized well, the action of dissipating high heat through the entire housing 40 is made smoothly.

According to the present invention as described above, even if a drive element is built in the high-pressure motor, high heat can be radiated efficiently, so that when the motor malfunctions, not only does it adversely affect the set body or the entire circuit part, but also significantly reduces noise generation. do.

Claims (4)

In the high-voltage DC non-commutator motor in which the motor driving element is built-in on the printed circuit board inside the motor housing, The high pressure type is characterized in that the space between the motor housing and the heat sink of the motor drive element is further provided with a heat transfer member of the metal material which is in surface contact so that the high heat radiated through the heat sink is transmitted to the entire outer surface of the housing to allow air cooling. Heat dissipation device of DC rectifier motor. The method of claim 1, The heat dissipation device of the high-pressure direct current non-commutator motor, characterized in that the insulating paper is further attached to the bonding surface between the heat sink and the heat transfer member of the motor drive element to withstand the pressure resistance test. The method according to claim 1 or 2, The heat dissipation device of the high-voltage direct-current rectifier motor, characterized in that the silicon (Si) dust is further bonded to the bonding surface between the heat sink and the heat transfer member of the motor drive element to facilitate heat transfer. The method of claim 1, The heat transfer member is a heat dissipating device of a high-pressure direct current non-commutator motor, characterized in that made of aluminum (Al).