KR20010006521A - Socket for handler - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for handers for connecting electrical components and circuit boards to surfaces facing each other and for electrically connecting the electrical components to the circuit boards. The handler socket includes a socket body, a contact pin that abuts the electrical component and the circuit board to electrically connect both sides, and a holder that supports the contact pin and is fitted into the socket body. The holder includes the contact pin. The contact portion is projected from the surfaces facing each other, and the holder is configured to be detachably attached to the side of the socket body.

Description

Handler socket {SOCKET FOR HANDLER}

Conventionally, as described in Japanese Patent Application Laid-open No. Hei 9-113580, what is called a handler is that a plurality of IC carriers in which an IC package is housed is mounted on a test tray, and the test tray is conveyed. .

On the other hand, although not described in this publication, a plurality of sockets for handlers are disposed at predetermined positions of a circuit board on the IC test apparatus side.

After the IC carrier conveyed by the test tray and the socket for the handler have been positioned, the IC package stored in the IC carrier is pressed from the top by a pressure contactor, and the terminal of the IC package is handled by the handler. It is pressed by a socket for conducting to a circuit board via this handler socket.

In the handler socket, a plurality of contact pins are arranged in the socket body, and these contact pins are in contact with the terminals of the IC package and the circuit board to electrically connect both of them.

Thus, by electrically connecting, the IC package is tested by the IC test apparatus, and the good and bad parts are distinguished based on the test result.

However, in such a conventional method, the socket for the handler must be positioned with respect to the IC carrier and the circuit board, and it is necessary to set the number of pins and the pin spacing of the contact pins corresponding to the terminals of the IC package. Therefore, when the position of the positioning portion of the IC carrier or the circuit board is changed or the number of terminals or terminal spacing of the IC package is changed, the entire socket for the handler must be replaced, resulting in an increase in cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and provides a socket for a handler which can be partly used even when the position of the positioning portion of the IC carrier or the circuit board is changed or the number of terminals or terminal spacing of the IC package is changed. There is a purpose.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a socket for a handler interposed between an electric component such as a semiconductor device (hereinafter referred to as an “IC socket”) and a circuit board to electrically connect the electric component to a circuit board.

1 is a plan view of a socket for a handler according to an embodiment of the present invention,

2 is a front view of a socket for a handler according to the embodiment;

3 is a bottom view of the socket for a handler according to the embodiment;

4 is a cross-sectional view taken along line IV-IV of FIG. 1 according to the embodiment;

5 is a cross-sectional view taken along the line VV of FIG. 1 according to the embodiment;

6 is a plan view of a holder according to the embodiment;

7 is a cross-sectional view taken along the line VII-VII of FIG. 6 according to the embodiment;

8 is a view showing an IC package according to the embodiment, (a) is a plan view of the IC package, (b) is a left side view of the IC package,

9 is a perspective view of a test tray, an IC carrier, and the like according to the embodiment.

In order to achieve the above object, the present invention provides a socket for a handler for connecting an electrical component and a circuit board to surfaces facing each other, and for electrically connecting the electrical component to the circuit board. And a contact pin that contacts the component and the circuit board and electrically connects both sides thereof, and a holder supporting the contact pin and fitted into the socket body, wherein the contact pin protrudes a contact portion from the surfaces facing each other. In addition to being supported, the holder is made of a socket for handlers detachably attached to the side of the socket body.

According to this, the holder which supports a large number of contact pins can be detachably attached to the side of a socket main body, and when a change of an IC carrier or a circuit board, or the number of terminals of terminals of an electric component, or the distance between terminals differs, Alternatively, since only one side of the socket body is replaced, the other part can be shared.

Another invention is characterized in that the holder with different pin numbers and / or pin spacing of the contact pins can be mounted with respect to the socket body.

Another invention is characterized in that the socket body is provided with a positioning portion for positioning on the electric component or a circuit board, and a socket body having a different position or shape of the positioning portion with respect to the holder is mountable.

According to another aspect of the present invention, the contact pin has a substantially U-shape, and the contact portion is formed near the end of the U-shape.

According to this, the thickness of the socket for handler can be made thin, and the same contact pressure acts on both contact parts of a contact pin, and contact stability can be improved. In addition, since the contact pin is U-shaped, the current flow path is shortened, which is suitable for testing high frequency IC packages.

According to another aspect of the present invention, the contact portion of the contact pin is shaped to protrude toward the outside of the U-shape, and the amount of protrusion from the opposing surfaces of the electrical component side contact portion on the side to which the electrical component is connected is determined by the circuit board. It is characterized by being larger than the protrusion amount from the said mutually opposing surface of the contact part of the circuit board side of the side to contact.

According to this, the electrical component side contact part can be suitably contacted by the terminal of an electrical component.

Another invention is characterized in that the end of the contact pin is engaged with the contact pin engaging portion of the socket body in a state where the contact pin is mounted on the socket body, so that the load is applied in advance.

According to this, the alignment property of each contact pin can be improved and the height of each contact part can be made uniform.

Another invention is characterized in that the holder is provided with an insulating wall positioned between the plurality of contact pins to insulate, and each insulating wall is fitted to a fitting recess formed in the socket body.

According to this, each insulating wall formed in the holder is fitted to the fitting recess formed in the socket body, and the positioning at the time of attaching the holder to the socket body is performed in parallel, thereby improving the attachment workability and position accuracy of the holder. Can be.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 9 show one embodiment of the present invention.

Referring first to the configuration, reference numeral 11 in FIG. 1 denotes a handler socket, and the handler socket 11 is used to perform a performance test of the IC package 12, which is an "electrical component" shown in FIGS. 8 and 9. The terminal 12b of the IC package 12 and the circuit board 13 on the side of the IC test apparatus can be electrically connected.

In the IC package 12, a plurality of terminals 12b protrude in a crank shape at a predetermined pitch toward the side from the side surface of the rectangular package body 12a. In this embodiment, the number of terminals 12b is 54, and the space | interval of each terminal 12b is 0.8 mm.

On the other hand, in the handler IC socket 11, a pair of holders 15 are detachably attached to the side of the socket body 14, and the holders 15 correspond to the number of terminals and the terminal spacing of the terminals 12b. The contact pin 16 is accommodated.

In detail, the socket main body 14 has a substantially rectangular plate shape, as shown in Figs. 1 and 5 and the like, and a pair of cutouts 14a to which the holder 15 is attached is formed and positioning is performed. A pin fitting hole 14b and a stopper pin fitting hole 14c are formed, and the positioning pin 17 and the stopper pin 18 are fitted to these holes 14b and 14c. Moreover, a pair of positioning convex portions 14d as "positioning portions", which are fitted into the fitting holes of the circuit board 13 and positioned to be positioned at the lower surface portion of the socket body 14, protrude on a diagonal line. (See Figure 3).

As shown in Fig. 5, the positioning pin 17 is made of metal, and the fitting portion 17a fitted to the positioning pin fitting hole 14b and the edge portion 17b abutting the upper surface portion of the socket body 14 are provided. ) And a positioning unit 17c for positioning the IC carrier 20 described later.

In addition, as shown in FIG. 5, the stopper pin 18 is comprised by the fitting part 18a fitted to the said stopper pin fitting hole 14c, and the stopper part 18b which the IC carrier 20 contacts.

Further, the recess 14e of the socket body 14 is formed with a fitting recess 14e into which the holder 15 is fitted (see Fig. 4).

On the other hand, as shown in Figs. 6 and 7, the holder 15 has a receiving pin 15a to which the contact pin 16 is fitted at a predetermined pitch, and the contact pin housed in the housing 15a. A plurality of insulating walls 15b interposed between the 16 are protruded adjacent to each other. The tip portion 15c of the insulating wall 15b is fitted to the fitting recess 14e of the socket body 14.

As shown in FIG. 4, the screw 21 is inserted into the through hole 15e formed in the end 15d of the holder 15 so that the screw 21 is formed in the socket main body 14. By being screwed to 14f), the holder 15 is detachably attached to the socket body 14 while the holder 15 supports the contact pin 16.

This contact pin 16 is formed by punching a thin plate material having conductivity and elasticity, and has a U-shaped contact pin main body 16a, and the electrical component is located near the upper end of the U-shaped upper side. The side contact portion 16b and the circuit board side contact portion 16c are respectively formed in the vicinity of the lower end of the U-shape.

These contact portions 16b and 16c have a protruding shape projecting outward toward the U-shape, and the electrical component side contact portion 16b is connected to the terminal 12b of the IC package 12, and the circuit board side contact portion ( 16c is connected to the circuit board 13.

Then, the projection amount L1 from the upper surface of the electrical component side contact portion 16b as the "face facing each other" is the projection amount L2 from the lower surface of the circuit board side contact portion 16c as the "face facing each other". It is set larger than.

The tip portions 16d and 16e of the U-shaped contact pin main body 16a of the contact pin 16 have the "contact pins" of the socket main body 14 with the holder 15 mounted on the socket main body 14. To the contact pin 16 by engaging with the upper wall 14g and the lower wall 14h of the fitting recess 14e as the locking portion ", and elastically deforming the two front end portions 16d and 16e on their sides. The load is set in advance (see FIG. 4).

Hereinafter, the usage method of the handler socket 11 of the above structure is demonstrated.

In advance, the positioning convex portions 14d of the plurality of handler sockets 11 are fitted to the fitting holes 13a of the circuit board 13 and attached to the predetermined positions, respectively. In this state, the circuit board side contact portion 16c of the contact pin 16 is pressed against the circuit board 13.

Meanwhile, as shown in FIG. 9, a plurality of IC carriers 20 are mounted on the test tray 23 of the handler, and the IC package 12 is positioned and stored in the IC carrier 20, and in this state. The test tray 23 is conveyed by the apparatus not shown. Then, the IC carrier 20 is placed on the plurality of handler sockets 11 arranged at a predetermined position on the circuit board 13 on the IC tester side.

Then, by lowering the test tray 23, the positioning pin 17 is fitted into the positioning hole formed in the IC carrier 20, and the IC carrier 20 is attached to the stopper pin 18. Make contact.

In this state, the IC carrier 20, further, the IC package 12, the handler socket 11, and the circuit board 13 are assembled to each other in a predetermined positional relationship.

Then, the terminal 12b of the IC package 12 is pressed from the upper side with a presser not shown on the handler side, and the terminal 12b of the IC package 12 is pressed into the electrical component side contact portion 16b of the contact pin 16. Press to join.

At this time, the contact pin 16 is elastically deformed so that the terminal 12b of the IC package 12 and the electrical component side contact portion 16b come into contact with each other by a predetermined pressing force.

In this way, the IC package 12 is electrically connected to the circuit board 13 via the handler socket 11, so that the IC package 12 is tested by the IC test apparatus. On the basis of this, the classification of a good product and a defective product is performed.

Thus, by forming the contact pin 16 in a U shape to elastically deform, the thickness of the socket for the handler 11 can be reduced, and furthermore, the contact pins 16b and 16c of the contact pins 16 are formed. The same contact pressure acts to improve contact stability.

In addition, since the contact pin 16 is U-shaped and the current flow path is shortened, it is suitable for testing the high frequency IC package 12.

Furthermore, the contact pins 16 are pre-loaded by slightly bending the U-shaped contact pins 16 and fitting them into the fitting recesses 14e of the socket body 14, thereby providing a contact load of each of the contact pins 16, respectively. Alignment property is improved and the height of each contact part 16b or 16c can be made uniform.

Furthermore, the IC of the electrical component side contact portion 16b is made larger by making the protrusion amount L1 of the electrical component side contact portion 16b of the contact pin 16 larger than the protrusion amount L2 of the circuit board side contact portion 16c. Contact stability with respect to the terminal 12b of the package 12 can be ensured. That is, the amount of elastic deformation of the entire U-shaped contact pin main body 16a is determined by the contact pin 16, and the amount of displacement of each of the contact portions 16b and 16c is an amount that distributes the total amount of elastic deformation. Therefore, the amount of displacement L1 of the electrical component side contact portion 16b is made larger than the amount of protrusion L2 of the circuit board side contact portion 16c to increase the displacement amount of the electrical part side contact portion 16b. In this case, since the amount of pushing in the IC package 12 side can be long, the electrical component side contact portion 16b can be brought into proper contact with the terminal 12b of the IC package 12. On the other hand, although the displacement amount of the circuit board side contact part 16c becomes small, since the circuit board 13 does not bend that much, even if the displacement amount becomes small, contact stability can be ensured.

On the other hand, since the socket 11 for the handler is interchangeable with the holder 15 on which the socket body 14 and the contact pin 16 are supported, the socket body 14 or the holder 15 can be shared. do.

That is, even if the number of terminals and the terminal spacing of the terminals 12b of the IC package 12 are the same, or if the IC carrier 20, the circuit board 13, and the like are different, the socket body 14 is connected to the IC carrier 20 or the circuit board ( 13) may not be attached in a predetermined positional relationship. At this time, the holder 15 is not replaced, and only the socket main body 14 is replaced with that corresponding to the IC carrier 20 or the like, and the holder 15 is attached to the socket main body 14. In this case, since the holder 15 does not need to be replaced only by replacing only the socket main body 14, the holder 15 can be shared.

On the contrary, even if the IC carrier 20, the circuit board 13, etc. are the same, the number of terminals and terminal spacing of the terminal 12b of the IC package 12 may differ. In this case, the socket main body 14 can be replaced by replacing only the holder 15 on which the contact pin 16 is supported without being replaced. In this way, since the socket main body 14 does not need to be replaced only by replacing only the holder 15, the socket main body 14 can be shared.

In addition, when attaching the holder 15 to the socket main body 14, the tip 15c of the insulating wall 15b of the holder 15 is fitted to the fitting recess 14e of the socket main body 14. It is possible to position, to impart a positioning function to the insulating wall 15b for insulating the contact pin 16, and to improve attachment workability and positional accuracy.

Furthermore, supporting the contact pin 16 to the holder 15 can be supported simply by fitting the U-shaped contact pin main body 16a to the housing 15a suitable for this shape.

In addition, although the IC package 12 was applied as "electric component" in the said embodiment, it is not limited to this, It may be another type IC package, and may also be electrical components other than IC package.

As described above, the handler socket according to the present invention can be preferably used to electrically connect the IC package to the circuit board.

Claims (7)

A handler socket for connecting an electrical component and a circuit board to surfaces facing each other, and for electrically connecting the electrical component to the circuit board. A socket main body, a contact pin that abuts the electrical component and the circuit board to electrically connect both sides, and a holder supporting the contact pin and fitted into the socket main body, The holder is a socket for handlers, wherein the contact pins are supported by protruding contact portions from the surfaces facing each other, and the holders are detachably attached to the side of the socket body. The socket for a handler according to claim 1, wherein the holder having a different number of pins and / or pin spacing of the contact pin is mountable with respect to the socket body. 2. The handler according to claim 1, wherein the socket body is provided with a positioning portion for positioning on the electrical component or a circuit board, and a socket body having a different position or shape of the positioning portion with respect to the holder is mountable. socket. The socket for a handler according to claim 1, wherein the contact pin has a substantially U shape, and the contact portion is formed near the end of the U shape. The contact portion of the contact pin is a projection projecting toward the outside of the U-shape, and the amount of protrusion from the opposing surfaces of the electrical component side contact portion on the side to which the electrical component is connected is determined by the circuit. A socket for a handler, characterized in that it is larger than the amount of protrusion from said mutually opposing surfaces of the circuit board side contact portion on the side to which the substrate is connected. The handler according to claim 1, wherein the contact pin is configured such that an end portion of the contact pin is engaged with a contact pin engaging portion of the socket body in a state where the holder is mounted on the socket body, so that a load is applied in advance. Socket. 2. The handler according to claim 1, wherein the holder is formed with an insulating wall positioned between the plurality of contact pins to insulate, and each insulating wall is fitted to a fitting recess formed in the socket body. Socket.