KR20000063340A - Treatment of the wastewater of semiconductor sawing process using ultrafiltration membrane - Google Patents
Treatment of the wastewater of semiconductor sawing process using ultrafiltration membrane Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
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Abstract
Description
본 발명은 한외여과막을 이용한 반도체 쇼잉공정폐수의 처리방법에 관한 것으로, 보다 상세하게는 지속적으로 확장, 발전되고 있는 전자산업에서 가장 중요한 공정의 하나인 반도체공정의 웨이퍼(wafer) 가공공정에서 발생하는 폐수를 전처리 없이 단순히 막으로 처리하여 처리수를 재사용함으로써 막 오염문제, 처리수 수질안정문제, 역세수 최소화 문제를 해결하면서 장치를 단순화하여 투자비를 최소화하는 한외여과막을 이용한 반도체 쇼잉공정폐수의 처리방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating semiconductor shoring wastewater using an ultrafiltration membrane. More particularly, the present invention relates to a process for processing wafers, which is one of the most important processes in the electronics industry, which is continuously expanding and developing. Treatment method of semiconductor shoring wastewater using ultrafiltration membrane that minimizes investment cost while solving membrane contamination problem, water quality stability problem and minimizing backwash water by reusing treated water by simply treating membrane with wastewater without pretreatment. It is about.
일반적인 폐수재활용 시스템으로 막(membrane)이 주로 사용되고 있으며, 콜로이드성 물질(colloidal particle)을 포함한 폐수를 처리하여 재사용하기 위해서는 응집처리 후 정밀여과막 또는 한외여과막을 사용하게 된다. 폐수처리 시스템에 막을 적용하기 위해서는 막 오염문제, 처리수 수질안정문제, 역세수 또는 농축수 최소화문제, 투자비 및 운전비 최소화문제가 동시에 해결되어야 한다. 그러나, 막 오염문제를 해결하려 하면 처리수가 불안정해지거나 역세수의 양이 증가하게 되며, 오염에 강한 형태의 막을 사용할 경우 투자비와 운전비가 상승하게 된다. 반면에, 처리수의 수질을 개선하려 하면 처리수량의 감소로 인한 투자비 증가 또는 역세수(농축수)의 증가문제가 발생하게 된다.As a general wastewater recycling system, a membrane is mainly used, and a microfiltration membrane or an ultrafiltration membrane is used after the flocculation treatment in order to reuse and treat wastewater including colloidal particles. Membrane contamination, treated water quality stability, backwash or concentrated water minimization problems, investment and operating cost minimization problems must be addressed in order to apply membranes to wastewater treatment systems. However, attempting to solve the membrane contamination problem may lead to unstable treatment water or increase the amount of backwash water, and increase the investment and operating costs when using membranes resistant to contamination. On the other hand, attempts to improve the quality of the treated water may result in an increase in investment costs or an increase in backwash water (concentrated water) due to the reduced amount of treated water.
국내외에서 폐수재활용 즉, 콜로이드성 물질을 제거하여 재사용하는 공정은 1차 응집처리후 평행류 흐름방식의 중공사형 정밀여과장치를 적용하거나 평행류 흐름방식의 중공사형 또는 관형의 한외여과막을 사용하게 된다. 그러나, 1차 응집처리후 평행류 흐름방식의 중공사형 정밀여과막을 적용하는 경우는 처리하고자 하는 폐수의 불균일성 유입으로 인하여 응집처리가 불안정해지므로 일부 큰 입자들이 중공사형 정밀여과장치에 유입되어 막 오염 및 처리수 수질의 불안정을 유발한다. 평행류 흐름방식의 중공사형 한외여과장치를 사용할 경우 유입수량 대비 처리수량(회수율)의 증가에 따라 막오염의 현상이 발생하며, 설계조건을 제시하기가 어렵다. 또한, 평행류 흐름방식의 관형 한외여과장치를 사용하는 경우는 관형 여과막의 여과면적이 작으므로 투자비가 상승되고, 그에 따라 운전비도 증가하게 된다.Wastewater recycling at home and abroad, that is, the colloidal material is removed and reused, after the first coagulation treatment, a parallel flow-flow hollow fiber type microfiltration device or a parallel flow-flow hollow fiber type or tubular ultrafiltration membrane is used. . However, in the case of applying the hollow fiber type microfiltration membrane of the parallel flow method after the first flocculation treatment, the coagulation process becomes unstable due to the inhomogeneous inflow of the waste water to be treated, so that some large particles enter the hollow fiber type microfiltration device and contaminate the membrane. And instability of the treated water quality. In the case of using the parallel-flow hollow fiber type ultrafiltration system, membrane fouling phenomenon occurs due to the increase in the treated water volume (recovery rate) compared to the inflow amount, and it is difficult to present design conditions. In addition, in the case of using the parallel flow-type tubular ultrafiltration device, the investment area is increased because the filtration area of the tubular filtration membrane is small, thereby increasing the operating cost.
경제발전과 산업구조가 고도화됨에 따라 많은 분야에서 순수 및 초순수의 사용이 증가하고 있고, 그 중 지속적으로 발전 및 확장될 것으로 전망되는 반도체 분야에서는 초순수의 수질이 생산수율과 직접적인 연관이 있으므로 특히 순수 또는 초순수의 수질이 중요하며, 그 사용량도 크게 증가될 것으로 예상된다. 반도체 제조공정에 사용되는 순수 또는 초순수는 대부분 세정수로서 다량 사용되고 있으며, 특히 다이아몬드 절단기를 사용하여 웨이퍼의 표면을 연마하거나 필요한 크기로 절단하는 쇼잉(sawing)공정에서는 세정용수로 초순수가 사용되고 있고, 전량 폐수처리장으로 유입되고 있다. 쇼잉공정폐수의 성상은 반도체 제조용 등급의 초순수에 콜로이드성 실리콘입자가 일부 포함되어 있는 것으로, 다른 불순물은 없으므로 콜로이드성 입자만 제거하면 양질의 처리수를 얻을 수 있어 재사용이 가능하다.As economic development and industrial structure are advanced, the use of pure water and ultrapure water is increasing in many fields, and in the semiconductor field, which is expected to continue to be developed and expanded, the quality of ultrapure water is directly related to the production yield. Ultrapure water quality is important, and its use is expected to increase significantly. Pure water or ultrapure water used in the semiconductor manufacturing process is mostly used as washing water, and in the sawing process in which a diamond cutter is used to polish the surface of the wafer or cut it to the required size, ultrapure water is used as the washing water, and the whole amount of waste water is used. It is flowing into the treatment plant. Shawing process waste water is a part of colloidal silicon particles contained in the ultrapure water of the semiconductor manufacturing grade, there is no other impurities, so only the colloidal particles can be removed to obtain a high-quality treated water, which can be reused.
쇼잉공정에서 발생하는 폐수 중에 있는 콜로이드성 입자인 실리콘 입자를 제거후 재사용하기 위하여 1차 응집처리후 평행류 흐름방식의 중공사형 정밀여과장치및 중공사형태 또는 관형의 한외여과막을 사용할 수 있다. 그러나, 1차 응집처리후 평행류 흐름방식의 중공사형 정밀여과막을 적용하는 경우 처리하고자 하는 폐수의 이온농도가 낮으면 응집약품의 투입조건을 맞추기가 어렵기 때문에 응집처리가 불안정해지며, 일부 큰 입자들이 침전조를 거쳐서 다음 처리단계로 넘어가게 된다. 다음 처리단계인 중공사형 정밀여과장치에 유입된 입자들은 막 오염과 처리수 불안정을 유발하여 공정의 운전이 어렵게 된다. 평행류 흐름방식의 중공사형 한외여과장치를 사용할 경우 유입수량 대비 처리수량(회수율)의 증가에 따라 막의 내경을 작게 함으로써 단위 부피당 막의 여과면적을 증가시킨 중공사막의 특성으로 인하여 유입수가 농축되면서 막오염 현상이 발생하게 되며, 회분식(batch)운전 또는 연속운전의 설계조건을 제시하기가 까다로워진다. 또한, 평행류 흐름방식의 관형 한외여과장치를 사용하는 경우는 막의 오염을 줄이기 위하여 막의 내경을 크게 함으로써 단위 부피당 차지하는 막의 여과면적이 감소하며, 관형 여과막의 특성으로 인하여 여과면적이 작으므로 투자비가 상승되고 그에 따라 운전비도 증가하게 된다.In order to remove and reuse the colloidal silicon particles in the waste water generated in the shoring process, a hollow fiber microfiltration device of a parallel flow flow method and a hollow fiber or tubular ultrafiltration membrane may be used after the first flocculation treatment. However, when the parallel flow-flow hollow fiber type microfiltration membrane is applied after the first flocculation treatment, if the ion concentration of the wastewater to be treated is low, the flocculation treatment becomes unstable because it is difficult to meet the input conditions of the flocculating chemicals. The particles pass through the settling tank to the next treatment step. Particles introduced into the next processing stage, hollow fiber type microfiltration system, cause membrane contamination and instability of the treated water, making the process difficult to operate. In case of using the parallel-flow hollow fiber type ultrafiltration device, the membrane is contaminated by the inflow of water due to the characteristics of the hollow fiber membrane which increases the filtration area of the membrane per unit volume by decreasing the inner diameter of the membrane according to the increase in the treated water volume (recovery rate). The phenomenon occurs, and it becomes difficult to present design conditions for batch operation or continuous operation. In addition, in the case of using the parallel flow type tubular ultrafiltration device, the membrane filtration area per unit volume is reduced by increasing the inner diameter of the membrane to reduce the contamination of the membrane, and the investment cost increases because the filtration area is small due to the characteristics of the tubular filtration membrane. As a result, the driving cost is increased.
따라서, 본 발명의 목적은 반도체 쇼잉공정폐수를 처리하는 과정의 문제점들인 막 오염문제, 처리수 수질안정문제, 역세수 또는 농축수 최소화문제, 투자비 최소화문제를 해결하기 위하여, 일반적으로 사용될 수 있는 응집 후 평행류 흐름의 중공사형 정밀여과막처리 및 평행류 흐름의 중공사형 또는 관형 한외여과막의 사용을 배제하고, 수직류 흐름방식의 중공사형 한외여과막을 적용함으로써 처리수의 수질 안정화 및 투자비 최소화를 달성하고, 에어스크러빙(air scrubbing) 및 처리수 (또는 처리수질과 같거나 처리수질보다 양호한 수질의 물)를 역으로 처리수 배관으로 유입시키는 역세방식을 적용함으로써 막오염을 확실히 제거하여 막오염문제, 역세수 또는 농축수 최소화 문제를 해결하는 한외여과막을 이용한 반도체 쇼잉공정폐수의 처리방법을 제시하는데 있다.Accordingly, an object of the present invention is to provide a cohesion that can be generally used to solve the problems of the process of treating semiconductor shoring wastewater, the problem of membrane contamination, the stability of treated water quality, the problem of minimizing backwash or concentrated water, and the minimizing investment cost. By eliminating the use of hollow fiber type microfiltration membranes in the parallel flow stream and the hollow fiber type or tubular ultrafiltration membranes in parallel flow streams, and by applying the hollow fiber type ultrafiltration membranes in the vertical flow flow method, water quality stabilization and minimized investment costs are achieved. , Air scrubbing and the backwashing method which inflows the treated water (or water of the same quality or better than the treated water) into the treated water pipe in order to surely remove the membrane contamination, The method of treating the semiconductor shoWing process wastewater using ultrafiltration membrane that solves the problem of minimizing washing or concentrated water I can ignore.
도 1은 본 발명의 바람직한 실시예에 따른 반도체 쇼잉공정폐수의 처리 및 재사용과정을 도시한 공정도,1 is a process chart showing a treatment and reuse process of a semiconductor shoring wastewater according to a preferred embodiment of the present invention;
도 2는 본 발명의 바람직한 실시예에 따른 수직류 흐름방식의 역세 가능한 중공사형 한외여과막에 의한 반도체 쇼잉공정폐수 처리의 원리를 도시한 사시도,Figure 2 is a perspective view showing the principle of the semiconductor shoring process wastewater treatment by a backwashable hollow fiber type ultrafiltration membrane of the vertical flow method according to a preferred embodiment of the present invention,
도 3은 본 발명의 바람직한 실시예에 따른 역세 가능한 중공사형 한외여과막을 이용한 폐수처리공정의 운전방식을 도시한 사시도이다.3 is a perspective view showing the operation of the wastewater treatment process using a backwashable hollow fiber type ultrafiltration membrane according to a preferred embodiment of the present invention.
상기 목적을 달성하기 위하여 폐수의 수질, 입자의 크기와 특성을 정확히 분석한 후, 반도체 제조공정의 쇼잉공정 중에서 발생하는 폐수의 특성인 0.15∼0.6 ㎛ 크기의 실리콘 입자를 포함하며 전도도가 30 μS/cm 이하인 폐수처리에 적합한 막을 선택하여 운전방법과 운전조건을 최적화시킴으로써 폐수내의 입자들로 인한 막 오염문제를 해결하고, 폐수내 입자의 막 통과로 인한 처리수의 수질을 안정화시키며, 막의 회수율에 따른 역세수 또는 농축수를 최소화하고, 막의 선택과 운전조건에 따른 투자비 및 운전비를 최소화하였다.In order to achieve the above purpose, after precisely analyzing the water quality, particle size and characteristics of the wastewater, it contains silicon particles having a size of 0.15 to 0.6 μm, which is a characteristic of the wastewater generated during the shoring process of the semiconductor manufacturing process, and has a conductivity of 30 μS / By selecting the membrane suitable for wastewater treatment of cm or less, it optimizes the operation method and the operating conditions to solve the membrane contamination problem caused by the particles in the wastewater, stabilize the water quality of the treated water due to the passage of the membrane in the wastewater, and Minimize backwash or concentrated water, and minimize investment and operating costs according to membrane selection and operating conditions.
이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예를 설명하고자 하지만, 본 발명의 권리범위는 하기 실시예에만 한정되는 것은 아니다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, but the scope of the present invention is not limited only to the following examples.
도 1(P&ID)은 본 발명의 바람직한 실시예에 따른 반도체 쇼잉공정폐수의 처리 및 재사용과정을 도시한 공정도로서, 집수조에 모인 쇼잉공정폐수는 역세가 가능하며 외압형의 중공사형인 기공크기가 0.1 ㎛ 이하의 한외여과막이 설치되어 있는 탱크에 유입되고, 한외여과막에 의하여 처리된 여과수는 처리수탱크로 이송되며, 처리수는 반도체 제조공정으로 반송되어 재사용된다. 막의 오염을 제거하기 위하여 일정한 시간이 경과한 후, 역세펌프를 사용하여 처리수(또는 처리수질과 같거나 양호한 수질의 물)를 역으로 처리수배관을 통하여 막의 내부로 유입시킴으로써 오염된 막의 외부표면을 세정한다. 또한, 막의 표면을 확실히 세정하기 위하여 공정공기 또는 압축공기를 탱크 내부로 유입시켜 난류가 형성되도록 한다. 역세로 인하여 발생한 농축수(막 유입수의 5% 이내, 회수율 95% 이상)는 폐수처리장으로 이송하여 처리한다.1 (P & ID) is a process chart showing the treatment and reuse process of the semiconductor shoring wastewater according to a preferred embodiment of the present invention, the shoring process wastewater collected in the sump tank can be backwashed, the pore size of the external pressure hollow fiber type 0.1 The ultrafiltration membrane having a thickness of less than or equal to micrometers is introduced into the tank, and the filtered water treated by the ultrafiltration membrane is transferred to the treated water tank, and the treated water is returned to the semiconductor manufacturing process for reuse. After a certain time has elapsed to remove the fouling of the membrane, the back surface of the contaminated membrane is introduced by using a backwash pump to reversely introduce the treated water (or water of the same or better quality) into the membrane through the treated water pipe. Clean. In addition, process air or compressed air is introduced into the tank in order to clean the surface of the membrane so that turbulence is formed. Concentrated water from backwashing (within 5% of membrane influent and recovery of 95% or more) is transferred to a wastewater treatment plant for disposal.
도 2는 본 발명의 바람직한 실시예에 따른 수직류 흐름방식의 역세 가능한 중공사형 한외여과막에 의한 반도체 쇼잉공정폐수 처리의 원리를 도시한 사시도로서, 탱크에 유입된 폐수는 한외여과막의 수직방향으로 흐르고, 유입수 중의 부유물질(SS) 및 콜로이드성 입자들은 역세가 가능한 중공사형 한외여과막 표면에 걸려서 여과되며, 막의 기공을 통과한 여과수는 막의 내부 및 처리수배관을 통하여 처리수탱크로 이송된다.Figure 2 is a perspective view showing the principle of the semiconductor shoring process wastewater treatment by a backwashable hollow fiber type ultrafiltration membrane of the vertical flow flow method according to a preferred embodiment of the present invention, the wastewater flowing into the tank flows in the vertical direction of the ultrafiltration membrane The suspended solids (SS) and colloidal particles in the influent are caught on the surface of the hollow fiber-type ultrafiltration membrane which can be backwashed, and the filtered water passing through the pores of the membrane is transferred to the treated water tank through the membrane and the treated water pipe.
도 3은 본 발명의 바람직한 실시예에 따른 역세 가능한 중공사형 한외여과막을 이용한 폐수처리공정의 운전방식을 도시한 사시도로서, 막의 역세와 에어스크러빙은 병행 또는 개별적으로 수행이 가능하다. 일정시간의 정상운전 후 막세정운전으로 전환되고, 역세펌프를 이용하여 처리수를 탱크내로 반송함으로써 역세를 실시하며, 이 역세모드에서 공기밸브는 닫힌 상태이다. 역세가 종료되면 유입수 및 배출수 밸브가 닫힌 상태에서 압축공기에 의한 에어스크러빙을 실시한다. 에어스크러빙모드에 이어 배수밸브(drain valve)가 열린 상태에서 탱크내 오염물을 배출하기 위한 배수모드가 진행된다. 배수모드가 종료되면 공기배출밸브(air vent)가 열린 상태에서 탱크내로 폐수가 유입되는 유입모드(feed mode)가 진행되면서 다시 정상운전이 시작된다.Figure 3 is a perspective view showing the operation of the wastewater treatment process using a backwashable hollow fiber type ultrafiltration membrane according to a preferred embodiment of the present invention, the backwashing of the membrane and air scrubbing can be performed in parallel or separately. After normal operation for a certain period of time, the process is switched to the membrane cleaning operation, and backwashing is performed by returning the treated water into the tank using a backwash pump, and in this backwash mode, the air valve is closed. After the backwash is complete, air scrub with compressed air with the inlet and outlet valves closed. Following the air scrubbing mode, a drainage mode for discharging contaminants in the tank is performed while the drain valve is open. When the drain mode is finished, the normal operation is started again while the feed mode in which the waste water flows into the tank while the air vent valve is opened is performed.
이하, 본 발명의 구체적인 구성을 실시예를 들어 보다 상세하게 설명한다.Hereinafter, the specific configuration of the present invention will be described in more detail with reference to Examples.
표 1은 본 발명에 따라 수직류 흐름방식의 외압형 및 중공사형 한외여과막을 이용하여 반도체 쇼잉공정폐수를 처리한 여과수의 수질과 상수도 수질을 비교한 것으로, 본 발명에 따라 반도체 쇼잉공정폐수를 처리한 결과 부유물질은 완전히 제거되었고, 원수의 탁도가 99% 이상 제거되었다. 상수도의 수질과 비교하면 처리수의 염소이온 및 전도도가 현저히 낮았으며, 따라서 처리수의 수질이 상수도 수질보다 양호하므로 처리수를 반도체 제조공정으로 반송하여 재사용할 수 있다.Table 1 compares the water quality and the tap water quality of the filtered water treated with the semiconductor shoWing process wastewater using external pressure type and hollow fiber type ultrafiltration membranes of the vertical flow method according to the present invention. As a result, the suspended solids were completely removed and the turbidity of the raw water was removed by more than 99%. Compared with the water quality of the tap water, the chlorine ion and conductivity of the treated water were significantly lower. Therefore, since the water quality of the treated water is better than that of the tap water, the treated water can be returned to the semiconductor manufacturing process for reuse.
표 2는 반도체 쇼잉공정폐수를 나권형 한외여과막, 평행류 흐름방식의 내압형 및 중공사형 한외여과막, 평행류 흐름방식의 내압형 및 관형 한외여과막, 수직류 흐름 방식의 외압형 및 중공사형 한외여과막으로 처리할 경우에 각각의 장·단점을 비교한 것으로, 본 발명에 따라 수직류 흐름방식의 외압형 및 중공사형 한외여과막을 이용하여 반도체 쇼잉공정폐수를 처리하면 다른 막 또는 흐름방식을 사용한 경우보다 막의 오염될 가능성이 적고 운전의 안정성이 증대되며, 설계 및 시공이 편리하고 투자비가 적게 소요된다.Table 2 shows the semi-circular ultrafiltration membranes of spiral wound process, internal pressure type and hollow fiber type ultrafiltration membranes of parallel flow type, internal pressure type and tubular ultrafiltration membranes of parallel type flow type, external pressure type and hollow fiber type ultrafiltration membranes of vertical type flow type When comparing the advantages and disadvantages of each process, the semiconductor shoWing process wastewater was treated using external pressure type and hollow fiber type ultrafiltration membranes with vertical flow according to the present invention. Membrane is less likely to be contaminated, operation stability is increased, design and construction are convenient and investment costs are low.
표 3은 본 발명에 따라 수직류 흐름방식의 외압형 및 중공사형 한외여과막을 이용하여 반도체 쇼잉공정폐수를 처리하는 공정의 최적 운전조건을 나타낸 것으로, 막의 오염을 최소화하기 위해서는 운전압력을 1.5 kg/㎠ 이하로 하여 운전하는 것이 바람직하다. 역세압력은 1.5∼2.5 kg/㎠, 에어스크러빙 압력은 1.5∼2.5 kg/cm2로 운전하는 것이 적당하며, 역세는 2∼10시간 정상운전 후 3∼10분간 실시하는 것이 바람직하다.Table 3 shows the optimum operating conditions of the semiconductor shoring process wastewater using external pressure type and hollow fiber type ultrafiltration membranes of vertical flow according to the present invention, the operating pressure is 1.5 kg / to minimize the contamination of the membrane It is preferable to operate with 2 cm <2> or less. It is preferable to operate the backwashing pressure at 1.5 to 2.5 kg / cm 2 and the air scrubbing pressure at 1.5 to 2.5 kg / cm 2 , and the backwashing is preferably performed for 3 to 10 minutes after the normal operation for 2 to 10 hours.
이상, 본 발명의 구체적인 구성을 실시예를 참조하여 상세하게 설명한 바와 같이, 본 발명은 반도체 쇼잉공정폐수를 역세가능한 외압형의 중공사형 한외여과막에 수직방향으로 통과시키는 수직흐름방식을 도입한 폐수처리공정을 제공함으로써 폐수내의 입자들로 인한 막 오염문제를 해결하고, 폐수내 입자의 막 통과로 인한 처리수의 수질을 안정화시키며, 막의 회수율에 따른 역세수 또는 농축수를 최소화하고, 막의 선택과 운전조건에 따른 투자비 및 운전비를 최소화하며, 여과된 처리수를 반도체 제조공정으로 반송하여 재사용할 수 있는 뛰어난 효과가 있으므로 환경산업상 매우 유용한 발명인 것이다.As described above in detail with reference to the specific configuration of the present invention, the present invention is a wastewater treatment that introduces a vertical flow method for passing the semiconductor shoring wastewater in a vertical direction through an external pressure-type hollow fiber type ultrafiltration membrane. Providing a process solves the membrane fouling problem caused by particles in wastewater, stabilizes the water quality of treated water due to the passage of particles in the wastewater, minimizes backwash or concentrated water according to the recovery rate of membranes, and selects and operates the membrane. It is a very useful invention for the environmental industry because it minimizes the investment and operating costs according to the conditions, and has an excellent effect that can be reused by returning the filtered water to the semiconductor manufacturing process.
Claims (4)
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20010079372A (en) * | 2001-07-10 | 2001-08-22 | 홍진의 | Method for reuse of wastewater from semiconductor sawing process |
| KR20020065106A (en) * | 2001-02-05 | 2002-08-13 | 동안엔지니어링 주식회사 | method of reusing process of SAW wastewater in semiconductor rinsing wastewater |
| KR100415165B1 (en) * | 2001-04-26 | 2004-01-13 | 주식회사 라파텍 | Wastewater treatment system using air injection type tubular membrane |
| KR101019032B1 (en) * | 2010-08-24 | 2011-03-04 | 주식회사 시노펙스케미코아 | Treatment apparatus and method for wafer waste water |
| RU2446111C1 (en) * | 2010-09-14 | 2012-03-27 | Александр Владимирович Микиртычев | Method of water treatment and membrane unit to this end |
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| JPH01307490A (en) * | 1988-06-06 | 1989-12-12 | Japan Organo Co Ltd | Method of recovering backwashing waste water of condensate desalting device |
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| JPH06238135A (en) * | 1993-02-17 | 1994-08-30 | Daicel Chem Ind Ltd | Permeated flux recovery method for hollow fiber filter membrane module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20020065106A (en) * | 2001-02-05 | 2002-08-13 | 동안엔지니어링 주식회사 | method of reusing process of SAW wastewater in semiconductor rinsing wastewater |
| KR100415165B1 (en) * | 2001-04-26 | 2004-01-13 | 주식회사 라파텍 | Wastewater treatment system using air injection type tubular membrane |
| KR20010079372A (en) * | 2001-07-10 | 2001-08-22 | 홍진의 | Method for reuse of wastewater from semiconductor sawing process |
| KR101019032B1 (en) * | 2010-08-24 | 2011-03-04 | 주식회사 시노펙스케미코아 | Treatment apparatus and method for wafer waste water |
| RU2446111C1 (en) * | 2010-09-14 | 2012-03-27 | Александр Владимирович Микиртычев | Method of water treatment and membrane unit to this end |
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