KR20000062400A - Inlet structures for introducing a particulate solids containing and/or solids forming gas stream to a gas processing system - Google Patents

Abstract

The present invention relates to an inlet structure 60 for passing airflow from an upstream source 90 of gas to a downstream point, which not only inhibits the deposition and formation of particles and thin films, but also adversely affects hydrodynamics. Are configured, arranged and operated.

Description

INLET STRUCTURES FOR INTRODUCING A PARTICULATE SOLIDS CONTAINING AND / OR SOLIDS FORMING GAS STREAM TO A GAS PROCESSING SYSTEM}

In the process of treating the particulate solid-containing air stream and / or the particulate solid-forming air stream, it is often a problem that the inlet structure of the processing equipment is blocked by the particulate solid in the air stream. As the particulate solid containing air stream and / or particulate solid forming air flow flows through the processing equipment, the solids may be deposited on the surfaces and passages of the inlet structure.

If particulate solids accumulate as the processing equipment continues to run, the inlet structure of such equipment may be blocked enough to completely block it. Alternatively, the accumulation of such solids may not block the inlet of the processing unit, but the flow of airflow will be impaired and the pressure drop in the system will be increased to such an extent that the processing equipment is considerably inefficient to achieve its intended purpose. It may be.

In general, particles associated with the air stream are (i) particles generated in the upstream treatment unit and upstream with the air stream to the downstream inlet structure, (ii) oxygen from the leaks entering the system line, and reaction with the treatment gas component. Particles formed in the system line by means of (iii) particles formed in the system line due to two or more process off-gas reactions during the flow of air to the downstream inlet structure, and (iv) in the inlet structure downstream. Treatment with particles formed by (partial) condensation of the blocking gases leading to, (v) back-diffusion oxygen or water vapor from a downstream air flow treatment unit, such as a downstream water scrubber, And from various sources, including particles formed by reaction with gases. In some situations where particles are formed by condensation, this problem may be ameliorated by heating the processing line to remove condensable portions of the air stream. However, even if the treatment line is heated, problems with particles from other sources still remain.

In particular, in the field of semiconductor manufacturing, (a) incoming water sensitive BCl ₃ , WF ₆ , DCS, such as combustion products of downstream oxidation and / or water purification operations used to treat the airflow; Return movement of water vapor or liquid water to the inlet by capillary action causing a hydrolysis reaction in a heterogeneous or homogeneous manner with a gas such as TCS, SiF ₄ , (b) Pyrolysis, and (c) condensation of inlet gases due to transition points in the system, are likely to cause clogging of the inlet.

Due to the inlet blockage problem described above, it is necessary to incorporate a plunger mechanism or other solids removal means to prevent solids from accumulating at the inlet. However, these mechanical fasteners add significant cost and labor to the system and can damage the ingress over time. In other cases, clogging of the inlet can affect the entire system and it is necessary to take periodic precautions to ensure that solids do not accumulate at the inlet. However, these measures require the system to be shut down, which reduces the productivity of the manufacturing or processing plant to which the inlet is associated.

In view of the phenomenon that water vapor or water flows back from the downstream water purification device to the upstream inlet structure in the semiconductor process outflow airflow treatment system, the water vapor discharged from the water purification device is subjected to the normal flow direction of the processing gas. In contrast, return movement from the water purification device inlet toward the processing tool], various mechanisms may be involved in the return movement transport of water vapor.

One such mechanism is gas-gas interdiffusion. The only practical way to avoid the return movement of water vapor is to add a diffusion boundary to the water purifier inlet.

Another mechanism for this despreading of water vapor is the so-called Richardson effect annular effect. All dry pumps cause some amount of pressure vibration in the gas flow stream. This pressure oscillation causes a countercurrent transport mechanism that pumps the gases in opposition to the usual gas flow direction. This phenomenon is the result of the boundary layer annular effect. Because of this effect, the reverse flow velocity is greatest where it is a short distance away from the surface of the wall.

If the granular solids continue to accumulate as the processing equipment continues to run, the inlet structure of such equipment may be blocked enough to block the entirety. Alternatively, the accumulation of such solids may not block the inlet of the processing unit but may impair the flow of airflow and increase the pressure drop in the system to such an extent that the processing equipment is considerably inefficient to achieve its intended purpose.

In particular, in the case of a water purification device used to clean airflow such as waste stream generated in the manufacture of a semiconductor device, waste material constituting the airflow flowing into the water purification device may be prepared by CVD or other deposition operations. It may contain fairly fine particles, such as fine silica particles, metal particles, or produce such particles (by reaction or condensation). These waste streams tend to clog the inlet of the waste water purification system very easily. As a result, it is necessary to frequently wash the inlet of the water purification device manually.

Such inlet plugging is a major drawback of water purification unit units currently available in the semiconductor industry. In this application, the time required for the inlet of the water purification device to be clogged depends on the process and is unique to the location. Factors affecting the average time for the water purification unit to fail due to blockage of the inlet include: a processing tool for generating a particle-containing treatment outflow airflow to be treated in the water purification unit, and an upstream treatment for generating the outflow airflow to be treated in the water purification unit. The specific process recipes and chemistries used in the unit, the nature of the inert gas purge used to flush the pumps and processing lines in the system. There are other treatment conditions and factors suspected of contributing or affecting the accumulation of particles in the treatment system, but not yet clearly defined. Abreu, R., Troup, A., and Sahm, M., "The Causes of Unusual Solid Formation in Low Pressure Chemical Deposition and Plasma Enhanced Chemical Deposition Semiconductor Process Discharge Systems. Causes of anomalous solid formation in the exhaust systems of low-pressure chemical vapor deposition and plasma enhanced chemical vapor deposition semiconductor processes "(July / August 1994, J. Vac. Sci. Technol. B 12 (4), 2763 -2767).

In the case of an operation such as the treatment of gases flowing out during a semiconductor manufacturing operation, the wastes may be oxidized by thermal oxidation or other oxidation reaction process, in order to reduce the oxidizable harmful components of the effluent gas by oxidizing power. By this oxidation, not only the other components that may be harmful when discharged from the treatment plant to the atmosphere can be removed by the oxidizing power, but also the natural and phyrophoric components and toxic components in the effluent stream can be significantly reduced. .

The effluent gases thus treated may contain fairly fine particles, such as ultrafine silica particles, metal particles, etc., generated during CVD or other deposition operations, but such air flows include high temperature, processing environments typically used in oxidation treatments. Significant gas components may be contained that may be corrosive at. These corrosive properties create problems with the hot effluent air streams present during the oxidation treatment, and with the cumulative problem of solids that can contribute to the particle content in these effluent air streams.

Granular solids in this air stream can clog downstream treatment equipment, such as downstream treatment operations, including water purification operations. Clogging of the purification equipment is a significant problem in the art. This is especially a problem when there is a transition from the high temperature oxidation state inherent in the combustion device to the low temperature wet state of the quench chamber. Obviously, there is a transition region where a flow transition from a hot combustion state to a wet cooling state occurs. Problems associated with this oxidation / purification / cooling system include the accumulation of particles, the despreading of water and spray from the wet cooling zone, which produces sticky adhering particulate that accumulates in the cooling zone portion just above the wet zone. There is a problem such that the cross section is blocked.

Another problem is the inability to permanently locate the wet / dry interface. Since the position of the wet / dry interface can change as the hydrodynamic state of the system changes, it becomes very difficult to pinpoint the wet / dry interface correspondingly. Factors affecting the location of the interface include (a) combustion shutoff gas flow rate and thermal duty, (b) cooling spray flow rate and overflow weir flow rate, and (c) the cooling spray. Or backmixing and vortexing of overflow weir flows. The inability to fix the location of the wet / dry interface results in two problems: That is, (1) areas where particles tend to condense are created, and (2) the materials in the cooling zones can be corroded as a result.

Most alloys used in combustion and cooling equipment are corrosion resistant to certain combinations of conditions. These alloys that withstand high temperature oxidation conditions are typically unsuitable for wet corrosion conditions and vice versa. This problem is exacerbated in the presence of other materials that accelerate corrosion or oxidation, such as halogens, sulfidizing agents and the like. Since it is impossible to pinpoint specific transitions of constituent materials, it is necessary to use new constituent materials that are quite expensive and only function at a moderate level.

To solve this problem, considerable effort has been made. Until recently, no acceptable solution was found, and all of the proposed solutions had several drawbacks. Typically, two approaches are used as a matter of necessity. The first method is to use an overflow weir to wet the wall at the transition. The second method is to use submerged quench. The overflow weir does an optimal job of preventing the accumulation of particles, but there are three major drawbacks. The overflow weirs still have a wet / dry interface at the point of injection of water, so they only do the usual work to prevent the accumulation of particles. Overflow weirs require a significant amount of water to maintain a minimum metal surface wetting rate. In addition, overflow weirs require accurate leveling to maintain a uniform falling film that protects the metal in the cooling zone.

Of these problems, the most important is to directly associate the overflow weir water addition rate with the minimum wetting speed and level of the device. These factors preclude minimizing the rate of water addition to the overflow weir and constitute an unacceptable limit. No matter how much effort is put into leveling the cooling equipment, it has been found that due to the inherent thermal stresses involved during the combustion / cooling process, it is necessary to constantly relevel the device in order to maintain the cooling level within the tolerance range. In these situations, an unacceptable maintenance effort must be involved. A discussion of the conditions necessary to minimize the rate of wetting and the structure can be found in Pey & Chilton's "Chemical Engineering Handbook" (Fifth Edition pp. 5-57). Also, Hewitt. See "Heat Transfer Treatment" (CRC Press, pp. 539-541) by Hewitt, G.F. et al., And page 475 of this reference for a detailed description of submerged cooling.

In the treatment of industrial waste streams, it is common to incorporate a cleaning device downstream of the processing equipment (relative to the waste flow direction). The cleaning apparatus functions to receive and treat effluents generated during the upstream treatment operation.

For example, in the semiconductor manufacturing industry, several integrated cleaning apparatuses are commercially available and are often used to treat effluents and barrier gases from semiconductor manufacturing processes. Semiconductor manufacturing processes may include chemical vapor deposition, metal etching, etching and ion implantation operations. Examples of commercially integrated air cleaners include the Delatech Controlled Decomposition Oxidizer, the Dunnschicht Analagen System Escape system, and the Edwards Thermal Processing Unit. have. Each of these systems incorporates a wet cooling device to control the temperature of the off-gas from the hot oxidizer, and includes a heat treatment unit to oxidatively decompose the effluent gases and to remove acid gases and particles found during the oxidation process. Wet purge system is included.

Purification devices, such as those used above, generally include an elongated column to receive the effluents and to counter-current contact them with a liquid solvent, reaction solution or slurry. Backflow contact results in intimate mixing, which assists the adsorption process to remove impurities from the effluent.

An integrated cleaning system can be installed in the manufacturing system to be an integral part of the manufacturing system. In contrast, a stand-alone system is maintained in the housing structure independent of the processing or manufacturing system. Such isolated units may be integrated into the equipment of the upstream process, but the isolated units are more fluid than the counterparts of the integrated cleaning system.

The use of purge technology is not limited to integrated cleaning systems, but may also be incorporated into isolated operating systems. For example: a) stacked bed dry purifier that is not heated and chemically reacted, b) stacked bed dry purifier that is not heated and chemically absorbed, c) stacked bed dry purifier heated and chemically reacted, d E) wet bed type purifier, e) wet purifier, f) flame-based heat treatment unit, and the like. Each of these units can be adapted to the selected application depending on the nature of the airflow during the treatment.

Purifier technology entails several drawbacks, including blockage of the inlet, line, and manifold of the purifier. Partially clogged lines and / or manifolds thereby prevent the processing gas from flowing efficiently. Partially clogged lines or manifolds may interfere with the normal operation of the cleaning apparatus, such as the adsorption process that occurs with the decomposition of gaseous component (s) contained in the solvent medium.

In applications for purifying effluent airflow, several causes of obstruction have been suggested. The blockage can be caused by reaction with a silicon-containing incoming species that reacts with water or water vapor, and can be caused by droplets containing silicon deposited at the inlet of the purification device. This clogging mechanism is applied to semiconductor tools used for epitaxial growth on a wafer and appears in processes using trichloro silane and dichloro silane. The blockage may also be caused by condensation of condensable components in the inlet to the water purification device. The blockage may be caused by water vapor moving back from the water purification apparatus to the inlet treatment line. The return moving water vapor can then react with the incoming components, form a low volatility material and deposit at the inlet to the water purification apparatus. This last mechanism is characterized, for example, by decaying the purification device of the tool for metal etching treatment.

During metal etching machine operation, release gases such as BCl ₃ (boron trichloride) may be produced. BCl ₃ reacts with water vapor to form nonvolatile granular boric acid, which is condensed, accumulates and at least partially blocks the inlet or inlet lines.

In existing practice, several methods have been attempted to remove this type of blockage. One way is to periodically pour water through these obstructions. This adds a pressurized water stream to the blocked portion, which dissolves the blocked portion and ejects water. However, undesirably in such a jetting process, the return movement of water is now generated at the injection point of the fulsh water, leading to hydrolysis reaction with water-sensitive gases such as WF ₆ (tungsten hexafluoride) upstream. It simply increases the blockage further upstream.

Other methods use mechanical plunger mechanisms or other solid removal means to ensure that no accumulation of solids occurs at the inlets and lines. However, this mechanical solution is expensive, labor intensive, requires substantial maintenance and is prone to mechanical breakage.

The present invention relates to an inlet structure for injecting airflow into a downstream treatment equipment, such as a downstream gas treatment device. In certain embodiments, the present invention relates to an anti-clogging inlet structure for injecting particulate solid-containing air streams and / or particulate solid-forming air streams into a gas treatment system.

1 is a schematic diagram of a clogging-resistent inlet structure in accordance with an exemplary embodiment of the present invention.

2 is a schematic view of a blockage-treated inlet structure according to another embodiment of the present invention.

3 is a schematic view of a blockage-resistant inlet structure according to another embodiment of the present invention.

4 is a schematic view of an anti-clogging inlet structure according to another embodiment of the present invention.

5 is a schematic cross-sectional view of a gas / liquid interface structure in accordance with an exemplary embodiment of the present invention.

FIG. 6 is a plan view of the device of FIG. 5, showing a tangential feed device for liquid passing through the annular volume portion contained in the interface structure shown in FIG. 5. FIG.

7 shows (1) an upstream semiconductor manufacturing system; (2) manifold assembly; (3) A schematic illustration of a system including a downstream purification unit.

8 is a schematic diagram of an exemplary embodiment of the present invention.

9 is a block diagram illustrating steps of a cleaning cycle that may be executed in the exemplary embodiment of FIG. 8.

In a broad aspect, the present invention relates to an inlet structure that injects an air stream, such as, for example, a particulate solid containing air stream and / or a solid forming air stream into a downstream processing unit, such as a gas treatment system. It is constructed, arranged and operated to minimize negative hydrodynamic effects such as blockages (by solid deposits, air stream decomposition, etc.) and bypassing, short-circuiting of gas flow streams.

In one aspect, the inlet structure includes a gas permeable wall surrounding a gas flow path and an outer annular jacket surrounding the gas permeable wall and defining an annular gas reservoir therebetween. The outer annular jacket includes an annular solid containing air stream and / or a solid forming air stream while flowing into the gas treatment system through an inlet structure such as a port in a jacket for attaching a compressed gas supply vessel, such as a conventional compressed gas cylinder. Means for injecting gas into the gas reservoir are provided. In such a structure, the gas supplied to the annular gas reservoir is compressed sufficiently to escape through the gas permeable wall for the purpose of preventing solids from depositing or forming on the inner surface of the gas permeable wall portion.

As another variation, the inlet structure described above may include a port for selectively injecting pulsed high pressure gas into the annular gas reservoir, which port pulses gas from the source and the annular gas reservoir from the source. It is connected to the conveying means for conveying in a manner. In operation, such pulsing high pressure gas injection causes additional blockage resistance on the gas permeable wall, and even when low pressure gas is permeated through the wall, the inner surface of the gas permeable wall is caused by pulsatility. The particulate matter formed or deposited on the phase is removed. Ports in the outer annular jacket can be configured or arranged to allow tangential flow of high pressure gas into the annular reservoir.

As another variant of the inlet structure extensively described above, the gas permeable wall and outer annular jacket are optionally connected with a downstream flow path section, the downstream flow path section defining a corresponding other section of the gas flow path. It includes an enclosed, gas permeable wall and a wall forming a slot therebetween. The wall of the downstream flow path section is surrounded by an outer annular jacket to define an annular liquid reservoir between the slot and the liquid overflow relationship therebetween, whereby the annular liquid reservoir is defined by the height of the wall portion. In the case of filling with water or other liquid as above, the liquid extends downward along the inner surface of the wall portion in the form of a falling liquid film beyond the wall portion. Thus, the falling liquid film provides a shielding medium or a protective medium which prevents solids from depositing or forming on the inner surface of the wall portion, and nevertheless also serves to wash off any solids deposited or formed on the inner surface of the wall portion.

The outer annular jacket of the downstream flow path section of the inlet structure may be provided with a port or other inlet means, the inlet means being a liquid, such as a liquid containment vessel, by a line or conduit or the like comprising a flow control valve or other flow control means. Connected to the source.

Port elements included in the above-mentioned structures may include a unitary opening, channel, connecting conduit, nipple, or other inlet structure and / or a plurality of said structures, for example, spaced from one another in a series of vertical and / or circumferential directions. There is an inlet structure, etc., through which in each case fluid is transferred to the contents of the annular reservoir associated with the port.

In another aspect, the inlet structure of the present invention comprises a first flow passage section and a second flow passage section connected in series with one another and generally disposed in a vertical direction, defining a generally vertical flow passage in this series connection relationship. Through this passage, the particulate solid-containing and / or solid-forming airflow may flow from the upstream source of the particulate solid-containing fluid and / or sieve fluid toward the downstream downstream fluid treatment system arranged to receive the inlet structure and the fluid airflow. have.

The first flow passage section is the top of the inlet structure and includes a gas permeable inner wall, which wall may be formed of a porous metal, porous ceramic, porous plastic, or other suitable constituent material, the first top of the flow passage section Surround. The porous inner wall has an inner surface that partitions the upper boundary of the flow passage.

The gas permeable wall is surrounded and surrounded by an outer wall spaced apart from the porous inner wall. The outer wall is not porous in nature, but the outer wall is provided with a gas flow port. By this arrangement, an annular inner portion is formed between each porous inner wall and the outer wall surrounding it.

The gas flow port can in turn be connected in such a way that flow can be made to the gas source, allowing the gas to flow into the annular volume, for example at a low flow rate predetermined by suitable valves and control means, and then the gas To flow from the annular volume into the flow passage. In addition, a high pressure gas flow port is provided on the outer wall of the first flow passage section and is connected in such a way that flow can be made with the high pressure gas source to allow the gas to flow intermittently into the annular inner volume, which high pressure gas flow is porous Serves to remove particulate matter that may be deposited on the inner wall from its inner wall (which delimits the flow passage in the first flow passage section). Likewise, the high pressure gas can be controlled to flow to the desired pressure by suitable valves and regulating means.

The second flow passage section is connected in series with the first flow passage section to allow particulate solid containing fluid to flow from the first flow passage section to the second flow passage section downstream. The second flow passage section has an outer wall provided with a fluid injection port, which port is connected with a liquid source such as water or other processing liquid. The outer wall is connected with the first flow passage section by something like a flap flange in each outer wall of the first flow passage section and the second flow passage section. The second flow passage section includes an inner wall spaced from the outer wall and defines an annular content therebetween, the weir inner wall extending toward the porous inner wall of the first flow passage section and ending near the wall. A gap is provided between each inner wall of the first flow passage section and the second flow passage section defining the weir. When liquid flows into the annular volume between the outer wall of the second flow passage section and the inner wall thereof, the introduced liquid flows over the weir along the inner surface of the inner wall of the second flow passage section. This liquid flow down the inner wall washes away the particulate solid from the wall and inhibits the deposition or formation of solid on the inner surface of the inner wall.

Flanging the first flow passage section and the second flow passage section to each other may include a clamp assembly that can be quickly released, which facilitates the first flow passage section and the second flow passage section of the inlet structure. Can be disassembled.

In addition, the first flow passage section of the inlet structure can be connected with the quick dismantling inlet section of the top inlet structure, which likewise can be easily disassembled for cleaning and maintenance.

In another aspect, the present invention relates to an airflow receiving structure capable of preventing depositing, clogging and corrosion of solids when a high temperature particle accumulation-containing airflow containing a corrosion component flows. More specifically, this aspect of the present invention relates to a gas / liquid interfacial structure useful for transferring hot particulate solid-containing gas flowing from an upstream gas source to a downstream processing unit.

This gas / fluid interface structure is a first inlet flow passage member extending in a vertical direction defining a first air flow flow path therein, the upper inlet for injecting air flow into the air flow flow path, and the gas flow in the inlet flow path member. A first inlet flow passage member having a lower outlet end for discharging the air stream following the air flow flowing through the path; A second flow passage member that surrounds the first flow passage member to be spaced outwardly so that an annular volume is formed therebetween, the lower outlet end of which extends downwardly below the lower outlet end of the first flow passage member, A second flow passage member having a lower liquid impermeable portion and an upper liquid permeable portion defining an air flow flow passage of the second flow passage member; An outer wall member enclosing the second flow passage member and defining an annular inner portion with the second flow passage member; A liquid flow inlet port of the outer wall member for injecting liquid into the annular volume between the outer wall member and the second flow passage member, whereby the fluid injected through the liquid flow inlet port of the outer wall member is enclosed Enters and oozes through the upper liquid permeable portion of the second flow passage member, and then flows down along the inner surface of the fluid impermeable portion of the second flow passage member to cause an inner surface of the liquid impermeable portion of the second flow passage member. Providing a liquid film flowing downward in the bed prevents particulate solids from depositing or accumulating thereon, and airflow flowing through the first flow passage member is discharged from its lower outlet end and flows through the flow passage of the second flow passage member. And then released from the gas / fluid interface structure.

By this arrangement, the airflow is prevented from directly contacting the lower wall of the structure, and the airflow flow passage is defined by the inner wall surface of the second flow passage member. A water film flowing down from the “weeping weir” above the second flow passage member prevents particulate solids from accumulating on the wall surface of the second flow passage member. The flowing liquid airflow on the wall transports particles of the airflow in contact with the water film downwards and releases them from the gas / liquid interface structure. In addition, the corrosive components in the airflow are prevented from contacting the wall, which is protected by a water film flowing down from the bottom of the interface structure.

In another specific embodiment, the present invention is disposed between an upstream oxidation unit, such as an electrothermal oxidation unit, and a downstream water purifier that purifies with water to remove particulate solids contained in the gas.

The upper liquid permeable portion of the second flow passage member may consist of a suitable porosity, for example comprising a porous sintered metal, a porous plastic, or a porous ceramic wall, wherein the pore size is, for example, about 0.5 To about 30 microns, and may be larger.

In another aspect of the present invention, the present invention is directed to an apparatus and method for purifying an inlet line of a manifold that directs processing airflow to a downstream processing unit, such as a purification unit in the case of a semiconductor manufacturing outflow airflow.

The apparatus includes a manifold that receives gas from an upstream source, such as a semiconductor manufacturing process system or tool. The manifold includes a first inlet line and a second inlet line that are alternately used to flow the gas to a downstream process. These lines are connected to the manifold conduit at its first (upstream) end, and each of the first inlet line and the second inlet line may comprise a downstream treatment, which may include, for example, a purge unit at its second (downstream) end. The unit is connected in flow communication.

Each of the first inlet line and the second inlet line includes a pneumatic valve that can be selectively opened and closed therein, for example, to flow and interrupt the gas.

The manifold is arranged to receive gas from an upstream source and to flow gas through the manifold and the first inlet line or the second inlet line, one of which lines actively flow gas from the upstream source to the downstream process. The other inlet line blocks the flow of gas through the line by closing the valve therein.

A pressurized water source is connected to the manifold by water flow lines to the first inlet line and the second inlet line. Each water flow line includes, for example, a pneumatic valve. Each valve can be selectively opened and closed to allow compressed water to flow or intervene therethrough.

In order to selectively raise the temperature of at least one of the inlet lines of the two inlet lines, the heat source is each of the first inlet line and the second by a heat jacket disposed near each of the first inlet line and the second inlet line, for example. It may be thermally connected to the inlet line.

In operation, gas from the upstream processing unit flows into the manifold. During active processing, the valve of either the first inlet line or the second inlet line is open and the valve of the other inlet line is closed so that gas entering the manifold is through a specific inlet line comprising an open valve. Flow. In this way, the gas flows through a specific inlet line that includes an open valve and passes the downstream process. The inlet line comprising an open valve is referred to hereinafter as “open inlet line” for the sake of simplicity, and the other line of the manifold is referred to as the “off-stream line”. In the flow shutoff line, the valve is closed to prevent gas from flowing through it.

The valve of the inlet line can be operatively integrated and controlled by suitable cycle timer means and control means of conventional conventional form, as employed in the apparatus of the present invention.

The flow shutoff line, which does not flow gas, is purged to regenerate gas for further processing. Thus, in the case of continuous operation of the apparatus, the valves in each inlet line are opened at one of these valves at a given time, the other is to purify the flow shutoff line and then the line for on-stream operation. It is controlled to close to renew.

The flow cutoff line is cleaned by opening a valve in the water flow line that communicates the compressed water source with the flow cutoff line, thereby allowing compressed water to flow from the compressed water source to the flow cutoff line. In other water lines, the water line valves are closed to prevent compressed water from flowing from the compressed water source to the flow connection line.

In this way, the flow blocking lines, which are now empty due to their isolation, are actively cleaned, including compressed water washing and the like.

Optionally, a source of compressed dry gas is connected to the manifold by a dry gas flow line to each of the first inlet line and the second inlet line. Each dry gas flow line includes, for example, a pneumatic valve. Each valve can be selectively opened and closed to allow the compressed dry gas to flow or be interrupted.

After the compressed water flows through the flow shutoff line, the flow shutoff line can subsequently be dried to prepare fresh gas to flow from the upstream source to the downstream treatment unit. This is done by closing the valve in the compressed water flow line to stop the compressed water jetting / purging action on the water at the surface of the flow interrupting line. At the same time, the valve in the dry gas flow line in communication with the flow shutoff line is opened to allow compressed dry gas to enter the flow shutoff line through the valve and to dry the inner surface of the flow shutoff line, so that the effluent is manifolded. It is completely removed from the flow shutoff line of the fold. In this way, the flow shutoff line is the entire system when the process gas flow through the cleaned and dried line is resumed, i.e. when the flow shutoff line is back to the flow connection line and the previous flow connection line is to the shutoff line. It may be completely dried to avoid hydrolysis reaction in the subsequent work of.

This continuous conversion operation involves first opening the valve in the flow shutoff line so that the process gas can subsequently flow through the valve. Once the valve in the flow shutoff line is changed to open, the valve in the dry gas line is closed. This process prevents the valve from closing and the occurrence of deadhead conditions in the upstream treatment flow.

In this way, the manifold gas treatment system is operated such that gas flows from the upstream source through the inlet line through the downstream treatment unit, and the gas flows continuously through each inlet line alternately, giving a given inlet line. During the flow interruption period of the line, the line is spouted with compressed water and optionally and preferably, dried by flow through the inlet line of the compressed drying gas, thereby refreshing the inlet line so that the gas flows through the inlet line. do.

The water from the compressed water flush step and the compressed gas drying step can flow through the flow block inlet line and can be discharged into a water purification device or discharged from the flow block line through a valved discharge line for this purpose. do. In the treatment of the semiconductor production exhaust gas by downstream purification, it is usually advantageous to discharge the jetted water and the compressed dry gas into the downstream purification device.

The first inlet line and the second inlet line may be provided with associated heating means such as electric resistance heaters, stream tracing lines, heating jackets, etc., by which the drying process can be carried out faster, Otherwise heat is provided to the process to facilitate cleaning of the inlet line of the manifold.

In a method aspect, the invention relates to a method of flowing gas from an upstream source through a manifold comprising two inlet lines through which gas flows, wherein (a) one of the inlet lines is a flow Flowing said gas through a flow connection inlet line of said two inlet lines, wherein said inlet line is an inlet line that is isolated for gas flow from an upstream source to a downstream processing unit; (b) ejecting the isolated inlet line with compressed water to remove particulate solids, water soluble solids, and the like from the inner surface of the isolated inlet line; (c) regulating the flow of compressed water through the isolated inlet line; (d) optionally, flowing compressed dry gas through the isolated inlet line to dry the inner surface of the isolated inlet line; (e) regulating the flow of compressed dry gas through the isolated inlet line; (f) isolating said isolated inlet line to constitute a flow connection inlet line; (g) intercepting the flow of gas through the flow connection inlet line and isolating the flow connection inlet line to form an isolated flow blockage inlet line; (h) reflowing said gas through a flow connection inlet line isolated from an upstream source to a downstream processing unit, performing steps (a) to (h) periodically, alternately and repeatedly, During the gas flow from the upstream source to the downstream treatment unit, one of the inlet lines contains gas from the upstream source that flows through it, the other line is in a flow interruption state, and the high pressure water jet and drying are optionally carried out. It is done.

The treatment may optionally be carried out by heating the inlet lines.

Other aspects, features and embodiments of the invention will be more clearly understood from the following disclosure and claims.

Referring to the drawings, FIG. 1 is a schematic diagram of an anti-clogging inlet structure according to an exemplary embodiment of the present invention.

The inlet structure shown in FIG. 1 can be connected to a process pipe connecting the inlet structure and the airflow source injected into such a structure with each other. Such upstream pipe joints can be appropriately heat traced in a conventional manner from the semiconductor fabrication tool or the like, which is the upstream airflow source, to the inlet flange of the inlet structure shown above. The purpose of such heat tracing is to provide sufficient energy to the airflow in the pipe so that the components of such airflow do not condense or sublimate in the inlet structure.

The inlet structure 60 shown in FIG. 1 has an inlet section 7 comprising an inlet flange 16. The inlet flange can correspondingly be engaged with the flange 18 of the upper annular section 8 whose upper end terminates in the flange. The inlet section may, for example, be connected to an upstream particulate solid containing and / or solid forming flow generating facility 90, such as a semiconductor manufacturing tool.

The annular section 8 has a porous inner wall 6 having an appropriate porosity of gas permeability and a rigid outer wall 9 forming an annular inner portion 20 therebetween. The inner surface of the porous inner wall 6 thus defines the flow passage 66 in the upper annular section 8. The rigid outer wall 9 is closed against the inner wall 6 by means of end walls 40 and 42 which surround the annular inner portion. A gas inlet port 22 is provided on the outer wall 9, and a gas supply line 24 is connected to the port. The gas supply line 24 is connected at its outer end to the gas source 4. The gas supply line 24 is arranged with a check valve 14 to regulate the airflow flowing into the annular inner portion 20. The supply line 24 may be provided with other flow control means (not shown) to selectively supply gas from the source 4 to the annular volume 20 at the required amount and flow rate during operation of the system.

Means for heating the gas supply line 24 may be included to raise the temperature of the gas passing through the porous wall 6. The heating means of the gas supply line 24 are electric resistance heaters, flow tracing lines, heating jackets or other that are known to those skilled in the art and are useful for transferring thermal energy to the internal passages of the gas supply line 24 to raise the temperature of the gas. And a heating system. For example, the heating means employed in the embodiment of FIG. 1 is composed of a heating coil 23. The heat jacket may also cooperate with the heating means to raise the internal temperature of the gas supply line 24.

The upper annular section 8 can optionally have a high pressure gas injection port 50, which is connected to the high pressure gas supply line 52, which in turn is connected to the high pressure gas source 5. Connected. The gas supply line is shown with a built in flow control valve 51, which can be connected to flow control means (not shown) which operates the valve in a predetermined order. The high pressure gas supply line 52 may be arranged at an appropriate angle, for example at an inclined angle, with respect to the high pressure gas injection port 50.

The optional high pressure gas injection port 50 and the high pressure gas supply line 52 allow the low pressure gas at a constant flow rate (or “bleed-through”) from the supply line 24 to the annular volume 20. Even if injected, it is beneficial if accumulation of solids occurs on the inner surface of the gas permeable wall. Heating means of the high pressure gas supply line 52 may be included to raise the temperature of the gas. The heating means of the gas supply line 52 is an electric resistance heater, a flow trace line, a heating jacket or other heating which is known to those skilled in the art and which is useful for transferring heat energy to the inner passage of the gas supply line 24 to raise the temperature of the gas. It may include a system. For example, the heating means employed in the embodiment of FIG. 1 is composed of a heating coil 23. The heat jacket may also cooperate with the heating means to raise the internal temperature of the gas supply line 52.

The upper annular section 8 terminates at its lower end at the flange 26, which engages in a corresponding relationship with the flange 28 of the lower annular section 30. The flanges 26 and 28 may be sealed by a sealing means such as the o-ring 10 shown in FIG. 1.

The lower annular section 30 includes an outer wall 12 whose upper end terminates at the flange 28. The outer wall is a type of jacket member whose lower end is joined to the inner weir wall 11 by an end wall 44, forming an annular inner portion 32 between the outer wall 12 and the inner weir wall 11. . The inner weir wall 11 protrudes vertically upward as shown, but terminates at the upper end 46 at intervals with respect to the lower end of the porous inner wall 6 of the upper annular section 8, with its lower end and Between the upper ends a gap 36 is formed which forms an overflow weir for the lower annular section 30.

The outer wall 12 of the lower annular section 30 is provided with a water inlet port 48, which is connected to a water source 3 containing a liquid flow control valve 81, the liquid flow control valve being It is operatively coupled with other flow control means to maintain the flow rate of liquid flowing into the lower annular section 30 to the extent necessary. The water inlet port 48 may be fixed to the lower annular section 30 in the radial or tangential direction. In a preferred embodiment of the invention, the water inlet port 48 is fixed tangentially to the lower annular section 30 so that the water momentum jet injected into the lower annular section travels against the fixed wall. Rather, it dissipates itself by setting the vortex to overflow in the lower annular section. The injection of water in the tangential direction optimizes the height of the water film flowing over the lower annular section as a moment disturbance to the upper layer height of the water film.

Long air flow conveying tubes 70 may be used to inject the particulate solid containing air stream and / or the particulate solid forming air stream to a specific location of the inlet structure. The transport tube 70 is connected to the upstream source 90 in a manner that accommodates the airflow, and propagates and exhausts the airflow to an appropriate location in the internal gas flow passage 66 to minimize the formation of solids in the inlet structure. The transport tube 70 is surrounded by a rigid outer wall 9 in which the inlet 7 is modified to receive the transport tube 70. The transport tube 70 can be heated to prevent condensation of the airflow flowing between the tube 70.

In the inlet structure shown in FIG. 1, the tube 70 is surrounded by a porous inner wall 6 and is concentric with the inner wall 6. The outer surface of the transport tube 70 and the inner surface of the porous inner wall 6 form an annular volume therebetween. The gas delivery tube 70 includes a first end 72 connected to an airflow source 90 in an airflow receiving relationship, and a second end 74 for discharging airflow in the airflow passage 66. The second end 74 discharges airflow in the airflow passage 66 included in the upper annular section 8 or the lower annular section 30. In the illustrated embodiment, the tube 70 is venting airflow at a position about 1/2 inch below the weir wall top 46, while the tube 70 is a weir wall top (depending on the air flow, process usage and conditions). 46) may extend further down or terminate above the weir wall top 46.

The delivery tube 70 may be comprised of, for example, stainless steel with an internal diameter of about 0.5 to 4 inches. Those skilled in the art will appreciate that the tube 70 can be constructed in a variety of materials, sizes, cross sections and arrangements. The common annular flow pattern created by placing the transport tube 70 relative to the porous wall 6 and the overflow weir wall 11 is that when the process gas exits the transport tube and enters the passageway 66 region. It serves to minimize the process gas from mixing with the water vapor from the barrier 11. Thus, any solid phase is reduced downstream by the action of the barrier 11 because the solid phase forming reaction between the process gas exiting the transport tube 70 and the water vapor from the barrier 11 is greatly reduced to a sufficiently downstream position. May be ejected into the appliance.

In order to determine the anti-clogging efficacy for a given inlet configuration within the scope of the present invention, as an appropriate judgment technique, the location of a particular inlet structure after moisture has elapsed under a nitrogen carrier gas of average flow rate and trichlorosilane of 1-5 slpm flow rate And by monitoring the amount of formation of the solid phase to determine the suitability of the configuration and the effect on any parameter change in the inlet structure. Longer observation periods would be desirable to observe growth characteristics of the solid phase. In addition, depending on the airflow, process application and conditions, the layered axial airflow flow is maintained in the annular section between the gas delivery tube and the outside of the gas delivery tube and the interior of the porous wall, thereby adequately retaining the inlet wall and covering the outflow of airflow. To ensure.

The transport tube 70 may be heated to reduce the condensation gas. The condensation of gas flowing between the tubes forms a solid phase on the walls of the tubes 70. Appropriate means for heating the tube 70 may include an electrical resistance heater, an airflow tracing line, a heating jacket, etc., wherein the heating system is configured to transfer thermal energy to the inner passage of the transport tube 70 to prevent condensation and Are arranged. For example, the heating means is shown with a heating coil 76. The heating jacket may also cooperate with the heating means to raise the internal temperature of the transport tube 70. The heating jacket can raise the temperature of the sidewalls to prevent condensable process gases from condensing in the tubes.

At the bottom, the lower annular section 30 can be properly connected to the housing of the water washer 13. The water scrubber may be configured in a conventional manner to scrub away particles and dissolved components in the process stream. Optionally, the inlet structure 60 may be connected to other process equipment for the treatment of airflow passing the inlet structure from the inlet end to the outlet end.

Thus, inlet structure 60 has a gas flow passage 66 which is a passage through which inlet gas can flow from the direction indicated by arrow "1" in FIG. 1 to the discharge end in the direction indicated by arrow "2" in FIG. Is provided.

In operation, the granular solid phase containing gas is injected from an upstream source, such as a semiconductor manufacturing tool (not shown), by an appropriate connection pipe, which connection has been described above to prevent harmful sublimation or adhesion of airflow in the inlet structure. Can be thermally transferred. The air flow enters the inlet structure in the flow direction indicated by arrow "1", passes through inlet section 7 (or transport tube 70 if installed) and back into upper annular section 8. Gas, such as nitrogen or other gas, enters the annular inner volume 20 from the source 4 through a gas supply line 24 connected to the port 22. The injected gas from the annular inner portion 20 flows through the gas permeable wall 6 into the internal gas flow passage 66. Thus, the granular containing or granular forming gas is passed through the water gas scrubber 66 through the internal gas flow passage 66 as the gas from the gas supply pipe 24 flows through the gas permeable wall 6 in the annular volume 20. 13) Flow in.

In this way, the annular inner portion 20 is pressurized by the gas from the source 4. By such pressure, it is ensured that the gas is constantly flowing through the porous wall into the gas flow passage 66 therein. Such a low flow rate constant flow of gas through the permeable wall serves to keep particles of airflow flowing through the inner gas flow passage away from the inner wall surface of the inlet structure. In addition, any gas present with the gas flow in the inner flow passage 66 is also kept away from the inner wall of the inlet structure.

Gas supply line 24 may be thermally transferred if desired. Such thermal transfer may be desirable when the airflow flowing through the inlet structure contains chemical species that can condense or sublimate and deposit on the walls of the inlet structure.

At the same time, the high pressure gas from the high pressure gas source 5 can be periodically flowed through the high pressure gas supply pipe 52 and the high pressure gas injection port 50 into the annular inner volume 20. For example, the supply pipe 52 has a built-in flow control valve (not shown) to accommodate the high-pressure gas injected into the pulse. In this way, the high pressure gas is injected into the annular volume at specific or predetermined intervals to remove any particle formations formed on the inner surface of the gas permeable wall 6. The sequence continuity and timing of the pulsed injected high pressure gas is not due to inadequate experimentation in the art, and it is easy to achieve a desired wall scoring effect that can prevent the accumulation of solid phase on the gas permeable wall. Can be determined. If necessary, when the inlet structure is employed in connection with a water scrubber functioning as a semiconductor fabrication tool, such high pressure spraying may eliminate pressure fluctuations at the instrument outlet port by appropriately incorporating control means operatively connected to the instrument control system. May be interrupted during one treatment cycle of the instrument. For this purpose, a control valve, such as a solenoid valve, can be suitably connected to the control means of the instrument assembly.

In the inlet structure of the illustrated embodiment, the flanges 26, 28 can be interlocked so that the upper annular section 8 can be quickly separated from the lower annular section 30. For that purpose, quick disconnect clamps can be used. The sealing gasket 10 between the flanges 26, 28 may be formed of a suitable material, such as a corrosion resistant high temperature elastomeric material. Such elastomeric gaskets additionally act as a thermal barrier to minimize heat transfer from the upper annular section of the inlet structure to the lower annular section, which is a particularly important feature in the heat traced embodiment of the present invention.

The gas permeable wall 6 of the upper annular section of the inlet structure may be formed of a suitable gas permeable material such as ceramics, metals, alloys and plastics. As a specific example, the wall may be formed of Hastelloy 276 material. The outer wall 9 of the upper annular section can likewise be formed of a suitable material, for example a thin walled stainless steel pipe.

The lower annular section 30 of the inlet structure may be formed of a suitable material such as polyvinylchloride plastic. Water is sprayed from the water supply source 3 through the line 50 to the annular inner portion 32 between the outer wall 12 and the inner weir wall 11. The water is sprayed in the tangential direction so that, due to the angular momentum of the water in the annular inner portion 32, the water is above the upper end 46 of the weir wall 11 of the inlet structure and below the inner surface of the weir wall in the internal flow passage 66. It's good to do a spiral workout. Thus, water flows below the inside surface of the dam wall 11, and the predetermined fines are washed below the flow passage 66 toward the water scrubber 14 below the inlet structure. As mentioned above, the lower annular section 30 is an optional structural feature that may be omitted, for example when the downstream process unit is a combustion cleaning apparatus.

A pressure tap is formed in the discharge pipe from the upstream process unit of the inlet structure and the downstream cleaning device unit to measure the pressure drop through the inlet structure. The pressure drop can be detected by a photohelic gauge or other suitable pressure-sensing gauge, and such pressure drop readings can be sent to appropriate monitors and controls to monitor clogging, which is a blockage in the scrubber inlet. .

By the use of the inlet structure according to the invention, it is possible to provide a face which is not clogged repeatedly in a normal process operation between the tool discharge flow from the semiconductor manufacturing operation and the water scrubber. The inlet structure of the present invention provides an interface with two secondary process flows: a steady low flow purge stream and a high pressure pulse flow. The low flow purge flow forms a net flux of inert gas, such as nitrogen, from the inner surface of the upper annular section towards the centerline of the central flow passage 66. The high pressure air stream provides solid clogging, ie self-cleaning capability against clogging due to solid phase material. Using high pressure airflow, no particles build up on the inner surface of the upper annular section of the inlet structure of the central flow passage.

The gas, entrained particles and previously fixed particles are then directed to an overflow flow at the inner wall surface in the lower annular section of the inlet structure and ejected into the water scrubber downstream of the inlet structure. In this way, the direct interface between the gas permeable wall of the upper annular section of the inlet structure and the weir wall of the lower annular section ensures a high efficiency inlet that efficiently minimizes the accumulation of particulate solids during operation.

The inlet structure according to the invention has a number of advantages. In applications for semiconductor manufacturing facilities and water scrubber treatment systems that treat waste gas discharged from tools in semiconductor process equipment, the exhaust gas from the semiconductor tool continues to flow from the tool discharge port to the water interface in the water scrubber inlet structure. Can be heated. Heat tracing on the inlet line can be used to deliver energy to the conduit to heat the line, which delivers energy to the flowing gas stream by forced convection. By heat tracing the air flow line flowing gas into the upper annular section and heat tracing the high pressure air flow line delivering the pulsed high pressure gas into the inner annular volume of the upper annular section of the inlet structure, the process gas is It can be heated all the way to the overflow dam wall of the section. Such a flow of heated gas allows the process gas to continue to flow through the central flow passage of the inlet structure at a predetermined temperature measured by the vapor pressure of the desired particulate forming gas in the gas stream flowing from the upstream process unit to the inlet structure. Otherwise, this gas will condense or sublimate and settle on the walls of the inlet structure.

As another advantage of the inlet structure of the present invention, such a structure can be easily disassembled. If the inlet structure becomes clogged during operation, the inlet structure is easily dismantled simply by removing the clamps or other fastening elements that hold the flanges of the structure together. Thus, by separating the clamps that hold the individual flanges in place and the individual gas delivery lines connected to the upper annular section, the upper annular section can be replaced.

As another advantage of the inlet structure according to the invention, it has self cleaning properties. Particles entrained in the gas flow flowing from the upstream process unit to the inlet structure or formed by chemical reactions within the inlet structure are gas permeable of the inlet structure by high pressure gas that is pulsed into the inner annular volume within the upper annular section of the inlet structure. It can be easily cleaned from the wall. The particles that then fall off the inner wall surface of the upper annular section of the inlet structure are directed to the overflow portion of the weir wall where such particulate solids are ejected into the downstream scrubber. It may be easy to set the pressure, persistence and periodicity of the high pressure gas pressure pulse to accommodate the key conditions of the system particulate concentration and the properties of such solids. The efficiency of intermittent high pressure gas injection will depend on the nature of the particulate solid. Therefore, the characteristic of the self-cleaning of the inlet structure of the present invention is that it does not use the scraper or plunger device typical of the so-called self-cleaning device of the prior art fluid treatment system.

The material properties of the porous wall element of the upper annular section of the inlet structure depend on the process gas coming from the upstream process unit. If the gas stream comprises an acidic gas component, such gas will be absorbed in the water scrubber and present in the water recycled to the overflow dam wall in the lower annular section of the inlet structure. Some of the water in the overflow dam wall may splash into the porous inner wall of the upper annular section of the inlet structure. In that case, the porous wall is preferably selected as the corrosion resistant structural material. A preferred metal material for this purpose is Hastelloy 276 steel, which exhibits excellent corrosion resistance under low temperature acid aqueous solution conditions.

As another advantage of the inlet structure of the present invention, water backflow into the process piping from the top of the water scrubber is minimized when the inlet structure is used upstream of the water scrubber as illustrated herein. By explaining this advantage, it will be appreciated that the fines may be present in the exhaust stream of some semiconductor tools as reactants of chemical reactions within the flow path of the particulate or gas stream entrained from the process tool.

The present invention minimizes or eliminates the aforementioned Richardson annular effect. Due to the steady outflow of gas at the inner surface of the porous wall of the upper annular section of the inlet structure, static boundary layer conditions cannot be exerted on the inner wall surface of the upper annular section. The net flux of gas exiting the gas permeable wall acts to “punish” the process airflow from the wall surrounding the central flow passage of the inlet structure and eliminate the Richardson annular effect by the absence of static boundary conditions. Thus, when particles are formed as a result of chemical reactions in an airflow stream, the particles thus formed do not reach the wall to which they condense. Instead the particles will flow into the water scrubber along with the gas stream. The same applies to the entrained particles. Once the particles reach the top of the inlet, these particles will be entrained during the airflow because they have no wall to condense.

By retarding the conditions causing the Richardson annular effect, the porous wall in the upper annular section of the inlet structure of the present invention acts as an effective barrier to back migration of water vapor to the discharge line of the process system. Any reverse movement will be extremely slow due to the interdiffusion mechanism described above. This factor greatly reduces the average failure time of the scrubber, since the scrubber inlet and outlet lines will not be frequently blocked in the inlet structure of the present invention. When the delivery tube 70 is used, the reverse movement of water vapor is minimized or eliminated due to the annular gas blanket formed by the action of the gas flowing through the porous wall 6.

Although the porous wall member of the upper annular section of the inlet structure of the present invention has been described herein as being composed of a metallic material, it will be appreciated that such gas permeable walls may be formed of any suitable structural material. For example, the porous walls have the ability to withstand the corrosive environments, extreme temperatures and input pressures that may be present in the use of porous ceramics, plastics (such as porous polyethylene, polypropylene, polytetrafluoroethylene, etc.), or inlet structures of the present invention. It may be formed of other materials.

Although the invention is described in the embodiment illustrated in FIG. 1 as having separate separate upper and lower annular sections interconnected by, for example, flanges and associated quick disconnect clamps or other interconnecting means, such inlet structures are described herein. It may be formed as a single or integral structure if desired or necessary for a given end use application, and the lower annular section may in some cases be an optional section for the unnecessary upper annular section.

Referring to FIG. 2, another embodiment of the anti-clogging inlet structure is shown. The inlet structure 100 may optionally include a conical skirt 105 that is surrounded by a rigid outer wall 110. An annular gas flow passage 115 is formed between the outer surface of the delivery pipe 112 and the inner surface of the conical skirt 105. The conical skirt annularly surrounds the particulate solid-containing and / or particulate solid-forming airflow with an inert gas and / or liquid. Inert gas enters the inlet structure via supply line 120. The conical skirt which opens downwards to the outside is gradually reduced in cross-sectional area, so that the speed of the inert gas is increased and the pressure is reduced. The conical skirt 105 is designed such that the velocity of the airflow discharged from the delivery pipe 112 and the velocity of the inert gas are the same. This matching of the flow rates of the inert gas and the airflow creates an equivalent co-laminar flow to prevent turbulence in the airflow and to prevent mutual mixing at the interface between the two flows of airflow. . Thus, the efficiency of this inlet structure is improved by minimizing the accumulation of particulate solids during operation.

The conical skirt that opens downward outwardly may also be advantageously used to inject liquid into the inlet structure. The outer wall 110 and the lower end (bottom circumference) of the conical skirt are spaced apart from each other in the transverse direction, forming a liquid flow passage 135 therebetween. Spray nozzles 125 may be spaced apart in the circumferential direction with respect to each other in the inlet structure to disperse the liquid. The conical skirt guides the liquid towards the wall surface 130. For example, if the liquid is water, a thin film of water is formed on the wall surface 130 to eject the granular solid into a downstream scrubber. The material specification of the conical skirt depends on the inert gas and the airflow flowing through the delivery conduit 112. If the air stream contains an acidic gas component, this gas is present in the water recycled to the spray nozzle 125. The conical skirt of this example is preferably made of a corrosion resistant material. As described with reference to the embodiment of FIG. 1, the conduit, inert gas and / or water may be heated to reduce condensation.

3, another embodiment of the anti-clogging inlet structure 200 is shown. The rigid outer wall 205 and the porous inner wall 210 form an annular inner portion therebetween. An extended form air flow conduit 212 may be used to inject the particulate solid-containing and / or particulate solid-forming airflow into a particular predetermined location of the inlet structure. The delivery conduit 212 is coupled in a gas flow receiving relationship with the upstream source and directs airflow to a suitable location within the inlet structure. The inner surface of the porous inner wall 210 wraps around the outer surface of the delivery tube 212. The upper end of the outer wall 205 is surrounded by the end cap 215.

The outer wall is provided with a water inlet port 225 that may be connected to a water source. The end cap 215 is provided with a gas inlet port 230 to inject a shielding inert gas axially into the inlet structure. End cap 215 may optionally include a porous dispersing device that axially disperses inert gas into the inlet structure. Optionally a gas cavity or reservoir may contain an inert gas, such as nitrogen, which is injected into the inlet device. In this embodiment, water is blown out through the porous inner wall 210 to form a liquid thin film, which passes through the inlet structure to eject particulates. Porous wall 210 may be formed of a suitable material, such as, for example, ceramic, metal, alloy, or plastic, such as polyvinylchloride. As mentioned above, the delivery tube, inert gas and / or water may be heated to reduce or eliminate condensation.

As another variation of the particular structure shown in FIG. 3, the porous inner wall 210 may be replaced with a weir of the type shown in FIG. 1. For example, the upper end of the weir wall may be configured to be spaced with respect to the end cap such that a gap is formed between the upper end cap 215 and the upper end cap 215.

4 shows another embodiment of the anti-clogging inlet structure 300. The annular upper section 305 includes a porous upper inner wall 310 and a rigid upper outer wall 315 forming an annular upper inner chamber 320 therebetween. The elongated air flow carrier 322 is shown surrounded by a porous upper wall 310 and is disposed coaxially with the porous wall 310. The outer surface of the gas delivery pipe and the inner surface of the porous upper wall form an annular volume therebetween. The delivery pipe 332 is coupled in a gas flow receiving relationship with an upstream gas source. The rigid upper wall 315 includes an inlet port 325 to inject suitable fluid into the upper inner chamber 320.

The annular lower section 330 includes a porous lower inner wall 335 and a rigid lower outer wall 340 defining an annular lower inner chamber 345 therebetween. The rigid lower wall includes an inlet port 350 to inject fluid into the lower chamber 345. In operation, the inlet structure of FIG. 4 allows inert gas to penetrate through the porous upper wall 310 and allow water to bleed through the porous lower wall 335. This flow of inert gas keeps particulates in the airflow away from the inner surface of the wall of the inlet structure. The thin film of water on the inner surface of the lower porous inner wall 335 washes away any particulates from the inlet structure.

4 shows a delivery conduit 322 that releases airflow above the transition region 355 between the upper section 305 and the lower section 330. The transition region 355 may be a region in which the annular upper section 305 and the annular lower section 330 are brought into contact with and coupled to each other. The transition region 355 may also include a region that separates the upper section 305 from the lower section 330 and surrounds the gas delivery tube 322. It will be appreciated that the conduit may optionally extend down the transition region 355 to the lower section. Whether the delivery pipe 322 emits airflow inside the upper section, inside the transition zone, or inside the lower section depends on the airflow, the method of use and the conditions. As mentioned above, the delivery tube, inert gas and / or water may be heated to reduce or eliminate condensation.

5 is a schematic cross-sectional view of a gas / liquid interface structure 410 in accordance with an embodiment of the present invention.

The gas / liquid interface structure 410 includes a vertically extending first inlet flow passage member 412 formed by the elongated cylindrical wall 414. The cylindrical wall 414 surrounds the inlet passage 418 of the inlet flow passage member 412. At the top of the cylindrical wall 414 is provided a flange 416 extending radially outward, which is for joining the gas / liquid interface structure to flow piping, conduits, installations, etc. of the associated process.

The first inlet flow passage member 412 thus has an inlet 420 at the top and a corresponding outlet 422 at the bottom such that the open inlet and outlet ends comprise a flow passage 418 with the contents. And a gas from upstream processing unit 458 may be flowed through this flow path as exemplarily shown by line 460 in FIG.

The length of the first inlet flow passage member 412 may be considerably shorter than that shown in FIG. 5, with the distal outlet 422 of this flow passage member having a top wall 438 of the annular content 430 of the structure. It may end immediately below. Optionally, the distal outlet 422 of this flow passage member may be terminated at a point below the vertical direction inside the second flow passage member 424 more than illustratively shown in FIG. 5.

Accordingly, the downward vertical range of the first inlet flow passage member 412 may vary in accordance with the practice of the present invention, and certain length and dimensional characteristics may be determined immediately without improper experiments so that the particular use of the inlet structure of the present invention. The structure and arrangement are selected to achieve the required operating characteristics of.

The upstream processing unit 458 may include, for example, a semiconductor manufacturing tool and associated emission gas processing apparatus. Such release treatment apparatus may also include an oxidizer for the oxidation of the oxidizable component in the emission gas. Suitable oxidation devices are of a wide variety of types and may be comprised, for example, of thermal oxidation units, electrothermal oxidation devices and the like.

When the upstream processing unit 458 includes a gas generating means and a gas processing means for the semiconductor manufacturing process, the airflow injected into the inlet 420 of the first inflow flow passage member 412 may be at an elevated temperature, for example For example, particulate solids in the form of particles of submicron size may be significantly concentrated.

The interface structure 410 further includes a second flow passage member 424, which is enclosed around the first flow passage member 412 and between the first flow passage member as shown. Spaced so as to form an annular volume 430. The second flow passage member 424 extends downward to the bottom 468, and the bottom thereof is located below the bottom of the first flow passage member 412, so that the open outlet 422 of the first flow passage member is second. Is in a vertically spaced relationship with the open bottom 468 of the flow passage 424. As described above, the position of the outlet 422 of the first flow passage member may vary widely in the vertical direction in accordance with the broad implementation of the present invention.

The second flow passage member 424 includes a liquid permeable top 426, as shown, and the remaining liquid impermeable portion 428 extending downward from the liquid permeable portion 426. The liquid permeable top 426 and the liquid impermeable bottom 428 are for example soldered, soldered, mechanical fastener fixtures to the porous cylindrical upper segment 426 which is initially separated from the rigid walled cylindrical bottom 428. It may be formed in a suitable manner or by other suitable bonding means and methods by, or by bonding to each other by other suitable manner.

Optionally, the second flow passage member 424 may be formed using a single cylindrical tubular member, the upper portion of which is characterized by water jet machining, etching, sintering, microelectroma processing, or porous or penetrating properties of the tubular member. It is possible to demonstrate liquid permeability by processing such as other suitable techniques that can be imparted on top. Preferably, the second flow passage member is initially formed of a top and a bottom that are separated and joined together, the top of which is composed of a porous sintered metal material, a porous plastic material, a porous ceramic material, or other porous material, The size of the hole is large enough to allow liquid to penetrate through it, as described in more detail below.

The gas / liquid interface structure 410 further includes an outer wall member 434 that completely surrounds the second flow passage member and forms an annular inner portion 470 therewith. The outer wall member 434 includes a cylindrical sidewall 436, a top wall 438 and a bottom wall 440, which cooperate to surround the interior portion 470. The side wall 436 is provided with a liquid injection port 442. This injection port may be provided in a suitable manner, but in the illustrated embodiment consists of a tubular port extension 444. Optionally, the injection port may simply be an opening or orifice in the sidewall, or other liquid inlet structure, whereby liquid can be injected into the annular volume 470 from an external liquid source.

In the embodiment of FIG. 5, the liquid injection port 442 is coupled with a liquid injection line 446 having a flow control valve 448 therein. The liquid inlet line 446 is connected to the liquid supply reservoir 450.

FIG. 6 is a top plan view of the device of FIG. 5 showing a tangential device for liquid supply flowing into the annular inner portion 470 of the interface structure shown in FIG. 6. FIG. 6 shows that the tubular port extension 444 is arranged to tangentially intersect the cylindrical sidewall of the outer wall member. In this way the injection liquid is fairly evenly distributed in the circumferential direction around the porous cylindrical upper segment (liquid penetrating top 426), so that a liquid thin film which seeps through the porous cylindrical segment is thus described in more detail below. As such, the wall inner surface 472 is uniformly covered in the circumferential direction.

The liquid flow control valve 448 in line 446 passes through the central processing unit to provide a predetermined or in other words a selected flow of liquid from reservoir 450 through line 446 to liquid inlet port 442. CPU), microprocessor, flow control console, and / or auxiliary controller / timer means, including suitable monitoring and control means. The injected liquid fills the annular inner portion 470, which may be injected under suitable processing conditions.

For the treatment of gases such as hot particulate accumulated release air streams from semiconductor manufacturing processes, the liquid in the annular volume 470 may be water or other aqueous media.

Due to the liquid penetrating properties of the liquid permeable top 426 of the second flow passage member 424, the liquid penetrates from the annular volume 470 through the top 426 of the second flow passage member, It appears as a liquid drop 454 on the wall inner surface 432.

These spilled liquid droplets fall under the influence of gravity and merge with other liquid droplets to collect as a whole, forming a downward flow liquid thin film 456 on the wall inner surface 472 of the liquid impermeable portion of the second flow passage member. The liquid in the liquid thin film discharged from the lower open end 68 of the second flow passage member is, for example, the gas flow passage of the second flow passage member which flows here in the downstream processing unit 464 in line 462. It may be directed to suitable collection and processing means (not shown) to be treated with the airflow from 452.

The downstream treatment unit 464 may be a water scrubber, reaction chamber, or other processing apparatus or processing zone, where it flows from the passage 452 in the line 462 where additional processing is applied to the flow connection. The final offgas is discharged from the downstream processing unit in 466.

The gas / liquid interface structure 410 is thus configured to provide a liquid permeable top 426 of the second flow passage member and an annular volume 430 between the first and second flow members, thereby providing liquid permeability. The liquid that has permeated through the top may be combined to develop into the falling liquid thin film 456. By this arrangement, the gas flowing from the flow passage 418 into the flow passage 452 impinges the inner wall surface 472 of the lower portion of the second flow passage member covered with the protective liquid thin film 456. Accordingly, any corrosive substances in the gas discharged from the lower open end 422 of the first flow passage member can be detected in relation to the wall inner surface, so that corrosion and poor reaction on this wall inner surface of the second flow passage member can be detected. Minimize the effect.

In addition, a liquid reservoir structure is provided by injecting liquid into the annular inner portion 470 between the second flow passage member and the outer wall member 434. As a result, a liquid is provided on top of the porosity of the second flow passage member to penetrate therethrough and flows downward to form a protective thin film on the wall inner surface of the second flow passage member.

This falling thin film on the inner surface 472 of the second flow passage member is also extracted by entraining any particulates that may be deposited and collected on the wall inner surface of the second flow passage member in the absence of such liquid thin film from the air stream. It plays a role.

Thus, the falling liquid thin film not only provides a protective function with respect to the inner wall surface of the second flow passage member, but also extracts particulate solids and other gaseous components that may be harmful if accumulated on the inner wall surface of the flow passage member. To provide a companion medium to splash.

Another advantage of this structure, which is illustrated by way of example in FIG. 5, is the use of a liquid penetrable top 426, which serves to minimize liquid usage compared to the installation of structures such as liquid overflow weirs, in which the annular content The liquid from the drop 470 simply overflows the top of the wall 426 and flows downward in the form of a thin film of wall over the entire length of the inner surface of the second flow passage member. The liquid required for operation is maintained at a very low level by the whipping weir structure of the present invention.

Another advantage of the whipping weir structures of the present invention over simple liquid flooding weir structures is that the liquid flooding weir structures must be aligned vertically and precisely in order for the weirs to operate efficiently, while the whipping structures have a working structure. There is room for deflection from normal (vertical) orientation without compromising or degrading efficiency.

In other words, the whipping weir structure of the present invention is characterized by mitigating the additional rate of overflowing weir water not only by the horizontal of the structure but also by the minimum wet rate by the liquid penetrating weir wall (according to conventional flooding structures Since there is no list of starting liquids to set and maintain the start of liquid outflow from the weir).

As an illustrative example of a gas / liquid interfacial structure of the type shown illustratively in FIG. 5, such a structure may be used downstream of a thermal oxidation device unit process releasing gas from a semiconductor manufacturing process, thus leading to a line entering the interfacial structure 410. The airflow in 460 accumulates not only fine particles such as silicon, fine metal particles, and particles having a submicron size, larger solids, but also corrosive solids and the like, and is hot.

In such an embodiment, the top 426 of the second flow passage member may be comprised of a sintered metal wall about 1/16 inch thick with holes formed with an average size of about 2 microns. The first flow passage member 412 may be about 4.48 inches long and may be about 2.5 inches in diameter. The corresponding second flow passage member 424 is accordingly about 13.5 inches long and about 4.5 inches in diameter. The outer wall member 434 may be about 5.5 inches in vertical length and about 6 inches in diameter.

Water may be used as a liquid medium in such a system, where water is injected from the reservoir 450 into the annular interior portion 470 and onto the inner surface 432 of the liquid permeable top 426 of the second flow passage member. Soak through it. The water usage of such a system may be on the order of 0.1 to 0.3 gallons per minute during operation.

7 shows an upstream system 512 for generating exhaust gas, an exhaust line 514, a manifold duct line 516, a first suction line 518 and a second suction line 520, and a downstream scrubber unit ( A schematic diagram of a system 510 consisting of 550 is shown. As shown, an upstream system, which may include, for example, a semiconductor manufacturing facility or semiconductor processing tool, is gas tightly connected with the scrubber via the manifold and the suction line. The diameter of the discharge line, the manifold line and the suction line can be any suitable diameter, such as 1.5 to 3 inches (3.81 to 7.62 cm).

8 is a schematic diagram of an exemplary embodiment of the present invention. An upstream system 612, such as a semiconductor manufacturing tool, is connected to the discharge line 614. Discharge line 614 has an elongated tubular wall with an inner flow passageway and a first end upstream of the second end. An internal flow passage of the discharge line 614 is connected to the upstream system 612 at the first end to receive the exhaust gas from the upstream system. The second end of the outlet line 614 is connected to approximately an intermediate point of the intake manifold line 616. Suction manifold line 616 has an inner flow passageway and a wall that forms an elongated body having a first end and a second end. The first and second ends of the intake manifold line 616 are downstream from the connection with the outlet line 614 at approximately an intermediate point. The connection of the discharge line 614 and the manifold line 616 allows the exhaust gas to efficiently pass from the internal flow passage of the discharge line 614 into the internal flow passage of the manifold line 616.

The first suction line 618 and the second suction line 620 have internal passageways and walls that form first and second ends. The first ends of each of the first suction line 618 and the second suction line 620 are connected to the first and second ends of the manifold line 616 such that the exhaust gas flows into the manifold line 616. Facilitate passage from the passage to the internal flow passages of the suction lines 618, 620. The second end of the suction line is downstream from the first end. A second end of each of the first suction line 618 and the second suction line 620 is connected to the scrubber unit 650.

As shown, the scrubber unit 650 is connected to the scrubber channel 652. The connection facilitates the passage of water from the scrubber channel 652 to the scrubber 650. In addition, the scrubber 650 is connected to the exhaust gas discharge discharge line 654 to allow gas from the scrubber 650 to pass through the discharge line 654 to the discharge position. In addition, the scrubber 650 is connected to the liquid waste line 656 to allow the liquid waste from the scrubber 650 to pass through to the liquid waste discharge position without clogging. Scrubber channel 652, exhaust gas discharge line 654, liquid waste line 656, discharge line 614, manifold suction line 616, and first suction line 618 and second suction line 620 ) May have any diameter suitable for the particular gas flow rate and operation of the processing unit provided in the installation.

The connection between the manifold suction line and the first and second suction lines is deflected at an angle of between 45 and 90 °, so that the internal passage of the manifold suction line causes water to flow into the internal passages of the first and second suction lines. It serves as a water baffle that suppresses the backflow of water from the interior of the.

A first suction valve 622 and a second suction valve 624 are connected adjacent upstream ends of the first suction duct and the second suction duct. The intake valve is a two-way valve, each having an open position and a closed position. When in the closed position, the intake valve prevents the flow of exhaust gas from the manifold line 616 into the intake line.

The first heating means 646 and the second heating means 648 are located adjacent the second downstream end of the suction line. Although shown as a heater coil, the heating means can be provided with any heating system known to those skilled in the art for transferring thermal energy to the inner passages of the first and second suction lines.

A gas delivery system for transferring gas from a gas source to the inner passages of the first and second suction lines will be described. The gas delivery system of the present invention includes a gas source 626, a first gas transfer line 628 and a second gas transfer line 632 with internal passages, first and second ends, and a gas flow control valve therein. 630 and 634.

It will be appreciated that the gas delivery system described herein may have one or more gas sources. The plurality of gas sources are connected in gas communication with the gas source manifold. The gas source manifold may have a gas source shutoff valve for each gas source and a gas source flow control valve for each gas source. Therefore, the gas source manifold is connected in gas communication with the gas delivery system.

Gas source 626 is located adjacent to the first and second suction lines. The gas source 626 delivers gas, such as nitrogen, to the internal passages of the first suction line 618 and the second suction line 620 at a rate of 2 to 100 ft ³ per hour. Effective gas transfer to the suction line is facilitated by the connections of the first and second gas transfer lines and the first and second suction lines (any suitable connection means such as couplings, connectors, etc.).

The gas source 626 is connected to the first gas transfer line 628 at the first end of the first gas transfer line 628. The first end of the second gas transfer line 632 is connected to the first gas transfer line at approximately an intermediate point along the length of the first gas transfer line 628. The connection portion of the first gas transfer line 628 and the second gas line 632 is connected so that the gas contained in the first line 628 passes through the inner passage of the second line 632 without being blocked or leaked. The second gas transfer line 632 is along the length of the first gas transfer line 628 at a point downstream of the connection between the first gas transfer line 628 and the gas source 626. )

The downstream end of the first gas delivery line 628 is connected to a second length of the second suction line 620 downstream of the second valve 624. The connection between the first gas transfer line 628 and the suction line 620 allows the gas contained in the inner passage of the first gas transfer line 628 to flow without clogging so that the gas freely leaks inside the suction line 620. Flow into the passage. The second end of the second gas transfer line 632 downstream from the first end of the second gas transfer line 632 is connected to the first suction line 618. The connection between the second gas transfer line 632 and the suction line 618 allows the gas contained in the second gas transfer line 632 to freely flow into the suction line 618 without leaking.

A first gas valve is located along the first gas transfer line 628 upstream from the connection with the second suction line 620 and downstream of the connection with the second gas transfer line 632. The first gas valve 630 is a two-way valve such as the first and second intake valves described above. The first gas valve 630 controls the passage of gas to the second suction line 620 along the interior of the first gas transfer line 628. Upstream from the connection with the first suction line, a second gas valve 634 is located in the second gas delivery line. The second gas valve 634 facilitates the passage of gas from the second gas transfer line to the first suction line.

Now, a compressed water delivery system will be described. The water transport system includes a water source 636, a first water supply line 638 and a second water supply line 642 with first and second ends and internal passageways, a first water valve 640 and a second. And a water valve 644.

Compressed water source 636 is located adjacent to the first suction line and the second suction line. Compressed water source 636 generates a flow of water with a pressure of 0.5 to 5 gallons per minute. The water supply 636 is connected to an internal passage of the water supply line 638 at one end of the first water supply line 638. The connection allows the compressed water to flow efficiently from the water source into the inner passage of the first water supply line 638. The second end of the water supply line 638 downstream from the first end is connected to a second suction line (620) to transfer compressed water from the inner passage of the first water supply line 638 to the second suction line 620. 620. Upstream from the connection with the second suction line 620, a first water valve 640 is positioned in the first water supply line 638, where the compressed water is sucked through the suction line 620. Easily and easily flow into the line. The first water valve is a two-way valve.

The first end of the second water transfer line 642 is connected to the first water transfer line 638 upstream from the first water valve 640 and between a position downstream of the water source 636. The second end of the second water transfer line 642 downstream from the first end is configured to transfer compressed water from the internal passage of the first water transfer line 638 to the internal passage of the first suction line 618. Is connected to the first intake valve 618. Upstream from the connection with the first suction line 618, a second water valve 644 is connected to the second water transfer line to selectively control the passage of compressed water. The second water valve 644 is a two-way valve.

The first heat jacket 658 may include a first suction line 618 of a predetermined length, a first suction valve 622, a connection between the suction line 618 and the second gas transfer line 634, and the suction line ( A connection between the 618 and the second water transfer line 634 and the first heating means 648. The first heat jacket provides insulating properties to the components contained therein and cooperates with the heating means to raise the internal heat temperature of the first suction line 618. The heat jacket 658 raises the temperature of the sidewalls to evaporate the water deposited on the sidewalls while N ₂ is flowing, and raises the temperature of the sidewalls to prevent condensable process gases from condensing in the line. . In the case of metal etching processing, the BCl ₃ from this processing will form boric acid at the scrubber inlet when the hydrolysis reaction occurs, but the process line is designed to prevent AlCl ₃ from condensing at the inlet along this line as well. It must be heated. The line can then be heated from the process source as in the case of metal etching or WCVD processing.

The second heat jacket 660 may include a second suction line 620 of a predetermined length, a second suction valve 624, a connection between the suction line 620 and the second gas line 628, and the suction line 620. ) And the connection of the second water line 634 and the second heating means 646. The second heat jacket provides insulating properties to the components contained therein and cooperates with the heating means to raise the internal heat temperature of the second suction line 620.

The valve described above is a two-way valve having an open position and a closed position, respectively. For the purpose described below, this valve is opened by the operation of air and closed by the operation of the spring (depending on the requirements, performance and use of the system, which may be closed by air or opened by the spring). It is assumed to be a pneumatic valve. Such a pneumatic valve may include a KF-50 connection, an electro-pneumatic valve integrated with an air solenoid valve, and a switch opening and closing conductor. Such a valve may be a model name 190 available from MKS Instruments Inc., HPS Division. The electrical connection between the valve described above and the valve described below is maintained in a control panel (not shown). The control panel includes a programmable logic controller (PLC) electrically connected to the system valve. The PLC maintains an electrical connection with the valve and senses the valve position to adjust the valve position (ie, open or closed position). In addition, a timer is installed in the PLC to facilitate timing of valve positions by the PLC. However, it will be apparent to those skilled in the art that alternative embodiments of other valves and controls may be substituted without departing from the spirit and scope of the present invention. For example, the valve may be composed of any type of electric valve, mechanical valve, magnetic valve, and the like. Such a valve may in particular comprise a limit switch electrically coupled to a cycle timer control means or an alternating current control means. This limit switch provides valve positioning and regulates mutual locking to ensure that no flow of process gas is returned, and assists in preventing water from entering the connection line (flow connection) gas flow line.

The method of operation of the above-described embodiment of the present invention shown in FIG. 8 will be described below in connection with the flowchart of FIG. 9. In this embodiment, reference numerals for the same components are made to coincide with reference numerals in FIG. 8.

In the first step of the method of operation of the present invention (see block 701 in the flowchart of FIG. 9), all valves 622, 624, 630, 634, 640, 644 are closed. A programmable logic controller (PLC) controls the opening and closing of the valves by regulating the flow of compressed air (not shown) to the valves. The blocking of compressed air to the valve allows the spring to move the valve baffle to the shut off position, thereby preventing gas strip material from flowing from the upstream position of the valve to the downstream position of the valve. The first step prevents any effluent gas flow, compressed water flow, or other gas flow through any of the aforementioned duct lines. This initial step is a safety precautionary step prior to using the device of the present invention, informing the operator that the intake duct line is always filled by the airflow of outflow gas from the upstream system 612. This initial step ensures that the flow of effluent gas (along with water and gas compressed from gas source 636) has not yet begun.

The second step in the method of operation of the present invention (see block 702 in the flowchart of FIG. 9) includes searching whether all valves are closed. This search is performed by a PLC built into the control panel. As mentioned above, the PLC is in electrical communication with the electrical position indicator means incorporated in the aforementioned valve. This search is performed by detecting a signal from the position indicator means by the PLC and comparing this signal with a predetermined value of the closed position indication. When determining this value as the value of the closed position, the third step is initiated. When it is determined that the value is the value of the closed position, a beep sounds and the previous step is repeated.

The third step (see block 703 in the flowchart of FIG. 9) involves the opening operation of the second intake valve 624. Opening of the intake valve 624 allows the flow of compressed air to the valve, such that the inner spring positions the position of the valve baffle and the outflow gas from the manifold 616 passes through the second intake valve 624 to the second intake line. By adjusting it to a position that allows it to pass to 620.

Opening of the second suction valve 624 is operated by the PLC. Since the first intake valve 622 is maintained in the closed position, the first intake line is sealed from the flow of the effluent gas and the flow blocker gas so that this gas flows only through the second intake line 620.

The fourth step (see block 704 in the flowchart of FIG. 9) involves searching whether the second intake valve 624 is open. This retrieval of the suction valve is performed by the PLC in the same manner as the valve position retrieval performed in the second step. If the PLC determines that the second intake valve is closed, the alarm sounds and the previous step is repeated. If the PLC determines that the second suction valve is open, the next step of the operation sequence is performed.

The fifth step (see block 705 in the flowchart of FIG. 9) involves opening the second water valve 644. Opening of the valve 644 is performed by the PLC similarly to the method described above. Opening of the valve 644 forms an outlet for the flow of compressed water from the water source 636 towards the first suction line 618 via the first water transfer line 638 and the second water transfer line 642. do. The first water valve 640 is maintained in a closed position to prevent water from the water source 636 from flowing through the first water valve to the second suction line 620. The valve 644 remains open by the PLC during the first time period and is sensed by a timer cooperating with the PLC. The flow of compressed water directed to the first suction line 618 not only decomposes the molten particulates, but also ejects from the internal passages of the line 618 to clean the passages so that particulates and the like end up at the second end of the first suction line. Through the scrubber unit 650 through.

A sixth step (see block 706A in the flowchart of FIG. 9) involves closing the water valve 644 after the first time period has passed. After closing the second water valve 664, open the second gas valve 634 (see block 706B in the flowchart of FIG. 3), and activate the first heating means if it is not already operating ( Block 706C in the flowchart of FIG. 3). Closing and opening of the valve is performed by the PLC in the manner described above. The first heating element is operated by generating a current flowing through this element and controlled by the PLC. The current flow affects the intrinsic resistance of the heating means and generates heat due to the reliable guarantee of electrical resistance. The second gas valve 664 remains open for a second timed period and is sensed by a timer that interacts with the PLC. The preferred range of the time for leaving the second gas valve open and the operating time of the heating means is 30 minutes to 8 hours. The first gas valve is maintained in the closed position such that gas flow from the gas source 626 is directed along the first gas transfer line 628 to the second gas transfer line 632 and the first suction line 618. The gas interacting with the heat transferred by the first heating means 648 dries the inner wall of the first suction line.

The seventh step (see block 707 in the flowchart of FIG. 9) involves separating the first heating means and opening the first intake valve 622. Opening of the first intake valve 622 is performed similarly to the method described above. The heating means are separated by cutting off the current flowing to this heating means with control by the PLC.

An eighth step (see block 708 in the flowchart of FIG. 9) involves searching whether the first intake valve 622 is open. The retrieval is executed by the PLC similarly to the retrieval method described above. If the PLC determines that the first intake valve is open, an alarm sounds and the seventh step is repeated. Only when the PLC is sure that the newly cleaned inlet is open, the PLC will close the other inlet for cleaning, otherwise the flow of process gas may be interrupted. If the PLC determines that the first suction valve is open, the next step of the operating sequence is executed.

The ninth step (see block 709 in the flowchart of FIG. 9) involves closing the second intake valve 624. The first suction valve 622 is maintained in the open position. By closing the second intake valve 624, the outflow flow is diverted from the second intake line that is currently closed to the first intake line that is currently open.

The tenth step (see block 710 in the flowchart of FIG. 9) involves searching whether the second intake valve 622 is closed. This search is performed by a PLC which is electrically connected to the second intake valve as described above. If the PLC determines that the second intake valve is closed, the alarm sounds and the ninth step is repeated. If it is determined that the second intake valve is closed, the next step of the operation sequence is executed.

The eleventh step (see block 711 in the flowchart of FIG. 9) involves opening the first water valve 640. The second water valve 644 is maintained in the closed position. By opening the first water valve (with the second water valve 644 closed), the passage of compressed water is opened to provide a water supply source through the first water transfer line 638 and the first water valve 640. From 36 to the second suction line 620. The second water valve 644 is maintained in the closed position to prevent water from flowing through the valve to the first suction line 618. The compressed water flows through the second suction line 620 to perform the cleaning and cleaning action as described above in connection with the first suction line. The compressed water is discharged to the second suction line through the second end connected to the scrubber 650. The compressed water is ejected out of the second suction line for a predetermined time period of 1 to 10 minutes. An adjustable timer electrically connected to the PLC cooperates with the PLC at the same time as the discharge of the compressed water.

The twelfth step (see block 712 in the flowchart of FIG. 9) closes the first water valve 640, and the thirteenth step (see block 713 in the flowchart of FIG. 9) the first gas valve ( Opening 630 and the fourteenth step (see block 714 in the flowchart of FIG. 9) involve actuating the second heating means 646. Opening and closing of the valves is executed by the PLC in a manner similar to the above-described method. The second water valve 644 is held in the closed position to prevent gas from passing through the valve and into the first inlet duct line 618. Opening of the first gas valve 630 opens the gas passage so that gas passes through the first gas transfer line 628 and the first gas valve 630 from the gas source 626 to the second suction line 660. To flow. The operation of the second heating means interacts with the second heat jacket 660 to raise the internal temperature of the second suction line. Gas and heat generated from the second heating means dry the inner passage of the second suction line 620. The gas flows through the second suction line and enters the scrubber 650 past the second end of the suction line. The first gas valve is kept open and the second heating means is operated for a range of 30 minutes to several hours. The time setting period is sensed by a timer cooperating with the PLC as described above.

The fifteenth step (see block 715 in the flowchart of FIG. 9) involves closing the first gas valve 630 and separating the second heating means 646 after reaching the set time. In a sixteenth step (see block 716 in the flowchart of FIG. 9), the PLC searches for the first intake valve 622 to keep the valve open.

The seventeenth step (see block 717 in the flowchart of FIG. 9) opens the second intake valve 624 to retrieve whether the second intake valve 624 has been opened by the PLC (the flowchart of FIG. 9). In block 718). If it is determined that the second intake valve is not open, an alarm sounds and the previous step is repeated. The PLC performs a search process similar to the method described above.

A nineteenth step (see block 719 in the flowchart of FIG. 9) closes the first intake valve 622 to detect whether the first intake valve is securely closed (see block 720 in the flowchart of FIG. 9). Entails). If valve 622 is not closed, a beep sounds and the previous step is repeated. If the first intake valve 622 is closed, the operator searches for the following actuation process.

Finally, the operator repeats the washing step described above and searches to return to the fifth step or to end the washing cycle (see block 721 in the flowchart of FIG. 9).

The inlet structure of the present invention comprises a downstream process unit such as an air flow scrubber, purifier, filter, neutralizer, extraction system for recovery of strip components, reaction system for further gas treatment of the composition of gas obtained at an upstream location, and the like. Always used in conjunction with The intake structure is constructed, arranged, and operated to minimize the frequency of deposition of particulates, thin film formation from components of the airflow, and inadequate hydrodynamic effects.

Claims (78)

An inlet structure for passing airflow from an upstream source to a downstream point, (A) a gas permeable wall surrounding the gas flow path; An outer annular jacket surrounding the gas permeable wall to form an annular gas reservoir between the gas permeable wall; While the particulate solid containing and / or solid forming airflow flows through the inlet structure to the gas treatment system, the gas penetrates through the gas permeable wall and inhibits solids from depositing or forming on the inner surface of the gas permeable wall. An inlet structure comprising gas injecting means for injecting gas into said annular gas reservoir at a pressure sufficient to make it suitable for use; (B) a first inlet flow passage member extending in a vertical direction having an upper introduction portion for injecting the airflow and a lower end portion for discharging the airflow; Surround the first inlet flow passage member at regular intervals to form an annular space therebetween, the lower end extending downward below the lower end of the first inlet flow passage member, A second flow passage member having a lower liquid impermeable portion below the liquid permeable portion; An outer wall member surrounding and enclosing the second flow passage member to form an inner annular space surrounded with the passage member; And A liquid flow inlet port disposed in the outer wall member for injecting liquid into the enclosed inner annular space between the second flow passage member and the outer wall member And the inlet structure, characterized in that provided with, (C) a manifold having a first inlet line and a second inlet line for receiving gas from said upstream source and optionally used to cause gas to flow into a downstream process, wherein each manifold of said inlet line One end is connected to the manifold conduit, and each second end of the inlet line is connected in communication with a downstream processing unit to allow each of the first and second inlet lines to flow or block airflow through the line. A manifold adapted to include therein a valve that can be selectively opened or closed; A pressurized water source coupled with the manifold by a water flow line flowing to first and second inlet lines, and Cycle timer control means configured and arranged to control the operation of the manifold and valve so that they are in an operating state, The manifold is arranged to receive gas from an upstream source such that gas flows through the manifold and either the first inlet line or the second inlet line, so that one of the inlet lines allows the gas from the upstream source to flow downstream. active flow into the lower process, while the other inlet line shuts off each valve in it, preventing gas from flowing through it, Each of the water flow lines includes a valve that can be selectively opened or shut off to generate or block a flow of compressed water therethrough, respectively, The valve disposed in one of the first and second inlet lines is open, while the gas disposed in the other of the first and second inlet lines is closed, and the gas flows from the upstream process to the manifold. Flows, the gas entering the manifold flows through a specific inlet line with a valve open, the gas flows through a specific inlet line consisting of a flow connection line including an open valve and transported to a downstream process, Meanwhile, the other line of the manifold consists of a flow shutoff line with the valve closed to prevent gas from passing there, The flow shutoff line, where gas cannot flow through it, is cleaned to regenerate the gas for the next process, the valve at each inlet line is opened one at a time and the other valve is connected to the subsequent flow. To ensure that the line is renewed for action and to remove the flow blockage of the line, The flow shutoff line is cleaned of the compressed water from the compressed water source by entering the flow shutoff line by opening the valve of the water flow line in communication with the compressor source in the flow shutoff state, while in the other flow line, the water flow line valve is Shut off to prevent compressed water from flowing from the compressed water source to the flow connection line, and after compressed water flows through the flow connection line to clean the flow connection line, the valve of the inlet line at each inlet line is opposed to the open / closed To a state, With the air flow alternately directed to each inlet line, during the flow shutoff period of a particular inlet line, the flow shutoff line is filled with compressed water to update the inlet line so that gas flows continuously through the line. Entrance structure A structure selected from the group consisting of: An anti-clogging inlet structure for injecting a particulate solid containing and / or solid forming air stream into a gas treatment system, A gas permeable wall surrounding the gas flow path; An outer annular jacket surrounding the gas permeable wall to form an annular gas reservoir between the gas permeable wall; While the particulate solid containing and / or solid forming airflow flows through the inlet structure to the gas treatment system, the gas penetrates through the gas permeable wall and inhibits solids from depositing or forming on the inner surface of the gas permeable wall. Gas injection means for injecting gas into the annular gas reservoir at a pressure sufficient to cause Inlet structure comprising a. 3. The apparatus of claim 2, further comprising a port for injecting pulsed high pressure gas into the annular reservoir, the port being a high pressure gas source and means for distributing pulsed high pressure gas from the source to the annular reservoir. means for pulsed delivery to perform an additional anti-clogging action on the gas permeable wall. The gas flow permeable wall and the outer annular jacket are connected to a downward flow path section including a wall surrounding a corresponding further gas flow path section and forming a slot therebetween with the gas permeable wall. The wall of the downcomer section is surrounded by an outer annular jacket to form an annular reservoir in liquid overflow relation with the slot therebetween, so that the height of the wall in the annular liquid reservoir When the liquid is filled past a point defined by the liquid, the liquid flows over the inner surface of the wall with a falling liquid film, whereby the falling liquid film provides a barrier medium to the inner surface of the wall, Solid deposits or formations on these inner surfaces are prevented from occurring and nevertheless deposited or formed on the inner surfaces of the walls Inlet structure, characterized in that any solids can be removed. 5. The inlet structure according to claim 4, wherein the outer annular jacket of the downflow flow section of the inlet structure is provided with a port connected to the liquid supply. The inlet structure according to claim 2, wherein the first end of the gas flow path is connected in a gas flow relationship with the semiconductor manufacturing tool. 7. The inlet structure according to claim 6, wherein the second end of the gas flow path is connected with a water scrubber unit in a gas flow relationship. 7. The inlet structure according to claim 6, wherein the second end of the gas flow path is connected in a gas flow relationship with a combustion scrubber unit. 3. The inlet structure according to claim 2, further comprising an airflow transport tube surrounded by an outer annular jacket for transporting particulate solid-containing and / or solid-forming airflow to the inlet structure. 10. The inlet structure according to claim 9, further comprising heating means for heating said airflow transport tube to prevent condensation of particulate solid-containing and / or solid-forming airflow flowing through the airflow transport tube. 5. The inlet structure according to claim 4, further comprising an airflow transport tube surrounded by a gas permeable wall for transporting particulate solid-containing and / or solid-forming airflow to the inlet structure. 12. The inlet structure according to claim 11, further comprising heating means for heating said airflow transport tube to prevent condensation of particulate solids and / or solids forming airflow flowing through the airflow transport tube. 12. The inlet structure according to claim 11, wherein the air flow conveying tube discharges particulate solid containing and / or solid forming airflow below the top wall of the downstream flow section. The inlet structure according to claim 2, wherein the inlet structure also comprises gas heating means for heating the gas passing through the gas permeable wall. An anti-clogging inlet structure for injecting a particulate solid containing and / or solid forming air stream into a gas treatment system, A first flow passage section and a second flow passage section disposed generally in a vertical direction in a mutually connected relationship; A gas flow port on an outer wall of the first flow passage portion, The first flow passage section and the second flow passage section form a vertical flow passage in the series-connected relationship, wherein a particulate solid containing and / or solid forming air stream contains the particulate solid through and through the flow passage; Or from an upstream source of solid forming airflow to a downstream gas treatment system disposed in an gas stream-receiving relationship with the inlet structure, The first flow passage section includes an upper section of the inlet structure, and between the gas permeable wall and the gas permeable wall having an inner surface defining an upper portion of the flow passage and surrounding the gas permeable wall. Having an outer wall forming an inner annular space, The gas flow port may be connected to a gas source that introduces gas into the inner annular space at a predetermined gas flow rate for continued flow of gas from the inner annular space into the flow passage of the inlet structure, The second flow passage section is connected in series to the first flow passage section such that particulate solid containing fluid flows downwardly from the first flow passage section into the second flow passage section, the second flow passage being An inner weir wall disposed at regular intervals with respect to the outer wall and having an inner annular space therebetween, the outer wall having a liquid injection port, An outer wall is connected with the first flow passage section, the weir wall extending toward the gas permeable wall of the first flow passage section but terminating just before the gas permeable wall to form a weir therebetween. Wherein the weir wall has an inner surface defining a flow passage of the second flow passage section, Thus, when liquid flows into the inner annular space between the outer wall of the second flow passage section and the inner weir wall thereof, the injected liquid overflows the weir downwards to the inner surface of the inner wall of the second flow passage section. Flowing to wash away any particulate solid from the wall and to prevent deposits or formation of solid on the inner surface of the weir wall as the particulate solid-containing air flow flows through the flow passage of the inlet structure. Inlet structure. 16. The apparatus of claim 15, further comprising a high pressure gas flow port on an outer wall of the first flow passage section, the high pressure gas flow port introducing high pressure gas into the inner annular space to clean particles deposited or formed from the gas permeable wall. Inlet structure, characterized in that it can be connected to a high pressure gas source. 16. The inlet structure according to claim 15, wherein a gas source is connected to a gas port at an outer wall of the first flow passage section. 17. The inlet structure as claimed in claim 16, wherein the high pressure gas source is connected to a high pressure gas port on an outer wall of the first flow passage section. 16. The inlet structure according to claim 15, wherein the lower end of the second flow passage section is connected to a water purifier for purifying particulate solid-containing airflow flowing through the flow passage of the inlet structure. 16. The inlet structure according to claim 15, wherein said first flow passage section and said second flow passage section are detachably connected to one another. The inlet structure according to claim 15, wherein the first flow passage section and the second flow passage section are coaxially aligned with each other. The inlet structure according to claim 15, wherein the gas permeable wall is formed of a porous metal. The inlet structure according to claim 15, wherein the gas permeable wall is formed of porous ceramics. The inlet structure according to claim 15, wherein the gas permeable wall is formed of porous plastic. 16. The inlet structure according to claim 15, wherein said gas permeable wall and outer annular jacket are formed in a circular cross section. 16. The inlet structure according to claim 15, wherein the outer wall and the inner weir wall of the second flow passage section are formed in a circular cross section. The inlet structure according to claim 15, wherein the first flow passage section is connected with an upstream semiconductor fabrication tool. 16. The air flow distribution tube of claim 15 further comprising an air flow distribution tube surrounded by an inner surface of the gas permeable wall, the air flow distribution tube in a gas flow receiving relationship with an upstream source, the air flow distribution tube being generally in a vertical direction. An inlet structure characterized by discharging a particulate solid containing and / or solid forming air stream in the flow passage. 29. The inlet structure as claimed in claim 28, wherein said air flow distribution tube discharges particulate solid containing and / or solid forming airflow in said second flow passage section. 29. The inlet structure as claimed in claim 28, wherein said air flow distribution tube discharges particulate solid containing and / or solid forming airflow below a gap forming said weir. 29. The inlet structure of claim 28, wherein the airflow distribution tube discharges particulate solids containing and / or solids forming airflow above the gap that forms the weir. 16. The inlet structure according to claim 15, further comprising heating means for heating said airflow distribution tube to prevent condensation of particulate solid-containing and / or solid-forming airflow flowing through the airflow distribution tube. 16. The inlet structure according to claim 15, further comprising gas heating means for heating a gas passing through said gas permeable wall. An anti-clogging inlet structure for injecting particulate solid-containing and / or solid-forming airflow, comprising: an upper section with an upper porous wall and a lower section with a lower porous wall, the upper porous wall and the lower porous wall being a gas; An inlet structure surrounding the flow path and wherein each porous wall receives a shroud fluid. 35. The inlet structure according to claim 34, further comprising an airflow distribution tube for discharging particulate solids and / or solids forming airflow in said upper section, surrounded by said upper porous wall. 35. The inlet structure according to claim 34, further comprising an airflow distribution tube for discharging particulate solids and / or solids forming airflow in said lower section, surrounded by said upper porous wall. 35. The system of claim 34, further comprising a transition region and an airflow distribution tube between the upper section and the lower section, wherein the airflow distribution tube discharges particulate solid containing and / or solid forming airflow in the transition region. Inlet structure. 35. The inlet structure of Claim 34, further comprising an axially disposed porous structure for injecting fluid into the inlet structure. A gas / liquid interface structure that delivers airflow from an upstream gas source to a downstream processing unit, A first inlet flow passage member extending in a vertical direction having an upper introduction portion for injecting the airflow and a lower end portion for discharging the airflow; Surround the first inlet flow passage member at regular intervals to form an annular space therebetween, the lower end extending downward below the lower end of the first inlet flow passage member, A second flow passage member having a lower liquid impermeable portion below the liquid permeable portion; An outer wall member surrounding and enclosing the second flow passage member to form an inner annular space surrounded with the passage member; And A liquid flow inlet port disposed in the outer wall member for injecting liquid into the enclosed inner annular space between the second flow passage member and the outer wall member A gas / liquid interface structure comprising a. 40. The gas / liquid interface structure of claim 39, wherein the upper liquid permeable portion of the second flow passage member comprises a porous cylindrical wall member. 41. The gas / liquid interface structure of claim 40, wherein the porous cylindrical wall member is formed of a material selected from the group consisting of sintered metal material, porous ceramic material, and porous plastic material. 41. The gas / liquid interface structure of claim 40, wherein the liquid permeable portion of the upper portion of the second flow passage member is formed of a porous sintered metal material. 41. The gas / liquid interface structure of claim 40, wherein the liquid permeable portion is constituted by a porous wall having an average pore dimension in the range of about 0.5 to 30 microns. 40. The gas / liquid interface structure of claim 39, wherein the first flow passage member and the second flow passage member are each cylindrical in shape and coaxial with each other. 40. The cylindrical wall of claim 39, wherein the outer wall member surrounding and enclosing the second flow passage member has a cylindrical sidewall disposed in a radially spaced relationship with respect to the second flow passage member, and the extending first flow passage member. And a bottom wall between which the second flow passage member and a side wall of the outer wall member pass. 40. The liquid flow inlet port of claim 39, wherein a liquid flow inlet port disposed in said outer wall member for injecting liquid into an enclosed inner annular space between said second flow passage member and said outer wall member further comprises injecting injected liquid into said second flow passage member. A gas / liquid interface structure, configured and arranged to tangentially feed liquid into the enclosed inner annular space for circumferential distribution around a liquid permeable portion of the top of the substrate. 40. The gas / liquid interface structure of claim 39, wherein the weir liquid rate is configured and arranged such that the weir liquid rate is decoupled from the level of the structure. 40. The gas / liquid interface structure of claim 39, wherein the weir liquid rate is configured and arranged to be independent of the minimum wetting rate. A gas / liquid interface structure for conveying airflow from an upstream airflow source to a downstream processing unit, comprising a first flow passage member and a second flow passage member defining an annular space therebetween, wherein the second flow passage member comprises: Extending downwardly at a lower level than a lower end of the first flow passage member, wherein the second flow passage member is surrounded by an outer wall member to form an inner annular space surrounded by the passage member and surrounded by the outer wall member. There is a liquid flow port for injecting liquid into the inner sulfurous space, and the second flow passage member has a liquid permeable upper portion in liquid circulation relationship with the enclosed inner annular space, whereby liquid from such space is directed to the permeable portion. A protective liquid system for the second flow passage member that can flow therethrough and also to an inner surface portion of the second flow passage member A falling liquid film (falling liquid film) formed in the gas / liquid interface structure characterized in that. 50. The gas / liquid interface structure of claim 49, wherein the liquid permeable top of the second flow passage member comprises a porous cylindrical wall member. 51. The gas / liquid interface structure of claim 50, wherein the porous cylindrical wall member is formed of a material selected from the group consisting of sintered metal material, porous ceramic material, and porous plastic material. 51. The gas / liquid interface structure of claim 50, wherein the liquid permeable top of the second flow passage member is formed of a porous sintered metal. 51. The gas / liquid interface structure of claim 50, wherein the top of the liquid permeability ranges from about 0.5 to 30 microns in average pore size. 50. The gas / liquid interface structure of claim 49, wherein the first flow passage member and the second flow passage member are cylindrical and coaxial with each other. 52. The cylindrical wall member of claim 49, wherein the outer wall member surrounding and enclosing the second flow passage member has a cylindrical sidewall disposed in a radially spaced relationship with respect to the second flow passage member, and the first flow passage member extending. And a bottom wall between which the second flow passage member and the side wall of the outer wall member pass through. 50. The liquid flow inlet port of claim 49, wherein the liquid flow inlet port disposed in the outer wall member to inject liquid into an enclosed inner annular space between the second flow passage member and the outer wall member directs the injected liquid to the second flow passage member. A gas / liquid interface structure, configured and arranged to tangentially feed liquid into the enclosed inner annular space for circumferential distribution around a liquid permeable portion of the top of the substrate. 50. The gas / liquid interface structure of claim 49, wherein the weir liquid rate is constructed and arranged to be independent of minimum wetting rate. As a system for treating outflow gas in semiconductor manufacturing, A semiconductor manufacturing unit for generating outflow airflow; An oxidation unit for oxidizing the outflow air stream; Gas / liquid interface structure that delivers airflow from the oxidation unit to downstream processing units And a gas / liquid interface structure A first inlet flow passage member extending in a vertical direction having an upper introduction portion for injecting the airflow and a lower end portion for discharging the airflow; Surrounds the first inlet flow passage member at regular intervals to form an annular space therebetween, the lower end of which extends downwards below the bottom of the first inlet flow passage member, the upper liquid permeable portion And a second flow passage member having a lower liquid impermeable portion below the liquid permeable portion; An outer wall member surrounding and enclosing the second flow passage member to form an inner annular space surrounded with the passage member; A liquid flow inlet port disposed in said outer wall member for injecting liquid into said enclosed inner annular space between said second flow passage member and said outer wall member; And Downstream treatment unit for receiving an outlet airflow from the gas / liquid interface structure Emission gas treatment system comprising a. A conveying apparatus for transferring a processing air stream from an upstream supply source to a downstream processing unit, A manifold having a first inlet line and a second inlet line for receiving gas from said upstream source and optionally used to cause gas to flow into a downstream process, each first end of said inlet line being Connected to a manifold conduit, each second end of the inlet line is in communication with a downstream processing unit and is selectively open to allow each of the first and second inlet lines to flow or block airflow through the line Or a manifold adapted to contain therein a valve that can be closed; A pressurized water source coupled with the manifold by a water flow line flowing to first and second inlet lines, and Cycle timer control means configured and arranged to control the operation of the manifold and valve so that they are in an operating state, The manifold is arranged to receive gas from an upstream source such that gas flows through the manifold and either the first inlet line or the second inlet line, so that one of the inlet lines allows the gas from the upstream source to flow downstream. active flow into the lower process, while the other inlet line shuts off each valve in it, preventing gas from flowing through it, Each of the water flow lines includes a valve that can be selectively opened or shut off to generate or block a flow of compressed water therethrough, respectively, The valve disposed in one of the first and second inlet lines is open, while the gas disposed in the other of the first and second inlet lines is closed, and the gas flows from the upstream process to the manifold. Flows, the gas entering the manifold flows through a specific inlet line with a valve open, the gas flows through a specific inlet line consisting of a flow connection line including an open valve and transported to a downstream process, Meanwhile, the other line of the manifold consists of a flow shutoff line with the valve closed to prevent gas from passing there, The flow shutoff line, where gas cannot flow through it, is cleaned to regenerate the gas for the next process, the valve at each inlet line is opened one at a time and the other valve is connected to the subsequent flow. To ensure that the line is renewed for action and to remove the flow blockage of the line, The flow shutoff line is cleaned of the compressed water from the compressed water source by entering the flow shutoff line by opening the valve of the water flow line in communication with the compressor source in the flow shutoff state, while in the other flow line, the water flow line valve is Shut off to prevent compressed water from flowing from the compressed water source to the flow connection line, and after compressed water flows through the flow connection line to clean the flow connection line, the valve of the inlet line at each inlet line is opposed to the open / closed To a state, With the air flow alternately directed to each inlet line, during the flow shutoff period of a particular inlet line, the flow shutoff line is filled with compressed water to update the inlet line so that gas flows continuously through the line. Transfer device. 60. The transport apparatus of claim 59, further comprising drying means for drying the flow interruption line following water washing. 61. The method according to claim 60, wherein said drying means selectively flows or provides a dry gas source, a dry gas line interconnecting each inlet line to said dry gas source, and a dry gas installed in and passing through the dry gas line. A valve for preventing flow, said valve being controllably coupled with a cycle timer control means. 60. The transport apparatus of claim 59, further comprising heating means for heating the flow interruption line to enhance drying. 63. The transport apparatus of claim 62, wherein the heating means comprises a heat resistant element. 60. The transport apparatus of claim 59, wherein each valve is a pneumatic valve. 60. The transport apparatus of claim 59, wherein water flows through the flow blocking inlet line and then discharges water from the pressure water source to the downstream treatment unit. 60. The transfer apparatus of claim 59, wherein the upstream source is a semiconductor manufacturing tool. 60. The transport apparatus of claim 59, wherein the downstream treatment unit is a water purification treatment unit. 60. The transport apparatus of claim 59, wherein the cycle timer control means comprises one or more limit switches for determining the position of the valve. 60. A transport apparatus according to claim 59, wherein said cycle timer control means operates to prevent the first and second inlet lines from closing at the same time. 60. A transport apparatus according to claim 59, wherein said cycle timer control means is operable to prevent pressure water from flowing into the flow connection line through which the treatment airflow is flowed. A method of flowing gas from an upstream source through a manifold comprising two inlet lines through which gas can flow, to a downstream processing unit; (a) flowing the gas through an inlet line, which becomes a flow connection inlet line, while the other inlet line is isolated to flow the gas from an upstream source to a downstream processing unit; (b) ejecting granular solids and pressure water from the inner surface of the isolated inlet line in a separate inlet line to remove solids, such as water soluble solids, and the like; (c) stopping the flow of pressure water through the isolated inlet line, (d) optionally, flowing compressed dry gas through the isolated inlet line to dry the inner surface of the isolated inlet line, (e) regulating the flow of compressed dry gas through the isolated inlet line, (f) isolating said isolated inlet line to constitute a flow connection inlet line; (g) intercepting the flow of gas through the flow connection inlet line and isolating the flow connection inlet line to form an isolated flow blockage inlet line; (h) reflowing the gas to a downstream processing unit through a flow connection inlet line that is isolated from an upstream source, Periodically, alternately and repeatedly performing steps (a) to (h), during gas flow from the upstream source to the downstream processing unit, one of the inlet lines contains gas from the upstream source flowed through it, The other line is in a flow interruption state and is characterized in that the high pressure water jet and drying are optionally carried out. 72. The method of claim 71, further comprising flowing the pressurized dry gas through the flow shutoff line following the high pressure water jet. 72. The method of claim 71, wherein the flow blocking line is heated. 72. The apparatus of claim 71, wherein the upstream source is a semiconductor manufacturing tool. 72. The method of claim 71, wherein the gas comprises a semiconductor fabrication effluent gas. 72. The method of claim 71, wherein the downstream treatment comprises water purification of the gas. 72. The method of claim 71, wherein the manifold further comprises controlling steps (a) through (h) to maintain the flow of gas from the upstream source to the downstream processing unit. 72. The method of claim 71, further comprising controlling steps (a) to (h) to prevent ejection of the flow connection line by pressure water, simultaneously blocking the flow of gas from the upstream source to the downstream processing unit and Controlling the steps (a) to (h) to prevent isolation of the inlet line.