KR20000061442A - Computer cooling system mixing water cooling and air cooling - Google Patents

Computer cooling system mixing water cooling and air cooling Download PDF

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Publication number
KR20000061442A
KR20000061442A KR1019990010483A KR19990010483A KR20000061442A KR 20000061442 A KR20000061442 A KR 20000061442A KR 1019990010483 A KR1019990010483 A KR 1019990010483A KR 19990010483 A KR19990010483 A KR 19990010483A KR 20000061442 A KR20000061442 A KR 20000061442A
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KR
South Korea
Prior art keywords
heat sink
cooling
computer
air
pump
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KR1019990010483A
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Korean (ko)
Inventor
최은광
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최은광
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Priority to KR1019990010483A priority Critical patent/KR20000061442A/en
Publication of KR20000061442A publication Critical patent/KR20000061442A/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Abstract

PURPOSE: A system for cooling a computer by using water and the air is provided to keep the inner temperature of a computer housing and to cool effectively a CPU in the computer by improving a form of a heat sink. CONSTITUTION: A pump(2) having a motor(1) is connected to a cooling fan(3). A hexagon type heat sink(6) has a suction hole(4) connected to the pump(2) and an entrance of the heat sink(6). The pump(2) is connected to a warm water pipe(7). The hexagon type heat sink(6) is connected to a cooling water pipe(8). The pump(2) and the hexagon type heat sink(6) are connected to a heat absorption pipe(10) installed in the upper of a central processing unit(9). The cooling system has an air inhalation hole(4-1) and an air exhaust hole(4-2). The hexagon type heat sink(6) has an upper plate(6-1) and a bottom plate(6-2) of the heat exhaust plate. A connector(6-3) connects the upper plate(6-1) to the bottom plate(6-2). A vent(12) is located in the hexagon type heat sink(6).

Description

수냉 공냉 혼합형 컴퓨터 냉각 시스템{Computer cooling system mixing water cooling and air cooling}Computer cooling system mixing water cooling and air cooling

본 발명은 컴퓨터 하우징내의 온도를 일정하게 유지되도록 함과 동시에 컴퓨터내의 중앙처리장치의 효율적인 냉각을 수행하기 위한 수냉공냉 혼합형 컴퓨터 냉각 시스템에 관한 것이다.The present invention relates to a water-cooled air-cooled mixed computer cooling system for maintaining a constant temperature in a computer housing while at the same time performing efficient cooling of a central processing unit in a computer.

현재 일반적인 컴퓨터 하우징내의 중앙처리장치의 냉각방법은 공냉식이 주로 사용되고 있다. 공냉식의 가장 큰 문제점은 자체 냉각팬으로 인한 소음과 먼지의 발생, 그리고 컴퓨터 본체 전체의 열의 순환 등에 근원적인 장애를 가지고 있다. 먼지의 발생과 증착은 컴퓨터 회로 기판 및 소자에 장애를 발생시키는 중요 요인중의 하나이다. 또, 중앙처리장치 냉각을 위해서 냉각팬이 작동하는 경우 특히 근접거리에 있는 다른 회로 소자나 기판에 폐열이 공급되어 타 부품에 열을 공급하는 문제가 발생된다. 즉, 일부부품의 냉각을 위해서 타 부품에 장애를 공급하는 모순적인 시스템에서 벗어날 수 없다.Currently, the cooling method of the central processing unit in a general computer housing is mainly used for air cooling. The biggest problem of air-cooling is that it has a fundamental obstacle such as noise and dust generated by its own cooling fan, and heat circulation of the whole computer body. Dust generation and deposition are one of the major causes of failure of computer circuit boards and devices. In addition, when the cooling fan is operated to cool the central processing unit, waste heat is supplied to other circuit elements or a board, which is particularly close to each other, thereby causing a problem of supplying heat to other components. In other words, it cannot escape the contradictory system of supplying faults to other parts for cooling some parts.

본 발명은 위에서 열거한 중앙처리장치 및 컴퓨터 본체의 효율적인 냉각을 위해 수냉식과 공냉식을 혼합한 것이다.The present invention is a mixture of water-cooled and air-cooled for efficient cooling of the above-mentioned central processing unit and computer body.

본 발명은 특히 방열판의 형태나 구조 등을 개선하여 더욱 효율적인 효과를 얻을 수 있도록 함을 기술적 과제로 삼는다.In particular, the present invention makes it possible to obtain a more efficient effect by improving the shape or structure of a heat sink.

도 1은 본 발명을 설면하기 위한 구성도1 is a configuration diagram for releasing the present invention

도 2는 본 발명의 설치상태도2 is an installation state diagram of the present invention

도 3은 도 2의 A-A선 단면도3 is a cross-sectional view taken along the line A-A of FIG.

도 4는 도 2의 B-B선 단면도4 is a cross-sectional view taken along the line B-B of FIG.

도 5는 본 발명의 일부 발췌 측면도5 is a side view of some excerpts of the present invention

도 6은 도 5의 평면도6 is a plan view of FIG.

＜ 도면의 주요부분에 대한 부호의 설명 ＞<Explanation of symbols for the main parts of the drawings>

1: 모타 2: 펌프 3: 냉각팬1: motor 2: pump 3: cooling fan

4: 방열판 흡수구 4-1: 공기흡입구 4-2: 공기출구4: Heat Sink Absorber 4-1: Air Inlet 4-2: Air Outlet

5: 방열판 입구 6: 육각 방열판 6-1: 방열판 상판5: heat sink inlet 6: hexagon heat sink 6-1: heat sink top plate

6-2: 방열판 하판 6-3: 방열판 상하판 연결구6-2: Heat Sink Lower Plate 6-3: Heat Sink Upper and Lower Connector

6-4: 방열판 하판 외측면 7: 온수파이프6-4: Outer side of heat sink 7: Hot water pipe

8: 냉각수 파이프 9: 중앙처리장치(CPU) 10: 열흡수 파이프8: Cooling water pipe 9: Central processing unit (CPU) 10: Heat absorption pipe

10-1: 열흡수 하우징 11:방열판 출구 12: 통풍구10-1: heat absorption housing 11: heat sink outlet 12: vent

본 발명은 중앙처리장치의 효율적인 냉각과 먼지의 발생을 근원적으로 제거하고 컴퓨터 본체의 전체적인 항온성을 유지하여 각 부품의 효율적인 기능과 수명 연장을 도모하는 것이다.The present invention fundamentally eliminates the efficient cooling of the central processing unit and the generation of dust, and maintains the overall constant temperature of the computer main body to promote efficient function and long life of each component.

즉, 본 발명은 공냉식에서 쉽게 발생하는 먼지제거를 효율적으로 차단하는 수냉식을 제공하고, 컴퓨터 본체의 대류현상에 의한 전체적인 냉각을 제공하는 것이다.That is, the present invention is to provide a water cooling to effectively block the dust removal easily generated in the air cooling, and to provide the overall cooling by the convection of the computer main body.

또한, 본 발명은 물을 강제 순환시킴과 동시에 동일축에 냉각팬을 설치하여 방열판을 효과적으로 냉각시키게 하고, 컴퓨터 본체의 대류현상을 이용하여 전체적인 냉각을 유도하는 방열판 하판의 위치 및 기울기를 가지며, 강제순환공기의 흡입구 및 배출구를 모두 컴퓨터 본체 외부로 향하게 하여 본체내의 먼지나 분진의 흡수를 차단하게 하는 것이다.In addition, the present invention forcibly circulating water and at the same time to install a cooling fan on the same axis to effectively cool the heat sink, and has the position and inclination of the bottom of the heat sink to induce the overall cooling by using the convection of the computer main body, Both the inlet and outlet of the circulating air are directed out of the computer body to block the absorption of dust and dust in the body.

본 발명은 컴퓨터 본체(C)내의 일측에 설치하는 냉각 시스템으로서, 모터(1)와 결합되어 구동되는 펌프(2)에 냉각팬(3)을 설치하고, 방열판 흡수구(4)로 펌프 (2)와 방열판 입구(5)를 가지는 육각방열판(6)을 연결구성하며, 상기 펌프(2)에는 온수파이프(7)를, 육각방열판(6)에는 냉각수 파이프(8)를 각각 연결하되, 중앙처리장치(9)상단부에 설치하는 열흡수 파이프(10)와 연결시켜 구성하는 것이다.The present invention is a cooling system installed on one side of the computer main body (C), the cooling fan (3) is installed in the pump (2) which is driven in conjunction with the motor (1), the heat sink plate (4) pump (2) And a hexagonal heat sink (6) having a heat sink inlet (5), wherein a hot water pipe (7) is connected to the pump (2), and a coolant pipe (8) is connected to the hexagonal heat sink (6). (9) It connects with the heat absorption pipe 10 installed in an upper part, and is comprised.

상기 냉각시스템은 공기흡입구(4-1)와 공기출구(4-2)를 가지며, 육각방열판 (6)은 벌집모양의 육각형으로 형성된 방열판 상판(6-1)과 방열판 하판(6-2)을 방열판 상하판 연결구(6-3)로 연결하고, 그 내부에는 통풍구(12)가 형성되게 구성한다. 도면 중 6-4는 방열판 하판 외측판, 11은 방열판 출구이고, 10-1은 열흡수 하우징이다.The cooling system has an air inlet 4-1 and an air outlet 4-2, and the hexagonal heat sink 6 includes a heat sink upper plate 6-1 and a heat sink lower plate 6-2 formed in a hexagonal honeycomb shape. It is connected to the heat sink upper and lower plate connecting port (6-3), it is configured to have a vent hole 12 formed therein. 6-4 is a heat sink lower plate outer plate, 11 is a heat sink exit, and 10-1 is a heat absorption housing.

이와 같은 구성의 본 발명은 중앙처리장치(9)의 상단부에 설치되어 있는 밀집된 냉각수 통로 즉, 열흡수 파이프 (10)에서 열을 흡수하여 데워진 물은 온수 파이프(7)를 따라 모터(1)로 작동되는 펌프(2)에 이동한다. 펌프(2)에 의해 강제로 올려진 물은 방열판 흡수구(4)의 통로를 따라 방열판 상판(6-1)으로 이송되면서 1차 냉각된다. 이때 펌프(2)와 같은 축으로 연결된 냉각팬(3)이 작동하여 공기흡입구(4-1)에서 들어온 공기를 방열 상하판(6-1,6-2)사이의 통풍구(12)로 이동시켜 물에서 방열판(6)으로 전달된 열을 제거하여 외부로 연결된 방열판출구(11)를 따라 배출한다.According to the present invention having the configuration described above, the dense cooling water passage installed at the upper end of the central processing unit 9, that is, the water warmed up by absorbing heat from the heat absorption pipe 10 is transferred to the motor 1 along the hot water pipe 7. Move on to the operated pump (2). Water forcibly raised by the pump 2 is first cooled while being transferred to the heat sink upper plate 6-1 along the path of the heat sink absorbing port 4. At this time, the cooling fan (3) connected to the same shaft as the pump (2) is operated to move the air from the air inlet (4-1) to the vent (12) between the heat dissipation upper and lower plates (6-1, 6-2) The heat transmitted to the heat sink 6 is removed from the water and discharged along the heat sink outlet 11 connected to the outside.

한편, 육각방열판(6)의 상판부(6-1)를 거쳐온 물은 하판부(6-2)를 향하는 아래쪽 통로 방열판 상하판 연결부(6-3)로 이송되면서 방열판 하판부(6-2)에 의해 재차 냉각된다. 방열판 하판부에서 충분히 냉각된 물은 냉각수 파이프(8)를 통하여 중앙처리장치(9)의 상단에 설치된 열흡수하우징(10-1)에 도달한다. 본 하우징내부에는 열을 흡수하는 파이프(10)가 밀집되어 내장되어 있다.Meanwhile, the water passing through the upper plate portion 6-1 of the hexagonal heat sink 6 is transferred to the lower passage heat sink upper and lower plate connecting portions 6-3 facing the lower plate portion 6-2, and the lower plate portion 6-2 of the heat sink. It is cooled again by. Water sufficiently cooled in the heat sink lower plate part reaches the heat absorption housing 10-1 installed at the upper end of the central processing unit 9 through the cooling water pipe 8. Inside the housing, a pipe 10 for absorbing heat is densely embedded.

중앙처리장치(9)에서 발생된 열을 흡수한후 물은 다시 모터로 구동되는 펌프(2)에 의해 온수구파이프(7)를 따라 방열판으로 이동되어 냉각되는 순환 운동을 반복한다.After absorbing the heat generated by the central processing unit (9), the water is moved back to the heat sink along the hot water pipe (7) by the pump (2) driven by the motor to repeat the circulation movement.

그리고 본 방열판이 설치된 냉각시스템본체는 컴퓨터본체의 상단에 설치하여 본체내부의 대류현상이 자연스럽게 이루어지도록 하여 본체 전체적인 열 분위기를 제어한다. 즉, 방열판 하판부(6-2)에 부착된 방열판 하판 외측면(6-4)은 방열판 하판부에 의해 자연스럽게 냉각되게 되어 컴퓨터 본체 내부의 열로 대류현상을 일으키는 공기를 자동적으로 냉각시킨다. 이때 발생할 수 있는 습기 등은 공기 출구 (4-2)로 빠져나가는 방출열에 의해 자연스럽게 기화하여 컴퓨터 본체외부로 배출된다.In addition, the cooling system main body in which the heat sink is installed is installed on the top of the computer main body so that the convection phenomenon in the main body is naturally performed, thereby controlling the overall thermal atmosphere. That is, the heat sink lower plate outer surface 6-4 attached to the heat sink lower plate portion 6-2 is naturally cooled by the heat sink lower plate portion to automatically cool air causing convection by heat inside the computer body. Moisture, etc., which may be generated at this time is naturally vaporized by the heat of discharge exiting the air outlet (4-2) and discharged outside the computer body.

본 발명은 컴퓨터 냉각방법에 있어서 종래의 중앙처리장치의 냉각에만 한정된 냉각방법을 넘어 중앙처리장치 및 본체 전체적인 냉각에 주안점을 두어 컴퓨터의 통합적인 기능향상을 꾀하고 공냉식등에서 발생하는 먼지의 증착원인을 근본적으로 제거하였다. 또, 중앙처리장치에서 나오는 폐열이 타 부품이나 소자에 영향을 주지 않도록 하였다.The present invention focuses on the central processing unit and the overall body cooling in the computer cooling method beyond the cooling method limited to the conventional cooling of the central processing unit to achieve the integrated functional improvement of the computer and the cause of the deposition of dust generated in the air cooling type, etc. Essentially eliminated. In addition, the waste heat from the central processing unit does not affect other components or elements.

또, 모터(1)작동의 효율적인 사용을 위해 방열판(6)에 냉각팬(3)을 설치하여 방열판의 냉각효과를 더욱 높였으며 소음의 발생을 억제하기 위해 방열판내부에 냉각팬을 설치하고 방열판의 날개도 내부에만 설치하여 공기의 강제순환에 효율성을 높였다. 그리고 방열판의 형태나 방열판 날개를 벌집모양의 육각형으로 구성하여 방열판의 표면적을 최대한 증가시켰다.In addition, the cooling fan (3) is installed on the heat sink (6) for efficient use of the operation of the motor (1) to further increase the cooling effect of the heat sink, and in order to suppress the generation of noise, a cooling fan is installed inside the heat sink and the The wings are also installed inside to increase the efficiency of forced air circulation. And the surface area of the heat sink was maximized by configuring the shape of the heat sink or the heat sink wings into a honeycomb-shaped hexagon.

전체적인 구성상 중앙처리장치의 냉각은 물을 강제 순환시키는 수냉식이고 방열판은 냉각팬에 의해 강제 이송되는 공기가 열을 빼앗아 가므로 공냉식에 해당한다. 그리고 방열판을 냉각시키기 위한 공기순환의 입구와 출구를 모두 본체외부로 향하게 하여 먼지나 분진이 근원적으로 흡수 될 수 없도록 하였다. 단, 방열판은 컴퓨터 본체의 전체적인 냉각을 위해 본체하우징의 상층부위에 설치하여야 하며 방열판하단부의 습기를 제거하기 위해 방열판하단부에 약간의 기울기를 주어 습기가 외부로 자연스럽게 배출될 수 있도록 한다.In the overall configuration, the central processing unit cooling is water-cooled to circulate water and the heat sink is air-cooled because air forced by the cooling fan takes heat away. And both the inlet and outlet of the air circulation to cool the heat sink toward the outside of the main body so that dust or dust can not be absorbed fundamentally. However, the heat sink should be installed on the upper part of the main body housing for the overall cooling of the computer main body, and give a slight inclination to the lower part of the heat sink to remove moisture from the lower part of the heat sink so that moisture can be naturally discharged to the outside.

본 발명은 중앙처리장치의 냉각에 있어서 기존의 냉각시스템으로는 해결 할 수 없는 패열을 외부로 배출하기 때문에 중앙처리장치의 냉각 뿐만 아니라 이외의 소자의 기능향상에도 도움이 되어 전체적인 컴퓨터 성능향상에 기여할 수 있다. 뿐만 아니라 본 발명으로 인하여 새로운 냉각 시스템 개발과 본 발명의 새로운 변형으로 발명으로 이어져 새로운 컴퓨터 냉각시스템의 발전에 기여할 수 있다.In the present invention, since the cooling of the central processing unit discharges the heat that cannot be solved by the existing cooling system to the outside, it is helpful not only for the cooling of the central processing unit but also for improving the functions of other elements, thereby contributing to the improvement of the overall computer performance. Can be. In addition, the present invention may contribute to the development of new computer cooling systems, leading to the development of new cooling systems and new modifications of the present invention.

Claims (2)

모터(1)와 결합되어 구동되는 펌프(2)에 냉각팬(3)을 설치하고, 방열판 흡수구(4)로 펌프(2)와 방열판 입구(5)를 가지는 육각방열판(6)을 연결구성하며, 상기 펌프(2)에는 온수파이프(7)를, 육각방열판(6)에는 냉각수 파이프(8)를 각각 연결하되, 중앙처리장치(9)상단부에 설치하는 열흡수 파이프(10)와 연결시켜 구성함을 특징으로 하는 수냉공냉 혼합형 컴퓨터 냉각 시스템.Cooling fan (3) is installed in the pump (2) driven in conjunction with the motor (1), connecting the hexagonal heat sink (6) having the pump (2) and the heat sink inlet (5) by the heat sink absorbing opening (4) The hot water pipe 7 is connected to the pump 2 and the cooling water pipe 8 is connected to the hexagonal heat sink 6, and the hot water pipe 7 is connected to the heat absorption pipe 10 installed at the upper end of the central processing unit 9, respectively. A water-cooled air-cooled mixed computer cooling system. 제 1항에 있어서, 육각방열판(6)은 벌집모양의 육각형으로 형성된 방열판 상판(6-1)과 방열판 하판(6-2)을 방열판 상하판 연결구(6-3)로 연결하고, 그 내부에는 통풍구(12)가 형성되게 구성함을 특징으로 하는 수냉공냉 혼합형 컴퓨터 냉각 시스템.The heat sink 6 is connected to the heat sink upper plate 6-1 and the heat sink lower plate 6-2 by the heat sink upper and lower plate connecting holes 6-3. A water cooling air-cooled mixed computer cooling system, characterized in that it is configured to form a vent (12).
KR1019990010483A 1999-03-26 1999-03-26 Computer cooling system mixing water cooling and air cooling KR20000061442A (en)

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KR20010067887A (en) * 2001-04-04 2001-07-13 이원재 Liquid cpu cooler
KR100465088B1 (en) * 2002-02-08 2005-01-06 쿨랜스코리아 주식회사 The water cooling system for electronic device
CN112178407A (en) * 2020-09-14 2021-01-05 吉林大学 Foldable heat dissipation frame adjusted according to desktop smoothness
WO2021092963A1 (en) * 2019-11-16 2021-05-20 柏兆(吉安)电子有限责任公司 Heat dissipation structure of computer

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KR900700955A (en) * 1988-04-08 1990-08-17 미다 가쓰시게 Computer using semiconductor module and its cooling system
KR910015905A (en) * 1990-02-28 1991-09-30 미다 가쓰시게 LSI Chiller and Computer Chiller
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Publication number Priority date Publication date Assignee Title
KR20010067887A (en) * 2001-04-04 2001-07-13 이원재 Liquid cpu cooler
KR100465088B1 (en) * 2002-02-08 2005-01-06 쿨랜스코리아 주식회사 The water cooling system for electronic device
WO2021092963A1 (en) * 2019-11-16 2021-05-20 柏兆(吉安)电子有限责任公司 Heat dissipation structure of computer
CN112178407A (en) * 2020-09-14 2021-01-05 吉林大学 Foldable heat dissipation frame adjusted according to desktop smoothness
CN112178407B (en) * 2020-09-14 2021-09-24 吉林大学 Foldable heat dissipation frame adjusted according to desktop smoothness

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