KR20000056857A - Method of forming electrode on a back plate for plasma display panel - Google Patents

Abstract

PURPOSE: A method of forming an address electrode of a rear glass substrate for a plasma display panel is provided to use an aluminum as a main material, thereby reducing a manufacturing cost. CONSTITUTION: A method of forming an address electrode of a rear glass substrate(1) for a plasma display panel comprises steps of depositing an aluminum on an entire surface of a rear glass substrate, and selectively removing the aluminum deposited on the glass substrate to form an address electrode(2,3). In the method, the aluminum is deposited by a vacuum heating depositing technology and then changed into a non-conductor by an anodizing process. Therefore, a separate dielectric layer for insulating an electrode is not needed. The removing operation of the aluminum is performed by an etching process. The aluminum deposited on the glass substrate has a thickness of about 1 micro meter.

Description

Method for forming address electrode of back glass substrate for plasma display panel {METHOD OF FORMING ELECTRODE ON A BACK PLATE FOR PLASMA DISPLAY PANEL}

The present invention relates to a method of forming an address electrode on a back glass substrate for a plasma display panel.

In recent years, the development of high resolution products has rapidly progressed in the plasma display device, and the demand for high precision pattern forming technology using inorganic materials has been continuously expanded. In the manufacturing of the plasma display panel (hereinafter referred to as a PDP) backside module, the address electrode is becoming more and more fine, and thus, a general pattern formation method reflects this trend, and it is difficult in many aspects.

In general, a method of making an address electrode is to mix a metal powder, such as Ag or Ni, with a binder, a solvent, etc. to prepare a fluid viscous liquid (paste), and to silkscreen print this, or to mix a photosensitive resin in a paste to provide light The method of fixing by selective irradiation is mainly used. However, the silk screen printing method has a disadvantage of inferior precision and reproducibility, and the photosensitive paste method has a problem of high cost due to high consumption of materials. In addition, the address electrode thus made does not have high reflectivity, and thus a method of increasing reflectance by applying a white dielectric layer protecting the electrode is used.

The white dielectric layer is also generally manufactured by applying a paste made of white pigment such as titanium oxide, frit, binder, solvent, and then baking the same. As described above, the method of coating the white dielectric layer after firing the address electrode and firing again causes a complicated manufacturing process and slows down the production speed. In other words, the current electrode generation method is expensive, and the productivity is low, causing the PDP price competitiveness.

The present invention is to solve the above problems, by using aluminum as the address electrode material when forming the address electrode on the back glass substrate for PDP to reduce the production cost and oxidize the surface of the address electrode to form alumina layer white It is an object of the present invention to provide a method of forming an address electrode of a back glass substrate for a PDP, which can obtain high insulation and reflectance without a dielectric layer.

1 is a state diagram in which an aluminum address electrode is formed on a rear glass substrate for a plasma display, and an oxidized alumina layer is formed on a surface of the address electrode.

<Explanation of symbols for main parts of drawing>

1: back glass substrate for plasma display

2: aluminum address electrode

3: oxidized alumina layer on the address electrode surface

In the method of forming an address electrode on a back glass substrate for a PDP, an address electrode is formed by using aluminum on the glass substrate, and the surface of the address electrode is oxidized to form an alumina layer.

The present invention will be described in detail as follows.

In the present invention, aluminum is used as the address electrode material of the rear glass substrate for the plasma display panel, which is relatively easy to process and inexpensive. Aluminum has high electrical conductivity, relatively low melting point, and high reflectance, which is very suitable as an electrode material of PDP. In addition, the vacuum heating deposition method, which is widely used for producing mirrors by uniformly coating aluminum on a large area of glass, can reduce equipment costs by using coating equipment already commercialized. In addition, since aluminum can be easily converted to an insulator by oxidizing to alumina through anodizing, a process of forming a separate dielectric layer to insulate an electrode can be omitted.

In order to generate the address electrode and the dielectric layer by using the characteristic properties of the above-described aluminum, aluminum must first be deposited on the entire surface of the back glass substrate for the PDP to generate the electrode. At this time, vacuum heating deposition may be used, which is a widely used method for producing mirrors, and is very efficient for depositing aluminum on a large area of glass. The thickness of the electrode is appropriately around 1㎛ to obtain a proper adhesion and conductivity. The thinner the thickness, the better the adhesion, but the lower the electrical conductivity and reflectivity, and the higher the thickness, the lower the adhesion, which is easily damaged and the production speed decreases.

Next, aluminum is uniformly removed from the glass substrate to form an address electrode. In general, the address electrode of the AC-type PDP substrate is made in a parallel straight line. For the generation thereof, a pattern to be produced is printed on a thick aluminum film using a screen printing or photosensitive resist method and then etched with a removal liquid. The portion to which the resist is applied is protected from the etching solution to leave its shape, and the portion to which the resist is not applied is removed by the etching solution to leave a desired pattern. Removing the resist after etching completes the electrode. When forming the address electrode using aluminum, it is preferable to widen the electrode width to about 80% of the pixel spacing, unlike the general Ag paste printing method. In the case of Ag electrode, it is inappropriate to apply a wider than necessary because the material cost is high and the reflectance is lowered. However, since the aluminum electrode includes a reflecting function, it is more preferable to use a wider part as a reflector except for the partition wall generating part.

The surface of the resulting address electrode has a protective function by producing a transparent alumina insulating layer through anodization. In the case of anodization, it is necessary to adjust the concentration and time of the oxidizing solution so that only a certain depth of the surface is oxidized. In general, by adjusting the concentration and time using a commercially available oxidizing solution, the thickness in the range of 0 to 10,000 kPa can be oxidized within 1 minute.

The resulting electrode can be represented graphically as shown in Figure 1. That is, after forming a pattern of the aluminum address electrode (2, 3) on the back glass substrate (1), and then anodized it, the surface portion of the electrode is oxidized to form an alumina dielectric layer (3). The non-oxidized portion 2 is used as an electrode.

Example

A high-distortion glass substrate for PDP having a size of 50 × 50 cm 2 and a thickness of 2.1 mm was placed in a vacuum chamber and vacuumized using a rotary pump and a diffusion pump to a pressure of 10 ⁻⁷ torr. Afterwards, a 1.5 mm diameter 10 mm aluminum rod on the platinum pot was heated for at least 550 ° C for 5 minutes, and a glass substrate located about 70 cm away from this was kept at room temperature through a water-circulating jacket on the back to obtain an average of 7000 mm aluminum film. Got it. Here, a negative photosensitive resist was applied by spin coating, and the 150OW mercury lamp was irradiated for 3 minutes through an optical mask having an equally spaced linear groove having an interval of 200 µm and a width of 150 µm. This was washed with dilute NaOH solution and then the unpatterned portions were removed with aluminum etchant to form electrodes. Next, an insulating film was formed using a mixed solution of ammonium stannate aqueous solution and ethylene glycol. At this time, the oxidation voltage was 140V, the oxidation current was set at 30Ok / pH and the time was set to 23 minutes to obtain an oxide film of 2000kW. After that, the barrier rib was formed and the phosphor was coated and fired at 500 ° C. for 60 minutes in air.

As described above, the method of forming the address electrode of the back glass substrate for PDP according to the present invention can reduce the production cost by forming the address electrode using aluminum which is a relatively inexpensive material on the glass substrate, and also oxidizes the surface of the address electrode. By forming the alumina layer, a process of forming a separate white dielectric layer by realizing high insulation and reflectance can be omitted, and the process and equipment can be drastically reduced.

Claims (2)

A method of forming an address electrode on a back glass substrate for a plasma display panel, wherein the address electrode is made of aluminum. The method of claim 1, wherein the surface of the aluminum address electrode is oxidized alumina.