KR20000007779A - Method for forming electrode of plasma display device - Google Patents

Abstract

PURPOSE: A method of forming a plasma display panel electrode is provided to enhance adherence of electrodes by forming an address electrode with an electroless plating using a metal oxide layer. CONSTITUTION: The plasma display panel comprises a first substrate and a second substrate which are parallel each other. A pair of retaining electrodes are formed in the first substrate, and address electrode are formed to a cross direction with the retaining electrodes in the second substrate. A fabricating method of the second substrate comprises the steps of forming a glass member(110) of good etching characteristic on the glass substrate(102); exposing, developing, and etching a photoresist(111) with a constant pattern to form a groove(107) after deposition of the photoresist(111) on the glass member(110); and forming an address electrode(112) on an overall surface of a metal oxide layer(113) with the electroless plating using a metal oxide layer.

Description

Electrode Formation Method of Plasma Display Device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to an electrode forming method for forming an address electrode having excellent adhesion on a rear substrate in a plasma display panel (PDP) having a MOG structure.

FIG. 1 illustrates a MOG structure of a general plasma display panel through a cross-sectional view, and the upper structure is rotated 90 degrees for better understanding.

Looking at the PDP structure with reference to the drawings, it consists of a front substrate (1) which is a display surface of the image, and a rear substrate (2) disposed in parallel with a certain distance between the front substrate (1), the front substrate ( 1) a plurality of sustain electrode lines 3 formed on the opposite surface of the rear substrate 2 at a predetermined interval, a dielectric layer 4 formed on the plurality of sustain electrode lines 3 to limit discharge current, and the dielectric layer. (4) formed on the protective layer (5) to protect the sustain electrode line (3), the back substrate (2) a plurality of grooves (Groove) for forming a plurality of discharge spaces, and An address electrode 6 formed on the entire surface of the groove 7 and orthogonal to the sustain electrode line 3 and a fluorescent layer 8 formed on the front surface of the address electrode 6 to emit visible light upon discharge.

The image display process of any cell in the PDP according to the prior art configured as described above is as follows.

First, when the preliminary discharge voltage is supplied to the sustain electrode line 3, the preliminary discharge occurs between the sustain electrode lines 3 so that subsequent address discharge occurs stably.

Thereafter, when an address discharge voltage is supplied to the sustain electrode line 3 and the address electrode line 6, an address discharge occurs between the sustain electrode line 3 and the address electrode line 6. In other words, an electric field is generated inside the cell, and the trace electrons in the discharge gas are accelerated, the accelerated electrons and the neutral particles in the gas collide with each other, and are ionized into electrons and ions, and another collision between the ionized electrons and the neutral particles Neutral particles are gradually ionized into electrons and ions at high speed, and the discharge gas is turned into a plasma state and vacuum ultraviolet rays are generated. When the generated ultraviolet rays excite the fluorescent layer 8 to generate visible light, and the emitted visible light is emitted to the outside through the front substrate 1, the emitted ultraviolet light of an arbitrary cell may be recognized from the outside. do.

Thereafter, when the sustain discharge voltage of 150 V or more is supplied to the sustain electrode line 3, sustain discharge occurs between the pair of sustain electrode lines 3 to maintain light emission of each cell for a predetermined period of time.

The conventional PDP operated as described above is manufactured by constructing a front substrate and a rear substrate, and then combining them using frit glass (not shown).

In particular, the typical method used to form the discharge space on the back substrate (2) is a method of forming a discharge space by forming a vertical partition wall by forming a dielectric layer and then printing a multilayer pattern in a predetermined pattern using a screen mask. In the present specification, the MOG structure will be described as described above.

The MOG structure has the advantage of being capable of high definition by forming the fluorescent layer by electrophoresis method, and after forming a glass material having good etching property on the substrate glass by a method of forming a discharge space by the MOG structure, the photo is directly It forms by the exposure → image development → etching process using a mask.

Looking at the formation process of the MOG structure with reference to FIG.

First, the glass material 10 having good etching property is formed on the back substrate 2 about 150 to 180 μm, and then (a) → photoresist 11 is applied. (B) → Next, the photomask 12 is applied. After exposure to light (c)-> developing in the developing process to form a pattern (d)-> again in etching liquid to form the groove shape (7) (e)-the etching process is etched in etching liquid for 100-300 second. After carrying out the washing, washing is carried out and then placed in a firing furnace, which is fired for 20 to 60 minutes between 200 to 500 ° C.

Subsequently, a large area of the electrode film 12 is formed by forming gold (Au) or silver (Ag) using a sputter or electron beam deposition (E-BAEM) method in a vacuum chamber on the substrate where the photoresist 11 is left. (F) → Then, if the fluorescent layer 8 is formed by electrophoresis, the back substrate structure in which the address electrode 6 and the phosphor 8 are formed on the entire surface of the groove 7 is formed as in step (g). You are done.

However, the conventional address electrode forming process as described above takes excessive working time due to the vacuum exhaust time, and increases the manufacturing cost of the product due to the use of the vacuum equipment.

In addition, since the groove forming material is a glass material, the adhesion between the back substrate and the metal material is reduced due to the deposition of the electrode, and the soda component is diffused / infiltrated into the electrode from the glass material during the firing process, resulting in contamination of the electrode and high resistance. there was.

The present invention is invented to solve the problems of the prior art as described above to improve the adhesion between the address electrode and the groove surface in the MOG structure, to prevent contamination of the electrode generated during the firing process, and to reduce the work time The purpose is to increase the mass production of the product through.

The technical means of the present invention for realizing this is to first apply a metal oxide film on the groove in the electrode forming step, and then form the address electrode on the groove by electroless plating.

1 is a cross-sectional view of a conventional plasma display panel.

2 is a process chart for forming a back substrate according to the prior art.

3 is a process diagram for forming an address electrode according to the present invention;

*** Explanation of symbols for the main parts of the drawing ***

1: Front board 2: Back board

3: sustain electrode 4: dielectric layer

5: protective layer 6: address electrode

7,107 groove 8: fluorescent layer

102: back substrate 110: glass material

111, 111 ': photoresist (P / R) 112: address electrode

113: metal oxide film

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

First, the process of forming the address electrode of the back substrate according to the present invention will be described with reference to FIG. 3.

Step c is formed on the back substrate 102 by forming the glass material 110 having good etching property as in step a, and then applying the P / R 111 and forming the groove 107 through an exposure / development / etching process. The process proceeds as in the prior art.

When the pattern formation is completed, the P / R 111 is removed and then the metal oxide film 113 is formed on the entire surface of the substrate as shown in step d so that the metal oxide film 113 is thin filmed along the groove 107. do. The P / R (111 ') is coated on the entire surface, followed by an exposure / development process to form a P / R (111') pattern as in step f. The electroless plating method using the metal oxide layer 113 on the address electrode 112 is performed. If formed to form the same shape as step g.

When the P / R 111 'is removed after the above process is completed, the back substrate structure is completed by forming the shape as in step h.

That is, by forming a metal layer (Au, Ag, etc.) in the groove 107 by a method of electroless plating using a metal oxide film (ZnO, TiO _2, etc.) during the process according to the present invention, an address electrode having good adhesion with a metal oxide ( 112), the electrode forming process through this process can shorten the process time compared to the conventional vacuum process formed by metal deposition in the vacuum chamber and the adhesion of the metal compared to the conventional electroless plating It can bring about effects such as improvement.

In addition, the metal oxide film 113 prevents contamination of the electrode by preventing the soda component of the glass from diffusing / infiltrating the address electrode and increasing the resistance of the electrode during the firing process of the substrate.

As described above, the technical gist of the present invention is to improve the adhesion of the electrode by forming an address electrode by using an electroless plating method using a metal oxide film, and to prevent not only adhesion but also contamination of the electrode generated during the firing process and mass production of the product. The effect is to increase the sex.

Claims (3)

Among the two substrates coupled in parallel to each other, a sustain electrode is formed in pairs on the first substrate, and an address electrode is formed on the second substrate in a direction crossing the sustain electrode to form a plurality of unit cells. 2 manufacturing process of the substrate, Forming a glass material 110 having good etching property on the glass substrate 102; Forming a groove 107 by coating the photoresist 111 on the glass material 110 and then exposing / developing / etching in a predetermined pattern; Forming a metal oxide film 113 on the entire surface of the formed groove 107; And forming an address electrode (112) on the front surface of the metal oxide film (113) by an electroless plating method using a metal oxide film. The method of claim 1, The metal oxide film 113 is formed on the entire surface after removing the photoresist 111 remaining on the top of the glass material by the pattern formation, And the address electrode (112) is formed after the pattern is formed by applying, exposing and developing the photoresist (111 '). The method of claim 1, The metal oxide film is a method of manufacturing a plasma display panel, characterized in that made of a material such as zinc oxide, titanium oxide.