KR20000056484A - Equipment and method for testing semiconductor device - Google Patents

Abstract

PURPOSE: An apparatus and a method for testing semiconductor products are provided to continuously test the semiconductor products by forming at least one test region on a test stage where the test is performed. CONSTITUTION: In an apparatus for testing semiconductor products, a test unit is set at a predetermined region of the body of the testing apparatus. The test unit includes at least one test pad(231,232) on which the semiconductor products(202,203) are mounted to be tested, a probe pin(234) protruded from the test pad, and a semiconductor product fixing device(233) for fixing the body of the semiconductor product to the test pad. A semiconductor product providing means supplies the semiconductor products to the test unit. A semiconductor product storing means stores semiconductor products which have been tested by the test unit. The testing apparatus also has a transferring means for receiving the semiconductor products from the semiconductor product providing means and transferring the products to the test unit and the semiconductor product storing means.

Description

Equipment and method for testing semiconductor device

The present invention relates to a semiconductor product test facility and a test method, and more particularly, to a semiconductor product test facility and a test method in which at least one test area is formed in a test stage where a test is performed so that the semiconductor product can be continuously tested. It is about.

In recent years, semiconductor products, which are rapidly being developed, are becoming smaller and higher in size due to the development of semiconductor chips and package technologies that efficiently package semiconductor chips with a high degree of integration of semiconductor devices. There is a trend.

Since these semiconductor products have a wide variety of leads serving as terminals according to the mounting type, single inline packages, dual inline packages, and pin grid arrays are used according to the type and number of outer leads. ) It is largely classified into a package.

Until such a semiconductor product is released, a precise package process must be performed, and after one package process is finished or several package processes are finished, or a semiconductor product is finally shipped to determine whether a defect occurs in the package process. Prior to this, the appearance and performance of semiconductor products must be tested.

1 shows an example of a semiconductor product test facility having such a role, the semiconductor product test facility 100 includes a test fixture body 10 having an overall shape similar to a "c" shape. The test rig body 10 which is located in the upper portion of the test rig body 10 and which is relatively lower than the tube loader 20 and the tube loader 20 in which the tube containing the semiconductor product (for example, a single in-line package) is loaded is loaded. 10, an index rail 40 in which the semiconductor product is guided in the direction of gravity such that the semiconductor part unloaded from the test part 30 and the tube loader part 20 which are tested on the semiconductor product reach the test part 30. ), The test product 30 is composed of a material loader unit 50 inclined downward to be transported in the direction of gravity again and received in the tube.

At this time, briefly looking at the test process of the semiconductor product made in the test unit 30, one semiconductor product reaching the test unit 30 through a single index rail 40 is a test probe pin (not shown) of the test unit 30 The test rod is mounted on a test pad (not shown) installed with a si), and the quartz rod applies a predetermined pressure to the outer lead serving as a terminal of the semiconductor product so that the test probe pin and the outer lead of the semiconductor product come into contact with each other. .

However, the conventional semiconductor product test facility performs the test of the semiconductor product while transferring the semiconductor product in the direction of gravity, so that the appearance defect occurs frequently such as the outer lead portion or the molding portion of the semiconductor product, which is relatively susceptible to impact, is broken. have.

Another problem is that the semiconductor product test facility is unloaded from the tube loader 20 by being unloaded from the tube loader 20, seated on the test pad of the test unit 30, and then unloaded into the material loader 50. The overall operation efficiency of the 100) is greatly reduced and at the same time, there is a problem that the entire semiconductor product test time takes a lot.

Another problem is that when the outer lead of the semiconductor product seated on the test pad of the test unit 30 is pressed with a quartz rod to contact the test probe pin, an excessive force is applied to the outer lead of the semiconductor product, thereby bending or bending the outer lead. There is a problem that a poor appearance, such as occurs.

Accordingly, the present invention has been made in view of such a conventional problem, and an object of the present invention is to transport a semiconductor product in a horizontal direction instead of a gravity direction in order to prevent breakage and appearance defects of the semiconductor product.

Another object of the present invention is to allow at least two semiconductor products to be continuously tested in the test area.

Another object of the present invention is to prevent bending or bending of the outer lead of the semiconductor product by fixing the molded part of the semiconductor product when fixing the semiconductor product for testing the semiconductor product.

1 is a conceptual diagram of a conventional semiconductor product test facility.

2 is a conceptual diagram illustrating a plane of a horizontal semiconductor product test facility according to the present invention;

3 is an exploded perspective view showing a part of a test unit according to the present invention;

4 is a perspective view illustrating a semiconductor product fixed by a semiconductor product fixing device in a state in which a semiconductor product is seated on a test pad of a test unit according to the present invention;

5 is an explanatory diagram showing a semiconductor product test method according to the present invention;

The semiconductor product test facility for achieving the object of the present invention is installed in a plate-shaped test fixture body, a predetermined area of the test fixture body, at least one test pad, the test pad is mounted from each of the test pads, each test pad A test unit including a protruding probe pin, a semiconductor product holding device for pressing and fixing the body of the semiconductor product to the test pad, a semiconductor product supply means for supplying the semiconductor product to the test unit, and a semiconductor product tested from the test unit in a predetermined container And a conveying means for receiving the semiconductor product from the semiconductor product supply means and receiving the semiconductor product from the semiconductor product supply means.

The semiconductor product test method according to the present invention comprises the steps of loading a semiconductor product to any one of at least two test pads protruding the test probe pins in contact with the terminal of the semiconductor product to be tested, and a terminal of the semiconductor product Performing a test of the semiconductor product in a state in which portions other than the above are fixed by the semiconductor product fixing device, and the test is performed on the rest of the test pads while the test of the semiconductor product loaded on any one of the test pads is being performed. Loading a semiconductor product to be tested, performing a test of the semiconductor product in a state in which portions other than terminals of the semiconductor product to be tested are fixed by the semiconductor product fixing device, and being loaded on a test pad to perform a test Semiconductor whose test is completed first among semiconductor products Unloading the products to be tested and the test pad blank comprises the step of re-loading the semiconductor products.

Hereinafter, a semiconductor product test facility and a semiconductor product test method according to the present invention will be described with reference to the accompanying drawings.

2, the semiconductor product test facility according to the present invention is shown. The semiconductor product test facility 200 includes a test fixture body 210 having a horizontal table shape and a tube 201 containing semiconductor products. The test unit 230 which will be described later by unloading a semiconductor product from the tube loader unit 220 installed on the upper surface of the test facility body 210 and any of the tubes 201 unloaded from the tube loader unit 220 so as to be accommodated in plurality. The semiconductor product supply unit 250, the test unit 230 installed in close proximity to the semiconductor product supply unit 250, and the semiconductor product which has been tested in the test unit 230 are loaded into the tube 201 again. A semiconductor product loading unit 240 and a transfer unit 260 for transferring the semiconductor product to the semiconductor product supply unit 250, the test unit 230, and the semiconductor product loading unit 240. .

More specifically, the tube loader unit 220 is composed of a tube feeder (not shown) for unloading any one tube from the tube housing 222 and the tube housing 222.

In one embodiment, the tube feeder includes a plate formed with a tube receiving groove into which a tube is inserted, and a plate driving device installed on the plate. The tube housed in the tube receiving groove formed on the plate by driving the plate driving device supplies a semiconductor product. Conveyed to the unit 250.

The semiconductor product supply unit 250 includes a tube fixture 252 and a tube fixture 252 for fixing the tube 201 transferred by a tube feeder (not shown) of the tube loader unit 220. A buffer stage in which the unloaded semiconductor product from the tube turning device 254 and the tube turning device 254 temporarily waits for the tube 201 to be inclined by having a predetermined angle with respect to the upper surface of the 210. It consists of 256.

In this case, the tube fixing device 252 is provided with a distributor (not shown) to prevent the plurality of semiconductor products from pouring out at once from the open outlet of the tube 201 and to unload the semiconductor products one by one.

In one embodiment, the distributor is a cylinder provided with a cylinder rod for pressing and fixing the semiconductor product located immediately behind the semiconductor product to be unloaded from the tube 201 fixed to the tube holding device 252.

The unloaded semiconductor product through the distributor is seated in the buffer stage 256 located in front of the tube fixture 252 of the semiconductor product supply unit 250.

The semiconductor product seated on the buffer stage 256 is transferred to the test unit 230 installed near the semiconductor product supply unit 250 and tested.

The test unit 230 is composed of test pads 231 and 232, a semiconductor product holding device 233, and a test probe device 234 as shown in FIG. 3 or 4.

More specifically, the test pads 231 and 232 have two plate shapes installed on the upper surface of the test equipment main body 210, and test probe pin insertion holes 231a and 232a are formed at side edges facing each other among the two test pads 231 and 232. The semiconductor product fixing jig 231b and 232b is installed at an edge opposite to the test probe pin insertion holes 231a and 232a to temporarily fix the semiconductor products 202 and 203 to be seated at a designated position.

In this way, the test probe pins 234a and 234b of the test probe pin unit 234 are inserted into the respective test probe pin insertion holes 231a and 232a formed in the test pads 231 and 232 provided on the upper surface of the test equipment main body 210. And protrudes a predetermined height from the test probe pin insertion holes 231a and 232a.

While the semiconductor product is temporarily seated on the semiconductor product fixing jig 231b and 232b, the outer lead of the semiconductor product 202 and 203 is in contact with the test probe pins 234a and 234b to be tested, but the semiconductor product 202 and 203 may be slightly tested. When moved, the alignment between the test probe pins 234a and 234b and the outer leads of the semiconductor products 202 and 203 is incorrect, so that the body 202a and 203a or the body 202a corresponding to the molded portion of the semiconductor products 202 and 203 are prevented. One of the outer lead portions protruding from 203a should be fixed, but when fixing the outer lead, deformation of the outer lead may occur, so it is preferable to pressurize and fix the bodies 202a and 203a of the semiconductor product 202 and 203. Do.

To implement this, when the semiconductor product is seated at a designated position among the upper surfaces of the test pads 231 and 232, two semiconductors are provided on the upper portions of the test pads 231 and 232 so as to press the positions where the upper ends of the upper surfaces of the semiconductor products 202 and 203 are pressed. The product fixing device 233 is installed.

In this case, two semiconductor product fixing devices 233 are not necessarily installed on the test pads 231 and 232. That is, one semiconductor product fixing device 233 may pressurize the bodies 202a and 203a of the semiconductor products 202 and 203 except for the outer lead.

The semiconductor product fixing device 233 is formed at the lower end of the rotating body 233b and the rotating body 233b in which the hinge protrusion 233a is formed at the rotational center, and the rotating body 233b is pushed or pulled by the rotating body 233b. It is composed of a rotation body driving device 233c which enables the rotation around the hinge protrusion 233a.

For example, as shown in FIG. 4, when the semiconductor products 202 and 203 to be tested are seated on the test pads 231 and 232, the rotation body driving device 233c operates so that the rotation body 233b is the hinge protrusion 233a. The end of the rotating body 233b pressurizes the body 202a and 203a of the semiconductor product 202 and 203 to a predetermined pressure while rotating in the direction toward the top surface of the semiconductor product 202 and 203. The outer leads formed on the bodies 202a and 203a of the 202 and 203 are in close contact with the test probe pins 234a and 234b.

At this time, the rolling roller 233d is formed at the end of the rotating body 233b so that the end of the rotating body 233b does not generate a scratch when pressing the semiconductor product.

After the semiconductor product is tested by the test unit 230 configured as described above, the semiconductor product is transferred to the semiconductor product loading unit 240 shown in FIG. 2.

The semiconductor product loading unit 240 is generally composed of a cylinder 242, a guide member 244, and a tube fixture 245.

Specifically, a portion of the upper surface is inclined downwardly inclined surface 212 is formed in the test facility body 210 adjacent to the test unit 230.

In this case, a plurality of cylinders 242 are installed on the horizontal surface, and the guide member 244 and the tube fixing device 245 are installed on the inclined surface 212.

The cylinder 242 is provided with a cylinder rod 242a for pushing out a semiconductor product, and a channel-shaped guide member 244 is provided on the inclined surface 212 corresponding to each cylinder 242, and each guide member ( The tube fixing device 245 is installed in correspondence with 244, and the tube 201 is fixed to the tube fixing device 245 to accommodate the semiconductor product after the test is completed in the tube 201.

However, in the semiconductor product test facility 200 according to the present invention, after the test of the semiconductor products 202 and 203 is completed in the test unit 230 via the aforementioned buffer stage 256, the semiconductor product loading unit 240 is transferred to the semiconductor product loading unit 240. In order to perform the test process for storing, the transfer device 260 for transferring the semiconductor products 202 and 203 is required.

The conveying device 260 is again a guide rail 262 passing through the buffer stage 256-test unit 230-semiconductor product supply unit 250, and a conveying body 264 moving along the guide rail 262. The vacuum adsorption module 266 is installed on the transfer body 264 to generate vertical displacement.

At this time, the vacuum adsorption module 266 is preferably formed with at least two vacuum adsorption plates.

Referring to FIG. 5, a semiconductor product test method using a semiconductor product test facility according to the present invention configured as described above is as follows.

First, referring to FIGS. 4 and 5A, after any one tube 201 is unloaded from the tube loader unit 220, the tube 201 is connected to the tube holder 252 of the semiconductor product supply unit 250. The buffer stage 256 is fixed while being rotated by the tube rotating device 254 formed in the semiconductor product supply unit 250 and separated from the plurality of semiconductor products 202 and 203 stored in the tube 201 by the distributor described above. ) Is stored.

Thereafter, the semiconductor products stored in the buffer stage 256 are fixed to the vacuum adsorption plate of the transfer device 260 again, and then aligned with any one of the two test pads 231 and 232 installed in the test unit 230, and then seated. do.

At this time, the outer leads of the semiconductor products 202 and 203 are in contact with the test probe pins 234a and 234b protruding a predetermined height from the upper surfaces of the test pads 232 and 231.

Thereafter, as illustrated in FIG. 5B, the semiconductor products 202 and 203 mounted on the test pads 232 and 231 are pressurized to a predetermined pressure by the semiconductor product fixing device 233 and the semiconductor products 202 and 203 and the test probe pins 234b and 234a. ) Is tested to the semiconductor products 202 and 203 while being prevented from being randomly released.

Subsequently, in this state, the semiconductor product is tested in the state in which the semiconductor products 202 and 203 are mounted on the other test pads 231 and 232 as shown in FIG. 5A and 5B.

At this time, the semiconductor product 202 which is first seated on the test pad 232 and is subjected to the test is naturally seated on the test pad 231 and the test is ended faster than the semiconductor product 203 where the test is performed. As the finished semiconductor product is removed as shown in FIG. 5D, the semiconductor product fixing device 233 is removed, and the transfer apparatus 260 transfers the semiconductor product to the semiconductor product loading unit 240.

Thereafter, the transfer apparatus 260 picks up the semiconductor product to be seated on the buffer stage 256 and tests the semiconductor product 202 and 203 by placing it on the test pads 232 and 231 of the empty test unit as shown in FIG. 5E. Improves test performance of semiconductor products.

As described in detail above, at least two semiconductor products can be continuously tested in the test area, and at the same time, when the semiconductor product is fixed to test the semiconductor product, the molding part, which is a component other than the terminal of the semiconductor product, is fixed. By doing so, there is an effect that bending or bending does not occur in the outer lead of the semiconductor product.

In addition, the test probe pin described in the present invention does not depart from the technical spirit of the claims of the present invention, such that one test probe pin tests a plurality of semiconductor products at the same time, or one test probe pin tests only one semiconductor product. Various modifications are possible within the range.

Claims (4)

Test fixture body in plate shape: At least one test pad installed in a predetermined region of the test fixture body and mounted with the semiconductor product, a probe pin protruding from each of the test pads, and a semiconductor product for pressing and fixing the body of the semiconductor product to the test pad A test unit including a fixture; Semiconductor product supply means for supplying the semiconductor product to the test unit; Semiconductor product storage means for storing the semiconductor product tested from the test unit in a predetermined container; And a transfer means for receiving the semiconductor product from the semiconductor product supply means and transferring the semiconductor product to the test unit and the semiconductor product storage means. The method of claim 1, wherein the semiconductor product supply means A tube unloader unit installed in a predetermined area of the test facility body to unload a plurality of tubes containing the semiconductor product one by one; A semiconductor product supply device for fixing the unloaded tube from the tube unloader and generating a tilt in the tube to discharge the semiconductor product one by one from the tube; And a buffer stage in which a semiconductor product accommodating portion for accommodating the semiconductor product unloaded from the semiconductor product supply device is formed. The method of claim 1, wherein the semiconductor product receiving means A tube fixing device for fixing an empty tube having a downward slope to receive the semiconductor product after the test is completed in the test unit; A guide member formed to slide while the semiconductor product is inserted into the tube fixing device; And a semiconductor product injection cylinder for pushing the semiconductor product into the guide member in a state where the semiconductor product, which has been tested in the test unit, is seated in front of the guide member by the transfer means. Testing equipment. Loading the semiconductor product into any one of at least two test pads with protruding test probe pins contacting the terminals of the semiconductor product to be tested; Performing a test of the semiconductor product in a state in which a portion of the semiconductor product other than the terminal is fixed by a semiconductor product fixing device; Loading a semiconductor product to be tested on the remaining of the test pads while the test of the semiconductor product loaded on any one of the test pads is being performed; Performing a test of the semiconductor product in a state in which a portion of the semiconductor product, except for the terminal, on which the test is to be performed is fixed by a semiconductor product fixing device; And unloading the semiconductor product of which the test is completed first among the semiconductor products loaded on the test pad and performing the test, and reloading the semiconductor product to be tested on the empty test pad. Way.