KR20000041037A - Method for cutting glass substrate for liquid crystal display device - Google Patents
Method for cutting glass substrate for liquid crystal display device Download PDFInfo
- Publication number
- KR20000041037A KR20000041037A KR1019980056805A KR19980056805A KR20000041037A KR 20000041037 A KR20000041037 A KR 20000041037A KR 1019980056805 A KR1019980056805 A KR 1019980056805A KR 19980056805 A KR19980056805 A KR 19980056805A KR 20000041037 A KR20000041037 A KR 20000041037A
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- KR
- South Korea
- Prior art keywords
- liquid crystal
- cutting
- glass substrate
- display device
- crystal display
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
Abstract
Description
본 발명은 액정표시소자용 유리기판의 절단방법에 관한 것이다.The present invention relates to a method for cutting a glass substrate for a liquid crystal display device.
액정표시소자를 구성하는 주요 부품 재료의 하나인 기판은 표시방식, 구동방식 및 제작공정 등에 의해 요구되는 성능이 달라지기 때문에 각각의 용도에 따라 개발되어 사용된다.The substrate, which is one of the main component materials constituting the liquid crystal display device, is developed and used according to each use because the performance required by the display method, the driving method, and the manufacturing process varies.
액정표시소자의 제조시에 상하기판의 합착, 액정의 주입 후 상하기판을 요구되는 규격에 맞추어 절단하는 것은 수율에 관계하는 매우 중요한 공정 중에 하나이다.In the manufacture of the liquid crystal display device, bonding of the upper and lower substrates and cutting the upper and lower substrates according to the required specifications after injection of the liquid crystal are one of very important processes related to yield.
도 1a, 1b는 다이아몬드커터를 이용한 종래 액정표시소자용 유리기판의 절단방법을 나타내는 도면으로서, 종래 액정표시소자용 유리기판의 절단은 먼저 도 1a에 나타내듯이 액정표시소자의 상하판(100a, 100b)을 합착한 후 다이아몬드커터로 절단선 A1을 따라 상판(100b)을 절단한 후 계속해서 절단선 A2를 따라 하판(100a)을 절단한다. 그 결과 도 1b에 나타낸 것과 같은 형태로 상기 두 기판(100a, 100b)이 절단되는데 도면의 B영역을 도 1c에서 확대하여 보면 도시한 바와 같이 절단면이 고르지 않아 절단면에 대하여 연마(grinding)공정을 필요로 하게 된다. 이러한 기판에 대한 연마는 공정 중에 정전기가 발생할 우려가 있고 연마불량에 의한 수율의 저하를 초래하기도 하였다.1A and 1B illustrate a method of cutting a glass substrate for a conventional liquid crystal display device using a diamond cutter, and the cutting of the glass substrate for a conventional liquid crystal display device is performed by first cutting the upper and lower plates 100a and 100b of the liquid crystal display device. ) And then cut the upper plate (100b) along the cutting line A1 with a diamond cutter, and then cut the lower plate (100a) along the cutting line A2. As a result, the two substrates 100a and 100b are cut in the same shape as shown in FIG. 1B. As the B region of the drawing is enlarged in FIG. 1C, the cutting surface is uneven as shown in FIG. Done. Such polishing of the substrate may generate static electricity during the process and may cause a decrease in yield due to poor polishing.
상기한 다이아몬드커터를 이용한 기판의 절단방법의 단점을 해결하고자 최근에는 레이저를 이용하여 기판을 절단하는 방법이 제안되고 있다.In order to solve the shortcomings of the substrate cutting method using the diamond cutter, a method of cutting the substrate using a laser has recently been proposed.
도 2a, 2b는 레이저를 이용한 종래 액정표시소자용 유리기판의 절단방법을 나타내는 도면으로서, 유리기판의 절단은 먼저 도 2a에 나타낸 바와 같이 상하판(100a, 100b)을 합착한 후 상판(100b)의 윗면으로부터 레이저를 조사하여 절단선 A1을 따라 상판(100b)을 절단한 후 계속해서 하판(100a)의 아랫면으로부터 레이저를 조사하여 절단선 A2를 따라 하판(100a)을 절단한다. 그 결과 도 2b에 나타낸 것과 같은 형태로 상기 두 기판(100a, 100b)이 절단된다. 이때, 절단면은 균일하게 절단되나 TAB(tape automatic bonding)부분이 90°를 유지하게 되어 결합시 끊어질 우려가 있다.2A and 2B illustrate a method of cutting a glass substrate for a conventional liquid crystal display device using a laser. The cutting of the glass substrate is performed by bonding the upper and lower plates 100a and 100b to each other, as shown in FIG. 2A. After irradiating the laser from the upper surface of the upper plate 100b along the cutting line A1, the laser is irradiated from the lower surface of the lower plate 100a, and the lower plate 100a is cut along the cutting line A2. As a result, the two substrates 100a and 100b are cut in the form as shown in FIG. 2B. At this time, the cutting surface is uniformly cut, but the TAB (tape automatic bonding) portion is maintained at 90 ° there is a risk of breaking when bonding.
본 발명은 상기한 종래 기술의 문제점을 해결하기 위한 것으로, 상하판 모두에 대하여 레이저를 윗면으로부터 조사하므로써 매끄러운 절단면을 갖고 TAB부분의 경사를 완만하게 할 수 있는 액정표시소자용 유리기판의 절단방법을 제공하는 것을 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art. It aims to provide.
본 발명의 다른 목적은 유리기판에 TAB, TCP, 또는 FCP등이 접착되어 지는 모든 경우의 공정에 상기한 방법을 이용하는 것이다.Another object of the present invention is to use the above-described method in all cases in which TAB, TCP, or FCP is bonded to a glass substrate.
상기한 목적을 달성하기 위하여 본 발명에 따른 액정표시소자용 유리기판의 절단방법은 먼저, 합착된 두 기판 중 상판에 대하여 레이저를 조사하여 절단한 후, 계속해서 하판의 윗면으로부터 레이저를 조사하여 절단한다.In order to achieve the above object, a method of cutting a glass substrate for a liquid crystal display device according to the present invention may be performed by first irradiating and cutting a laser on an upper plate of two bonded substrates, and then cutting by irradiating a laser from an upper surface of the lower plate. do.
이렇게 절단된 두 기판은 절단면이 매끄럽고 TAB결합시 끊어짐을 방지할 수 있도록 형성된다.The two substrates cut in this manner are formed to have a smooth cut surface and to prevent breakage when the TAB is bonded.
도 1a, 1b는 다이아몬드커터를 이용한 종래 액정표시소자용 유리기판의 절단방법을 나타내고, 도 1c는 도 1b의 B영역의 확대도를 나타낸다.1A and 1B show a method of cutting a glass substrate for a conventional liquid crystal display device using a diamond cutter, and FIG. 1C shows an enlarged view of region B of FIG. 1B.
도 2a, 2b는 레이저를 이용한 종래 액정표시소자용 유리기판의 절단방법을 나타낸다.2A and 2B show a method of cutting a glass substrate for a conventional liquid crystal display device using a laser.
도 3a, 3b는 레이저를 이용한 본 발명에 따른 액정표시소자용 유리기판의 절단방법을 나타낸다.3A and 3B illustrate a method of cutting a glass substrate for a liquid crystal display device according to the present invention using a laser.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
100a ----- 하판 100b ----- 상판100a ----- bottom plate 100b ----- top plate
A1 ----- 상판 절단선 A2 ----- 하판 절단선A1 ----- top cutting line A2 ----- bottom cutting line
이하, 본 발명의 바람직한 실시예를 도면을 참조하여 상세하게 설명한다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
도 3a, 3b는 레이저를 이용한 본 발명에 따른 액정표시소자용 유리기판의 절단방법을 나타내는 도면으로서, 유리기판의 절단은 먼저 도 3a에 나타낸 바와 같이 상하판(100a, 100b)을 합착한 후 상판(100b)의 윗면으로부터 레이저를 조사하여 절단선 A1을 따라 상판(100b)을 절단한 후, 계속해서 하판(100a)의 윗면으로부터 레이저를 조사하여 절단선 A2를 따라 하판(100a)을 절단한다. 그 결과 도 3b에 나타낸 것과 같은 형태로 상기 두 기판(100a, 100b)이 절단된다. 이때, 절단면은 매끄럽게 절단될 뿐만 아니라 TAB부분이 90°보다 큰 각을 유지하게 된다. 자세히 말하면 레이저를 맞은 부분은 가우스측면(Gaussian Profile)을 가진 곡선으로 형성된다.3A and 3B illustrate a cutting method of a glass substrate for a liquid crystal display device according to the present invention using a laser. The cutting of the glass substrate is performed by bonding the upper and lower plates 100a and 100b to each other as shown in FIG. 3A. After irradiating a laser from the upper surface of 100b and cutting the upper plate 100b along the cutting line A1, the lower plate 100a is cut along the cutting line A2 by irradiating a laser from the upper surface of the lower plate 100a. As a result, the two substrates 100a and 100b are cut in the form as shown in FIG. 3B. At this time, the cut surface is not only smoothly cut but also maintains an angle greater than 90 ° of the TAB portion. In detail, the laser hit is formed by a curve with a Gaussian profile.
본 발명의 액정표시소자용 유리기판의 제조방법에 따르면, 상하판 모두에 대하여 레이저를 윗면으로부터 조사하므로써 매끄러운 절단면을 갖고, TAB부분의 경사를 완만하게 하여 TAB을 끊어지지 않도록 할 수 있다.According to the method for manufacturing a glass substrate for a liquid crystal display device of the present invention, the laser beam is irradiated to both the upper and lower plates from the upper surface to have a smooth cut surface, and to smoothly incline the TAB portion so as not to break the TAB.
또한 본 발명에 따르면, 유리기판의 절단 후 연마공정이 없으므로 정전기 발생 및 그에 따른 불량을 방지할 수 있다.In addition, according to the present invention, since there is no polishing process after cutting the glass substrate, it is possible to prevent the generation of static electricity and the defect thereof.
Claims (1)
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KR1019980056805A KR20000041037A (en) | 1998-12-21 | 1998-12-21 | Method for cutting glass substrate for liquid crystal display device |
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KR1019980056805A KR20000041037A (en) | 1998-12-21 | 1998-12-21 | Method for cutting glass substrate for liquid crystal display device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100490048B1 (en) * | 2001-06-19 | 2005-05-17 | 삼성전자주식회사 | In-line system for manufacturing liquid crystal display and method of manufacturing liquid crystal display using the same |
-
1998
- 1998-12-21 KR KR1019980056805A patent/KR20000041037A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100490048B1 (en) * | 2001-06-19 | 2005-05-17 | 삼성전자주식회사 | In-line system for manufacturing liquid crystal display and method of manufacturing liquid crystal display using the same |
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