KR20000036239A - Liquid crystal display device, production method thereof and mobile telephone - Google Patents

Abstract

PURPOSE: A liquid crystal display device is provided to simplify the wiring pattern of the input/output wiring, and freedom of the wiring pattern of the input/output wiring. CONSTITUTION: A liquid crystal display device comprising a liquid crystal display panel and a semiconductor integrated circuit for controlling and driving the liquid crystal display panel. The liquid crystal display panel includes a pair of insulating substrates, and the semiconductor integrated circuit is mounted on one of the insulating substrates. The semiconductor integrated circuit includes a mode terminal kept at a power source potential or a reference potential during the operation of the semiconductor integrated circuit, and a power source dummy terminal connected to the power source potential or to the reference potential inside the semiconductor integrated circuit. The mode terminal is connected to the power source dummy terminal by the wiring pattern formed on the pair of insulating substrates.

Description

Liquid crystal display, its manufacturing method and mobile phone {LIQUID CRYSTAL DISPLAY DEVICE, PRODUCTION METHOD THEREOF AND MOBILE TELEPHONE}

Liquid crystal displays have the characteristics of ultra-thin type, low voltage drive, and low power consumption, and they are used a lot as display devices of various electronic devices. Among these liquid crystal display devices, the smaller ones have been developed as a display device of a portable electronic calculator or a digital clock, but have recently been pioneering new uses as display devices of portable telephones.

As a small liquid crystal display device used in such a cellular phone, a simple matrix liquid crystal display device of a twisted nematic (TN) method or a super twisted nematic (STN) method is used.

In addition, as one of the simple matrix type liquid crystal display devices used in mobile phones, an LCD controller and a liquid crystal display panel (LCD) for driving and controlling a liquid crystal display panel (LCD) constituted by one semiconductor integrated circuit device include a chip on glass (COG). The liquid crystal display module connected by the method (hereinafter referred to as chip on glass method) is known.

The chip-on-glass liquid crystal display module has a liquid crystal panel in which liquid crystal is injected and sealed between a pair of glass substrates, and one semiconductor integrated circuit is formed on one glass substrate of the pair of glass substrates constituting the liquid crystal display panel. An LCD controller (LSI) is mounted.

Further, the liquid crystal drive voltage (segment voltage) is connected to the liquid crystal output terminal of the LCD controller LSI on the one glass substrate and is connected to the electrodes (segment electrode and common electrode) in the liquid crystal display panel LCD from the LCD controller LSI. And input / output terminals connected to the liquid crystal output wiring for outputting common voltage) and input / output terminals of the LCD controller (LSI), input various signals and power supply voltages to the LCD controller (LSI), and output various signals from the LCD controller (LSI). Wiring is also formed. The input / output wiring is led to the end of the one glass substrate, connected to the printed wiring board at the end of the glass substrate, and connected to the printed circuit board on which the central processing unit (CPU) and the like are mounted.

As described above, in the chip-on-glass liquid crystal display module, since the liquid crystal display panel, the LCD controller (LSI), the liquid crystal output wiring and the input / output wiring are formed on one glass substrate, it is possible to reduce the external dimensions of the liquid crystal display module. .

Moreover, about this kind of liquid crystal display module, it is described in Unexamined-Japanese-Patent No. 6-118433 and Unexamined-Japanese-Patent No. 63-191130.

In this chip-on-glass type liquid crystal display module, since the liquid crystal output wiring formed on one glass substrate is directly connected to the liquid crystal display panel, there is no problem of dragging the liquid crystal output wiring.

In general, however, since the input / output wiring formed on one glass substrate is drawn out to the end of one glass substrate without crossing the input / output terminals of the LCD controller (LSI), the input / output terminal of the LCD controller (LSI) Is different from the arrangement order of the input / output terminals of the printed circuit board, the signal line for supplying various signals to, for example, the LCD controller (LSI) and the signal line for supplying the output signal from the LCD controller (LSI) in the printed circuit board. It is necessary to cross the power supply wiring such as the power supply potential (V _CC ) or the reference potential (G _ND ). For this reason, it is necessary to carry out wiring that is complexly drawn in the printed circuit board.

In particular, in the LCD controller LSI in which the mode terminal for changing the internal state (operation mode or device ID information) of the LCD controller LSI is provided, the entire input / output wiring including the input / output wiring to which the mode terminal is connected is connected. Draw out the end of one glass substrate without cross, and connect the mode terminal to the power supply wiring (V _CC ) or the reference potential (G _ND ) of the printed circuit board through the printed wiring board. Is pulled up to constant power potential (V _CC ) or pulled down to reference potential (G _ND ).

Therefore, in a liquid crystal display module equipped with an LCD controller (LSI) in which a mode terminal is provided, it is necessary to form a large number of input / output wires on one glass substrate. The degree of freedom of the wiring pattern was impaired, and it was necessary to carry out wiring that was more complicated in the printed circuit board connected through the printed wiring board.

SUMMARY OF THE INVENTION An object of the present invention is to reduce the number of input / output wirings connected to input / output terminals of a semiconductor integrated circuit, to make the wiring pattern of the input / output wiring a simple wiring pattern, and to improve the degree of freedom of the wiring pattern of the input / output wiring, and the manufacture thereof. To provide a method.

Another object of the present invention is to provide a liquid crystal display device and a method of manufacturing the same, which reduce the number of input / output wirings connected to the input / output terminals of the semiconductor integrated circuit, reduce the size of the external dimensions, and reduce the cost.

Another object of the present invention is to provide a cellular phone with a reduced size and reduced cost.

The above and other objects and novel features of the present invention will become apparent from the description and the accompanying drawings.

[Initiation of invention]

Briefly, an outline of typical ones of the inventions disclosed herein is as follows.

In a liquid crystal display device comprising a liquid crystal display panel and a semiconductor integrated circuit for driving control of the liquid crystal display panel, the semiconductor integrated circuit has a liquid crystal display having a mode terminal fixed to a power supply potential or a reference potential during operation of the semiconductor integrated circuit. In the apparatus, the semiconductor integrated circuit includes a power supply dummy terminal connected to a power supply potential or a reference potential inside the semiconductor integrated circuit, and the mode terminal is connected to the power supply dummy terminal.

A plurality of mode terminals are provided, and the power supply dummy terminal is disposed between the plurality of mode terminals.

The liquid crystal display panel includes a pair of insulating substrates, the semiconductor integrated circuit is mounted on one insulating substrate of the pair of insulating substrates, and the mode terminal is connected by a wiring pattern formed on the pair of insulating substrates. It is connected to the said power supply dummy terminal.

The semiconductor integrated circuit includes a plurality of dummy terminals connected to each other by a wiring layer inside the semiconductor integrated circuit.

In a liquid crystal display device having a liquid crystal display panel having a pair of insulating substrates and a semiconductor integrated circuit for driving control of the liquid crystal display panel on one insulating substrate of the pair of insulating substrates, the semiconductor integrated circuit comprises the semiconductor. A mode terminal fixed to a power potential or a reference potential during operation of an integrated circuit, and a power dummy terminal connected to a power potential or a reference potential inside the semiconductor integrated circuit, wherein the mode terminal is connected to the power dummy terminal. A method of manufacturing a liquid crystal display device, the method comprising: forming a wiring pattern on the pair of insulating substrates, injecting and sealing liquid crystal between the pair of insulating substrates, and on one insulating substrate of the pair of insulating substrates. Bonding the semiconductor integrated circuit to each other, and connecting the mode terminal with a wiring pattern formed on the pair of insulating substrates. At least the step of connecting the power supply dummy terminal.

The cellular phone is provided with the liquid crystal display device of the said means.

According to the above means, in a liquid crystal display device, a semiconductor integrated circuit has a mode terminal fixed to a power supply potential or a reference potential during its operation, and a power supply in which the mode terminal is connected to a power supply potential or a reference potential inside the semiconductor integrated circuit. Connect to the dummy terminal. As a result, the extrusion force wiring connected to the input / output terminals of the semiconductor integrated circuit can be reduced, the external dimension of the liquid crystal display device can be reduced, and the cost of the liquid crystal display device can be reduced.

According to the above means, since the power supply dummy terminal is arranged between the plurality of mode terminals, the mode terminal and the power supply dummy terminal can be easily connected.

According to the above means, since the mode terminal and the power supply dummy terminal are connected by the wiring pattern formed on the insulated substrate, the input / output wiring connected to the input / output terminal of the semiconductor integrated circuit can be reduced, thereby making the input / output on the insulated substrate By making the wiring pattern of the wiring a simple wiring pattern, it becomes possible to improve the degree of freedom of the wiring pattern of the input / output wiring.

According to the above means, the semiconductor integrated circuit has a plurality of dummy terminals connected to each other by a wiring layer inside the semiconductor integrated circuit, whereby cross wiring of the input / output wiring connected to the input / output terminals of the semiconductor integrated circuit is possible. .

Since the liquid crystal display device of the above means is used as the display means of the mobile telephone, it is possible to reduce the external dimension of the mobile telephone and reduce the cost of the mobile telephone.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device, and more particularly, to a liquid crystal display device in which input / output wiring connected to an input / output terminal of a semiconductor integrated circuit for controlling and driving a liquid crystal display panel is reduced.

1 is a block diagram showing a schematic configuration of a liquid crystal display module (LCM) of a chip on glass system according to one embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of an example of a liquid crystal display panel (LCD) of FIG. 1.

3 is a cross-sectional view of an essential part showing a schematic configuration of an example of a liquid crystal liquid crystal display panel (LCD) of FIG. 1.

4 is a cross-sectional view of an essential part showing a schematic configuration of another example of the liquid crystal liquid crystal display panel (LCD) of FIG. 1.

5 is a plan view showing the wiring pattern of the transparent conductive film ITO on the glass substrate 1 in correspondence with the segment electrode 11 and the common electrode 12.

FIG. 6: is a figure which shows schematic structure of an example of the connection area | region 25 shown in FIG.

FIG. 7: is a figure which shows schematic structure of another example of the connection area | region 25 shown in FIG.

8 is a sectional view of principal parts for explaining an example of a method of manufacturing a liquid crystal display module (LCM) of the present embodiment.

9 is a sectional view of principal parts for explaining an example of a method of manufacturing a liquid crystal display module (LCM) of the present embodiment.

Fig. 10 is a diagram showing the arrangement of the functional modules and the arrangement of the input / output terminals in the LCD controller LSI of this embodiment.

FIG. 11 is a circuit diagram showing a circuit configuration of an internal circuit connected to the mode terminal 41 in the LCD controller LSI of this embodiment.

Fig. 12 is a block diagram showing the functional blocks inside the LCD controller (LSI) of this embodiment.

FIG. 13 is a view for explaining an example of a segment voltage applied to the segment electrode 11 and a common voltage applied to the common electrode 12 in the time division driving method of the present embodiment.

14 is a diagram for explaining an example of a segment voltage applied to the segment electrode 11 and a common voltage applied to the common electrode 12 in the static driving method of the present embodiment.

Fig. 15 is a diagram showing the power supply wiring inside the semiconductor integrated circuit (LSI) of this embodiment.

FIG. 16 is a diagram showing an example of a more specific wiring pattern of the transparent conductive film ITO on the glass substrate 1 in the portion where the LCD controller LSI is mounted, in correspondence with the LCD controller LSI.

FIG. 17 is a cross-sectional view showing a cross-sectional structure including the LCD controller LSI of the connection portion A-A 'between the terminal ID1 / CS * and the power supply dummy terminal VCCDUMMY2 shown in FIG.

FIG. 18 is a diagram showing another example of a more specific wiring pattern of the transparent conductive film ITO on the glass substrate 1 in the portion where the LCD controller LSI is mounted, in association with the LCD controller LSI.

FIG. 19 is a cross-sectional view showing a cross-sectional structure including the LCD controller LSI of the connection portion B-B 'between the dummy terminal DAY16 and the dummy terminal DAY17 shown in FIG.

20 is a block diagram showing a schematic configuration of a conventional PHS system in which a liquid crystal display module (LCM) of the present embodiment is used.

Fig. 21 is a view for explaining the cellular phone on which the liquid crystal display module LCM of this embodiment is mounted.

FIG. 22 is a view illustrating a chip on board (COB) type liquid crystal display module (LCM) to which the present invention is applicable.

FIG. 23 is a view applicable to a liquid crystal display module LCM of a tape carrier package (TCP) method.

24 is a diagram illustrating another example of the pad-to-pad connection wiring 25 of the present embodiment.

Best Mode for Carrying Out the Invention

The structure of this invention is demonstrated with embodiment.

In addition, in order to demonstrate embodiment of this invention, the thing which has the same function is attached | subjected with the same code | symbol, and the repeated description is abbreviate | omitted.

1 is a block diagram showing a schematic configuration of a liquid crystal display module LCM of a chip on glass system according to an embodiment of the present invention.

As shown in the same figure, the liquid crystal display module LCM of this embodiment is equipped with the liquid crystal display panel LCD. This liquid crystal display panel (LCD) has a liquid crystal layer which is injected and sealed between the glass substrate 1 and the glass substrate 2 bonded to each other via the seal member 3.

In addition, an LCD controller (LSI) consisting of one large-scale semiconductor integrated circuit is mounted on the glass substrate (1), and connected to a liquid crystal output terminal of the LCD controller (LSI) on the glass substrate (1). LCD output wiring for outputting the liquid crystal drive voltage (segment voltage and common voltage) to electrodes (segment electrode and common electrode) in the liquid crystal display panel (LCD), connected to the input / output terminals of the LCD controller (LSI), and the LCD controller (LSI Input and output wirings for inputting various signals and power supply voltages, and outputting various signals from the LCD controller (LSI) are also formed. This liquid crystal output wiring and input / output wiring are formed of a transparent conductive film (Indium-Tin-Oxide; ITO).

The input / output wiring is led to the end of the glass substrate 1, connected to the heat seal (printed wiring substrate) 4 at the end of the glass substrate 1, and equipped with a central processing unit (CPU) or the like. Connected to a printed circuit board.

The LCD controller LSI mounted on the glass substrate 1 is faced down on the transparent conductive film ITO (input / output wiring, liquid crystal output wiring) formed on the glass substrate 1, and the LCD The gold (Au) bumps deposited on the pad portion of the controller LSI are connected to the transparent conductive film ITO.

2 is a perspective view showing a schematic configuration of an example of a liquid crystal display panel (LCD) of FIG. 1, and FIG. 3 is a cross-sectional view of an essential part showing a schematic configuration of an example of a liquid crystal display panel (LCD) of FIG. 1.

The liquid crystal display panel (LCD) shown in FIG. 2, FIG. 3 is a liquid crystal display panel of STN system. As shown in FIGS. 2 and 3, the liquid crystal display panel LCD includes a plurality of segment electrodes 11 formed of a strip-shaped transparent conductive film ITO on the glass substrate 1 side with respect to the liquid crystal layer 10. ) Is formed, and a plurality of common electrodes 12 made of a strip-shaped transparent conductive film ITO is formed on the glass substrate 2 side. A plurality of segment electrodes 11 and an alignment layer 13 are sequentially stacked inside the glass substrate 1 (the liquid crystal layer side), and a plurality of common electrodes 12 and the alignment layer are disposed inside the glass substrate 2 (the liquid crystal layer side). 14 are sequentially stacked. In addition, a polarizing plate 15 and a retardation plate 17 are formed outside the glass substrate 1, and a polarizing plate 16 is formed outside the glass substrate 2.

The segment electrode 11 and the common electrode 12 are orthogonal to each other, and the intersection of the segment electrode 11 and the common electrode 12 constitutes a pixel region.

Moreover, the spacer which makes constant the gap length of the liquid crystal layer 10 in the liquid crystal layer 10 can also be arrange | positioned. In addition, in the liquid crystal display panel LCD shown in FIG. 2, FIG. 3, the back light which irradiates a liquid crystal display panel LCD below the glass substrate 2 is provided.

4 is a cross-sectional view of an essential part showing a schematic configuration of another example of a liquid crystal display panel (LCD) of FIG. 1.

The liquid crystal display panel (LCD) shown in FIG. 4 is a liquid crystal display panel of a reflection type TN system.

Although the internal structure of the liquid crystal display panel LCD shown in FIG. 4 is the same as that of the liquid crystal display panel LCD shown in FIG. 3, in the liquid crystal display panel LCD shown in FIG. 4, the polarizing plate 15 is outer side of the glass substrate 1; ) Is formed, and a polarizing plate 16 and a reflecting plate 18 are formed outside the glass substrate 2.

5 is a plan view showing the wiring pattern of the transparent conductive film ITO on the glass substrate 1 in correspondence with the segment electrode 11 and the common electrode 12.

In the figure, the LCD controller LSI faces down to the portion indicated by the dotted line frame and is connected to the transparent conductive film ITO by the gold bumps deposited on the pad portion of the LCD controller LSI. The liquid crystal output wiring for supplying the segment voltage and the common voltage to the common electrode 12 from the LCD controller LSI to the segment electrode 11 in the liquid crystal display panel LCD includes the segment side liquid crystal output wiring 20 and the common side liquid crystal. The output wiring 21 is divided into two.

Most of the segment side liquid crystal output wiring 20 is formed integrally with the segment electrode 11 in the liquid crystal display panel LCD, and the part in the liquid crystal display panel LCD of the segment side liquid crystal output wiring 20 is integrated. This segment electrode 11 is constituted. The common side liquid crystal output wiring 21 is divided into two, the upper common side liquid crystal output wiring 21a and the lower common side liquid crystal output wiring 21b, and a part of the segment side liquid crystal output wiring 20 and the common side. The liquid crystal output wirings 21a and 21b are connected to each common electrode 12 through the connection region 25 provided in the actual material 3.

FIG. 6: is a figure which shows schematic structure of an example of the connection area | region 25 shown in FIG.

In the example shown in the figure, the silver paste AGP is formed in the actual material 3, whereby a real is formed from the common side liquid crystal output wirings 21a and 21b (or a part of the segment side liquid crystal output wiring 20). The common voltage is applied to the common electrode 12 through the silver paste material AGP in (3). In this case, the actual material 3 and the silver paste material AGP can be formed by known screen printing.

FIG. 7: is a figure which shows schematic structure of another example of the connection area | region 25 shown in FIG.

In the example shown in the figure, the real material 3 formed of the anisotropic conductive material is used for the real material 3, and from the common side liquid crystal output wirings 21a and 21b (or a part of the segment side liquid crystal output wiring 20). The common voltage is applied to the common electrode 12 through the material 3.

As the real material 3 formed of this anisotropic conductive material, for example, a synthetic resin in which conductive beads 31 are dispersed can be used. In this case, by appropriately setting the dispersion amount of the conductive beads 31 dispersed in the synthetic resin, between the common side liquid crystal output wirings 21a and 21b and the common electrode 12 adjacent in the connection region 25. It is possible to prevent short circuits.

As the conductive beads 31 shown in FIG. 7, any of beads having conductivity such as beads coated with a transparent conductive film, beads coated with metal powder, beads coated with carbon, or metal beads can be used. In addition, in FIG. 7, it is also possible to use conductive fiber (ACF) instead of the conductive beads 31.

In FIG. 5, the input / output wiring 22 is led to the end of the glass substrate 1 and connected to the heat seal 4 at the end of the glass substrate 1. In addition, the power supply potential V _CC wiring in the input / output wiring 22 has a first region 23 formed broadly in the portion where the LCD controller LSI is mounted. Similarly, the reference potential in the input / output wiring 22 G _ND ) wiring has a second region 24 formed wide in a portion where LCD controller LSI is mounted.

In FIG. 5, 25 is an inter pad connection wiring which connects between the pads of LCD controller LSI mentioned later.

8 and 9 are principal part cross-sectional views for explaining an example of a manufacturing method of the liquid crystal display module LCM of this embodiment.

Next, an example of the manufacturing method of the liquid crystal display module LCM of this embodiment is demonstrated using FIG. 8, FIG.

(1) Process 1

The glass substrate 1 and the glass substrate 2 are cleaned (FIG. 8A).

(2) process 2

An ITO film is formed on the glass substrate 2 by vapor deposition, sputtering, or the like, and then the common electrode 12 is formed by photolithography. Similarly, the segment electrode 11, the liquid crystal output wiring (segment side liquid crystal output wiring 20, the common side liquid crystal output wiring 21), the input / output wiring 22, and the first region 23 on the glass substrate 1. The connection region 25 between the second region 24 and the pad is formed (FIG. 8B).

(3) process 3

An alignment layer 13, 14 including the surface of the segment electrode 11 on the glass substrate 1 and the common electrode 12 on the glass substrate 2, and the entire display surface of the glass substrate 1 and the glass substrate 2. ) Is formed, followed by rubbing treatment (FIG. 8C).

(4) process 4

The actual material 3 is applied to the outer periphery of the glass substrate 1 (FIG. 8D).

(5) step 5

The patterned surfaces of the glass substrate 1 and the glass substrate 2 are joined together and heated while pressing the outer surfaces of the glass substrates 1 and 2 to cure the real material 3, and the glass substrate 1 and the glass substrate ( 2) seal the adhesive (Fig. 8e).

(6) step 6

The liquid crystal layer 10 is injected from the opening 30 of the actual material 3, the opening 30 is sealed with an epoxy resin, and then the polarizing plate 15 and the retardation plate 17 are disposed outside the glass substrate 1. ) And a polarizing plate 16 on the outside of the glass substrate 1 (FIG. 9F).

(7) Process 7

The positions of the glass substrate 1 and the LCD controller LSI are determined, and the gold deposited on the pad portion of the LCD controller LSI is bonded by face down bonding and bonding the LCD controller LSI onto the glass substrate 1. The bump is connected to a transparent conductive film ITO formed on the glass substrate 1. As a result, each pad portion of the LCD controller LSI is connected to the liquid crystal output wiring (segment side output wiring 20, common side liquid crystal output wiring 21), input / output wiring 22, and the connection wiring 25 between the pads. (Fig. 9g)

(8) Process 8

The positions of the input / output wiring 22 and the heat seal 4 drawn out to the end of the glass substrate 1 are determined, and the heat seal 4 is applied to the end of the glass substrate 1 by pressing and heating with a heat tool. Connect After that, an insulating resin such as a polyimide resin, an epoxy resin, or a silicone resin is applied to the exposed portion to form a protective film 32 (Fig. 9H).

Fig. 10 is a diagram showing the arrangement of the functional modules and the arrangement of the input / output terminals in the LCD controller LSI of the present embodiment.

In the figure, the common driver block 44 and the segment driver block 45 are blocks for displaying an image on a liquid crystal display panel LCD by time division driving. The common driver block 44 outputs a common voltage from the terminals COM1 to COM32 and COMS2 to the common electrode 12 in the liquid crystal display panel LCD. The segment driver block 45 outputs a segment voltage from the terminals SEG1 to SG60 to the segment electrode 11 in the liquid crystal display panel LCD.

The anunciator display unit block 46 is a block for displaying an icon or a mark on the liquid crystal display panel LCD by the static driving, and the common electrode 12 in the liquid crystal display panel LCD from the terminal ACOM1. The static drive common voltage is output to a part of the static drive segment voltage from the terminals ASEG1 to ASEG12 to a part of the segment electrode 11 in the liquid crystal display panel LCD.

When the reference potential G _ND is input to the terminal OPOFF, the OP amplifier block 48 divides the power potential _VCC and the second reference potential V _EE to drive the liquid crystal of five levels. The voltages V1 to V5 are output. When the power supply potential V _CC is input to the terminal OPOFF, the OP amplifier block 48 is turned off, and five levels of liquid crystal drive voltages V1 to V5 are input from the outside to the terminals V1OUT to V5OUT. Here, the terminal VREFP, the terminal VREF, and the terminal VREFM are terminals for adjusting the driving capability of the built-in OP amplifier according to the liquid crystal driving voltage.

The booster circuit block 49 boosts the voltage input to the terminal VC1 twice (or triple) and outputs it from the terminal V5OUT2 (or terminal V5OUT3). Is a terminal (V5OUT2) (or terminal (V5OUT3)) and a second reference potential (V _EE) in a LCD controller (LSI), by connecting the terminal (VEE) from the outside. In the case where the boost circuit block 49 is used, the boost capacitor is connected between the terminal C1 and the terminal C2.

The oscillation circuit block 50 generates a clock signal used inside the LCD controller LSI by connecting a resistor between the terminal OSC1 and the terminal OSC2. When an external clock signal is used as the clock signal used inside the LCD controller LSI, an external clock signal is input to the terminal OSC1.

The low voltage resistance buffer block 47 is provided with an input / output buffer circuit for input / output signals, the low voltage resistance logic logic block 51 is provided with various registers or control circuits, and the ROM block 52 and the RAM block 53. The memory of ROM and RAM is arranged.

The key scan circuit control block 54 is, for example, a control block for detecting a key input state in a cellular phone, outputs a stroke signal in time division at terminals KST0 to KST7, and strokes at terminals KIN0 to KIN3. Accept key status in synchronization with signal.

The terminal IM is a terminal for selecting the serial interface mode of the liquid crystal display module LCM and the central processing unit CPU of the present embodiment. When the power supply potential V _CC is applied to the terminal IM, the clock synchronization serial interface mode is applied. When the reference potential V _EE is applied to the terminal IM, the I ² C bus interface mode is applied. In the I ² C bus interface mode, the terminal ID1 / CS * and the terminal ID0 become terminals for setting the lower two bits of the device ID code assigned to the LCD controller LSI. In the serial interface mode, the terminal ID1 / CS * is a terminal to which a chip select signal is input, and the terminal ID0 is a terminal for setting the lower 1 bit of the device ID code assigned to the LCD controller LSI.

To set the lower bit of the device ID code assigned to the LCD controller (LSI), be sure to apply the power supply potential (V _CC ) or the reference potential (V _EE ) to this terminal (ID1 / CS *) or terminal (ID0). There is a need.

The terminal IM, the terminal ID1 / CS * and the terminal ID0 are referred to as mode terminals 41 hereinafter.

As shown in FIG. 11, the potential applied to the mode terminal 412 is input to the mode selection circuit 43 through the CMOS inverter circuit 42 and in accordance with the potential applied to the mode terminal 41. The selection circuit 43 changes the internal state (operation mode or device ID information) of the LCD controller LSI. The circuit module related to this mode selection circuit 43 is arranged near the mode terminal 41 as shown in FIG.

In Fig. 10, two power supply dummy terminals VCCDUMY1 in the vicinity of the mode terminal 41, for example, between the terminal IM and the terminal ID0, and between the terminal ID0 and the terminal ID1 / CS *. , VCCDUMY2) is arranged. The power supply dummy terminals VCCDUMY1 and VCCDUMY2 are connected to the power supply wiring of the power supply potential V _CC inside the LCD controller LSI. Therefore, the terminal IM and the terminal are connected by connecting the terminal IM, the terminal ID0 and the terminal ID1 / CS * to the power supply dummy terminals VCCDUMY1 and VCCDUMY2 by the pad-to-pad connection wiring 25. The power supply potential V _CC can be applied to the ID0 and the terminal ID1 / CS *. In addition, since the second connection area 24 is provided in proximity to the terminal IM, the terminal ID0 and the terminal ID1 / CS *, the terminal IM, the terminal ID0 and the terminal ID1 / CS *. Can be applied to the second connection region 24 to apply the reference power supply potential G _ND to the terminal IM, the terminal ID0, and the terminal ID1 / CS *. Thereby, the number of input / output wirings 22 on the glass substrate 1 can be reduced.

Fig. 12 is a block diagram showing the functional blocks inside the LCD controller (LSI) of this embodiment.

The common driver block 44 shown in FIG. 10 includes a common shift register 101 and a common driver 102. The common shift register 101 selects the common electrode 12 driven every one horizontal scanning time on the basis of the output timing control timing signal input from the timing generating circuit 110. The common driver 102 supplies a predetermined liquid crystal driving voltage within the liquid crystal driving voltage of another voltage level supplied from the liquid crystal driving voltage selection circuit 106 to the selected common electrode 12 and the common electrode 12 other than the common electrode 12. Select and print.

The segment driver block 45 shown in FIG. 10 includes a segment register 103, a latch circuit 104, and a segment driver 105. The segment register 103 generates a signal for receiving display data on the basis of the display data latch timing signal input from the timing generation circuit 103. The latch circuit 104 latches the display data based on the display data reception signal, and outputs the latched display data to the segment driver 105 based on the output timing control signal. The segment driver 105 has another voltage supplied from the liquid crystal drive voltage selection circuit 106 based on the display data for each segment electrode 11 whose display data for one horizontal is "1" or "0". The predetermined liquid crystal drive voltage is selected and output within the level liquid crystal drive voltage.

FIG. 13 is a view for explaining an example of a segment voltage applied to the segment electrode 11 and a common voltage applied to the common electrode 12 in the time division driving method of the present embodiment.

In the liquid crystal display module LCM of the present embodiment, a segment voltage applied to the plurality of segment electrodes 11 and a common voltage applied to the plurality of common electrodes 12 so that a direct current voltage is not applied to the liquid crystal layer 10. A so-called alternating current driving method is used, which inverts the power at a predetermined cycle.

In the example shown in FIG. 13, for example, display is performed when the negative polarity (the segment voltage applied to the segment electrode 11 of the display data "1" is lower than the common voltage applied to the common electrode 12). The segment voltage of V5 supplied from the liquid crystal drive voltage selection circuit 106 is supplied to each segment electrode 11 having data "1", and the liquid crystal drive voltage selection circuit 106 is provided at each segment electrode 11 having display data "0". The segment voltage of V3 supplied from is applied, and the common voltage of V6 supplied from the liquid crystal drive voltage selection circuit 106 is applied to the selected common electrode 12, and the liquid crystal drive is applied to the non-selected common electrode 12. The common voltage of V4 supplied from the voltage selection circuit 106 is applied.

In addition, when the positive polarity (the segment voltage applied to the segment electrode 11 of the display data "1" is higher than the common voltage applied to the common electrode 12), the display data is "1". A segment voltage of V6 supplied from the liquid crystal drive voltage selection circuit 106 is supplied to the segment electrode 11, and a segment of V2 supplied from the liquid crystal drive voltage selection circuit 106 is supplied to each segment electrode 11 having the display data "0". A voltage is applied, a common voltage of V5 supplied from the liquid crystal drive voltage selection circuit 106 is applied to the selected common electrode 12, and a liquid crystal drive voltage selection circuit 106 is applied to the non-selected common electrode 12. Is applied to the common voltage of V1.

The annunciator display block 46 shown in FIG. 10 includes an annunciator driver 108. The annunciator driver 108 applies the segment voltage of the voltage waveform of FIG. 14B with respect to the selected segment electrode 11 in the segment electrodes 11 connected to the terminals ASEG1 to ASEG12. The segment voltage of the voltage waveform of FIG. 14A is output with respect to the unselected segment electrode 11 connected to (). The common voltage of the voltage waveform of FIG. 14C is output to the common electrode 12 connected to the terminal ACOM1.

As a result, the liquid crystal driving voltage is not applied to the liquid crystal layer 10 between the unselected segment electrode 11 connected to the terminals ASEG1 to ASEG12 and the common electrode 12 connected to the terminal ACOM1. In the liquid crystal layer 10 between the selected segment electrode 11 connected to the terminals ASEG1 to ASEG12 and the common electrode 12 connected to the terminal ACOM1, a potential difference of 2 × (V _CC -A _GND ) is applied. The liquid crystal drive voltage is applied.

The OP amplifier block 48 shown in FIG. 10 includes a series resistor circuit in which five resistors 121 to 125 and one variable resistor 126 are connected in series, and five voltage polos connected to the connection point of the series circuit. Follower circuits 131 to 135 are provided. When the reference potential G _ND is input to the terminal OPOFF, the voltage is divided between the power supply potential V _CC and the second reference potential V _EE , and five levels of liquid crystal are obtained from the voltage follower circuits 131 to 135. The driving voltages V1 to V5 are output.

The five levels of liquid crystal drive voltages V1 to V5 and the power source potential V _CC (the liquid crystal drive voltage of V6) are output to the liquid crystal drive voltage selection circuit 106.

The booster circuit 111 and the clock signal generation circuit 112 constitute a booster circuit block 49 and an oscillator circuit block 50 shown in FIG.

The character generator ROM 153 generates a 5 x 8-bit character pattern from an 8-bit character code. This character generator ROM 153 is provided in the ROM block 52 shown in FIG.

The display data RAM 154 is a random access memory (RAM) that stores an 8-bit character code. The character generator RAM 152 is a random access memory (RAM) for a user font in which a user freely rewrites a character pattern in a program. The segment RAM 151 is a random access memory (RAM) that freely controls a segment such as an icon or a mark in a user program. This display data RAM 154, character generator RAM 152, and segment RAM 151 are provided in the RAM block 53 shown in FIG.

The cursor blink control circuit 118 is a circuit for blinking or inverting the cursor. Display data (bit data) from the cursor blink control circuit 118, the segment RAM 151, the character generator RAM 152, and the character generator ROM 153 is converted into serial data by the serial-to-parallel conversion circuit 107. It is sent out to the latch circuit 104. This series-parallel conversion circuit 107 and the cursor blink control circuit 118 are provided in the low breakdown voltage logic logic block 51 shown in FIG.

In the serial interface 113, the clock synchronization serial interface mode and the I ² C bus interface mode are selected by the voltage applied to the terminal IM. The address information and data transmitted from the central processing unit (CPU) via the serial interface 113 are stored in the instruction register 151 and the data register 153. The address information stored in the instruction register 151 is, in the instruction decoder 116, address information of the display data RAM 154, the segment RAM 151, the character generator RAM 152, and the character generator ROM 153. ) Is divided into address information.

The address information of the segment RAM 151, the character generator RAM 152, and the character generator ROM 153 divided by the instruction decoder 116 is input to the address counter 117. The segment RAM 151, the character generator RAM 152, and the character generator ROM 153 are accessed by this address counter 117.

The instruction decoder 116, the address counter 117, the instruction register 151, the data register 153, and the busy flag 152 are provided in the low breakdown voltage logic logic block 51 shown in FIG.

The LED output port 119 has three LED drive ports connected to the terminals LED0 to LED2 and three general purpose output ports connected to the terminals PORT0 to PORT2. The lighting of the light emitting diode connected to the terminals LED0 to LED2 can be controlled via the serial interface 113. This LED output port 119 is provided in the low breakdown voltage logic logic block 51 shown in FIG.

The timing generating circuit 110 generates a common register 101, a segment register 103, a latch circuit 104, a display data RAM 154, and a character generator RAM by a clock signal from the clock signal generating circuit 112. 152 and a timing signal for operating an internal circuit such as the segment RAM 151 are generated. This timing generation circuit 110 is provided in the low breakdown voltage logic logic block 51 shown in FIG.

The key scan circuit control block 54 shown in FIG. 10 includes a key scan timing control circuit 115 and a key scan register 114.

Fig. 15 is a diagram showing the power supply wiring inside the semiconductor integrated circuit (LSI) of this embodiment.

In the figure, 61 is a power wiring of the power potential (V _CC ), 62 is a power wiring of the second reference potential (V _EE ), 63 is a power wiring of the reference potential (G _ND ), 64 is a third reference potential ( A _GND ) 's power wiring. As shown in Fig. 15, the respective power supply dummy terminals VCCDUMY1 and VCCDUMY2 are connected to the power supply wiring 61.

FIG. 16 is a diagram showing an example of a more specific wiring pattern of the transparent conductive film ITO on the glass substrate 1 in the portion where the LCD controller LSI is mounted, in correspondence with the LCD controller LSI.

In the figure, the power supply potential V _CC is input to the power supply potential terminal VCC 80, and the reference potential G _ND is input to the reference potential terminal GND 82. The terminal OPOFF is connected to the reference potential terminal GND 82 through the second region 24. Therefore, the OP amplifier block 48 divides the power supply potential V _CC and the second reference potential V _EE , and outputs five levels of liquid crystal driving voltages V1 to V5 from each voltage follower circuit.

The terminal VCI is connected to the power source potential terminal VCC 80 by a transparent conductive film ITO formed on the glass substrate 1 outside the LCD controller LSI. Therefore, the booster circuit block 49 boosts the power supply potential V _CC by three times and outputs it from the terminal V5OUT3. The terminal V5OUT3 is connected to the terminal VEE which is the second reference potential V _EE input terminal by a transparent conductive film ITO formed on the glass substrate 1 outside the LCD controller LSI. have.

The terminal IM which is one of the mode terminals 41 is connected to the reference potential terminal GND 82 via the second connection region 24. Therefore, the LCD controller LSI mounted on the wiring pattern shown in FIG. 16 transmits and receives data in the I ² C bus interface mode with the central processing unit CPU. The terminal ID1 / CS *, which is one of the mode terminals 41, is connected to the power supply dummy terminals VCCDUMY1 and VCCDUMY2 by the pad-to-pad connection wiring 25, and the terminal (1) of one of the mode terminals 41 is connected. ID0 is connected to the reference voltage terminal (GND) 82 via the second connection region 24.

In FIG. 16, the 1st connection area | region 23 is also connected to the power supply terminal (VCC) 81 of the upper left. The power supply wiring (not shown in Fig. 15) of the power supply terminal V _{CC which} is not connected to the power supply wiring 61 shown in Fig. 15 inside the LCD controller LSI is connected to the left power supply terminal (VCC) 81. This is because it is connected to The second connection region 24 is also connected to the center reference power supply terminal (GND) 83. 15, the power supply wiring 63 of the reference potential G _ND is divided into two inside the LCD controller LSI, and the power supply wiring of the reference potential G _ND inside the LCD controller LSI is shown in FIG. 63) are not connected to each other.

16, terminals DMY15 to DMY18 are dummy terminals, and 78 is Al (aluminum) jumper wiring. The reason for providing these terminals DMY15 to DMY18 and Al (aluminum) jumper wiring 78 will be described later.

FIG. 17 is a cross-sectional view showing a cross-sectional structure including the LCD controller LSI of the connection portion A-A 'between the terminal ID1 / CS * and the power supply dummy terminal VCCDUMMY2 shown in FIG.

As shown in the figure, the terminal ID1 / CS * is formed of a gold bump 77 in order to enable connection between the Al (aluminum) pad portion 74 and the transparent conductive film ITO. The power supply dummy terminal VCCDUMY2 is formed of an Al pad portion 75 and a gold bump 77. In this case, the gold bumps 77 are formed, for example, by vapor deposition.

In this way, the connection between the Al pad portion 74 → gold bump 77 → pad connection (transparent conductive film (ITO)) → gold bump 77 → Al pad portion 75 in the path of the terminal ID1 / CS *. ) And the power supply dummy terminal VCCDUMY2 are connected. In Fig. 17, 71 is a wafer substrate, 72 is a field oxide film (selective silicon oxide film), 73 is an interlayer film, and 76 is a passivation film (passivation film).

18 is a diagram showing another example of a more specific wiring pattern of the transparent conductive film ITO on the glass substrate 1 in the portion where the LCD controller LSI is mounted, in association with the LCD controller LSI.

In the figure, the power supply potential V _CC is input to the power supply potential terminal VCC 85, and the reference potential G _ND is input to the reference potential terminal GND 87. As described above, the power source potential terminal VCC 85 and the center power source potential terminal VCC 86 are not connected inside the LCD controller LSI. Similarly, the reference potential terminal GND 87 and the central power supply potential terminal VCC 88 are not connected inside the LCD controller LSI.

In this case, as shown in Fig. 16, the power supply terminal VCC 85 and the center power supply potential terminal are formed by the transparent conductive film ITO formed on the glass substrate 1 outside the LCD controller LSI. The VCC 86 may be connected, but the power supply terminal VCC and the center power potential terminal are formed by the transparent conductive film ITO formed on the glass substrate 1 on which the LCD controller LSI is mounted. (VCC) 86 may be considered to be connected.

In this case, however, it is necessary to cross the first connection region 23 and the second connection region 24. Therefore, in the example shown in FIG. 18, the Al jumper wiring (provided with the third connection region 23a and the third connection region 23a and the first connection region 23 provided inside the LCD controller LSI ( 78). The configuration other than that is the same as the wiring pattern of FIG.

FIG. 19 is a cross-sectional view showing a cross-sectional structure including the LCD controller LSI of the connection portion B-B 'between the dummy terminal DAY16 and the dummy terminal DAY17 shown in FIG.

As shown in the figure, the dummy terminal DMY16 and the dummy terminal DMY17 are connected to each other via the Al jumper wiring 78. Therefore, in the path of the third connection region 23a-> gold bump 77-> Al jumper wiring 78-> gold bump 77-> first connection region 23, the power supply terminal 85 and the power supply potential of the center are centered. Terminal (VCC) 86 is connected.

As can be understood from Fig. 16 and Fig. 18, in the liquid crystal drive module LCM of the present embodiment, the power supply wiring for supplying the power voltage to the LCD controller LSI is connected to the LCD controller (not only the center of the LCD controller LSI). It can also be pulled out from the end (upper or lower end) of the LSI and connected to the heat seal 4. Therefore, the power supply wiring of the liquid crystal display module (LCM) can be replaced in accordance with the power supply wiring of the printed circuit board mounted in the portable device, and it is possible to correspond to various printed circuit boards mounted in the portable device.

The liquid crystal display module LCM of the present embodiment can be used as a display device of a PHS system, which is one of mobile phones, for example.

20 is a block diagram showing a schematic configuration of a conventional PHS system in which a liquid crystal display module (LCM) of the present embodiment is used.

The PHS system shown in the figure shows an ADPCM codec circuit 201, a speaker 202, a microphone 203, a liquid crystal display panel 204, a keyboard 205, and digital data for compressing and decompressing audio data. A TDMA circuit 206 for time division multiplexing, an E ² PROM 209 for storing a registered ID number, a ROM 208 for storing a program, a memory such as an SRAM 207, a PLL circuit for setting a wireless carrier frequency ( 210, an RF circuit 211 for transmitting and receiving wirelessly, and a microprocessor 212 controlling the same.

The liquid crystal display module LCM of this embodiment can be used as the liquid crystal display panel 204 shown in FIG.

21 is a diagram for explaining a cellular phone on which the liquid crystal display module LCM of the present embodiment is mounted.

The liquid crystal display module LCM of the present embodiment is connected to the printed circuit board 92 on which the central processing unit CPU is mounted by the heat seal 4, and is mounted on the cellular phone 91.

As described above, in the liquid crystal display module LCM of the present embodiment, the terminal IM and the terminal ID0 are connected to the second connection region 24, and the terminal ID1 / CS * is connected between pads. (25) is connected to the power supply dummy terminal VCCDUMY2.

As a result, the terminal IM, the terminal ID0, and the terminal ID1 / CS * are drawn out from the input / output wiring 22 to the end of the glass substrate 1, so that it is not necessary to connect the heat seal 4. . Therefore, the number of input / output wirings 22 on the glass substrate 1 can be reduced.

Therefore, in the wiring pattern of the input / output wiring made of the transparent conductive film ITO on the glass substrate 1, the power supply potential wiring and the reference power wiring, and the simple wiring pattern in which the normal signal wiring does not cross on the glass substrate 1 You can do As a result, the wiring pattern of the input / output wiring 22 can be simplified, whereby the liquid crystal display module LCM can be easily manufactured, and the cost of the liquid crystal display module LCM can be reduced.

Moreover, the area of the heat seal 4 can be made small and the cost of the heat seal 4 can be reduced.

In addition, since it is less necessary to carry out complicated wiring in the printed wiring board connected to the liquid crystal display module LCM, the area of the printed circuit board and the cost of the printed circuit board can be reduced.

In the liquid crystal display module LCM of the present embodiment, the power supply wiring for supplying the power supply voltage to the LCD controller LSI is connected not only to the center portion of the LCD controller LSI but also to the end portion (upper or lower) of the LCD controller LSI. Can be taken out and connected to the heat seal 4. Therefore, the power supply wiring of the liquid crystal display module (LCM) can be replaced in accordance with the power supply wiring of the printed circuit board mounted in the portable device, and it is possible to correspond to various printed circuit boards mounted in the portable device.

Therefore, in the liquid crystal display module LCM of this embodiment, the degree of freedom of the wiring pattern of power supply wiring can be improved.

In addition, by mounting the liquid crystal display module LCM of the present embodiment to a cellular phone, the cellular phone can be miniaturized and the cost can be reduced.

In addition, in this embodiment, although embodiment which applied this invention to the liquid crystal display module (LCM) of the chip-on-glass system was demonstrated, it is not limited to this, As for this invention, as shown in FIG. 22, an LCD controller is shown. The liquid crystal display device (LSI) and the liquid crystal display panel (LCD) are connected in a chip-on-board (COB) manner, or as shown in FIG. 23, the LCD controller (LSI) and the liquid crystal display panel (LCD) are tape carrier packages (TCP). It is also applicable to a liquid crystal display device connected in a) manner.

It is also possible to use a polymer film instead of the glass substrates 1 and 2 constituting the liquid crystal display panel (LCD).

In addition, the power supply dummy terminals VCCDUMY1 and VCCDUMY2 are not necessarily provided near the mode terminal 41, and the power supply dummy terminals are formed by setting the wiring pattern of the inter-pad wiring 25 as the wiring pattern shown in FIG. (VCCDUMY1, VCCDUMY2) and the mode terminal 41 may be separated. In addition, the power supply wiring of the reference potential V _GND is connected to the power supply dummy terminals VCCDUMY1 and VCCDUMY2 inside the LCD controller LSI, and the reference potential V is connected to the mode terminal 41 by the pad connection wiring 25. _GND ) may be applied.

Thus, according to this embodiment, the following effect is obtained.

In the liquid crystal display device, the number of input / output wirings connected to the input / output terminals of the semiconductor integrated circuit for driving control of the liquid crystal display panel can be reduced, and the wiring pattern of the input / output wiring is a simple wiring pattern, and the wiring pattern of the input / output wiring It is possible to improve the degree of freedom. As a result, the liquid crystal display device can be miniaturized and the cost of the liquid crystal display device can be reduced.

The printed wiring board connected to the liquid crystal display device can be simplified, the number of parts can be reduced, and the size can be reduced, thereby reducing the cost of the printed wiring board.

Through the printed wiring board, the wiring which pulls out the signal wiring in the printed circuit board connected to the liquid crystal display device becomes small, and the area of the printed circuit board can be reduced. As a result, the cost of the printed circuit board can be reduced.

By using the liquid crystal display device of the present invention in a portable device such as a cellular phone, the portable device can be miniaturized and the cost of the portable device can be reduced.

As mentioned above, although the invention made by this inventor was demonstrated concretely based on embodiment, this invention is not limited to the said embodiment, Of course, various changes are possible in the range which does not deviate from the summary.

In the above description, the case in which the invention made mainly by the present inventors is applied to a liquid crystal display device used in a mobile phone which is the background of the use is described, but the present invention is not limited thereto. Can be used in electronic equipment.

Claims (12)

In a liquid crystal display device comprising a liquid crystal display panel and a semiconductor integrated circuit for driving control of the liquid crystal display panel, the semiconductor integrated circuit includes a liquid crystal having a mode terminal fixed to a power supply potential or a reference potential during operation of the semiconductor integrated circuit. In the display device, The semiconductor integrated circuit includes a power supply dummy terminal connected to a power supply potential or a reference potential inside the semiconductor integrated circuit. And the mode terminal is connected to the power supply dummy terminal. The method of claim 1, The plurality of mode terminals are provided, and the power supply dummy terminal is disposed between the plurality of simulations. The method according to claim 1 or 2, The liquid crystal display panel includes a pair of insulating substrates, the semiconductor integrated circuit is mounted on one insulating substrate of the pair of insulating substrates, and the mode terminal is formed by a wiring pattern formed on the pair of insulating substrates. Is connected to the power supply dummy terminal. The method of claim 3, wherein The said wiring pattern is comprised by the transparent conductive film, The liquid crystal display device characterized by the above-mentioned. The method according to claim 3 or 4, And the insulating substrate is a glass substrate. The method according to any one of claims 1 to 5, And the semiconductor integrated circuit includes a plurality of dummy terminals connected to each other by a wiring layer inside the semiconductor integrated circuit. In a liquid crystal display device comprising a liquid crystal display panel having a pair of insulating substrates and a semiconductor integrated circuit for driving control of the liquid crystal display panel on one insulating substrate of the pair of insulating substrates, the semiconductor integrated circuit includes: A mode terminal fixed to a power supply potential or a reference potential during operation of the semiconductor integrated circuit, and a power supply dummy terminal connected to the power supply potential or the reference potential inside the semiconductor integrated circuit, wherein the mode terminal is connected to the power supply dummy terminal. In the method of manufacturing a liquid crystal display device, Forming a wiring pattern on the pair of insulating substrates; Injecting and sealing liquid crystal between the pair of insulating substrates; Bonding the semiconductor integrated circuit onto one insulating substrate of the pair of insulating substrates, and connecting the mode terminal and the power supply dummy terminal by a wiring pattern formed on the pair of insulating substrates; A method of manufacturing a liquid crystal display device, characterized by comprising at least. The method of claim 6, A plurality of mode terminals are provided, and the power supply dummy terminal is disposed between the plurality of mode terminals. The method according to claim 7 or 8, The wiring pattern is a manufacturing method of a liquid crystal display device, characterized by comprising a transparent conductive film. The method according to any one of claims 7 to 9, And said insulating substrate is a glass substrate. The method according to any one of claims 7 to 10, The semiconductor integrated circuit includes a plurality of dummy terminals connected to each other by a wiring layer inside the semiconductor integrated circuit. A mobile telephone comprising the liquid crystal display device according to claim 1.