KR20000030813A - Ball mounting apparatus for BGA semiconductor chip - Google Patents

Ball mounting apparatus for BGA semiconductor chip Download PDF

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Publication number
KR20000030813A
KR20000030813A KR1020000013806A KR20000013806A KR20000030813A KR 20000030813 A KR20000030813 A KR 20000030813A KR 1020000013806 A KR1020000013806 A KR 1020000013806A KR 20000013806 A KR20000013806 A KR 20000013806A KR 20000030813 A KR20000030813 A KR 20000030813A
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KR
South Korea
Prior art keywords
circuit board
integrated circuit
ball
guide rail
pick
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KR1020000013806A
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Korean (ko)
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KR100363026B1 (en
Inventor
백명열
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김종기
주식회사 극동테크
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Priority to KR1020000013806A priority Critical patent/KR100363026B1/en
Publication of KR20000030813A publication Critical patent/KR20000030813A/en
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Publication of KR100363026B1 publication Critical patent/KR100363026B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: A ball supplier for fabricating a semiconductor chip of ball grid array is provided to lower bonding defect by minutely controlling the supply of ball for a contact point to an accurate position on an integrated circuit board. CONSTITUTION: A ball supplier for fabricating a BGA semiconductor chip transfers a vis ion camera(30) to a decided position along a specific path(35) for stopping an integrated circuit board(20) transferred along a guide rail(10) by being hung in a stopper(37). Then, the ball supplier senses an upper pick-up device(40) and the lower integrated circuit board by using the vis ion camera at the same time for comparing if each position decis ion unit(23,43) is located in a corresponding position each other. If they are crossed each other, the position is automatically controlled by controlling the pick-up device or the guide rail. Then, if the position decis ion units of the integrated circuit board and the pick-up device are focused in a corresponding position each other, the pick-up device is lowered to attach a ball(27) to the contact point on the integrated circuit board.

Description

볼그리드어레이 반도체칩 제조용 볼공급장치{Ball mounting apparatus for BGA semiconductor chip}Ball mounting apparatus for ball grid array semiconductor chip manufacturing

본 발명은 볼그리드어레이 반도체칩 제조용 볼공급장치에 관한 것으로서, 보다 상세하게는 접점용 볼이 집적회로기판의 정확한 위치에 부착될 수 있도록 정밀 제어되어 공급되는 볼그리드어레이 반도체칩 제조용 볼공급장치에 관한 것이다.The present invention relates to a ball supply device for manufacturing a ball grid array semiconductor chip, and more particularly, to a ball supply device for manufacturing a ball grid array semiconductor chip which is precisely controlled so that a contact ball can be attached to an accurate position of an integrated circuit board. It is about.

도 1은 종래 볼그리드어레이 반도체칩 제조용 볼공급장치의 구성도로서, 상기 BGA반도체칩 제조용 볼공급장치는 집적회로기판(20)이 순차적으로 이송 공급되는 가이드레일(10)과, 이 가이드레일(10) 상부에 수평 및 수직방향으로 이송되면서 접점용 볼(27)을 흡착 집적회로기판(20)상에 공급하는 픽업기구(40)와, 상기 가이드레일(10) 일측에 구비된 볼공급통(도면에 도시되지 않음)으로 구성된다. 이때, 상기 가이드레일(10)의 소정위치에는 스톱퍼(15)가 돌출 형성되어 가이드레일(10)을 따라 이송 공급되는 집적회로기판(20)이 상기 스톱퍼(15)에 걸려 미리 정해진 위치에 공급되도록 한다.1 is a configuration diagram of a ball supply device for manufacturing a conventional ball grid array semiconductor chip, wherein the ball supply device for manufacturing a BGA semiconductor chip includes a guide rail 10 through which an integrated circuit board 20 is sequentially transported and the guide rail ( 10) the pick-up mechanism 40 for supplying the contact ball 27 on the adsorption integrated circuit board 20 while being transported in the horizontal and vertical direction at the top, and a ball supply cylinder provided at one side of the guide rail 10; Not shown in the figure). At this time, the stopper 15 is protruded at a predetermined position of the guide rail 10 so that the integrated circuit board 20 which is transported and supplied along the guide rail 10 is caught by the stopper 15 and supplied to a predetermined position. do.

상기 BGA반도체칩에 사용되는 집적회로기판(20)은 최근에 필름형태로 제작되기 때문에 가이드레일(10)을 따라 이송 공급되도록 하기 위해서는 금속재로 된 얇은 사각테두리형태의 프레임(25)상에 접착테이프(26) 등으로 부착 고정된 상태로 공급된다.Since the integrated circuit board 20 used in the BGA semiconductor chip has been recently manufactured in the form of a film, in order to be supplied and supplied along the guide rail 10, an adhesive tape is formed on a frame 25 having a thin rectangular border shape made of metal. (26) It is supplied in a fixed state attached to it.

그러나, 이러한 집적회로기판(20)은 수작업에 의해 사각 프레임(25)상에 부착 고정되기 때문에, 집적회로기판(20)이 프레임(25)상의 정위치에서 어긋나게 부착되는 경우에는 상기 프레임(25)이 스톱퍼(15)에 의해 미리 정해진 위치에 셋팅되더라도 접점용 볼(27)의 부착위치가 틀어져 반도체칩의 접점불량을 초래하는 문제점이 있다.However, since the integrated circuit board 20 is attached to and fixed on the rectangular frame 25 by hand, when the integrated circuit board 20 is attached to the frame 25 at a fixed position, the frame 25 is shifted. Even if it is set at a predetermined position by the stopper 15, there is a problem that the attachment position of the contact ball 27 is misaligned, resulting in a defective contact of the semiconductor chip.

더욱이, 최근에는 집적회로기판(20) 위에 부착되는 접점용 볼(27)이 0.5㎜이하로 작아져 집적회로기판(20)이 조금만 어긋나더라도 이를 정해진 위치에 부착할 수 없기 때문에 생산효율이 저하되고 있다.Moreover, in recent years, the contact ball 27 attached to the integrated circuit board 20 has become smaller than 0.5 mm, so that even if the integrated circuit board 20 is slightly displaced, it cannot be attached to a predetermined position, thereby reducing production efficiency. have.

본 발명은 상기의 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 접점용 볼이 집적회로기판의 정확한 위치에 공급되도록 정밀 제어되어 접점불량을 낮출 수 있도록 된 새로운 구조의 볼그리드어레이 반도체칩 제조용 볼공급장치를 제공하는 것이다.The present invention is to solve the above problems, an object of the present invention is a ball grid array semiconductor ball manufacturing ball of a new structure that can be precisely controlled so that the contact ball is supplied to the correct position of the integrated circuit board to lower the contact failure It is to provide a supply device.

도 1은 종래 볼그리드어레이 반도체칩 제조용 볼공급장치의 구성도1 is a block diagram of a ball supply device for manufacturing a conventional ball grid array semiconductor chip

도 2는 집적회로기판이 프레임에 부착된 모습을 도시한 평면도2 is a plan view illustrating a state in which an integrated circuit board is attached to a frame.

도 3은 본 발명의 일실시예에 따른 구성도3 is a block diagram according to an embodiment of the present invention

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10 : 가이드레일 20 : 집적회로기판10: guide rail 20: integrated circuit board

23 : 위치결정부 25 : 프레임23: positioning unit 25: frame

30 : 비젼비젼카메라 37 : 스톱퍼30: vision vision camera 37: stopper

40 : 픽업기구 43 : 위치결정부40: pickup mechanism 43: positioning unit

50 : 제어부50: control unit

본 발명에 따르면, 집적회로기판(20)이 이송 공급되는 가이드레일(10)과, 이 가이드레일(10) 상부에 수평 및 수직 이송되도록 설치되어 접점용 볼(27)을 흡착하여 상기 집적회로기판(20) 위에 공급하는 픽업기구(40)가 구비된 BGA반도체칩 제조용 볼공급장치에 있어서, 상기 가이드레일(10) 상부의 소정 경로(35)를 따라 이송되면서 미리 정해진 위치에서 집적회로기판(20)과 픽업기구(40)의 위치결정부(23,43)를 감지하는 비젼카메라(30)와, 이 비젼카메라(30)의 일측에 신축 작동되도록 설치되어 가이드레일(10)을 따라 이송되는 집적회로기판(20)이 정해진 위치에 정지되도록 하는 스톱퍼(37)와, 상기 비젼카메라(30)에 연결되어 집적회로기판(20)과 픽업기구(40)가 서로 대응되는 지점에 위치되도록 가이드레일(10) 또는 픽업기구(40)를 조절하는 제어부(50)를 포함하여 구성된 것을 특징으로 하는 볼그리드어레이 반도체칩 제조용 볼공급장치가 제공된다.According to the present invention, the integrated circuit board 20 is installed to be transported and supplied to the guide rail 10 and horizontally and vertically transported on the guide rail 10 to absorb the contact ball 27 to the integrated circuit board A ball supply device for manufacturing a BGA semiconductor chip provided with a pick-up mechanism 40 to be supplied above, wherein the integrated circuit board 20 is moved at a predetermined position while being transported along a predetermined path 35 above the guide rail 10. And the vision camera 30 for sensing the positioning units 23 and 43 of the pick-up mechanism 40, and the integrated camera which is installed on one side of the vision camera 30 to be stretched and moved along the guide rail 10. A stopper 37 for stopping the circuit board 20 at a predetermined position, and a guide rail connected to the vision camera 30 so that the integrated circuit board 20 and the pick-up mechanism 40 are positioned at corresponding points. 10) or comprises a control unit 50 for adjusting the pick-up mechanism 40 Provided is a ball supply device for manufacturing a ball grid array semiconductor chip.

이하, 본 발명의 바람직한 실시예를 첨부한 도면에 의거하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

도 3은 본 발명의 일실시예에 따른 구성도이다. 이를 참조하면, 상기 BGA반도체칩 제조용 볼공급장치는 집적회로기판(20)이 이송 공급되는 가이드레일(10)과, 이 가이드레일(10) 상부에 설치되어 볼(27)을 흡착 집적회로기판(20) 위에 공급하는 픽업기구(40)는 종래와 동일하며, 상기 가이드레일(10) 상부에는 소정 경로(35)를 따라 이송되며 미리 정해진 위치에서 집적회로기판(20)과 픽업기구(40)를 동시에 감지하는 비젼카메라(30)와, 이 비젼카메라(30)의 일측에 신축 작동되도록 설치되어 집적회로기판(20)이 정해진 위치에 공급되도록 하는 스톱퍼(37)와, 상기 비젼카메라(30)에 연결되어 집적회로기판(20)과 픽업기구(40)가 서로 대응되는 지점에 위치되도록 가이드레일(10) 또는 픽업기구(40)를 조절하는 제어부(50)로 구성된다.3 is a block diagram according to an embodiment of the present invention. Referring to this, the ball supply device for manufacturing BGA semiconductor chips includes a guide rail 10 to which the integrated circuit board 20 is transferred and supplied, and the ball 27 is installed on the guide rail 10 to absorb the balls 27. The pickup mechanism 40 to be supplied above 20 is the same as the conventional method. The pickup rail 40 is transferred along a predetermined path 35 on the guide rail 10, and the integrated circuit board 20 and the pickup mechanism 40 are disposed at a predetermined position. A vision camera 30 for sensing at the same time, a stopper 37 is installed on one side of the vision camera 30 is stretched to operate so that the integrated circuit board 20 is supplied to a predetermined position, and to the vision camera 30 It is connected to the integrated circuit board 20 and the pick-up mechanism 40 is composed of a control unit 50 for adjusting the guide rail 10 or the pickup mechanism 40 to be located at a point corresponding to each other.

상기 비젼카메라(30)는 가이드레일(10) 상부에 마련된 소정 경로(35)를 따라 이송되며, 그 상면과 저면에 각기 감지부(32,34)가 구비되어 상부의 픽업기구(40)와 하부의 집적회로기판(20)을 동시에 감지하여 집적회로기판(20)의 위치결정부(23)와 픽업기구(40)의 위치결정부(43)가 서로 대응되는 지점에 위치되는가를 비교 판단할 수 있도록 한다.The vision camera 30 is transported along a predetermined path 35 provided at the upper part of the guide rail 10, and sensing units 32 and 34 are respectively provided on the upper and lower surfaces thereof, and the pick-up mechanism 40 and the lower part of the vision camera 30 are provided. Simultaneously detect the integrated circuit board 20 of the integrated circuit board 20 can determine whether the positioning section 23 of the integrated circuit board 20 and the positioning section 43 of the pickup mechanism 40 is located at a point corresponding to each other Make sure

상기 제어부(50)는 비젼카메라(30) 및 픽업기구(40)에 연결되어 감지된 집적회로기판(20)의 위치결정부(23)와 픽업기구(40)의 위치결정부(43)가 서로 대응되는 지점에 위치되지 않았을 경우, 상기 픽업기구(40) 또는 가이드레일(10)을 자동 조절하여 접점용 볼(27)이 집적회로기판(20)의 정확한 위치에 부착되도록 제어하게 된다.The control unit 50 is connected to the vision camera 30 and the pick-up mechanism 40 so that the detected positioning unit 23 of the integrated circuit board 20 and the positioning unit 43 of the pick-up mechanism 40 are connected to each other. When not located at the corresponding point, the pick-up mechanism 40 or the guide rail 10 is automatically adjusted so that the contact ball 27 is attached to the correct position of the integrated circuit board 20.

상기 스톱퍼(37)는 비젼카메라(30)의 일측면에 수직 설치되어 신축 작동되며, 신장시 가이드레일(10)을 따라 이송 공급되는 집적회로기판(20)이 이 스톱퍼(37)에 걸려 가이드레일(10)의 정해진 위치에 정지되도록 한다.The stopper 37 is vertically installed on one side of the vision camera 30 and is stretched and operated, and the integrated circuit board 20 which is supplied and fed along the guide rail 10 when stretched is caught by the stopper 37. It is made to stop at the fixed position of (10).

따라서, 상기 BGA반도체칩 제조용 볼공급장치는 비젼카메라(30)가 소정의 경로(35)를 따라 정해진 위치로 이송된 후 스톱퍼(37)를 신장시켜 가이드레일(10)을 따라 이송되는 집적회로기판(20)이 이 스톱퍼(37)에 걸려 정지되도록 한다.Therefore, the ball supply device for manufacturing BGA semiconductor chips is an integrated circuit board that is transferred along the guide rail 10 by extending the stopper 37 after the vision camera 30 is transferred to a predetermined position along a predetermined path 35. 20 is caught by this stopper 37 to stop.

이어서, 상기 비젼카메라(30)에 의해 하부의 집적회로기판(20)과 상부의 픽업기구(40)를 동시에 감지하여 각 위치결정부(23,43)가 서로 대응되는 지점에 위치되는가를 비교 판단하여 서로 어긋나 있는 경우에는 상기 픽업기구(40) 또는 가이드레일(10)을 조절하여 자동적으로 그 위치를 맞추게 된다.Subsequently, the vision camera 30 simultaneously detects the lower integrated circuit board 20 and the upper pick-up mechanism 40 to compare and determine whether each of the positioning units 23 and 43 is located at a point corresponding to each other. If they are shifted from each other, the pickup mechanism 40 or the guide rail 10 is adjusted to automatically adjust its position.

이어서, 상기 스톱퍼(37)를 수축시킨 상태에서 비젼카메라(30)를 집적회로기판(20)의 후단쪽으로 정해진 경로(35)를 따라 이송시킨 후 다시 집적회로기판(20)과 픽업기구(40)를 동시에 감지하여 전술한 바와 같이, 각 위치결정부(23,43)가 서로 대응되는 지점에 위치되는지를 확인하고 서로 어긋난 경우 픽업기구(40) 또는 가이드레일(10)을 조절하여 자동적으로 그 위치를 맞추게 된다.Subsequently, in the state where the stopper 37 is contracted, the vision camera 30 is transferred along the path 35 defined toward the rear end of the integrated circuit board 20, and then the integrated circuit board 20 and the pickup mechanism 40 are again transferred. As described above, by simultaneously detecting the respective positioning units 23 and 43 are located at a point corresponding to each other, and if they are shifted from each other by adjusting the pickup mechanism 40 or the guide rail 10 automatically Will be adjusted.

이와 같은 과정에 의해 집적회로기판(20)과 픽업기구(40)의 위치결정부(23,43)가 서로 대응되는 지점에 맞추어지면, 상기 픽업기구(40)를 하강시켜 집적회로기판(20) 위에 접점용 볼(27)을 부착하게 된다.When the integrated circuit board 20 and the positioning units 23 and 43 of the pick-up mechanism 40 are aligned to correspond to each other by this process, the pick-up mechanism 40 is lowered so that the integrated circuit board 20 is lowered. The contact ball 27 is attached on the top.

이상에서와 같은 본 발명에 의하면, 집적회로기판(20)의 위치결정부(23)와 픽업기구(40)의 위치결정부(43)가 자동적으로 맞추어져 픽업기구(40)에 흡착된 접점용 볼(27)이 집적회로기판(20)의 정확한 위치에 공급 부착되므로, 접점불량을 방지할 수 있게 된다.According to the present invention as described above, the positioning portion 23 of the integrated circuit board 20 and the positioning portion 43 of the pick-up mechanism 40 are automatically matched for the contact adsorbed on the pick-up mechanism 40. Since the ball 27 is supplied and attached at the correct position of the integrated circuit board 20, contact failure can be prevented.

Claims (1)

집적회로기판(20)이 이송 공급되는 가이드레일(10)과, 이 가이드레일(10) 상부에 수평 및 수직 이송되도록 설치되어 접점용 볼(27)을 흡착하여 상기 집적회로기판(20) 위에 공급하는 픽업기구(40)가 구비된 BGA반도체칩 제조용 볼공급장치에 있어서, 상기 가이드레일(10) 상부의 소정 경로(35)를 따라 이송되면서 미리 정해진 위치에서 집적회로기판(20)과 픽업기구(40)의 위치결정부(23,43)를 감지하는 비젼카메라(30)와, 이 비젼카메라(30)의 일측에 신축 작동되도록 설치되어 가이드레일(10)을 따라 이송되는 집적회로기판(20)이 정해진 위치에 정지되도록 하는 스톱퍼(37)와, 상기 비젼카메라(30)에 연결되어 집적회로기판(20)과 픽업기구(40)가 서로 대응되는 지점에 위치되도록 가이드레일(10) 또는 픽업기구(40)를 조절하는 제어부(50)를 포함하여 구성된 것을 특징으로 하는 볼그리드어레이 반도체칩 제조용 볼공급장치.The guide rail 10 to which the integrated circuit board 20 is conveyed and supplied, and is installed to be horizontally and vertically transported on the guide rail 10, absorbs the contact ball 27 and is supplied onto the integrated circuit board 20. In the BGA semiconductor chip manufacturing ball supply device having a pickup mechanism 40, the integrated circuit board 20 and the pickup mechanism at a predetermined position while being transported along a predetermined path 35 above the guide rail 10. Vision camera 30 for detecting the positioning portion (23, 43) of the 40, and the integrated circuit board 20 is installed to be stretched to operate on one side of the vision camera 30 is moved along the guide rail (10) The guide rail 10 or the pick-up mechanism connected to the vision camera 30 and the integrated circuit board 20 and the pick-up mechanism 40 are positioned at positions corresponding to each other. Characterized in that it comprises a control unit 50 for adjusting the 40 It is a ball grid array semiconductor chip for making the ball feeder.
KR1020000013806A 2000-03-18 2000-03-18 Ball mounting apparatus for BGA semiconductor chip KR100363026B1 (en)

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KR100363026B1 KR100363026B1 (en) 2002-11-30

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