KR20000020299U - A device for removing the contaminated material on the anti-dust glass of semiconductor stepper - Google Patents
A device for removing the contaminated material on the anti-dust glass of semiconductor stepper Download PDFInfo
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- KR20000020299U KR20000020299U KR2019990007345U KR19990007345U KR20000020299U KR 20000020299 U KR20000020299 U KR 20000020299U KR 2019990007345 U KR2019990007345 U KR 2019990007345U KR 19990007345 U KR19990007345 U KR 19990007345U KR 20000020299 U KR20000020299 U KR 20000020299U
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- purge gas
- foreign matter
- glass
- dust
- chamber
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- 239000011521 glass Substances 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000000463 material Substances 0.000 title claims abstract description 10
- 239000000428 dust Substances 0.000 title 1
- 238000010926 purge Methods 0.000 claims abstract description 34
- 238000005286 illumination Methods 0.000 claims abstract description 14
- 238000007599 discharging Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 5
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 29
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
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- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
본 고안은 반도체 웨이퍼 노광용 스테퍼 장비의 방진그라스 이물질 제거장치에 관한 것으로서, 종래의 반도체 웨이퍼 노광용 스테퍼 장비는 방진그라스 상에 이물질이 부착되기 쉬웠으며, 또한 이물질이 부착된 경우에는 웨이퍼에 불완전하게 전사되어 패턴불량이 발생되고, 이에 의하여 수율이 저하되는 문제점이 있었다. 본 고안의 방진그라스 이물질 제거장치는 조명계의 일부를 밀폐시켜 방진그라스에 이물질이 부착되는 것을 근본적으로 방지하고, 만약 부착시에는 퍼지가스의 분사에 의하여 용이하게 제거시켜 이물질 부착으로 비롯되는 반도체 웨이퍼의 패턴불량을 감소시킬 수 있다.The present invention relates to a dustproof foreign matter removal apparatus of the semiconductor wafer exposure stepper equipment, the conventional semiconductor wafer exposure stepper equipment is easy to adhere to the foreign matter on the dustproof glass, and when the foreign matter is attached to the wafer incompletely transferred There was a problem that the pattern defect is generated, whereby the yield is reduced. The dust-proof glass foreign material removal device of the present invention essentially seals a part of the illumination system to prevent foreign matters from adhering to the dust-proof glass, and when attached, it is easily removed by the injection of purge gas to remove the foreign matter resulting from the adhesion of the semiconductor wafer. It can reduce the pattern defect.
Description
본 고안은 반도체 웨이퍼 노광용 장비인 스테퍼(Stepper)에 관한 것으로서, 보다 상세하게는 스테퍼 장비를 구성하는 조명계의 일부를 밀폐시켜 방진그라스에 이물질이 부착되는 것을 근본적으로 방지하고, 만약 부착시에는 퍼지가스의 분사에 의하여 용이하게 제거시켜 이물질 부착으로 비롯되는 반도체 웨이퍼의 패턴불량을 사전에 방지할 수 있는 반도체 웨이퍼 스테퍼 장비의 방진그라스 이물질 제거장치에 관한 것이다.The present invention relates to a stepper, a semiconductor wafer exposure equipment, and more specifically, to seal a part of the illumination system constituting the stepper equipment to prevent foreign matter from adhering to the dust-proof glass, and if attached, purge gas The present invention relates to a dust-proof glass foreign material removal apparatus of a semiconductor wafer stepper device that can be easily removed by spraying and can prevent a pattern defect of a semiconductor wafer caused by foreign matter adhesion in advance.
일반적으로 반도체 웨이퍼 제조공정 중에는 웨이퍼의 상면에 감광유제(Photo Resist)를 도포하여 구운 후, 상기 웨이퍼의 상측에 회로 패턴이 반복 형성된 레티클(Reticle)을 배치하고, 상기 레티클의 상부에서 자외선 광원을 비추어 상기 회로 패턴을 웨이퍼 상에 노출시켜 이식하는 노광공정(Exposure Process)이 있으며, 스테퍼(Stepper)는 이와 같은 노광공정을 수행하기 위한 장비이다.In general, during the semiconductor wafer manufacturing process, a photoresist is applied to the top surface of the wafer and baked, and a reticle having a circuit pattern repeatedly disposed on the top of the wafer, and an ultraviolet light source is illuminated from the top of the reticle. There is an exposure process for exposing and implanting the circuit pattern on a wafer, and a stepper is a device for performing such an exposure process.
도 1은 일반적으로 사용되는 반도체 웨이퍼 노광장비의 조명계를 도시한 계통도이다.1 is a schematic diagram illustrating an illumination system of a semiconductor wafer exposure apparatus generally used.
도 1에 도시된 바와 같이, 종래의 노광장비는 레티클(7)을 기준으로 그 이전의 각종 렌즈로 구성된 조명계와, 상기 레티클(7) 이후의 축소렌즈(8) 등으로 구성되어 최종적으로 웨이퍼(9)까지 광원을 전송하기 위한 투영렌즈계로 구성된다.As shown in FIG. 1, the conventional exposure apparatus is composed of an illumination system composed of various lenses before and after the reticle 7, and a reduction lens 8 or the like after the reticle 7. 9) is composed of a projection lens system for transmitting the light source.
상기 조명계는 노광원(1)으로 부터 노광에너지가 생성되며, 각종렌즈 및 거울(3) 등을 경유하여 도달된 빛(2)을 최종적으로 집광하여 전송시키는 제3 콘덴서 렌즈(3'rd Condensor Lens)(4)와, 웨이퍼의 얼라인(Align)을 조정하는 아이에이 스코프(IA Scope)(5)와, 노광공정중 이물질이 레티클(7)에 부착되는 것을 방지하기 위하여 설치된 광선 투과형 거울인 방진그라스(Anti-Dust Glass)(6)가 설치된다.In the illumination system, exposure energy is generated from the exposure source 1, and a third condenser lens (3'rd condensor lens) which condenses and transmits the light 2 finally reached through various lenses and mirrors 3 and the like. (4), an IA Scope (5) for adjusting the alignment of the wafer, and a dust-proof mirror which is a light transmitting mirror installed to prevent foreign matter from adhering to the reticle (7) during the exposure process. Glass (Anti-Dust Glass) 6 is installed.
상기 방진그라스(6)의 하부에는 회로 패턴이 반복 형성된 레티클(7)이 배치되고, 상기 투영렌즈계는 상기 레티클(7)의 하부에서 상기 회로를 5:1로 축소하여 웨이퍼(9)에 전송하는 축소렌즈(8)와, 상기 웨이퍼(9)가 설치되는 스테이지(미도시)로 구성된다.A reticle 7 having a circuit pattern repeatedly disposed below the dustproof glass 6 is disposed, and the projection lens system reduces the circuit 5: 1 at the bottom of the reticle 7 to transfer to the wafer 9. It comprises a reduction lens 8 and a stage (not shown) on which the wafer 9 is installed.
상기와 같이 구성된 종래의 반도체 웨이퍼 노광장비의 조명계에 의한 작용을 설명하면 다음과 같다.Referring to the operation by the illumination system of the conventional semiconductor wafer exposure equipment configured as described above are as follows.
상기 스테퍼 장비의 조명계에 있어서, 노광원(1)으로 부터 발광된 빛(2)은 최종적으로 제3 콘덴서렌즈(4)에서 집광되어 아이에이 스코프(5)의 거울을 경유하여 방진그라스(6)에 도달된다. 상기 방진그라스(6)를 통과한 빛(2)이 레티클(7)의 패턴을 투과하여 축소렌즈(8)를 투과한 후, 웨이퍼(9)에 패턴을 노광시킨다.In the illumination system of the stepper equipment, the light 2 emitted from the exposure source 1 is finally collected by the third condenser lens 4 and is dust-proof glass 6 via the mirror of the eye scope 5. Is reached. After the light 2 passing through the dustproof glass 6 passes through the pattern of the reticle 7 and passes through the reduction lens 8, the pattern is exposed to the wafer 9.
그러나, 도 2에 도시된 바와 같이, 종래 반도체 웨이퍼 노광장비의 방진그라스(6)에 이물질(10)이 부착된 경우에는 조명계의 노광원(1)으로 부터 생성된 빛(2)이 방진그라스(6)를 투과하는 과정에서 이물질이 부착된 부분의 투과광이 레티클(7)과 축소렌즈(8)를 투과하여 웨이퍼(9)에 노광시 정확한 해상도를 얻을 수 없으므로 웨이퍼(9)상에 패턴불량(11)이 발생되고, 이에 의하여 수율이 저하되는 문제점이 있었다.However, as shown in FIG. 2, when the foreign matter 10 is attached to the dustproof glass 6 of the conventional semiconductor wafer exposure equipment, the light 2 generated from the exposure source 1 of the illumination system is dustproof glass ( 6) In the process of passing through, the transmitted light of the portion where the foreign matter is attached passes through the reticle 7 and the reduction lens 8 so that accurate resolution cannot be obtained when the wafer 9 is exposed to the pattern 9. 11) is generated, whereby the yield is lowered.
본 고안은 상기와 같은 종래기술의 문제점을 해결하기 위하여 안출된 것으로서, 본 고안의 목적은 반도체 웨이퍼 노광용 스테퍼 장비에서 이물질이 부착되는 조명계의 일부를 밀폐시켜 방진그라스에 이물질의 부착을 사전에 방지하고, 부착된 이물질을 용이하게 제거함으로써, 반도체 웨이퍼의 패턴불량을 사전에 방지할 수 있는 반도체 스테퍼 장비의 방진그라스 이물질 제거장치를 제공하는 데 있다.The present invention has been made to solve the problems of the prior art as described above, the object of the present invention is to seal the part of the illumination system to which the foreign matter is attached in the stepper equipment for semiconductor wafer exposure to prevent the adhesion of foreign matter to the dust-proof glass in advance The present invention provides a dustproof glass foreign material removal apparatus of a semiconductor stepper device which can prevent a pattern defect of a semiconductor wafer in advance by easily removing foreign matters attached thereto.
도 1은 종래 반도체 웨이퍼 노광장비의 조명계를 도시한 계통도.1 is a system diagram showing an illumination system of a conventional semiconductor wafer exposure equipment.
도 2는 종래 반도체 웨이퍼 노광장비의 방진그라스에 이물질이 부착된 경우의 노광상태를 도시한 계통도.2 is a schematic diagram illustrating an exposure state when a foreign matter is attached to the dustproof glass of a conventional semiconductor wafer exposure apparatus.
도 3은 본 고안에 따른 방진그라스 이물질 제거장치가 구비된 노광장비의 조명계를 도시한 계통도.Figure 3 is a system diagram showing an illumination system of the exposure equipment with a dust-proof glass foreign material removing apparatus according to the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1 ; 노광원 2 ; 빛One ; Exposure source 2; light
3 ; 렌즈 4 ; 제3 콘덴서렌즈3; Lens 4; Third condenser lens
5 ; 아이에이 스코프 6 ; 방진그라스5; Aiscope 6; Dustproof Grass
7 ; 레티클 8 ; 축소렌즈7; Reticle 8; Zoom lens
9 ; 웨이퍼 10 ; 이물질9; Wafer 10; Foreign substance
11 ; 패턴불량부 20 ; 이물질 제거장치11; Pattern defective part 20; Foreign material removal device
21 ; 챔버 22 ; 퍼지가스 공급관21; Chamber 22; Purge gas supply pipe
23 ; 퍼지가스 배기관23; Purge gas exhaust pipe
상기 목적을 달성하기 위하여, 본 고안은 노광원에 의해 발생된 빛이 제3 콘덴서렌즈, 아이에이 스코프, 방진그라스, 레티클 및 축소렌즈로 투과되는 조명계를 구성하는 반도체 스테퍼 장비의 방진그라스 이물질 제거장치에 있어서, 상기 아이에이 스코프와 방진그라스를 포함하며 밀폐공간부가 형성되는 챔버와, 상기 챔버의 일측에 설치되어 상기 방진그라스의 상면으로 퍼지가스를 분사하는 퍼지가스 공급관과, 상기 챔버의 타측에 설치되어 공급된 퍼지가스와 부유된 이물질을 배출시키는 퍼지가스 배기관으로 구성된 것을 특징으로 한다.In order to achieve the above object, the present invention is a dust-proof glass foreign material removing apparatus of the semiconductor stepper equipment constituting the illumination system through which the light generated by the exposure source is transmitted to the third condenser lens, eye scope, dust-proof glass, reticle and the reduction lens. In the chamber, including the eye scope and the anti-vibration glass, the chamber is formed in a sealed space portion, a purge gas supply pipe is installed on one side of the chamber to inject the purge gas to the upper surface of the anti-vibration glass, and installed on the other side of the chamber It characterized in that it consists of a purge gas exhaust pipe for discharging the supplied purge gas and suspended foreign matter.
이하, 본 고안의 바람직한 실시례를 첨부도면에 의거하여 설명한다.Hereinafter, preferred embodiments of the present invention will be described based on the accompanying drawings.
도 3은 본 고안에 따른 방진그라스 이물질 제거장치가 구비된 노광장비의 조명계를 도시한 계통도로서, 본 실시례에 따른 방진그라스 이물질 제거장치(20)는 노광장비인 스테퍼의 아이에이 스코프(5)와 방진그라스(6)를 감싸는 챔버(21)와, 퍼지가스(Perge Gas)를 분사하는 퍼지가스 공급관(22)과, 분사된 퍼지가스와 부유된 이물질을 배출시키는 퍼지가스 배기관(23)으로 구성된다.3 is a schematic diagram illustrating an illumination system of an exposure apparatus equipped with a dustproof foreign matter removing apparatus according to the present invention, wherein the dustproof foreign matter removing apparatus 20 according to the present embodiment is an eye scope 5 of a stepper as an exposure apparatus. And a chamber 21 surrounding the dustproof glass 6, a purge gas supply pipe 22 for injecting purge gas, and a purge gas exhaust pipe 23 for discharging the injected purge gas and suspended foreign matter. do.
상기 챔버(21)는 아이에이 스코프(5)와 방진그라스(6)를 포함하여 감싸는 밀폐된 공간부를 형성하여 외부의 이물질 유입을 차단시킨다.The chamber 21 forms an enclosed space surrounding the eye scope 5 and the dustproof glass 6 to block the inflow of foreign substances.
상기 챔버(21)의 일측에서는 방진그라스(6)의 상면을 향하여 퍼지가스를 분사하는 퍼지가스 공급관(22)이 형성되며, 상기 퍼지가스는 질소 또는 압축공기가 사용되어, 상기 퍼지가스 공급관(22)은 챔버(21)의 외부에 설치되어 있는 별도의 압축기(미도시)에 의하여 배관으로 연장된다.On one side of the chamber 21 is formed a purge gas supply pipe 22 for injecting a purge gas toward the upper surface of the dustproof glass 6, the purge gas is nitrogen or compressed air is used, the purge gas supply pipe 22 ) Extends into the pipe by a separate compressor (not shown) installed outside the chamber 21.
상기 챔버(21)의 타측에서는 퍼지가스 공급관(22)에 의해 공급된 퍼지가스와 방진그라스(6)에 분사되어 부유된 이물질을 배출시키는 퍼지가스 배기관(23)이 형성된다. 상기 퍼지가스 배기관(23)은 챔버(21)의 외부로 연장되어 바람직하게는 필터(미도시)를 통하여 배출된다.On the other side of the chamber 21 is formed a purge gas exhaust pipe 23 is injected into the purge gas supplied by the purge gas supply pipe 22 and the dust-proof glass 6 to discharge the suspended foreign matter. The purge gas exhaust pipe 23 extends outside the chamber 21 and is preferably discharged through a filter (not shown).
상기의 구성을 갖는 방진그라스 이물질 제거장치의 작용을 살펴보면 다음과 같다.Looking at the operation of the dust-proof glass foreign material removal device having the above configuration as follows.
도 3에 도시된 바와 같이, 상기 챔버(21)는 측면에 퍼지가스 공급관(22)과 퍼지가스 배기관(23)이 연결되며 아이에이 스코프(5)와 방진그라스(6)를 포함하여 감싸고 있으므로 그 내부는 외부의 부유성 이물질과 차단되도록 구성된다.As shown in FIG. 3, the chamber 21 has a purge gas supply pipe 22 and a purge gas exhaust pipe 23 connected to the side thereof, and includes an eye scope 5 and a dustproof glass 6 so as to surround the chamber 21. The inside is configured to block the external floating foreign matter.
그러나, 아이에이 스코프(5), 노광장비내의 다른 부분을 정비하거나 또는 기타 영향에 의하여 방진그라스(6)에 이물질이 부착되는 경우에는 퍼지가스 공급관(22)을 통하여 퍼지가스를 방진그라스(6)의 상면에 분사시켜 이물질을 부유시키고, 부유된 이물질을 퍼지가스 배기관(23)을 통하여 배출시킨다.However, when foreign matter adheres to the dustproof glass 6 due to the maintenance of the eye scope 5, other parts of the exposure equipment, or other influences, the purge gas is supplied to the dustproof glass 6 through the purge gas supply pipe 22. By spraying on the upper surface of the foreign matter is suspended, and the suspended foreign matter is discharged through the purge gas exhaust pipe (23).
한편, 상기 퍼지가스 공급관(22) 및 퍼지가스 배기관(23)은 별도의 제어밸브에 의하여 정하여진 일정시간 및 일정회수만 퍼지가스를 분사하고 배기시키는 것이 바람직하며, 상기 퍼지가스 배기관(23)은 챔버(21)의 외부로 연장되어 필터를 통하여 배출되어 외부공기의 오염을 방지하는 것이 바람직하다.Meanwhile, the purge gas supply pipe 22 and the purge gas exhaust pipe 23 preferably inject and exhaust the purge gas only for a predetermined time and a predetermined number of times determined by separate control valves, and the purge gas exhaust pipe 23 is It is preferable to extend to the outside of the chamber 21 to be discharged through the filter to prevent contamination of external air.
이상에서 설명한 바와 같이, 본 고안에 의한 반도체 스테퍼 장비의 방진그라스 이물질 제거장치는 이물질이 방진그라스에 부착되는 것을 근본적으로 방지할 수 있으며, 만약 부착시에는 퍼지가스의 분사에 의하여 용이하게 제거시켜 이물질 부착으로 비롯되는 웨이퍼의 패턴불량을 감소시키는 효과가 있다.As described above, the dustproof glass foreign material removal apparatus of the semiconductor stepper device according to the present invention can prevent the foreign matter from adhering to the dustproof glass, and, if attached, easily remove the foreign matter by spraying the purge gas. There is an effect of reducing the pattern defect of the wafer resulting from adhesion.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019990007345U KR20000020299U (en) | 1999-05-01 | 1999-05-01 | A device for removing the contaminated material on the anti-dust glass of semiconductor stepper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019990007345U KR20000020299U (en) | 1999-05-01 | 1999-05-01 | A device for removing the contaminated material on the anti-dust glass of semiconductor stepper |
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| Publication Number | Publication Date |
|---|---|
| KR20000020299U true KR20000020299U (en) | 2000-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019990007345U KR20000020299U (en) | 1999-05-01 | 1999-05-01 | A device for removing the contaminated material on the anti-dust glass of semiconductor stepper |
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| KR (1) | KR20000020299U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100842479B1 (en) * | 2006-12-28 | 2008-07-01 | 동부일렉트로닉스 주식회사 | Method for preventing a contamination of a scanner lens and apparatus thereof |
| KR101399303B1 (en) * | 2008-12-05 | 2014-05-26 | 엘지디스플레이 주식회사 | Exposing apparatus for flat panel display device |
| KR20180068001A (en) * | 2016-12-13 | 2018-06-21 | (주)에스제이엔 | Protecting device for electron beam column |
-
1999
- 1999-05-01 KR KR2019990007345U patent/KR20000020299U/en not_active Application Discontinuation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100842479B1 (en) * | 2006-12-28 | 2008-07-01 | 동부일렉트로닉스 주식회사 | Method for preventing a contamination of a scanner lens and apparatus thereof |
| KR101399303B1 (en) * | 2008-12-05 | 2014-05-26 | 엘지디스플레이 주식회사 | Exposing apparatus for flat panel display device |
| KR20180068001A (en) * | 2016-12-13 | 2018-06-21 | (주)에스제이엔 | Protecting device for electron beam column |
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