KR20000010797U - Rotary Drying Equipment for Semiconductor Manufacturing - Google Patents

Abstract

The present invention relates to a rotary drying apparatus for manufacturing a semiconductor, and forms a rotating plate rotated by a rotating motor in a process chamber, and mounts a wafer cassette equipped with a plurality of wafers on the rotating plate to dry the wafer by centrifugal force. In the wafer drying apparatus for manufacturing a semiconductor, the process chamber is provided with a heating unit so that the process chamber is heated to a constant temperature by the heating unit, and pure droplets attached to the inner wall surface of the process chamber are evaporated by the heating unit. It is a rotary drying device for semiconductor manufacturing that keeps the atmosphere in the chamber at low humidity.

Description

Rotary Drying Equipment for Semiconductor Manufacturing

The present invention relates to a rotary drying apparatus for manufacturing a semiconductor, and more particularly, to a semiconductor manufacturing apparatus including a heating unit in a process chamber of a rotary drying apparatus to evaporate pure droplets attached to an inner wall surface of a process chamber to keep the process chamber in a low humidity state. It is a rotary drying device.

Generally, a semiconductor device is manufactured by performing a process such as deposition or etching on a wafer. Since various foreign matters adhere to the wafer surface during the deposition or etching process, the wafer is washed with water and washed with pure water. It goes through a rinse process.

After the cleaning and washing processes are performed as described above, the wafer is dried using a rotary drying method in which moisture is dried by centrifugal force while rotating at a speed of approximately 800 to 1,000 rpm while a plurality of wafers are loaded in a wafer cassette. The boiling point is low, and the wafer drying process proceeds through a vapor drying method in which water is removed by reacting pure water and IPA vapor with each other using IPA (Isopropyl Alcohol) vapor which dissolves pure water easily.

FIG. 1 is a simplified diagram of a rotary drying apparatus using centrifugal force in a conventional wafer drying method, and 'a' denotes pure droplets attached to an inner wall surface of a process chamber.

The conventional rotary drying apparatus shown in FIG. 1 includes a process chamber 1 having a discharge line 4 through which pure water is discharged, a rotating plate 2 formed in the process chamber 1, and a rotating plate 2. It consists of a rotary motor (5) for rotating.

In addition, a cassette holder 3 is formed on the rotating plate 2 to fix the wafer cassette 6 on which the plurality of wafers 7 are mounted.

Drying of the wafer by such a rotary drying apparatus proceeds when the wafer cassette 6 on which the plurality of wafers 7 are mounted is moved onto the rotating plate 2 in the process chamber 1.

At this time, the wafer cassette 6 is fixed by the holder 3 of the rotating plate 2.

When the wafer cassette 6 is stably fixed, the rotary motor 5 rotates the rotating plate 2 at high speed to generate centrifugal force.

Pure water droplets on the surface of the wafer 7 flow outward from the center of the wafer 7 by the centrifugal force and fall to the lower end of the process chamber 1 to the outside of the process chamber 1 through the discharge line 4. It is discharged and wafer drying is completed.

However, in the conventional rotary drying apparatus, the pure water on the surface of the wafer flows outwardly toward the center of the wafer by centrifugal force in the process of removing the pure droplets, and drops to the bottom of the process chamber. It is attached to the inner wall of the process chamber without being discharged.

Therefore, the pure water droplets attached to the inner wall surface of the reaction chamber lower the efficiency of rotation drying by maintaining the atmosphere in the process chamber in a high humidity state.

In addition, the water droplets dropped by the centrifugal force bounces again while hitting the wall surface of the reaction chamber and reattach onto the wafer.

The object of the present invention is to provide a rotary drying apparatus for semiconductor manufacturing in which pure droplets attached to the wall of the reaction chamber are smoothly removed to increase the efficiency of wafer rotation drying.

Therefore, in order to achieve the above object, the present invention forms a rotating plate that is rotated by a rotating motor in a process chamber, and mounts a wafer cassette on which the plurality of wafers are mounted on the rotating plate, thereby drying the wafer by centrifugal force. In the wafer drying apparatus for manufacturing, the process chamber is provided with a heating unit so that the process chamber is heated to a constant temperature by the heating unit, and the heating unit is formed at a position for heating the inner wall surface direction of the reaction chamber.

In addition, a heating wire in the form of a coil is formed in the heating unit to be heated by the filament heating method.

1 is a view of a conventional rotary drying apparatus,

2 is a view of a rotary drying apparatus of the present invention.

Brief description of the main parts of the drawings

1,101: process chamber 2,102: rotating plate

3,103: Fixture 4,104: Discharge Line

5,105: rotary motor 6,106: wafer cassette

7,107; Wafer 108: Heating

109: temperature controller 110: power supply

Hereinafter, referring to FIG. 2 which is a brief view of the attached rotary drying apparatus of the present invention, the rotary drying apparatus for manufacturing the present invention is as follows.

The rotary drying apparatus of the present invention has a rotating plate 102 in which a wafer cassette 106 in which a plurality of wafers 107 is mounted is formed in a process chamber 101 in which a discharge line 104 is formed.

The rotating plate 102 is provided with a fixing table 103 for fixing the wafer cassette 106, so that the wafer cassette 106 is stably fixed when the wafer cassette 106 is transferred.

In addition, a rotary motor 105 is formed at the lower end of the rotating plate 102 to rotate the rotating plate 102 at high speed.

In addition, a heating unit 108 is formed in the process chamber 102, and a heating wire 108 ′ in the form of a coil is formed in the heating unit 108 and heated by a filament heating method.

The heating wire 108 ′ is connected to a temperature controller 109 connected to the power supply unit 110 to be heated to a constant temperature.

In this case, the heating unit 108 is formed at a position where the inner wall surface of the process chamber 102 is heated to evaporate pure droplets.

Such a rotary drying apparatus, when a wafer cassette 106 on which a plurality of wafers 107 are mounted is transferred onto the rotating plate 102 and fixed by the holder 103, the rotating motor 105 is driven to rotate the rotating plate 102. Rotate at high speed

The high speed rotation of the rotating plate 102 generates centrifugal force so that pure droplets of the surface of the wafer 107 mounted in the wafer cassette 106 flow outward from the center direction of the wafer 107.

Pure water flowing out by the centrifugal force is discharged to the outside of the process chamber 101 through the discharge line 104 formed at the lower end of the process chamber 101, and is attached to the inner wall surface of the process chamber 101 without being partially discharged. Pure drops will form.

At this time, since the inner wall surface of the process chamber 101 is heated by the heating unit 108 which maintains a constant temperature by the temperature controller 109, the attached pure droplets are evaporated through the heating unit 108.

Accordingly, the pure droplets discharged from the wafer surface by the centrifugal force and adhered to the inner wall surface of the process chamber 101 are vaporized by the heating wire 108 'of the heating unit 108, and the process chambers (through the discharge line 104). Discharged to the outside of the 101, the humidity in the process chamber 101 is always kept constant.

As described above, in the rotary drying apparatus for semiconductor manufacture according to the present invention, when the pure water on the surface of the wafer is discharged by centrifugal force, pure droplets attached to the inner wall surface of the process chamber are evaporated by the heating unit, so that the humidity in the process chamber is always constant. This is advantageous in that the wafer rotational drying efficiency is increased.

Claims (3)

In the rotary drying apparatus for manufacturing a semiconductor in which a rotating plate rotated by a rotating motor is formed in a process chamber, and a wafer cassette having a plurality of wafers mounted thereon is placed on the rotating plate to dry pure water on the wafer surface by centrifugal force. The process chamber is provided with a heating unit, wherein the process chamber is heated to a constant temperature by the heating unit, the semiconductor manufacturing rotation drying apparatus. The rotation drying apparatus for manufacturing a semiconductor according to claim 1, wherein the heating part is formed at a position for heating the inner wall surface direction of the reaction chamber. The rotary drying apparatus of claim 1 or 2, wherein a heating wire in a coil form is formed in the heating unit and heated by a filament heating method.