KR20000007753A - Semiconductor device molding die including position arrangement pin sensor - Google Patents

Abstract

PURPOSE: A semiconductor device molding die is provided prevent quality inferiority resulting from molding of a defect lead frame by forming a sensor sensing defect after a molding operation. CONSTITUTION: The die comprises a lower molding having capacitors for fabricating a package body, runners being paths transferring molding resin to the capacitors, ports into which the molding resin is implanted, and position arrangement pins formed at a center of the runners; an upper molding having upper casts corresponding to lower casts, respectively; and a cleaner removing foreign materials on the lower cast, wherein the cleaner horizontally moves between the upper and the lower casts and includes a sensors sensing whether the position arrangement pins are defect.

Description

Semiconductor device molding die comprising sensor sensing location pin

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding die in a device for assembling semiconductor devices, and more particularly to a location pin for aligning a position of a lead frame supplied to a low die. It relates to a semiconductor device molding die, characterized in that it has a sensor that can determine whether the damage.

In the process of assembling a semiconductor device, in order to protect the semiconductor chip and the inner leads of the lead frame electrically connected to the chip and its electrical connecting means from the external environment such as dust, heat, moisture, electrical and mechanical loads, an epoxy molding compound ( The process of encapsulation with molding resin such as EMC (Epoxy Molding Compound) is called Molding.

In general, among molding apparatuses used in a molding process, the present invention describes an automatic molding apparatus having a multi port as an example, and the present invention relates to a molding die of an automatic molding apparatus.

FIG. 1 is a perspective view illustrating a conventional semiconductor device molding die 100, and FIG. 2 is a bottom perspective view illustrating the cleaner 50 of FIG. 1. Looking at the structure of a conventional molding die 100 with reference to FIGS. 1 and 2 as follows.

The semiconductor device forming mold 100 includes an upper / lower mold 30/10 having a plurality of upper / lower molds 40/20, respectively, in addition to the horizontal between the upper / lower molds 30/10. It further includes a cleaner 50 moving to (A). The lower mold 20 is formed of a plurality of cavities 22 for forming the body of the semiconductor elements and a runner 24 and a runner 24 which is a path through which a molding resin (not shown) is transferred to the cavities. It includes a port 26 to be injected. In addition, the alignment pins 28 protrude from both sides of the lower mold 20 along the cavities 22.

The cleaner 50 moves horizontally A above the lower mold 20 and removes the foreign matter (not shown) on the lower mold 20. 56 is formed at the bottom.

More specifically, the alignment pins protrude above the lower mold along the side where the cavities are formed, and are inserted into the sprocket hole (not shown) of the lead frame (not shown) in which the semiconductor chips are mounted. Align the position of the frame.

In such a structure, when the alignment pin is damaged, such as a broken pin, the lead frame may not be correctly aligned on the lower mold, which may cause a poor supply of the lead frame and a poor quality after molding. In addition, in order to prevent this, the inspection of the alignment pins by the naked eye of the operator three times a day, but this may result in an increase in working time and an increase in maintenance personnel.

SUMMARY OF THE INVENTION An object of the present invention is to provide a mold for forming a semiconductor device including a detector capable of detecting a positioning pin.

1 is a perspective view showing a conventional semiconductor device molding die,

Figure 2 is a bottom perspective view of the cleaner of Figure 1,

3 is a perspective view showing a part of a semiconductor device molding die according to the present invention;

4 is a bottom perspective view of the cleaner of FIG. 3;

5 is a side view showing a cleaner in accordance with the present invention to detect the position alignment pins.

Description of the main parts of the drawing

10, 110: Low die 20, 120: Low chase

22, 122: Cavity 24, 124: Runner

26, 126: Port 28, 128: Location pin

30, 130: Upper die 40, 140: Upper chase

50, 150: Cleaner 52, 152: Brush

54, 154: vacuum inlet 56, 156: air outlet

100, 200: semiconductor device molding die

160: Detector

In order to achieve this object, the present invention provides cavities for forming a package body corresponding to each lead frame in which semiconductor chips are mounted, runners which are passages through which molding resin is transferred to cavities, and centers of runners. A lower mold having lower molds including position alignment pins protruding on both sides along ports and cavities into which the molding resin is injected, and an upper mold having upper molds corresponding to each lower mold; And a cleaner moving horizontally between the upper and lower molds and removing foreign matter on the lower mold, wherein the cleaner includes detectors for detecting whether the alignment pins are damaged. A semiconductor element molding die is provided.

Hereinafter, with reference to the drawings will be described a preferred embodiment of the present invention.

3 is a perspective view illustrating a semiconductor device molding die 200 according to an exemplary embodiment of the present invention, and FIG. 4 is a bottom perspective view of the cleaner 150 of FIG. 3. Looking at the structure of the conventional molding die 200 with reference to Figures 3 and 4 as follows.

As in the prior art, the semiconductor device forming mold 200 is horizontally formed between the upper / lower molds 130/110 and the upper / lower molds 130/110 having a plurality of upper / lower molds 140/120, respectively. It includes a cleaner 150 moving to). The lower mold 120 is formed in the form of a plurality of cavities 122 for forming the body of the semiconductor devices and runners 124 and solidified tablets, which are paths through which molding resin is transferred to the cavities. A port 126 into which the resin is injected. In addition, the alignment pins 28 protrude from both sides of the lower mold 120 along the cavities 122.

The cleaner 150 moves horizontally A on the lower mold 120, and a brush 152, a vacuum inlet 154, and an air outlet 156 are formed below. In addition, the cleaner 150 may be injected with a molding resin to form a package body (not shown) in each cavity, and then remove foreign substances, which are residues left on the lower mold 120.

In addition, in the present invention, the detectors 160 corresponding to the alignment pins 128 of the lower mold 120 are included under the cleaner 150. The detectors are proximity sensors and detect the damage of each alignment pin by sensing the height of the alignment pins.

5 is a side view showing a state in which the cleaner 150 according to the present invention detects the alignment pins 128. The process of detecting whether the detectors 160 are damaged by the alignment pins 128 will now be described with reference to FIG. 5.

There are three position alignment pins 128 formed at a height of about 3 mm and formed on each side of the lower mold 120 along the cavities, and the cleaner 150 is formed by using a brush 152 or the like. 120 As the horizontal A moves between the upper and lower molds 130/110 to remove the foreign matters above, the detectors 160 formed at the bottom of the cleaner 150 are positioned at the respective alignment pins 128. ) Detect the upper parts of

If any of the alignment pins are broken, the height of the corresponding alignment pins is lowered, so that damage to the alignment pins can be detected by using different from the other alignment pins. When the detector detects the alignment pins three times for each lower mold, there is no damage of the alignment pins. On the other hand, the number of positioning alignments not detected when the alignment pins are detected two or less times. The pin is damaged.

As such, by installing a detector on the cleaner driven every time the molding operation is performed, whether the alignment pins are damaged or not can be recognized immediately. Due to the poor supply of the lead frame and poor quality after molding.

The semiconductor device molding die according to the present invention forms the detectors that detect whether the alignment pins of the lower mold are damaged under the cleaner which removes the foreign matter on the lower mold after every molding operation. This broken and the like damage can be detected immediately and corrected by the operator, the lead frame is misaligned due to the damage of the alignment pins, and the result after molding caused by molding the misaligned lead frame Quality defects can be prevented. In addition, in order to prevent this by automating the work by the naked eye of the conventional worker can bring a reduction in working time and work manpower and consequently improve the efficiency of the process.

Claims (7)

Cavities for shaping a package body corresponding to each lead frame on which semiconductor chips are mounted, runners which are passages through which molding resin is transferred to the cavities, and formed in the center of the runners to inject the molding resin A lower mold having lower molds, wherein the lower molds have ports and position alignment pins protruding from both sides along the cavities; An upper mold having upper molds corresponding to the lower molds; And A cleaner moving horizontally between the upper and lower molds and removing foreign substances on the lower molds; In the semiconductor element molding die comprising: The cleaner includes a semiconductor device forming mold, characterized in that for detecting the damage of the alignment pins. The mold of claim 1, wherein the detectors are proximity sensors formed under the cleaner. The method of claim 2, wherein the position alignment pins of the lower molds are formed with a predetermined height and a predetermined number to align each lead frame, and the proximity sensor can detect the position alignment pins by the predetermined number. A semiconductor device molding die, characterized in that. 4. The semiconductor element molding die according to claim 3, wherein the predetermined height is about 3 mm. 4. The semiconductor element molding die according to claim 3, wherein the predetermined number is about three for each lead frame. 2. The semiconductor device molding die according to claim 1, wherein the molding resin is supplied in the form of a solidified tablet. The mold of claim 1, wherein the foreign material is a residue left on the lower mold after the molding resin forms the package body.