KR20000007374A - Method for detecting electrode short position of plasma display panel - Google Patents

Abstract

PURPOSE: A method for detecting an electrode short position of a plasma display panel is provided to detect a short generation position when a short is generated between two address electrode or maintenance electrodes. CONSTITUTION: In a plasma display panel having a first electrode formed on a substrate, and a second electrode formed on the first electrode, the method determines (S11) whether a short occurs between the first electrode or the second electrode or not. The method measures (S12) a short position detection resistance value if two electrodes are shorted. By using the short position detection resistance value and the short position detection equation, the method detects (S13) a short position. Thereby, a working time is reduced, and working efficiency is enhanced.

Description

Electrode short circuit position detection method of plasma display panel

The present invention relates to a method for detecting an electrode short circuit position of a plasma display panel for detecting a position where a short circuit occurs when a short occurs between two adjacent address electrodes or sustain electrodes in the plasma display panel.

In general, the plasma display panel is a device for displaying a predetermined image by emitting a phosphor by ultraviolet rays generated from the discharge gas, that is, the inert gas discharge, the structure is as shown in Figure 1, it is easy to transmit light In order to maintain a discharge voltage, a sustain electrode made of a transparent electrode 2 and a metal electrode 3 is formed to have a predetermined interval in the horizontal direction on the front substrate 1 made of glass and on the upper side of the front substrate 1. (2) (3) and a dielectric layer 4 and a dielectric layer 4 formed on the front surface of the front substrate 1 including the sustain electrodes 2 and 3 to protect the sustain electrodes 2 and 3. A protective layer (5), a back substrate (6), an underlayer (7) formed on the entire upper surface of the back substrate (6), for protection, to extend the lifespan, to improve the secondary electron emission effect, and to reduce the discharge characteristics. The sustain electrode 2 on the underside of the underlayer 7 (3) an address electrode (8) formed at regular intervals in a direction orthogonal to (3), a white back (9) formed on the entire surface of the underlayer (7) including the address electrode (8), the front substrate (1) and the back substrate ( 6) partition walls 10 formed in parallel with the address electrodes 8 with each of the lower address electrodes 8 therebetween to maintain a gap therebetween and to prevent misdischarge between cells; And a fluorescent layer 11 of red, green, and blue (R, G, B) formed thereon.

As such, when the structure of the front substrate 1 and the rear substrate 6 is completed, an exhaust hole is formed in the rear substrate 6 to fill a desired discharge gas in a vacuum state.

Subsequently, after applying the bonding frit to the periphery of the front substrate 1 and the rear substrate 6 and completing the bonding, a discharge space is formed between the front substrate 1 and the rear substrate 6.

In addition, the entire process of manufacturing the plasma display panel is completed by injecting a discharge gas according to desired optical characteristics through the exhaust hole.

At this time, in the case of the DC plasma display panel, a binary gas of helium (He: Helium) -Xenon (Xeon), which is an inert gas, is used as a discharge gas, and in the case of an AC plasma display panel, neon (Ne: Neon) is used. It uses two-way gas of xenon (Xe). Neon-Xen, Helium-Hexenon (Xe) binary gas is used for characteristics without any DC / AC distinction. have.

In addition, helium (He) -neon (Ne) -xenon (Xe) is mixed at a constant composition ratio in order to solve problems such as shortening of life, reduced color purity, high operating voltage, and lowered luminance due to the use of the binary gas. Raw gas may also be used.

The plasma display panel manufactured as described above is charged internally when a voltage equal to or higher than the discharge start voltage is applied to the address electrode 8 formed on the rear substrate 6 and the sustain electrodes 2 and 3 formed on the front substrate 1. The generated discharge gas is excited and transitions back to the ground state to generate the visible light by stimulating the fluorescent layer 11 to display a desired image on the screen.

At this time, if a short circuit occurs in the address electrode 8 or the sustain electrode 2 or 3 due to a poor process of the electrode line during the manufacturing process of the plasma display panel, the circuit may be damaged due to overcurrent, thereby causing the cells and pixels to display accurate colors. Since it causes an operation error such as failure to implement or the brightness of the pixel is different, the process for taking appropriate measures such as removing the short circuit by inspecting whether the electrode is shorted when manufacturing the front substrate 1 or the back substrate 6 is necessary. It is carried out as an integral part of the manufacturing process.

Hereinafter, an electrode short position detection method of a plasma display panel according to the related art will be described.

In the related art, when the manufacturing process of the back substrate 6 and the pad of the address electrode 8 is completed, an open / short checker is connected to the pad of each address electrode 8 so that the adjacent address electrodes ( 8) Determine whether there is a short circuit between

At this time, the short circuit decision is made by applying a constant current to either the right end and the left end of either of the two address electrodes 8 or the left end and the right end of any one of the two address electrodes 8 to determine whether the current is energized.

In other words, when the two electrodes are energized, it is determined that the short circuit.

Subsequently, when a short circuit between the two address electrodes 8 is confirmed, a short-circuit position is detected by scanning the entire area of the address electrode 8 with a high magnification camera controlled by the control device.

Under the control of the control device, a laser repair apparatus removes a short circuit at a corresponding short circuit position and performs a remaining manufacturing process to complete the manufacture of the plasma display panel.

On the other hand, in the case of the transparent electrodes of the sustain electrodes (2) and (3), it is impossible to detect the short circuit position by the above-described camera scanning, and thus it takes a long time because a human must directly detect the short circuit position.

The electrode short position detection method of the conventional plasma display panel has the following problems.

First, when an electrode short is detected, a short time is detected by scanning the entire region of the electrode with a camera, which takes a long time.

Second, in the case of the transparent electrode, camera scanning is impossible, so the operator must perform the short-circuit position detection by the naked eye, which takes a considerable amount of time and decreases the accuracy of the detection.

Accordingly, an object of the present invention is to provide a method for detecting an electrode short-circuit position of a plasma display panel that can shorten the time for short-circuit position detection and improve accuracy. have.

1 is a layout showing the structure of a typical plasma display panel

2 is a flowchart illustrating a method of detecting an electrode short circuit position of a plasma display panel according to the present invention.

3A to 3D are diagrams illustrating a resistance value measuring method for detecting an electrode short circuit position according to the present invention.

4A to 4D are diagrams illustrating a method for measuring a resistance value for detecting a short circuit position in an active region of an electrode according to the present invention.

Explanation of symbols for main parts of the drawings

8a, 8b: address electrode

According to the present invention, a plasma display panel having a first electrode formed on a first substrate and a second electrode formed on a second substrate comprises the steps of: determining whether the adjacent two electrodes of the first electrode or the second electrode are short-circuited; If it is determined that the two electrodes are short-circuited, measuring the short-circuit position detection resistance value, and detecting the short-circuit position by using the short-circuit position detection resistance value and the short-circuit position detection formula. .

Hereinafter, a preferred embodiment of an electrode short circuit position detection method of a plasma display panel according to the present invention will be described with reference to the accompanying drawings.

2 is a flowchart illustrating a method for detecting an electrode short circuit position in a plasma display panel according to the present invention, and FIGS. 3A to 3D are views illustrating a method for measuring a resistance value for detecting a short circuit position in a plasma display panel according to the present invention. 4D illustrate a method of measuring a resistance value for detecting a short circuit position in an active region of an electrode according to the present invention.

As shown in FIG. 2, the method of detecting the short circuit position of the electrode of the plasma display panel according to the present invention is opened / closed on each of the pads of the address electrode 8 when the manufacturing process of the pads of the back substrate 6 and the address electrode 8 is completed. A short circuit checker is connected to determine whether a short circuit between adjacent address electrodes 8 occurs (S11).

At this time, the short-circuit determination is performed according to whether the first address electrode 8a and the second address electrode 8b of FIG. 3a are energized as in the conventional art or the left side of the first address electrode 8a through the open / short tester. The resistance may be performed by measuring the line resistance of the right end or the left end of the right end and the second address electrode 8b and determining whether the measured line resistance is infinite.

That is, when the first address electrode 8a and the second address electrode 8b are open, the line resistance value is infinity, and when the short circuit is shorted, it is possible to determine whether the short circuit occurs.

Subsequently, when the determination result (S11), the first address electrode (8a) and the second address electrode (8b) is short-circuited, as shown in Figs. 3b to 3d, the resistance value (A ', B', C ') for detecting the short circuit position. It is measured (S12).

At this time, A 'is a line resistance value of the left end of the first address electrode (8a) and the right end of the second address electrode (8b), as shown in Figure 3b, B' is shown in FIG. It is the line resistance value of the left end of the first address electrode 8a and the left end of the second address electrode 8b, and C 'is the line resistance value of the first address electrode 8a or the second address electrode 8b itself. Since the line resistance values of the first address electrode 8a and the second address electrode 8b themselves are almost the same, they are set to the same in the following description.

Also, the wire resistance values A ', B', and C 'can be measured by an open / short tester.

X 'is the distance from the origin of the measuring device, i.e., the open / short tester probe, to the short-circuit position, and L is the active area of the first address electrode 8a or the second address electrode 8b. Length), y is the coordinate compensation value according to the origin of the open / short tester probe, and e is the resistance to the pad length so that the value of B '+ C'-A' becomes the line resistance value in the active area. D is the value that corrects the contact resistance of the open / short tester, and d is a value that corrects the resistance of the pad portion length and the contact resistance of the open / short tester so that the C 'value becomes a line resistance value in the active region.

When the measurement of the resistance values A ', B', C 'and calculation of the correction values d, e, and y are completed, the values are input to a control device, and the control device is expressed in Equation 1 previously stored in an internal memory. Using the short-circuit position detection equation, the electrode short-circuit position is detected (S13).

In this case, the establishment background of the short-circuit position detection equation is as follows.

That is, the distance from the origin of the open / short tester probe to the position where the short circuit occurs is X ', the length of the active region of the electrode is L, and the distance between the short circuit positions of each of the first and second address electrodes 8a and 8b. If the resistance value corresponding to R 'is defined as R', B ', and C', the following equation is defined.

First, in order to facilitate the calculation, a relational expression is defined for the active regions of the first and second address electrodes 8a and 8b, and then the distance and contact resistance compensation based on the origin coordinates of the open / short-circuit probe and the resistance value of the pad part. I will perform the compensation.

Since the length and the line resistance value C of the first address electrode 8a and the second address electrode 8b shown in FIG. 4C are almost the same, as shown in FIG. 4B, the left end and the second end of the first address electrode 8a are the same. The line resistance value A = R + C at the right end of the address electrode 8b is defined.

4A, the line resistance value of X becomes XC / L in proportion to the length L, and B is the left end of the first address electrode 8a and the left side of the second address electrode 8b as shown in FIG. 4C. In the end, B = R + 2 x XC / L is defined because the wire resistance value of the stage is doubled as X.

Thus, when A and B are defined, if A and B are calculated to eliminate R and solve for X, Equation 2 is established.

Then, in Equation 2, an operation for compensating the distance compensation value, the pad resistance value, and the probe contact resistance value from the origin of the open / short tester to the short circuit position is performed.

First, Equation 3 is established by substituting variables X ', A', B ', and C' for actual electrodes including pads instead of variables X, A, B, and C for electrodes defined only in the active region.

Subsequently, the pad portion resistance and the contact resistance compensation value e are added to (B '+ C'-A') of Equation 3 to establish Equation 4.

In this case, e is a value compensated for the pad part resistance and the contact resistance in order to limit each variable B ', C', and A 'to a value in the active region.

e =-[(pad part resistance at B 'value) + 2 × (probe contact resistance)]-[(pad part resistance at C' value) + 2 × (probe contact resistance)] + [2 × (A Value of pad resistance) + 2 x (probe contact resistance)]

Next, when d is added to the pad portion resistance and the contact resistance compensation value with respect to C 'of Equation 3, Equation 5 is established.

In this case, d is a value compensated for the pad part resistance and the contact resistance in order to limit C 'to a value in the active region, and is defined as follows.

d =-[(pad resistance at C ') + 2 x (contact resistance at probe)]

Finally, when y is added to the coordinate of the actual origin of the open / short checker probe with respect to X 'in Equation 5, Equation 1 is established.

Subsequently, when the short circuit position is detected by Equation 1, the controller controls the laser recovery apparatus to remove the short circuit at the corresponding position (S14).

The electrode short circuit position detection method of the plasma display panel according to the present invention has the following effects.

First, it is possible to quickly detect the location where the short circuit occurs and take the corresponding action, that is, the short circuit can be removed, thereby reducing work time and improving work efficiency.

Second, even in the case of the transparent electrode, since the control device detects the short circuit position by the relational expression using the line resistance value, the accuracy of the short circuit position detection can be improved.

Claims (7)

In a plasma display panel having a first electrode formed on a first substrate and a second electrode formed on a second substrate, Determining whether two adjacent electrodes of the first electrode or the second electrode are short-circuited; Measuring a resistance value for detecting a short circuit position when it is determined that the two electrodes are short-circuited; And detecting the short circuit position by using the short circuit position detection resistance value and the short circuit position detection equation. The method of claim 1, The determining whether the short circuit may include determining whether the line resistance values of one end of one of the two electrodes and one end of the other one are infinite; Judging that the wire resistance value is infinity as the result of the determination; And determining the line resistance value as a short circuit if the line resistance value is not infinite, wherein the short circuit position detection method of the plasma display panel is performed. The method of claim 1, The measuring of the resistance value for detecting the short circuit position may include measuring the line resistance value C ′ of any one of the two electrodes; Measuring the line resistance value A 'of the left end of the first electrode and the right end of the second electrode of the two electrodes; And measuring the line resistance value B 'of the left end of the first electrode and the left end of the second electrode among the two electrodes. The method according to claim 1 or 3, The short circuit position detection formula is Where X 'is the distance from the origin of the measuring device probe to the short-circuit position, e is the pad resistance and contact resistance compensation value of B' + C'-A 'value, d is the pad resistance of C' value and A method for detecting an electrode short circuit position in a plasma display panel, wherein a contact resistance compensation value is set and y is a coordinate compensation value of an origin of a measuring device probe. In a semiconductor device having two or more electrodes, Determining whether two adjacent electrodes are short-circuited; Measuring a resistance value for detecting a short circuit position when it is determined that the two electrodes are short-circuited; And detecting the short circuit position by using the short circuit position detection resistance value and the short circuit position detection equation. The method of claim 5, The measuring of the resistance value for detecting the short circuit position may include measuring the line resistance value C ′ of any one of the two electrodes; Measuring the line resistance value 'A' at the left end of the first electrode and the right end of the second electrode of the two electrodes; And measuring the line resistance value 'B' at the left end of the first electrode and the left end of the second electrode among the two electrodes. The method according to claim 5 or 6, The short circuit position detection formula is Where X 'is the distance from the origin of the measuring device probe to the short-circuit position, e is the pad resistance and contact resistance compensation value of B' + C'-A 'value, d is the pad resistance of C' value and A method for detecting an electrode short circuit position in a plasma display panel, wherein a contact resistance compensation value is set and y is a coordinate compensation value of an origin of a measuring device probe.