KR20000006149A - Motor drive device and xy table for a semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE: A motor drive apparatus and an XY table are provided to prevent a platform from being vibrated. CONSTITUTION: The linear motor drive apparatus for driving a drive body(10) by a linear motor(4) comprises a motor body(6), a platform(2) and a straight moving part(8). The motor body(6) and the drive body(10) are installed on the platform(3) so as to be movable in a drive shaft direction. The straight moving part(8) of the linear motor(4) is connected to the drive body(10). When driving the drive body(10), the motor body(6) moves toward an opposite direction to the drive body(10), removing a repulsion power by the driving of the drive body(10).

Description

MOTOR DRIVE DEVICE AND XY TABLE FOR A SEMICONDUCTOR MANUFACTURING APPARATUS}

The present invention relates to a motor driving apparatus and an XY table in a semiconductor manufacturing apparatus.

The motor driving device is used in various fields, but for example, the bonding device includes a die bonding device as a planar single axis drive, and a wire bonding device as a planar two axis (XY axis) drive.

In the die bonding apparatus, the arm holding the collet is uniaxially movable in the extending direction of the arm, and the die is picked up from the wafer into the collet or picked up from the positioned die and transferred onto the lead frame for bonding. Moreover, as this kind of die bonding apparatus, Unexamined-Japanese-Patent No. 57-26448 and 57-36836 are mentioned, for example. The wire bonding apparatus has an XY table which is driven in a planar two axis (XY axis) direction, the tool is driven in the XY axis direction by the XY table, and the wire inserted into the tool is connected to the first bond point and the second bond point. Connect. Moreover, as this kind of wire bonding apparatus, Unexamined-Japanese-Patent No. 4-320350 is mentioned, for example.

In the wire bonding apparatus which performs precise positioning at high speed, the problem is how to reduce the vibration which generate | occur | produces from the XY table driven at high speed. Moreover, in recent years, since the precision required for bonding is about [mu] m, problems such as deterioration in position detection accuracy and vibration of the mechanical part due to the influence of vibration have become a problem. In other words, if a system has no vibration at all, a great effect can be expected.

In more detail, the vibration caused by the vibration of the XY table causes the mount to vibrate due to the vibration of the XY table. The vibration is transmitted to the feeder for positioning and fixing the semiconductor device during transportation and bonding to swing the semiconductor device. Shake the rails (guide rails for guiding semiconductor devices) to damage the bonded wires. Moreover, in the unloader magazine which stores the semiconductor device which the bonding was complete | finished, the unloader magazine may cause an accident, such as a wire breaking, by continuous vibration. Therefore, care must be taken not to leave the semiconductor device stored in the unloader magazine for a long time.

Background Art Conventionally, countermeasures have been taken to optimize the control and to make the material of the mount artificial stone. However, when the drive body is driven by a motor, since the motor that is exerting the force necessary for the drive is also accelerated under the same force as a reaction, the shake of the mount could not be prevented.

An object of the present invention is to provide a motor driving device and an XY table in a semiconductor manufacturing apparatus that can prevent vibration of a mount.

A first means of the present invention for solving the above problems is a motor driving apparatus in a semiconductor manufacturing apparatus for driving a driving body by a motor, wherein the motor main body and the driving body of the motor are movable in the same driving axis direction. It is mounted on the mount and connects the linear moving part of the motor and the driving body so that the motor body can move in the opposite direction to the driving body when the driving body is driven. Characterized in that configured to eliminate.

A second means of the present invention for solving the above problems is a motor driving apparatus in a semiconductor manufacturing apparatus for driving a driving body by a motor, wherein the motor main body and the driving body of the motor are movable in the same driving axis direction. It is mounted on the mount and connects the linear moving part of the motor and the driving body so that the motor body can move in the opposite direction to the driving body when the driving body is driven. It is configured to remove, and the drive is moved to a predetermined position by the motor to be positioned.

The third means of the present invention for solving the above problems, in the first and second means, the damper for returning the movement of the motor body in the opposite direction to the original position when the drive body is driven; It is characterized by being installed in the motor body.

A fourth means of the present invention for solving the above problems is, in the first, second and third means, for detecting the position and the speed of the drive body relative to the mount in the mount or the drive body. A drive body detecting means is added, and the mount or the motor body is provided with a motor body speed detecting means for detecting the speed of the motor body relative to the mount.

The 5th means of this invention for solving the said subject arrange | positions 2 sets of motor drive apparatuses which drive a drive body by a motor in planar two-dimensional direction, and on the 1st drive body of one 1st motor drive apparatus, The upper table is provided to be movable in the direction of the drive shaft of the second drive body by the second motor drive device on the other side, and the upper table of the first motor drive device moves the second drive body of the second motor drive device. A XY table in a semiconductor manufacturing apparatus in which the upper table and the second driving body are connected to each other by a connecting means such that the upper table is movable in a movement direction with the first driving body. When the first drive body is driven, the motor main body of the first motor drive device is allowed to move in the opposite direction to the first drive body, and when the second drive body is driven, The motor main body of the second motor driving device can be moved in a direction opposite to the second driving body, so as to eliminate the reaction force caused by the driving of the first driving body and the second driving body.

According to a sixth means of the present invention for solving the above problems, two sets of motor driving devices for driving a driving body by a motor are arranged in a planar two-dimensional direction, and on the first driving body of one first motor driving device, The upper table is provided to be movable in the direction of the drive shaft of the second drive body by the second motor drive device on the other side, and the upper table of the first motor drive device moves the second drive body of the second motor drive device. A XY table in a semiconductor manufacturing apparatus in which the upper table and the second driving body are connected to each other by a connecting means such that the upper table is movable in a movement direction with the first driving body. When the first drive body is driven, the motor main body of the first motor drive device is allowed to move in the opposite direction to the first drive body, and when the second drive body is driven, The motor main body of the second motor driving device can move in a direction opposite to the second driving body, thereby eliminating the reaction force caused by the driving of the first driving body and the second driving body, and the first and second The first driving body and the second driving body are moved to a predetermined position by a motor to be positioned.

According to a seventh means of the present invention for solving the above problems, in the fifth and sixth means, when the first driving body and the second driving body are driven, the corresponding motor body moves in the opposite direction. The damper for returning to the position of the first and second motor body is characterized in that it is installed.

An eighth means of the present invention for solving the above problems, in the fifth and sixth means, the first drive relative to the mount to the mount or the first drive unit and the mount or the second drive unit. Driving body detecting means for detecting the position and the speed of the sieve and the second driving body, respectively, and the motor for detecting the speed of the motor body relative to the mount to the mount or the first and second motor body The main body speed detection means is added, respectively.

1 shows an embodiment of a basic structure of a motor drive device in a semiconductor manufacturing apparatus of the present invention, (a) is a plan view, (b) is a front view,

2 is a control block diagram;

FIG. 3 shows an embodiment of an XY table in the semiconductor manufacturing apparatus formed by combining two motor drive devices of FIG. 1, (a) is a plan view, and (b) is a front view.

Explanation of the sign

1, lX, 1Y: linear motor drive device 2: mount

3: motor holder 4: linear motor

4X: Linear motor for X axis (first linear motor)

4Y: Linear motor for Y axis (second linear motor)

6: motor body 8: linear moving part

9: guide rail 10, 10X, 10Y: drive body

11, 11X, 11Y: Guide rail 12, 12X, 12Y: Drive stay

15: motor body speed detection sensor 16: drive body sensor

17: damper 20: position command signal

21: drive position signal 22: position addition circuit

23: position command signal 24: first speed generation circuit

25: speed command signal 26: second speed generation circuit

27: drive body speed signal 28: motor body speed signal

29: speed addition circuit 30: speed command signal

31: voltage conversion circuit 32: amplification circuit

40: guide rail 41: upper table

42: guide member 43: connecting member

A basic embodiment of the present invention will be described with reference to FIGS. 1 and 2. First, the configuration of the linear motor drive device 1 shown in FIG. 1 will be described. The motor holder 3 is fixed to the mount 2, and the linear motor 4 is held at the motor holder 3. The linear motor 4 consists of the motor main body 6 which has the permanent magnet 5, and the linear movable part 8 which has the coil 7 as well known. The motor main body 6 is provided in the motor holding stand 3 via the guide rail 9 so as to be movable in the drive shaft direction of the linear movable section 8.

The drive body 10 is fixed to the linear movable part 8. The drive body 10 is provided on the drive body holder 12 through the guide rail 11 so as to be movable in the same direction as the drive shaft direction of the linear movable section 8, and the drive body support 12 is mounted on a mount ( It is fixed to 2). Here, the weight of the motor main body 6 is larger than the weight of the linear movable part 8 and the drive body 10.

The motor main body 3 is provided with a motor main body speed detection sensor 15 for detecting the speed of the motor main body 6, and the position and speed of the drive body 10 are provided in the drive main body 12. The drive body sensor 16 for detecting is provided. The motor support 3 is further provided with a damper 17 for returning the motor body 6 to its original position when the drive body 10 is driven in the opposite direction to the drive body 10. .

FIG. 2 shows a control block diagram of the linear motor drive device shown in FIG. 1. The position command signal 20 in the control apparatus and the drive body position signal 21 from the drive body sensor 16 are added and subtracted by the position adding circuit 22. The velocity command is generated by the first speed generation circuit 24, and the speed command signal 25 is outputted. That is, the drive body position signal 21 from the drive body sensor 16 is fed back to the position command signal 20 from the control apparatus.

In addition, the speed command signal 25 and the drive position signal 21 are generated by the drive speed signal 27 generated by the second speed generation circuit 26 and the motor body speed detection sensor 15. The motor body speed signal 28 is added or subtracted by the speed adding circuit 29. The added and subtracted speed command signal 30 is converted into a voltage by the voltage conversion circuit 31 and supplied to the linear motor 4 through the amplification circuit 32. The drive body speed signal 27 and the motor body speed signal 28 are fed back to the speed command signal 25.

Next, the operation will be described. As for the position command signal 20 which moves the drive body 10 to a predetermined position from a control apparatus, the speed command signal 25 is produced | generated by the 1st speed generation circuit 24, and the speed command signal 25 is a voltage | voltage. The voltage is converted by the converter circuit 31 into a voltage, amplified by the amplifier circuit 32, and supplied to the coil 7 of the linear motor 4. When the voltage is supplied to the coil 7, the linear moving part 8 is accelerated and moved in the direction of the drive shaft by the direction of the current by the voltage, and the driving body 10 is guided by the guide rail 11 to be in the same direction. Go to. In addition, since the motor main body 6 is installed to be movable along the guide rail 9, the motor main body 6 receives the same force as a reaction of the driving of the linear movable part 8 and the driving body 10 in the opposite direction to the driving body 10. Accelerate and move.

In this case, the position of the drive body 10 is detected by the drive sensor 16, the drive position signal 21 is input to the position addition circuit 22 and fed back to the position command signal 20, and also The driving body position signal 21 generates a driving body speed signal 27 by the second speed generating circuit 26 and inputs the speed adding circuit 29 to the speed command signal 25 of the speed generating circuit 24. Is supplied to the coil 7 of the linear motor 4 so as to move the driving body 10 to a predetermined position.

Thus, since the motor main body 6 moves in the opposite direction to the drive shaft direction of the drive body 10, the amount of momentum given to the mount 2 becomes theoretically zero, and the shake of the mount 2 does not occur. In reality, since the guide rail 9 has friction, a force is applied to the mount 2, but the force is very small.

As described above, since the motor main body 6 is movable in the direction of the drive shaft of the linear movable part 8, the motor main body 6 is also accelerated when the linear movable part 8 and the driving body 10 are accelerated. Acceleration at this time is inversely proportional to the weight of the drive body 10 including the linear movable section 8 and the weight of the motor body 6. For example, when the weight of the drive body 10 including the linear movable part 8 is 5Kg and the weight of the motor body 6 is 25Kg, when the drive body 10 is accelerated at 1G, the motor body 6 is It is accelerated to (5 ÷ 25) x 1G = 0.2G in the reverse direction to the driving body 10.

As a result, the relative acceleration between the drive body 10 and the motor main body 6 becomes 1.2 G, so that the relative speed generated between the linear moving unit 8 and the motor main body 6 is also the speed of the drive body 10. Greater than 20%. That is, even though the relative speed of the linear moving part 8 and the motor main body 6 is larger than the speed which the drive body sensor 16 detects the drive body 10, the drive body sensor 16 is a drive body. Since only (10) is detected, voltage is applied to the coil 7 ignoring the relative speed of 20%. However, since electromotive force is generated from the coil 7 in proportion to the relative speed, the applied voltage made on the basis of the signal applied from the drive body sensor 16 is insufficient for the voltage to be applied to the coil 7. .

Compensating this is the motor body speed detection sensor 15. That is, the speed of the motor body 6 is detected by the motor body speed signal 28, and the motor body speed signal 28 is input to the speed adding circuit 29 so that the speed command signal 25 and the driving body speed signal are detected. In addition to (27), the speed command signal 30 is input to the voltage conversion circuit 31, amplified by the amplifier circuit 32, and a voltage is supplied to the coil 7. This compensates for the undervoltage to be applied to the coil 7.

However, since the motor main body 6 is movable, for example, when the motor main body 6 is shaken while the driving body 10 is stopped regardless of the driving of the driving body 10, for example, the motor main body 6 Is moved by hand, the drive body sensor 16 detects a predetermined position of the drive body 10, so that the circuit outputs a stop signal, that is, 0V. In the absence of the motor body speed detection sensor 15, the drive body 10 tries to move relative to the motor body 6 in response to a stop, that is, the movement of the motor body 6. As a result, since the position shifts and tries to return to the original position, a shift occurs between the speed command and the position command, so that the drive body 10 is smaller than the movement in the middle, that is, the motor body 6 moves by hand. Movement similar to that of the main body 6 is performed. The degree is determined by the gain of velocity feedback and position feedback.

In this way, even when the motor body 6 is moved by an external force, the signal added to the circuit from the motor body speed detection sensor 15 acts to apply a voltage proportional to the movement of the motor body 6 to the coil 7. Therefore, the voltage generated by the relative speed of the motor body 6 and the drive body 10 is applied to the coil 7 in the reverse direction by the motor body speed signal 28 from the motor body speed detection sensor 15. do. As a result, the current generation of the coil 7 disappears and no force is generated, so that the drive body 10 is not affected by the movement of the motor body 6.

FIG. 3 is a combination of two linear motor drive devices 1 of the basic structure shown in FIG. 1 to form an XY table. Therefore, the same or equivalent members as those in FIG. 1 are denoted by the same reference numerals, and X and Y indicating two axes of X and Y axes are attached after the reference numerals, and detailed description thereof is omitted.

On the drive body 10X of the linear motor drive apparatus 1X arrange | positioned at one X axis, the pair of guide rails 40 extended and arrange | positioned in the Y-axis direction orthogonal to the guide rail 11X is fixed. . Inside the pair of guide rails 40, the upper table 41 is supported so as to be linearly movable in the Y axis direction orthogonal to the drive axis direction (X axis direction) of the drive body 10X.

On the upper table 41, the guide member 42 which extends in the drive shaft direction (X-axis direction) of the drive body 10X is being fixed. Immediately above the guide member 42, the end portion of the drive body 10Y of the linear motor drive device 1Y disposed on the other Y axis is disposed. Then, the transfer member 10Y is transferred to the upper table 41, and at the same time, the connecting member fixed to the driving member 10Y is movable so that the upper table 41 is movable in the moving direction with the driving member 10X. 43 is fitted to the guide member 42. In addition, the structure of the drive body 10X and the upper table 41, and the connection means (guide member 42, the connection member 43) of the upper table 41 and the drive body 10Y are, for example, a special-purpose station 59 It is known as shown in -52540.

Therefore, when the linear motor 4X is driven based on the instruction given from the control apparatus, the drive body 10X moves in the X-axis direction, and the upper table 41 also moves in the same direction. At this time, the guide member 42 can move in the X-axis direction along the connecting member 43 with respect to the movement in the X-axis direction of the upper table 41, so that there is no influence on the driving body 10Y. Do not. Similarly, when the linear motor 4Y is driven based on a command given from the control device, the drive body 10Y moves in the Y axis direction, and this operation is performed by the upper table via the connecting member 43 and the guide member 42. The movement in the Y-axis direction orthogonal to the drive body 10X becomes 41.

As described above, when the driving body 10X is driven in the X-axis direction, as described in the basic structure of FIG. 1, the motor main body 6X acts in a direction opposite to the driving body 10X as a reaction of the driving of the driving body 10X. Accelerate and move. For this reason, momentum is not given to the mount 2, and the shake of the mount 2 does not occur. The same applies to the case where the drive body 10Y is driven in the Y axis direction.

In the case of the XY table shown in the present embodiment, two linear motor drive units 1X and 1Y are provided, so that the control block shown in FIG. 2 is provided for each linear motor drive unit 1X and 1Y. Needless to say. As described in the basic structure of FIG. 1, the undervoltage to be applied to the coil in the case of driving the driving bodies 10X and 10Y is compensated by the action of the corresponding motor body speed detection sensor 15.

The configuration in the case where the linear motor drive device 1 shown in FIG. 1 and the XY table shown in FIG. 3 are applied to, for example, a bonding device will be briefly described. In the case of a die bonding apparatus, the arm which has a collet in the other end is provided so that the arm 10 of the linear motor drive apparatus 1 shown in FIG. 1 can move up and down. In the case of a wire bonding apparatus, a bonding apparatus head is attached to the surface of the upper table 41 of the XY table shown in FIG.

In the above embodiment, the case where the linear motors 4, 4X, 4Y are used has been described, but needless to say, the present invention can also be applied to the case where a pulse motor, a DC motor, an AC motor, or the like is used.

According to the present invention, in a motor driving apparatus for driving a driving body by a motor, the motor main body and the driving body of the motor are mounted on a mount so as to be movable in the same driving axis direction, and the linear moving part and the driving body of the motor are mounted. When the drive body is driven, the motor main body can move in the opposite direction to the drive body, and the reaction force caused by the drive body is eliminated. Thus, vibration of the mount can be prevented.

Claims (8)

In a motor driving apparatus in a semiconductor manufacturing apparatus for driving a driving body by a motor, the motor main body and the driving body of the motor are mounted on a mount so as to be movable in the same driving axis direction, and the linear moving part and the driving of the motor are mounted. In the semiconductor manufacturing apparatus according to claim 1, wherein the motor body is moved in a direction opposite to that of the driving body when the driving body is connected to remove the reaction force caused by the driving of the driving body. Motor-drive mechanism. In a motor driving apparatus in a semiconductor manufacturing apparatus for driving a driving body by a motor, the motor main body and the driving body of the motor are mounted on a mount so as to be movable in the same driving axis direction, and the linear moving part and the driving of the motor are mounted. A body connected to each other so that the motor body can move in a direction opposite to that of the driving body when the driving body is driven, thereby removing the reaction force caused by the driving of the driving body. A motor driving apparatus in a semiconductor manufacturing apparatus, characterized in that the positioning is performed by moving to a predetermined position. The semiconductor manufacturing apparatus according to claim 1 or 2, wherein a damper is provided in the motor body to return the motor body to its original position when the driving body is driven. Motor drive system. 4. The mount or the motor body according to any one of claims 1 to 3, wherein a drive body detecting means for detecting the position and the speed of the drive body relative to the mount is added to the mount or the drive body. And a motor body speed detecting means for detecting the speed of the motor body relative to the mount. 2 sets of motor drive devices which drive a drive body by a motor in a planar two-dimensional direction, and on the 1st drive body of one 1st motor drive device, the 2nd drive body by the other 2nd motor drive device The upper table is provided to be movable in the direction of the drive shaft of the upper table, and transfers the movement of the second driving body of the second motor driving device to the upper table of the first motor driving device, and the upper table drives the first drive. In an XY table in a semiconductor manufacturing apparatus in which the upper table and the second driving body are connected by means of connecting means so as to be movable in a moving direction with the sieve, when the first driving body is driven, the first motor drive is performed. When the motor main body of the apparatus is allowed to move in the opposite direction to the first driving body, and when the second driving body is driven, the motor main body of the second motor driving device is driven by the second body. Hayeoseo to move in the body in the opposite direction, XY table in the semiconductor manufacturing system, characterized in that the first drive element and configured to eliminate the reactive force by the driving of the second driving body. 2 sets of motor drive devices which drive a drive body by a motor in a planar two-dimensional direction, and on the 1st drive body of one 1st motor drive device, the 2nd drive body by the other 2nd motor drive device The upper table is provided to be movable in the direction of the drive shaft of the upper table, and transfers the movement of the second driving body of the second motor driving device to the upper table of the first motor driving device, and the upper table drives the first drive. In an XY table in a semiconductor manufacturing apparatus in which the upper table and the second driving body are connected by means of connecting means so as to be movable in a moving direction with the sieve, when the first driving body is driven, the first motor drive is performed. When the motor main body of the apparatus is allowed to move in a direction opposite to the first driving body, and when the second driving body is driven, the motor main body of the second motor driving device is driven by the first main body. The first driving body and the second motor are driven by the first and second motors so as to be movable in a direction opposite to the second driving body so as to eliminate reaction forces caused by the driving of the first driving body and the second driving body. An XY table in a semiconductor manufacturing apparatus characterized by moving a driving body to a predetermined position to position it. The said 1st and 2nd motor of Claim 5 or 6 WHEREIN: When the said 1st drive body and the 2nd drive body drive, the damper which returns to the original position that the corresponding motor body moves to the opposite direction is carried out by the said 1st and 2nd motor. The XY table in the semiconductor manufacturing apparatus characterized by the above-mentioned. 7. The position according to claim 5 or 6, wherein the mount or the first drive member and the mount or second drive member detect the position and the speed of the first drive member and the second drive member with respect to the mount frame. And a motor body speed detecting means for detecting the speed of the motor body relative to the mount, respectively, to the mount or the first and second motor bodies. XY table in a manufacturing apparatus.