KR20000002099A - Manufacturing device for partition-integration-typed-rear face substrate for plasma display panel and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A manufacturing device for a partition integration typed rear face substrate for a plasma display panel(PDP) is provided to reduce a weight of the rear face substrate and a manufacturing cost and to improve a productivity. CONSTITUTION: A partition integration typed rear face substrate comprises: a metal substrate(51) of a plate shape; plural integrated partitions(53) integrally formed with the metal substrate; plural address electrodes(55) arranged and formed for being separated to plural discharging cells by the integrated partitions; and fluorescent substance(57) sprayed for dividing into red, green, and blue colors on the address electrodes.

Description

Bulkhead integrated back substrate for plasma display panel, manufacturing apparatus and manufacturing method thereof

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (hereinafter referred to as a PDP). In particular, in the manufacture of a back substrate, a metal substrate is used for the back substrate, and at the same time, a barrier is formed on the metal substrate. The present invention relates to a partition integrated back substrate of a PDP, a manufacturing apparatus thereof, and a manufacturing method thereof.

In the 21st century, information and electronics technology will be further accelerated and developed by ultra high-speed information and communication technology and computers, and the core element technology supporting this is high value-added semiconductor and display technology.

Until now, the concept of display has been focused on the limited area of CRT (cathode-ray tube) univariate.However, with the development of the information society, the amount of information that humans can access is enormous and various types of information carriers. The concept of multimedia is emerging as an integrated concept. In this multimedia era, the importance of display is that most information is delivered through human visual functions and the use environment of the device is diversified.

For example, in the case of a device used in an environment where mobility is emphasized, such as a personal portable device, an automobile, an aircraft, and the like, light and small and low power consumption may be important factors. Display characteristics of a large screen are required. Representative items such as flat panel displays include liquid crystal displays (LCDs), plasma display panels (PDPs), field emission displays (FEDs), etc. Among these, CRTs have CRTs due to low cost and large size using thick film technology. Next generation display to replace the most in the spotlight.

The PDP has an advantage of being easier to manufacture due to the characteristics of the manufacturing process than other display elements in implementing high definition television (HDTV) of 40 Hz or more, and is widely used in wall-mounted TVs, home theater displays, and various monitors. Is being applied.

In general, a PDP is a flat panel display device using a penning gas for a discharge phenomenon, and constitutes an information display unit of a plasma display device. The PDP is divided into an AC type and a DC type according to a discharge method.

A typical AC PDP is composed of a surface substrate 1 and a rear substrate 5 positioned opposite to each other with a predetermined space therebetween as shown in FIGS. 1A and 1B.

The display electrode 2 is formed on one surface of the surface substrate 1 so as to be arranged in parallel with each other, and the display electrode 2 is disposed on an opposite surface of the rear substrate 5 to the surface substrate 1. The address electrodes 6 are arranged in parallel with each other so as to be orthogonal to each other. In this case, the display electrode 2 and the address electrode 6 are formed on a stripe.

In addition, a dielectric layer 3 having a uniform thickness is formed on the display electrode 2 to limit the discharge current during discharge and facilitate the generation of wall charges, and sputtering occurs during discharge on the dielectric layer 3. A magnesium oxide protective film 4 is deposited to protect the display electrode 2 and the dielectric layer 3.

In addition, partition walls 7 are formed between the surface substrate 1 and the rear substrate 5 to separate the address electrodes 6 into a plurality of discharge cells to prevent color mixing between cells and to secure a discharge space. On the address electrode 6, phosphors 8 divided into red, green and blue are coated.

In addition, a discharge gas such as neon (Ne), helium (He), xenon (Xe), or the like is injected into the discharge space between the surface substrate 1 and the rear substrate 5, and the surface substrate 1 and the rear substrate. 5 is frit-sealed using the hardened sealing material 9.

A sustain pulse voltage (or sustain voltage) is applied to the display electrode 2 and the address electrode 6 of the PDP configured as described above, and a discharge start voltage is applied between the display electrode 2 and the address electrode 6. When an overwriting voltage is applied, discharge starts in the discharge cell. That is, the discharge occurs on the surface of the dielectric layer 3 and the protective layer 4 in the discharge cell to generate ultraviolet rays. The fluorescent material applied to the back substrate 5 is excited by such ultraviolet rays and is converted into visible light corresponding to red, green, and blue colors, respectively, thereby generating a screen on the surface substrate 1.

The partition wall 7 of the back substrate 5 is manufactured by using a thick film printing method, which will be described with reference to FIG. 2 as follows.

First, after positioning a printing mask having an opening formed in accordance with a predetermined pattern on the glass substrate 10, the glass space 11 is supplied onto the printing mask to perform screen printing once. When the glassspace 11 is printed on the glass substrate 10 as described above, the glass substrate 10 is dried at a temperature of 150 to 200 ° C. for about 10 minutes. Thereafter, the above process is repeated about 10 to 15 times.

When the partition 7 of the desired shape is formed by repeating the printing and drying of the glass space 11 as described above, the glass substrate 10 is baked at a temperature of 310 to 500 ° C. for about 10 minutes to manufacture the partition 7. do.

Subsequently, an address electrode (6 in FIGS. 1A and 1B) is printed between the partitions 7 and a phosphor (8 in FIGS. 1A and 1B) is coated thereon to back substrate (5 in FIGS. 1A and 1B). To complete.

However, in the method of manufacturing a back substrate of the PDP according to the related art, plastic shrinkage occurs in all three axial directions because the material of the barrier rib 7 is the glass space 11 during firing for the barrier rib 7 manufacturing. . That is, the glass space 11 is composed of particles of about 1 to 20 μm in an amorphous state at room temperature, and when the glass space 11 is fired, the glass space 11 is changed to a crystalline state and as shown in FIG. 4 in the X, Y, and Z directions. To shrink. Therefore, there is a problem in that pitch control of the partition wall 7 becomes difficult due to plastic shrinkage in manufacturing the partition wall 7.

In addition, according to the prior art, the method for manufacturing the back substrate of the PDP should be repeated about 10 to 15 times during the manufacturing of the partition wall 7, so that the printing mask and the partition wall 7 are printed. Difficult to match the position, of course, there is a lot of loss of the glass space (7), that is, material loss, there is a problem that the performance of the PDP is reduced due to the degree of the partition wall 7 is reduced due to the repetition of this process.

In addition, the prior art is difficult to manufacture a large back substrate 5 due to the above problems, there is a problem that can not adequately cope with the increasingly global trend.

The present invention has been made to solve the above problems, the back substrate by using a metal mold to form a barrier rib on the metal substrate at the same time using the metal substrate on the back substrate in the manufacturing of the back substrate It is an object of the present invention to provide a PDP bulkhead integrated back substrate, a manufacturing apparatus, and a method of manufacturing the same, which reduce weight, reduce manufacturing costs, and enable production of a back substrate by a continuous process, thereby greatly improving productivity.

1A is a block diagram illustrating a structure of a general plasma display panel (hereinafter referred to as a PDP).

1B is a partial cross-sectional view of FIG. 1A,

2 is a flowchart illustrating a partition wall formation process according to the prior art;

3 is a configuration diagram showing a change in position due to plastic shrinkage when firing using a soda lime glass on the substrate for the back substrate according to the prior art,

4 is a cross-sectional view showing a partition wall integrated rear substrate of the PDP according to the present invention;

Figure 5 is a block diagram showing a barrier rib integrated substrate manufacturing apparatus of the PDP according to the present invention,

Figure 6 is a block diagram showing the structure of the forming roll of the barrier rib integrated rear substrate manufacturing apparatus of the PDP according to the present invention,

7 is a cross-sectional view taken along the line A-A shown in FIG.

8 is a flowchart illustrating a process of manufacturing a barrier rib integrated rear substrate of the PDP according to the present invention;

9 is a configuration diagram showing a positional change due to plastic shrinkage that appears when the titanium substrate (Ti) is fired in accordance with the present invention.

<Explanation of symbols for main parts of the drawings>

50 back substrate 51 Ti substrate

53: integral bulkhead 55: address electrode

57 phosphor 61 substrate supply roll

63: adhesive applying means 65: heating means

67: bulkhead material supply roll 67 ': glass space

69: forming roll 69a: upper roll

69b: Lower roll 69b ': Cooling water tank

71: first cooling means 73: cutter

75: firing furnace

According to a first aspect of the present invention for achieving the above object, a plate-shaped metal substrate, a plurality of integral partition walls are formed parallel to each other and simultaneously formed on one surface of the metal substrate, and the integral type Provided is a partition integrated back substrate of a PDP comprising a plurality of address electrodes arranged to be separated into a plurality of discharge cells by a partition wall, and phosphors having red, green, and blue colors coated on the address electrodes.

In addition, according to the second aspect of the present invention, the metal substrate is a metal material having a coefficient of thermal expansion of 8 to 9 x 10 &lt; ^-6 &gt;

Further, according to a third aspect of the present invention, there is provided a substrate supply roll for continuously supplying a metal substrate, an adhesive applying means for applying an adhesive on the metal substrate supplied from the substrate supply roll, and the adhesive is applied by the adhesive applying means. A partition material supply roll for supplying a partition material onto the coated metal substrate, and the partition material is formed by applying pressure to the metal substrate and the partition material to form a plurality of integral partition walls arranged parallel to each other. A forming roll for adhering to a metal substrate, a cutter for cutting the metal substrate on which the integral partition wall is formed by the forming roll to a predetermined size, and a metal substrate on which the integral partition wall is formed by the forming roll at a predetermined temperature to form an integrated partition wall. There is provided a partition integrated back substrate manufacturing apparatus of a PDP configured to include a firing furnace for completing the process.

Further, according to a fourth aspect of the present invention, a heating means is provided between the adhesive applying means and the partition wall material supplying roll to heat and maintain the metal substrate at an appropriate temperature so that the adhesive force of the adhesive is improved, followed by the forming roller. Cooling means for cooling the partition wall material is provided to facilitate cutting of the substrate and the partition wall material.

Further, according to the fifth aspect of the present invention, the forming roll is provided with cooling means for cooling the forming roll so that the molding of the partition wall material is easily performed.

In addition, according to a sixth aspect of the present invention, the forming roll is installed on the upper side of the metal substrate and at the same time the upper roll for forming a partition-shaped mold on the outer circumference to form a partition material on the metal substrate, and the upper It is installed on the lower side of the metal substrate so as to correspond to the roll and consists of a lower roll for bonding the barrier member to the metal substrate by pressing the metal substrate and the partition member together with the upper roll.

In addition, according to a seventh aspect of the present invention, the barrier rib is formed by supplying a metal substrate and then applying an adhesive thereon, and supplying a barrier material on the metal substrate and then applying pressure to the metal substrate and the barrier material. A second process of forming the ash and adhering the partition material to the metal substrate, and cutting the metal substrate and the partition material to a predetermined size and then firing the partition material at a predetermined temperature to complete the integrated partition wall. Provided is a method of manufacturing a barrier rib-integrated back substrate of a PDP comprising a process.

In addition, according to an eighth aspect of the present invention, the method further includes a step of heating and maintaining the metal substrate at a predetermined temperature so as to improve the adhesion of the adhesive applied to the metal substrate between the first and second processes. Between the second process and the third process further includes the step of cooling the partition wall material to facilitate the cutting of the metal substrate and the partition wall material.

According to a ninth aspect of the present invention, there is provided a first process of applying an adhesive thereon after supplying a metal substrate, and supplying a partition material onto the metal substrate, and then applying pressure to the metal substrate and the partition material, thereby forming the partition wall. A second process of forming the ash and simultaneously adhering the partition material to the metal substrate, and a third process of firing the partition material at a predetermined temperature to complete the integrated partition wall and cutting the metal substrate to a predetermined size. Provided is a method for manufacturing a partition wall integrated back substrate of a PDP.

In addition, according to the tenth aspect of the present invention, a process of heating the metal substrate to a predetermined temperature is further included between the first process and the second process so that the adhesive force of the adhesive applied to the metal substrate is improved.

According to the present invention configured as described above, the thickness of the back substrate is reduced by using the metal substrate as compared to the conventional back substrate, thereby reducing the weight of the back substrate and reducing the manufacturing cost, and supplying the metal substrate in a roll type. Since it is possible to manufacture the back substrate by a continuous process there is an advantage that the productivity is greatly improved.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

4 is a cross-sectional view showing a barrier rib-integrated rear substrate of the PDP according to the present invention, Figure 5 is a block diagram showing a device for manufacturing a barrier rib-integrated rear substrate of the PDP according to the present invention, Figure 6 is a partition integral of the PDP in accordance with the present invention Figure 7 is a block diagram showing the structure of the forming roll of the back substrate manufacturing apparatus, Figure 7 is a cross-sectional view of the AA line shown in Figure 6, Figure 8 is a flow chart showing the manufacturing process of the bulkhead integral back substrate of the PDP according to the present invention, Figure 9 Is a configuration diagram showing the positional change due to plastic shrinkage that appears when the titanium substrate (Ti) is fired in accordance with the present invention.

Referring to FIG. 4, the barrier rib-integrated rear substrate of the PDP according to the present invention is formed in parallel with the plate-shaped titanium substrate 51 (hereinafter, referred to as Ti substrate) and on one surface of the Ti substrate 51. A plurality of integral partition walls 53 integrally formed with the Ti substrate 51, a plurality of address electrodes 55 arranged to be separated into a plurality of discharge cells by the integrated partition 53, and the address electrodes 55. It is configured to include a phosphor 57 coated on top of the red, green, blue.

Here, the Ti substrate 51 can be used as long as it is about 0.1 to 5.0 mm thick, and most preferably 0.5 to 1.0 mm thick in consideration of cost and weight.

On the other hand, the basis for using the Ti substrate 51 in the back substrate is described as follows. In order to complete the PDP, the process of bonding the back substrate 50 and the surface substrate and then firing them is essential. In this case, the surface substrate and the thermal substrate are generated due to the thermal stress generated by the difference in the coefficient of thermal expansion (CTE). The back substrate 50 may have a poor plasticity such as distortion or cracking. Therefore, if the material for the substrate and the thermal expansion coefficient is similar to the substrate for preventing the above plastic failure can be used as a substrate for the back substrate. That is, since soda-lime glass is generally used for a surface substrate, a coefficient of thermal expansion (8-9 × 10 ^-6 cm / cm ° C.) similar to that of soda-lime glass (8.7 × 10 ^-6 cm / cm ° C.) is obtained. If the material has, it can be used as a substrate for the back substrate.

Therefore, a metal such as Ti or Ti alloy having a similar thermal expansion coefficient to soda-lime glass can be used for the substrate for the back substrate (CTE of Ti: 8.4 × 10 ⁻⁶ cm / cm ° C., CTE of Ti alloy: 8.8 × 10 ^-6 cm / cm ℃), thereby maximizing the effects that can be obtained by using a metal material on the substrate for the back substrate.

According to an embodiment of the present invention for manufacturing a barrier rib integrated rear substrate of the PDP, the barrier rib integrated rear substrate manufacturing apparatus of the PDP is a substrate supply roll for continuously supplying a Ti substrate 51 as shown in FIG. 5. (61), adhesive applying means (63) for applying the adhesive (63 ') onto the Ti substrate (51) supplied from the substrate supply roll (61), and the adhesive (63') by the adhesive applying means (63). ) Is applied to the partition wall material supplying roll 67 for supplying the glass space 67 'onto the Ti substrate 51 to which the surface of the Ti substrate 51 is coated, and the glass substrate (b) is applied by applying pressure to the Ti substrate 51 and the glass space 67'. 67 ') to form a plurality of integral bulkheads 53 arranged in parallel to each other and to form a bonding roll 69 for adhering the glass space 67' to the Ti substrate 51; A cutter (73) for cutting the Ti substrate (51) on which the integral partition wall is formed to a certain size by 69); And a firing furnace 75 for firing the Ti substrate 51 cut by the cutter 73 at a predetermined temperature to complete the integrated partition 53.

In the above, a heating means 65 is installed between the adhesive applying means 63 and the partition material feed roll 67 to heat and maintain the Ti substrate 51 at an appropriate temperature so that the adhesive force of the adhesive 63 'is improved. The first cooling means 71 cools the glass space 67 'so that the Ti substrate 51 and the glass space 67' are easily cut between the forming roll 69 and the cutter 73. Is installed.

In addition, the forming roll 69 is provided with second cooling means for cooling the forming roll 69 so that the molding of the glaze space 67 'is easily performed.

In addition, the forming roll 69 is installed on the upper side of the Ti substrate 51 and at the same time an upper roll for forming a glazing 67 'on the Ti substrate 51 by forming a partition-shaped mold on its outer peripheral surface ( 69a and the lower side of the Ti substrate 51 to correspond to the upper roll 69a. The Ti substrate 51 and the glass space 67 'are pressed together with the upper roll 69a to form a glass space. 67 ') is composed of a lower roll 69b for adhering the Ti substrate 51 to the Ti substrate 51.

Here, the upper roll (69a) and the lower roll (69b) is a cylindrical having a diameter of 200 mm, a length of 800 mm as shown in Figure 6 is provided so that the interval therebetween is 1.5 mm, the upper roll (69a) 7 is formed on the outer circumferential surface of the barrier rib groove 69a 'having a pitch of 0.42 mm and a depth of 0.2 mm.

In order to make the upper roll 69a as described above, using a lathe for machining, a plurality of bars having a pitch of about 0.16 to 0.42 mm and a depth of about 0.1 to 0.2 mm are formed by precisely processing cylindrical aluminum, copper, and stainless steel. Partition wall grooves 69a 'are formed.

At this time, as the material of the upper roll (69a) it is advantageous to use a nickel plated coating of about 0.5 mm in the cylindrical stainless steel in terms of life extension, which is equally applied to the lower roll (69b).

In addition, the glass space 67 ′ formed by the upper roll 69 a has a property of plastic shrinkage upon firing, and thus the glass space 67 ′ is used when processing the partition groove 69 a ′ of the upper roll 69 a. It should be processed taking into account the plastic shrinkage rate of. That is, the glass space 67 'is not contracted in the horizontal direction but contracted only in the vertical direction due to the adhesive force with the Ti substrate 51, so that the depth of the partition groove 69a' is about 20 to 50%. It should be relaxed with consideration of shrinkage rate.

In addition, the lower roll 69b is provided with a cooling water tank 69b 'as part of the second cooling means, and the lower roll 69b is partially locked in the cooling water tank 69b'. 69b is driven.

The operation of the barrier rib-integrated rear substrate manufacturing apparatus of the PDP configured as described above will be described with reference to FIG. 8.

First, when the Ti substrate 51 is supplied through the rotation of the substrate supply roll 61, the adhesive applying means 63 is operated to spray the adhesive 63 'to the Ti substrate 51 by spraying the Ti substrate. Apply to (51). At this time, the adhesive 63 'serves to facilitate adhesion between the Ti substrate 51 and the glass 67' which is subsequently supplied onto the Ti substrate 51. For this purpose, PbO, SiO ₂ , B was used as the glass component such as ₂ O ₃ it contained.

As described above, when the adhesive 63 ′ is applied onto the Ti substrate 51, the adhesive force of the adhesive 63 ′ is improved, and the heating means 65 is operated to uniformly apply the entire surface of the Ti substrate 51. The substrate 51 is heated and maintained at a temperature of about 60 to 100 ° C.

Thereafter, the partition wall material supplying roll 67 is operated to supply the glacial space 67 ', and the glacial space 67' is formed into an integral partition wall 53 while passing through the forming roll 69. It is adhered to the Ti substrate 51. That is, the upper roll 69a and the lower roll 69b compress the Ti substrate 51 and the glass space 67 'to each other so that the glass space 67' is bonded to the Ti substrate 51, and the upper roll 69a is pressed. The glacial space 67 'is shaped into an integral partition wall 53 by a mold having an integral partition wall 53 formed in 69a.

At this time, the upper roll (69a) and the lower roll (69b) is being cooled by the second cooling means to facilitate the molding of the glass space 67 'as well as absorb heat due to mechanical operation. The roll 69a is rotating at the speed of 5 rpm.

As described above, when the glass space 67 'is formed by the forming roll 69, the first cooling means 71 is operated to blow the air 71' toward the glass space 67 '. Cool ').

Thereafter, the Ti substrate 51 is cut into a predetermined size (40 ″, ie 610 × 800 mm) by the cutter 73, and then enters the firing furnace 75 and is fired at a predetermined temperature. Several (1-10) Ti substrates 51 cut | disconnected by the () may be laminated | stacked in several layers in the box type baking furnace 75, and may be baked.

The glass space 67 'causes the plastic shrinkage during firing in the firing furnace 75. The glass space 67' is bonded to each other by the Ti substrate 51 and the adhesive 63 '. As shown in Fig. 9, contraction occurs only in the Z direction. That is, since the Ti substrate 51 does not cause plastic shrinkage, friction force acts between the Ti substrate 51 and the glass space 67 ′ so that the contraction does not occur in the X and Y directions. Thus, an integrated partition 53 having a pitch of 0.42 mm and a height of 0.15 mm is completed.

Subsequently, the address electrode 55 is printed between the integrated partition walls 53, and respective phosphors 57 are separately coated thereon to complete the back substrate 50.

On the other hand, according to another embodiment of the present invention, the cutter 73 and the firing furnace 75 may be installed in a reversed order. That is, even if the cutting and firing processes of the Ti substrate 51 are performed in a reversed order, the manufacturing of the back substrate 50 has little effect.

In another embodiment of the present invention as described above, after the Ti substrate 51 having the integral partition wall 53 formed by the forming roll 69 is continuously fired in the firing furnace 75, the firing is completed. The cutter 73 is cut to a constant size. At this time, the kiln 75 is a built-in temperature program designed sequentially from the room temperature to the crystallization temperature. Other configurations and operations are the same as in the embodiment of the present invention.

The barrier rib integrated rear substrate manufacturing apparatus of the PDP according to the present invention constructed and operated as described above uses the Ti substrate 51 as the substrate for the rear substrate, so that the Ti substrate 51 is fired when the glass space 67 'is fired. Because the adhesive force does not shrink in the planar direction due to the adhesive force, there is an advantage in that accurate pitch control is performed in manufacturing the integrated bulkhead 53.

In addition, the present invention can reduce the thickness of the conventional back substrate substrate from 2.5 to 3.0 mm by 0.5 to 1.0 mm by using the Ti substrate 51 in the back substrate substrate, so that the weight of the back substrate 50 And since the volume is reduced, as well as the PDP is the lightest possible, there is an advantage that the material is reduced to reduce the manufacturing cost.

In addition, the present invention can supply the Ti substrate 51 in a roll type by using the Ti substrate 51 to the back substrate, it is possible to manufacture the back substrate 50 by a continuous process, thereby greatly improving productivity There is an advantage to be improved.

In addition, since the present invention forms the glacial space 67 'into an integral partition wall 53 by using the forming roll 69, an integral partition wall 53 is formed in a single process, thereby shortening the process time, and of course, an integral partition wall. There is an advantage that the degree of 53 is improved.

Claims (10)

A plurality of address electrodes arranged to be separated into a plurality of discharge cells by a plate-shaped metal substrate, a plurality of integral partition walls formed in parallel with one surface of the metal substrate and integrally formed with the metal substrate, and the integrated partition walls. And a fluorescent substance coated with red, green, and blue separately coated on the address electrode, wherein the partition integrated back panel of the plasma display panel (hereinafter referred to as PDP) is formed. The method of claim 1, The metal substrate is a barrier rib integrated back substrate of the PDP, characterized in that the material is a metal material having a coefficient of thermal expansion of 8 to 9 × 10 ^-6 cm / cm ℃. A substrate supply roll for continuously supplying a metal substrate, adhesive applying means for applying an adhesive on the metal substrate supplied from the substrate supply roll, and a partition wall for supplying a partition material on the metal substrate coated with the adhesive by the adhesive applying means. A resupply roll, a forming roll for forming the plurality of integral bulkheads formed parallel to each other by forming the partition material by applying pressure to the metal substrate and the partition wall material and adhering the partition material to the metal substrate; And a cutting machine for cutting the metal substrate having the integral partition wall formed by the forming roll to a predetermined size, and a firing furnace for completing the integral partition wall by firing the metal substrate having the integral partition wall formed by the forming roll at a predetermined temperature. PDP bulkhead integrated backplane manufacturing apparatus. The method of claim 3, Between the adhesive applying means and the partition wall material supply roll is provided with a heating means for heating and maintaining the metal substrate at an appropriate temperature so that the adhesive strength of the adhesive is improved, the metal roller and the partition wall material after the forming roller to be easily cut An apparatus for manufacturing a barrier rib integrated rear substrate of a PDP, wherein cooling means for cooling the barrier rib material is installed. The method of claim 3, The forming roll is a barrier rib integrated rear substrate manufacturing apparatus of the PDP, characterized in that the cooling means for cooling the forming roll is installed to facilitate the molding of the partition wall material. The method of claim 3, The forming roll is installed on the upper side of the metal substrate and at the same time an integral partition wall mold is formed on the outer circumferential surface thereof to form the upper roll for forming the partition material on the metal substrate, and the lower side of the metal substrate to correspond to the upper roll. Comprising the upper roll and the metal substrate and the partition member to each other by compressing the partition wall member to the metal substrate consisting of a partition plate integrated rear substrate manufacturing apparatus of the PDP. A first step of applying a metal substrate and then applying an adhesive thereon; and supplying a partition material onto the metal substrate and applying pressure to the metal substrate and the partition material to form the partition material and simultaneously A second process of adhering to the substrate, and a third process of cutting the metal substrate and the partition wall material into a predetermined size and then firing the partition wall material at a predetermined temperature to complete the integrated partition wall. Bulkhead integrated backplane manufacturing method. The method of claim 7, wherein Between the first process and the second process further comprises the step of heating and maintaining the metal substrate at a predetermined temperature to improve the adhesion of the adhesive applied to the metal substrate, between the second process and the third process And cooling the partition wall material to facilitate cutting of the partition wall material. A first step of applying a metal substrate and then applying an adhesive thereon; and supplying a partition material onto the metal substrate and applying pressure to the metal substrate and the partition material to form the partition material and simultaneously A second process of adhering to the substrate, and a third process of firing the partition material at a predetermined temperature to complete the integrated partition wall and then cutting the metal substrate to a predetermined size. Substrate manufacturing method. The method of claim 9, The method of claim 1, further comprising the step of heating the metal substrate to a predetermined temperature to improve the adhesion of the adhesive applied to the metal substrate between the first process and the second process.