KR20000001940A - Wafer examining system using lan - Google Patents
Wafer examining system using lan Download PDFInfo
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- KR20000001940A KR20000001940A KR1019980022427A KR19980022427A KR20000001940A KR 20000001940 A KR20000001940 A KR 20000001940A KR 1019980022427 A KR1019980022427 A KR 1019980022427A KR 19980022427 A KR19980022427 A KR 19980022427A KR 20000001940 A KR20000001940 A KR 20000001940A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
본 발명은 랜을 이용한 웨이퍼 검사 시스템에 관한 것으로서, 보다 상세하게는 마이크로스코프(Microscope)를 이용한 웨이퍼를 검사하면서 랜(LAN ;Locad Area Network)을 통하여 먼 거리에서도 모니터가 가능한 랜을 이용한 웨이퍼 검사 시스템에 관한 것이다.The present invention relates to a wafer inspection system using a LAN, and more particularly, a wafer inspection system using a LAN that can be monitored at a long distance through a LAN (LAN; Locad Area Network) while inspecting a wafer using a microscope. It is about.
통상적으로 웨이퍼 상에 사진, 확산, 식각, 화학기상증착 및 금속증착 등의 공정이 반복 수행됨에 따라 반도체장치가 제작된다.In general, semiconductor devices are fabricated by repeatedly performing processes such as photographing, diffusion, etching, chemical vapor deposition, and metal deposition on a wafer.
이들 반도체장치는 반도체소자의 고집적화, 고밀도화 추세에 따라 정밀한 제조설비와 제작기술 그리고, 반도체장치의 회로를 이루는 패턴의 형성 또한 보다 정교함과 정확성을 요구하고 있다.These semiconductor devices require precise manufacturing facilities, manufacturing techniques, and the formation of patterns constituting the circuits of semiconductor devices according to the trend of higher integration and higher density of semiconductor devices.
따라서, 상술한 바와 같이 반도체장치의 제조를 위한 각 단위공정에는 대부분 공정의 완성도를 검사하고 평가하기 위한 검사장비가 설치된다.Therefore, as described above, each unit process for manufacturing a semiconductor device is provided with inspection equipment for inspecting and evaluating the completion of most processes.
한편, 이러한 검사장비에 있어서 해당 단위공정을 수행한 웨이퍼 중 일부를 추출하여 디스플레이부를 갖는 카메라와 현미경을 통해 웨이퍼 상에 형성된 패턴의 형상을 작업자로 하여금 확인 검사하도록 하는 마이크로스코프 검사장비가 있다.On the other hand, there is a microscope inspection equipment that allows the operator to check the shape of the pattern formed on the wafer through a camera and a microscope having a display unit by extracting a portion of the wafer that performed the unit process in such inspection equipment.
종래에는 팹(FAB)에서 마이크로스코프를 통해서 본 웨이퍼의 상태를 검사자만 모니터가 가능하며 데이터를 저장할 때는 사진등을 통해서만 가능했던 문제점이 있었다.Conventionally, only a tester can monitor the state of a wafer viewed through a microscope in a FAB, and when storing data, there was a problem that was possible only through a photograph.
본 발명의 목적은, 웨이퍼 검사시에 팹(FAB)과 사무실에서 동시에 모니터가 가능하고, 검사결과를 여러 사람이 공유하면서 정확한 현상파악을 할 수 있도록 마이크로스코프의 검사자료를 시시디 카메라를 이용한 영상자료를 랜을 통해 제공하는 랜을 이용한 웨이퍼 검사 시스템을 제공하는 데 있다.An object of the present invention is to monitor at the fab (FAB) and the office at the time of wafer inspection, and to share the inspection results by multiple people to accurately identify the image of the microscope using the inspection data of the camera The present invention provides a wafer inspection system using a LAN that provides data through a LAN.
도1은 본 발명의 일 실시예에 따른 랜을 이용한 웨이퍼 검사 시스템을 개략적으로 나타낸 구성도이다.1 is a schematic view showing a wafer inspection system using a LAN according to an embodiment of the present invention.
※ 도면의 주요 부분에 대한 부호의 설명※ Explanation of codes for main parts of drawing
10 : 마이크로스코프 12 : 시시디(CCD) 카메라10: Microscope 12: CSI (CCD) Camera
14 : 랜(LAN) 16 : 웨이퍼14 LAN 16 Wafer
18,20 : 컴퓨터18,20: computer
상기 목적을 달성하기 위한 본 발명에 따른 랜을 이용한 웨이퍼 검사 시스템은, 웨이퍼 상에 형성된 패턴의 형상을 작업자로 하여금 확인 검사하도록 하는 마이크로스코프(Microscope), 상기 마이크로스코프에 장착하여 상기 웨이퍼 상에 형성된 패턴을 영상으로 인식하는 시시디(CCD : Charge Coupled Device) 카메라, 상기 시시디 카메라의 영상신호를 전송받는 컴퓨터 및 상기 컴퓨터와 랜(LAN)으로 연결된 컴퓨터를 포함하여 이루어진다.A wafer inspection system using a LAN according to the present invention for achieving the above object is a microscope for allowing an operator to check the shape of a pattern formed on a wafer, mounted on the microscope and formed on the wafer. A charge coupled device (CCD) camera for recognizing a pattern as an image, a computer receiving an image signal of the CD camera, and a computer connected to the computer by a LAN.
이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도1은 본 발명의 일 실시예를 따른 랜을 이용한 웨이퍼 검사 시스템을 개략적으로 나타낸 구성도이다.1 is a schematic diagram showing a wafer inspection system using a LAN according to an embodiment of the present invention.
도1에서 보는 바와 같이, 웨이퍼(16) 상에 형성된 패턴의 형상을 작업자로 하여금 확인 검사하도록 하는 마이크로스코프(10), 상기 마이크로스코프(10)에 장착하여 상기 웨이퍼(16) 상에 형성된 패턴을 영상으로 인식하는 시시디(CCD) 카메라(12), 상기 시시디 카메라(12)의 영상신호를 전송받는 컴퓨터(18) 및 상기 컴퓨터(18)와 랜(LAN)(14)으로 연결된 컴퓨터(20)를 포함하여 이루어진다.As shown in FIG. 1, the pattern formed on the wafer 16 is mounted on the microscope 10 and the microscope 10 to allow the operator to check the shape of the pattern formed on the wafer 16. A CCD camera 12 that recognizes an image, a computer 18 receiving an image signal of the CD camera 12, and a computer 20 connected to the computer 18 by a LAN 14. )
컴퓨터(18)에 이미지 보드(Board)를 장착하여 시시디 카메라(12)에서 전달된 영상신호를 처리한다. 원거리에 있는 또 다른 컴퓨터(20)에 랜(14) 케이블을 통하여 동시에 여러 사람이 팹(FAB)의 웨이퍼(16)의 상태를 검사할 수 있다.An image board (Board) is mounted on the computer 18 to process an image signal transmitted from the CD camera 12. At the same time, a plurality of people can check the state of the wafer 16 of the FAB via another LAN 14 cable to another remote computer 20.
팹(FAB)에서 마이크로스코프(10)를 통해서 웨이퍼(16)에 형성된 패턴이 랜(14)을 통하여 사무실, 먼 거리에서 모니터가 가능하며 웨이퍼(16)의 상태를 판단할 수 있는 이점이 있다.In the FAB, the pattern formed on the wafer 16 through the microscope 10 can be monitored at a distance from the office through the LAN 14, and there is an advantage of determining the state of the wafer 16.
따라서, 본 발명에 의하면 웨이퍼 검사시에 팹(FAB)과 사무실에서 동시에 모니터가 가능하고, 검사결과를 여러 사람이 공유하면서 정확한 현상파악을 할 수 있는 효과가 있다.Therefore, according to the present invention, it is possible to monitor at the same time in the FAB and the office at the time of wafer inspection.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various modifications and variations are possible within the technical scope of the present invention, and such modifications and modifications are within the scope of the appended claims.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980022427A KR20000001940A (en) | 1998-06-15 | 1998-06-15 | Wafer examining system using lan |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980022427A KR20000001940A (en) | 1998-06-15 | 1998-06-15 | Wafer examining system using lan |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20000001940A true KR20000001940A (en) | 2000-01-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019980022427A KR20000001940A (en) | 1998-06-15 | 1998-06-15 | Wafer examining system using lan |
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| Country | Link |
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| KR (1) | KR20000001940A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100921710B1 (en) * | 2007-10-09 | 2009-10-15 | 서울엔지니어링(주) | Method for inspecting wafer |
-
1998
- 1998-06-15 KR KR1019980022427A patent/KR20000001940A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100921710B1 (en) * | 2007-10-09 | 2009-10-15 | 서울엔지니어링(주) | Method for inspecting wafer |
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