KR19990085228A - Ultra-thin substrate and its manufacturing method - Google Patents

Abstract

A dummy substrate having a thickness of about 0.4 to 0.7 mm is bonded to a glass substrate having a thickness of about 0.3 to 0.5 mm with a sealing material to produce a process substrate having a total thickness of about 0.7 to 1.2 μm. A manufacturing process of forming a pattern for a thin film transistor substrate or a color filter substrate on the opposite substrate surface to which the dummy substrate is attached is completed to complete each of the thin film transistor substrate and the color filter substrate, and then the first scribe on the side where the pattern is formed. Is carried out. The scribed color filter substrate and the thin film transistor substrate are matched to face each other, and the two substrates are integrated by surrounding the encapsulant along the edges of the two substrates. In this case, the encapsulant is positioned inside the substrate rather than the encapsulant bonding the substrate and each dummy substrate. Finally, the second scribe is applied to the dummy substrate surface at the portion located outside the encapsulant, and then the brake is separated from the dummy substrate.

Description

Ultra-thin substrate and its manufacturing method

The present invention relates to an ultra-thin liquid crystal display substrate and a method of manufacturing the same.

BACKGROUND ART Generally, flat panel display devices have wide application fields such as lap top computers, camcorders, aviation systems, etc., and recently, the area of the substrate has also been enlarged. In particular, it is lighter than a display medium using a CRT and is widely applied to a portable device, and is being used as a substrate to facilitate its portability, and researches for reducing the weight of a glass substrate are being conducted.

Currently, thin film transistor substrates are fabricated using glass substrates having a thickness of about 0.7 mm, and the limit thickness reaches about 0.6 mm as the area of the substrate is enlarged. This is because, when the thickness of the substrate becomes thinner than this, difficulties arise in the progress of equipment and processes due to the warpage of the substrate or the impact during the high-speed rotational spin coating.

As a method for realizing a thinner and lighter liquid crystal display device, a method of grinding the back side of the substrate or chipping with a chemical after completion of fabrication of the liquid crystal display substrate is used. However, there are disadvantages such as the need for additional equipment, additional processes, and deterioration of product properties due to chemicals.

An object of the present invention is to form a thin substrate in a stable manner without adding a process and equipment.

1 is a cross-sectional view of a glass substrate for a liquid crystal display device with a dummy substrate,

2 is a plan view showing an encapsulant pattern on a substrate surface;

3A to 3E are cross-sectional views illustrating a method of manufacturing a liquid crystal display substrate according to an embodiment of the present invention according to a process sequence;

4 to 9 are plan views showing the encapsulant pattern according to the first to sixth embodiments of the present invention,

FIG. 10 is a schematic view of portion A of FIGS. 8 and 9.

In the manufacturing method of the liquid crystal display substrate according to the present invention for solving the above problems, the sealing pattern is applied along the edge of the first surface of the transparent insulating substrate to have an air outlet, and the dummy substrate is bonded to each other. Then, the dummy substrate is removed.

Here, the air outlet may be formed in a shape having a straw shape or a curve extending straight in the direction away from the edge of the substrate so that the chemical infiltration is difficult to penetrate.

In the method of manufacturing a liquid crystal display substrate according to another embodiment of the present invention, after assembling two substrates each having a thin film process using an insulating substrate having a dummy substrate using a sealing pattern, a scribe is performed to remove the sealing pattern. By doing so, the dummy pattern is separated from the completed liquid crystal display substrate. In this case, the first scribe of each substrate after the thin film process is performed so that the liquid crystal display substrate does not become excessive when the substrate is cut through the last scribe.

In order to stably advance the thin film process, it is preferable that the thickness of an insulation substrate shall be 0.3-0.5 micrometer, and the thickness of a dummy substrate shall be 0.4-0.7 micrometer.

Then, with reference to the accompanying drawings will be described in detail to be easily carried out by those of ordinary skill in the art with respect to the ultra-thin substrate according to the present invention and its manufacturing method.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of the glass substrate for liquid crystal display substrates with a dummy substrate, and FIG. 2 is a top view which shows the sealing material pattern of the glass substrate surface.

For the thin film transistor or color filter process, the dummy substrate having a thickness d2 of about 0.4 to 0.7 mm on the glass substrates 101 and 102 having a thickness d1 of about 0.3 to 0.5 mm as shown in FIG. 100) are combined into one so that the overall thickness of the substrate to be used in the process is about 0.7 to 1.2 μm.

As shown in FIG. 2, the encapsulant 200 is applied along the edge of the substrate 100 outside the portion where the active area A / A of the substrate 100 is to be formed.

The substrate shown in FIG. 1 is used in the manufacturing process of the liquid crystal display substrate.

Next, a method of manufacturing an ultra-thin substrate will be described with reference to FIGS. 3A to 3E.

3A to 3D are cross-sectional views illustrating a method of manufacturing an ultra-thin substrate according to an embodiment of the present invention using the process substrate referred to in FIGS. 1 and 2 in the order of a process.

As shown in FIG. 3A, the encapsulant 200 includes a dummy substrate 100 having a thickness d2 of about 0.4 to 0.7 mm on the glass substrates 101 and 102 having a thickness d1 of about 0.3 to 0.5 mm. Combined into one using to produce a process substrate with a total thickness of about 0.7 ~ 1.2μm.

At this time, it is preferable to apply the encapsulant 200 such that the interval H between the substrates 101 and 102 and 100 is 2 μm or less. If the spacing H is wider than this, particles easily enter between the substrates 101 and 102 and 100 in the process of preventing the air from escaping, thereby resulting in poor adhesion between the two substrates.

In order to form a narrow substrate gap H, the encapsulant 200 in a liquid state or a paste state may be used. In addition, in order to prevent the encapsulation region from being separated during the process, it is preferable to use a material having heat resistance and chemical resistance.

As shown in FIG. 3B, a manufacturing process of forming patterns 300 and 400 for a thin film transistor substrate or a color filter substrate is performed on the surface of the opposite substrate 101 (102) to which the dummy substrate 100 is attached. The thin film transistor substrate and the color filter substrate are completed. After each substrate is cleaned, a first scribe (scribe: S1, S2) is applied to the surface on which the patterns 300 and 400 are formed in order to facilitate the process after cutting the substrate in cell units.

As shown in FIG. 3C, the scribed color filter substrate 102 and the thin film transistor substrate 101 are matched to face each other, and the encapsulant 500 is aligned along the edges of the two substrates 101 and 102. The two substrates 101 and 102 are integrated together. In this case, the encapsulant 500 may be positioned inside the substrate 101 (102) rather than the encapsulant 200 that bonds the substrate 101 (102) and each dummy substrate 100.

Next, as shown in FIG. 3D, the second scribes S3 and S4 are applied to the surface of the dummy substrate 100 at a portion located outside of the encapsulant 500, and then the dummy substrate is subjected to a break. The 100 and the substrates 101 and 102 are separated.

As such, since the scribe process is performed on the thin film transistor substrate, the color filter substrate, and the dummy substrate 100, the substrates 101 and 102 and the dummy substrate 100 are easily removed without significant damage.

Next, the process is completed by injecting the liquid crystal and sealing the liquid crystal inlet.

As such, the contact between the dummy substrate and the process substrate is good, so that sufficient substrate strength can be maintained in the entire manufacturing process step, and the dummy substrate can be easily removed after the process is completed.

Next, the encapsulation pattern for adhering the substrate and the dummy substrate will be described in more detail with reference to FIGS. 4 to 10.

4 to 9 are schematic views of the first to sixth embodiments showing the sealing pattern for reducing the adhesion failure between the substrate and the dummy substrate.

As shown in FIG. 4, the sealing material 200 is apply | coated along the edge of the board | substrate 100, The part extends in a straight line toward the board | substrate inside. The end of the extended portion is open to serve as the air intake hole 201 in and out of the air. That is, since the gas generated during the adhesion of the glass substrate and the dummy substrate after the encapsulant 200 is applied is aspirated through the air outlet 201, the expanded gas is prevented from weakening the bond between the two substrates during the thermal process. Can be.

In addition, the air outlet 201 has a straw shape extending straight into the substrate to prevent chemicals from flowing between the substrates in a wet etching process of a thin film process or a color filter process. In general, when chemicals are introduced, cleaning may not be performed properly, which may contaminate the process chamber in the next step, and particles may be generated during the process.

As shown in FIGS. 5 to 7, the air vents 202 and 203 are formed with a curvature toward the inside of the substrate 100, or are parallel to one side from one end of the open portion of the encapsulant 200. And a long extending pattern 204 may be prevented from infiltrating the chemical.

However, the possibility of penetration of trace chemicals still exists. An improved structure is shown in FIGS. 8 to 10.

8 to 10, the encapsulant 200 is surrounded by the edge of the substrate 100, and the air outlet patterns 205 and 206 extend from the encapsulant 200 to the outside of the substrate 100. Formed. Open portions of the air outlet patterns 205 and 206 are sealed with a sealant 210, which is sealed to the glass substrates 101 and 102 with the dummy substrate 100 by the encapsulant 200. When the gas generated is discharged and then applied to prevent the weakening of the bonding of the two substrates (101; 102, 100).

In order to prevent the two substrates 101 (102, 100) from being deformed during the process, two or more layers of the encapsulant pattern may be formed.

As described above, the two substrates are bonded to each other to perform a thin film process such as forming a thin film transistor substrate or a color transistor substrate, thereby maintaining sufficient substrate strength during the process, and performing a first scribe after the thin film process and assembling the two substrates. After the second scribe on the surface of the substrate to be removed, a thin liquid crystal display substrate is manufactured in a stable manner.

Claims (14)

Forming a sealing pattern having an air outlet along the edge of the first surface of the transparent insulating substrate, Sealing the dummy substrate on the first surface; Performing a thin film process on a second surface opposite to the first surface, Removing the dummy substrate Method of manufacturing a liquid crystal display substrate comprising a. In claim 1, A method of manufacturing a liquid crystal display substrate to seal the air outlet before performing the thin film process. In claim 1, And the air outlet is formed in a direction away from the edge of the substrate to prevent penetration of chemicals. In claim 3, And the air outlet is formed in a straight straw shape. In claim 3, The air suction port is a manufacturing method of the liquid crystal display substrate to be formed in a form having a bend. In claim 3, The said insulating substrate is a manufacturing method of the liquid crystal display substrate whose thickness is 0.3-0.5 micrometer. In claim 6, The dummy substrate has a thickness of 0.4 to 0.7 µm. Adhering a first dummy substrate by applying a first encapsulation pattern to an edge of a first surface of the first substrate having a first surface and a second surface, Performing a thin film process on the second surface of the first substrate, Performing a first scribe on the second surface of the first substrate, Adhering a second dummy substrate by applying a second encapsulation pattern to an edge of the third surface of the second substrate having the third and fourth surfaces; Performing a thin film process on the fourth surface of the second substrate, Performing a second scribe on the fourth surface of the second substrate, Assembling the second surface of the first substrate and the fourth surface of the second substrate to face each other; Separating the first and second dummy substrates from the first and second substrates by performing a third scribe to remove the first and second encapsulation patterns on the first and third surfaces. Method of manufacturing a liquid crystal display substrate comprising a. In claim 8, A method of manufacturing a liquid crystal display substrate, wherein the liquid crystal display substrate is bonded so that a gap between the first substrate and the first dummy substrate is 2 μm or less. In claim 8, A method of manufacturing a liquid crystal display substrate, wherein the liquid crystal display substrate is bonded so that a distance between the second substrate and the second dummy substrate is 2 μm or less. In claim 8, The said 1st board | substrate is a manufacturing method of the liquid crystal display substrate which is thickness of 0.3-0.5 micrometer. In claim 11, The said 2nd board | substrate is a manufacturing method of the liquid crystal display substrate which is thickness of 0.3-0.5 micrometer. In claim 12, The thickness of the said first dummy substrate is 0.4-0.7 micrometers, The manufacturing method of a liquid crystal display substrate. In claim 13, The thickness of the said second dummy substrate is 0.4-0.7 micrometers, The manufacturing method of a liquid crystal display substrate.