KR19990055886A - VISION Package Ball Mounting Head - Google Patents

Abstract

The present invention relates to a BG package ball mounting head, wherein a head unit having a size and shape that can be attached to a solder ball in one package is mounted to the head holder at an appropriate number and at an appropriate interval, and the head units are sealed by sliding bars. By constructing the head, it is possible to adjust the number of head units and the distance between the head units without changing the whole ball-mounting head even if the package unit pitch or the number of package units of the package strip to be processed is different from the conventional ones. To reduce the cost of preparing the ball-mounting head and the shape of the ball mounting head, it is possible to reduce the working time for replacing the entire ball-mounting head.

Description

VISION Package Ball Mounting Head

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a busy package ball mounting head, and more particularly, to a busy package ball mounting head that can be used universally regardless of the package unit pitch of the package strip or the number of package units.

A ball grid array (BGA) package refers to a package having solder balls as an external connection terminal of the package. Attaching solder balls to these packages is not cut into each package after molding to a lead frame. The ball mounting process of placing solder balls on the pads on each package of the package strip which is not in the state of the package strip, and the reflow process of applying the heat to the solder balls to slightly melt and fix the pads, and the device used in the ball mounting process is Ball mounting head.

Figure 1 is an exploded cross-sectional view of a conventional ball mounting head, Figure 2 is a cross-sectional view showing a state in which the conventional ball mounting head is used, as shown, the conventional ball mounting head is a suction hole for holding the solder ball (B) The head (1a) is formed at regular intervals, and the vacuum nozzle (2a) is installed in the upper center portion, and the lower surface includes a head holder (2) on which the head (1) is mounted.

Guide rail coupling grooves are formed at portions not visible in the drawing or at both inner sides of the head holder 2, and guide rails corresponding thereto are formed at both sides of the head 1, so that the guide rail coupling grooves of the head holder 2 are formed. The guide rail of the head (1) is inserted into the sliding so as to be coupled, and then fixed so as not to move with the fixing pin (3).

The head 1 is formed in a separate shape and size according to the package unit pitch, which is the number of package units and the distance between the packages, which is the number of packages (not shown) in one package strip (not shown). And FIG. 2 shows a ball mounting head used for a package strip consisting of four packages with a gap between packages at a predetermined package unit pitch, and for a package strip not consisting of four packages. In the case of a package strip composed of four packages, if the package unit pitch is different, a different head 1 should be used. In the case of the head holder 2, a size corresponding to each head 1 should be used. do.

In the conventional ball mounting head having the structure as described above, the suction ball 1a is held by the vacuum ball applied to the solder ball B contained in the solder ball tray (not shown) through the vacuum nozzle 2a one by one. In the state, move to the position where the package strip (not shown) is brought into contact with the solder ball (B) and the package strip so that the pad (not shown) of the package (not shown) and the position of the solder ball (B) match, and then the vacuum pressure is applied. The action is performed by stopping the application so that the solder ball B is placed on the pad.

As described above, the head 1 of the conventional ball mounting head is made in a different shape and size according to the package unit pitch or the number of package units, and in the case of the head holder 2, the head 1 is formed in a size corresponding to the head 1. Therefore, even when the final package is the same, if the package unit pitch or the number of package units of the package strip is different, a separate ball mounting head had to be manufactured and used in place of the existing one, thereby increasing the cost.

Therefore, an object of the present invention created by recognizing the above-described problems is to provide a visual package ball mounting head that can be used universally regardless of the package unit pitch of the package strip or the number of package units, thereby reducing the cost. I would like to.

1 is an exploded cross-sectional view of a conventional ball mounting head.

2 is a cross-sectional view showing a state in which a conventional ball mounting head is used.

Figure 3 is a longitudinal sectional view showing the structure of the BG package ball mounting head according to an embodiment of the present invention.

Figure 4 is a side cross-sectional view showing the structure of the BGA package ball mounting head according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

2; Head holder 2a; Vacuum nozzle

2b; Guide rail insertion groove 3; Push pin

10; Head unit 10a; Suction hole

11; Sliding bar B; Solder ball

In order to achieve the object of the present invention as described above, the suction hole for catching the solder ball is formed on the lower surface and the guide rail is formed on both sides, and the guide rail coupling groove is coupled to the guide rail of the head is formed in the lower inner side A ball mounting head consisting of a head holder is formed with a vacuum nozzle for applying a vacuum pressure through the suction hole; The head is formed in a size that can hold the entire solder ball to be attached to one package of the package strip to adjust the number of head unit to be mounted on the head holder, if necessary, both ends in the guide rail coupling groove of the head holder Visible package ball-mounting head is provided, characterized in that the plate material of the predetermined width that is inserted and slidable and detachable from the head holder, are formed of sliding bars to seal between the head units so that vacuum pressure is not lost.

Hereinafter, the present invention will be described in detail with reference to an embodiment of the present invention shown in the accompanying drawings.

Figure 3 is a longitudinal sectional view showing a structure of a BG package ball mounting head according to an embodiment of the present invention, Figure 4 is a side cross-sectional view showing a structure of a BG package ball mounting head according to an embodiment of the present invention. to be.

As shown in the drawing, the BG package ball mounting head according to the exemplary embodiment of the present invention includes the guide rail coupling groove 2b and the head holder 2 in which the vacuum nozzle 2a is formed. Instead of the conventional head 1, which is integrally formed to hold the solder balls B to be mounted to all packages (not shown) on the package strip (not shown), guide rails (not shown) are formed on both sides and the package Several head units 10 and head holders 2 formed with a size capable of catching the entire solder ball B to be attached to one package of the strip, and having suction holes 10 a formed on the lower surface thereof to catch the solder balls B. Both ends are inserted into the guide rail coupling groove (2b) of the slide) is a plate of a predetermined width detachable from the head holder 2, the sliding bar to seal between the head unit 10 so that the vacuum pressure is not lost In that the head is composed of 11 There are differences with the prior art.

In FIG. 3, a BG package ball mounting head composed of three head units 10 and several sliding bars 11 that seal between the head units 10 is shown, but the distance between the head units 10 is shown. It is possible to construct a ball mounting head having more or less head units 10 by widening or narrowing the width of the package, and to package the number of head units 10 and the space between the head units 10. It is determined according to the package unit pitch and the number of package units in the circuit.

The sliding bar 11 is small enough to vary the interval between the head units 10 mounted on the head holder 2 according to the number of sliding bars 11 inserted between the head units 10. Prepare a plurality of the same width to have a width of, or formed with a width corresponding to the interval of the head unit 10 according to the package strip to be processed to have a separate width so as to insert only a single sliding bar (10) It is desirable to prepare a sliding bar of a kind.

The sliding bar 10 is preferably formed of an elastic material so that airtightness is maintained between adjacent sliding bars 10.

Reference numeral 3 in the drawings serves to fix the position of the head unit 10 as a fixing pin as in the prior art.

In the BG package ball mounting head according to the present invention having the structure as described above, the number of head units without having to replace the entire ball mounting head even if the package unit pitch or the number of package units of the package strip to be processed is different from the conventional method. Since it can be used by adjusting the distance between the head unit and the head unit, it is possible to reduce the cost of preparing the ball mounting heads of various sizes and shapes and to reduce the work time for replacing the entire ball mounting head.

Claims (3)

The suction hole for catching the solder ball is formed on the lower surface and the guide rail is formed on both sides, and the guide rail coupling groove for coupling the guide rail of the head is formed in the lower inner side and a vacuum nozzle for applying a vacuum pressure through the suction hole. In the ball mounting head composed of the formed head holder; The head is formed in a size that can hold the entire solder ball to be attached to one package of the package strip to adjust the number of head unit to be mounted on the head holder, if necessary, both ends in the guide rail coupling groove of the head holder Visible package ball-mounting head, characterized in that the plate is inserted into the slide of the predetermined width removable from the head holder, the sliding bar is sealed between the head units so that no vacuum pressure is lost. The sliding bar of claim 1, wherein the sliding bar is formed to have a predetermined width small enough to vary the interval between the head units mounted on the head holder according to the number of sliding bars inserted between the head units. This package ball mounting head. 2. The ball mounting head of claim 1, wherein the sliding bar is formed to have a width corresponding to an interval of the head unit according to the package strip to be processed so that only a single sliding bar is inserted between the head units.